Product Specification 108-57273 05-JAN-2011 Rev. C Wire To Board Serial, Pitch 1.25mm 1. SCOPE 1.1. CONTENTS This specification covers the performance, tests and quality requirements for the Wire To Board Serial connector. 1.2. QUALIFICATION When tests are performed on the subject product line, the procedures specified in AMP 109 series specifications shall be used. All inspections shall be performed using the applicable inspection plan and product drawing. 2. APPLICABLE DOCUMENT The following AMP documents form a part of this specification to the extent specified herein. Unless otherwise specified, the latest edition of the document applies. In the event of conflict between the requirements of this specification and the product drawing, the product drawing shall take precedence. In the event of conflict between the requirements of this specification and the referenced documents, this specification shall take precedence. 2.1 AMP DOCUMENTS 3. A. 109-1: General Requirements for Test Specifications B. 109 series: Test Specification as indicated in Figure 1 (Comply with MIL-STD-202, MIL-STD-1344 and EIA RS-364) C. Corporate Bulletin 401-76: Cross-reference between AMP test Specifications and Military or Commercial Documents. D. 501-57299: Test Report. REQUIREMENTS 3.1. DESIGN AND CONSTRUCTION Product shall be of the design, construction and physical dimensions specified on the applicable product drawing. 3.2. MATERIALS A. Contact Material: Copper Alloy. Finish: Tin-Lead or Matte-Tin over Nickel plated. B. Housing Material: Thermoplastic, natural color. 3.3. RATINGS A. Voltage: 100 VAC rms. B. Current: 1 A for AWG#28 DR Angus Wu ©2010 Tyco Electronics Corporation Taipei, Taiwan All International Rights Reserved. DATE APVD 11-NOV-2005 Wei-Jer Ke * Trademark │ Indicates change For latest revision, visit our website at www.tycoelectronics.com\documents. For Regional Customer Service, visit our website at www.tycoelectronics.com DATE 11-NOV-2005 1 of 4 LOC DW 108-57273 C. Temperature: -25 °C to 85°C 3.4. PERFOMANCE AND TEST DESCRIPTION The product is designed to meet the electrical, mechanical and environmental performance requirements specified in Figure 1 unless otherwise specified. All tests are performed at ambient environmental conditions per AMP Specification 109-1 3.5. TEST REQUIREMENTS AND PROCEDURES SUMMARY Test Item 1 Examination of Product Requirement Meets requirements of product drawing. No physical damage. Procedure Visual inspection Electrical Requirement Subject mated contacts assembled in housing to 20mV Max open circuit at 10mA Max. 2 Termination Resistance 3 Insulation Resistance 1000 M: Min. (Initial) 100 M: Min. (Finial) 4 Dielectric withstanding Voltage No creeping discharge nor flashover shall occur. Current leakage: 0.5 mA MAX 5 Temperature Rising 20 m: Max 30C° Max. under loaded rating current Impressed voltage 500 VDC Test between adjacent circuits and contact 500 VAC for 1minute Test between adjacent circuits and contact Contact series-wired, apply test current of loaded rating current to the circuit, and measure the temperature rising by probing on soldered areas of contacts, after the temperature becomes stabilized deduct ambient temperature from the measured value. Mechanical Requirement 6 7 Connector Mating Force 1 kgf/pin Max. Connector Unmating Force 0.1 kgf/pin Min. 8 Durability Operation Speed: 10 mm/min. Measure the force required to mate connector Operation Speed: 10 mm/min. Measure the force required to unmate connector Operation Speed: 10 cycle/min. No. of Cycles: 25 Cycles See note. Figure 1 (cont.) Rev C 2 of 4 108-57273 Test Item Requirement Procedure Mechanical Requirement 9 Vibration 10 Physical Shock Subject mated connectors to 10-55-10 No electrical discontinuity greater Hz traversed in 1 minute at 1.52mm than 1 microsecond shall occur. amplitude 2 Hours each of 3 mutually See note. perpendicular planes, passing DC 1mA current during the test. Accelerate Velocity: 490m/s2 50G Waveform: Half-sine shock plus No electrical discontinuity greater Duration: 11msec than 1 microsecond shall occur. No. of Drops : 3 drops each to normal and reversed directions of X,Y and Z See note. axes, totally 18 drops, passing DC 1mA current during the test. Environmental Requirements 11 Temperature Life (Heat Aging) See note. 12 Thermal Shock See note. 13 Humidity-Temperature Cycle See note. 14 Salt Spray Solderability 15 16 Resistance to Reflow Soldering Heat See note. The inspected area of each lead must have 95% solder coverage minimum. See note. Mated Connector 85C°, 250 hours Mated Connector -55+/-3C° (30 minutes), +85+/-2C° (30 minutes) Making this a cycle, repeat 5 cycles Mated Connector 25 – 65C°, 95% R.H., 10 cycles (See Figure 2) Subject mated connectors to 35+/-2C° and 5+/-1% salt condition for 48 hours. After test, rinse the sample with water and recondition the room temperature for 1 hour. Steam Aging Preconditioning: 93°C +3/-5°C, 8 hours ±15 min. Reflow Temperature: 230 - 245°C Reflow Time: 50 - 70 s. JESD22-B102D, Condition C Moisture Soak Preconditioning: 85°C and 85% RH. for 168 hours. Preheat Temp.: 150 – 200°C, 60 – 180 s. Time over liquidus (217°C): 60 – 150 s. Peak Temp.: 260 +0/-5°C, 20 – 40 s. Duration: 3 cycles. Tyco spec. 109-201, Condition B NOTE Shall meet visual requirements, show no physical damage, and meet requirements of additional tests as specified in the Product Qualification and Rrequalification Test Sequence shown in Figure 2. Figure 1 (end) Rev C 3 of 4 108-57273 Humidity-Temperature Cycle Temperature reduced 25°C to –10°C within 10 minutes. Humidity uncontrolled at a temperature less than 25°C. Figure 2 3.6. PRODUCT QUALIFICATION AND REQUALIFICATION TEST Test Examination A Examination of Product 1, 7 Termination Resistance Insulation Resistance 2, 5 Dielectric withstanding 3, 6 Voltage Temperature Rising Connector Mating Force Connector Unmating Force Durability Vibration Physical Shock Temperature Life Thermal Shock Humidity Temperature 4 Cycling Salt Spray Solderability Resistance to Reflow Soldering Heat B C 1, 9 2, 8 1, 6 2, 5 Test Group D E F G Test Sequence (a) 1, 5 1, 5 1, 5 1, 5 2, 4 2, 4 2, 4 2, 4 H I J 1, 3 1, 3 1, 3 2 3, 7 4, 6 5 3 4 3 3 3 3 2 2 Note: (a) Numbers indicate sequence in which tests are performed. Figure 3 Rev C 4 of 4