APPLICATION NOTES Ⅰ、Soldering General Notes 1.We recommend manual soldering operations only 5.After soldering, allow at least three minutes for the for repair and rework purposes.The soldering iron component to cool to room temperature befpre fur- should not exceed 30W in power. The maximum ther operations. soldering temperature is 300ºC for Pb-Sn solder Recommended PCB pin hole diameters for display displays.For blue (425-480),and blue-green(515-525) products are list below: LEDs, the maximun soldering iron on the com- Round pin type: 2xpin diameters ponent for more than 3 seconds. Square pin type: 2.The tip of soldering iron should never touch the lens epoxy. nent is heated above 85ºC otherwise internal wire Recommended Wave Soldering Profiles For Kingbright Through-Hole Products bonds may be damaged. 1.Wave Soldering Profile With Pb-Sn Solder 3.Do not apply stress to the leads when the compo- 4.SMD products must be mounted according to specified soldering pad patterns. Refer to the product datasheet for details.Solder paste must be evenly applied to each soldering pad to insure proper bonding and positioning of the component. Http://www.foryard.com Page ： 1/5 APPLICATION NOTES Ⅱ、Soldering 2.Lead-Free Wave Soldering Profile 2. Lead-Free Reflow Soldering Profile No more than two soldering passes with the recommended profile. Recommended Reflow Soldering Profiles Static Electricity and Voltage Spikes in For FORYARD SMD Products InGaN/GaN Products 1.Reflow Soldering Profile With Pb-Sn Solder No more than two soldering passes with the recommended profile. InGaN/GaN products are sensitive to electrostatic discharge (ESD) and other transient voltage spikes. ESD and voltage spikes can affect the component's reliability, increase reverse current, and decrease forward voltage. This may result in reduced light intensity or cause component failure. FORYARD InGaN/GaN products are stored in antistatic packaging for protection during transport and storage. Please note the anti-static measures below when FORYARD InGaN/GaN products. Http://www.foryard.com Page ： 2/5 APPLICATION NOTES Ⅲ、Soldering Design Precautions Products using InGa/GaN components must incor- porate protection circuitry to prevent ESD and voltage spikes from reaching the vulnerable component. ESD Protection During Production Static discharge can result when static-sensitive products come in contact with the operator or other conductors.The following procedures may decrease the possibility of ESD damage: 1.Minimize friction between the product and surroundings to avoid static buildup. 2.ALL production machinery and test instruments must be electrically grounded. 3.Operators must wear anti-static bracelets. 4.Wear anti-static suit when entering work areas with conductive machinery. 5.Set up ESD protection areas using grounded metal plating for component handling. 6.ALL workstations that hangle IC and ESD-sensitive components must maintain an electrostatic potential of 150V or less. 7.Maintain a humidity level of 50% or higher in production areas. 8.Use anti-static packaging for transport and storage. 9.ALL anti-static equipment and procedures should be periodically inspected and evaluated for proper functionality. LED Mounting Method 1.The lead pitch of the LED must match the pitch of the mounting holes on the PCB during component placement. Lead-forming may be required to insure the lead pitch matches the hole pitch.Refer to the figure below for proper lead forming procedures. (Fig.1) Http://www.foryard.com Page ： 3/5 APPLICATION NOTES Ⅳ、Soldering 2.When soldering wire to the LED, use individual 3.Donot stress the LED lens during lead-forming in heat-shrink tubing to insulate the exposed leads to order to prevent fractures in the lens epoxy and prevent accidental contact short-circuit.(Fig.2) damage the internal structures. 4.During lead forming, use tools or jigs to hold the leads securely so that the bending force will not be transmitted to the LED lens and its internal structures. DO not perform lead forming once the component has been mounted onto the PCB.(Fig.7) 3.Use stand-offs(Fig.3) or spacers (Fig.4) to securely position the LED above the PCB. 5.Do not bend the leads more than twice.(Fig.8) Lead Forming Procedures 1.Maintain a minimum of 2mm clearance between the base of the LED lens and the first lead bend.(Fig.5 and 6 ) 6. After soldering or other high-temperature assembly, allow the LED to cool down to 50ºC before applying outside force (Fig.9). In general, avoid placing excess force on the LED to avoid demage. For any questions please consult with FORYARD representative for proper hangling procedures. 2.Lead forming or bending must be performed before soldering, never during or after soldering. Http://www.foryard.com Page ： 4/5 APPLICATION NOTES Ⅴ、Soldering Cleaning 1.Donot use harsh organic solvents such as trichloro- 4.During soldering, SMD components should be ethylene,acetone,Chlorosen, and Diflon S3MC for mounted such that the leads are placed perpendic- cleaning because they may cloud or damage the ular to the direction of PCB travel to insure the sol- LED lens. der on each lead melts simultaneously during re- 2.lsopropyl alcohol or deionized water are recom- flow. mended solvents for cleaning. 3.Special attention should be taken if other chemicals are used for cleaning because other solvents may damage the epoxy in the lens or housing. 4.The cleaning process should take place at room temperature and the devices should not be washed for more than one minute 5.When water is used in the cleaning process, immediately remove excess moisture from the LED via forced-air drying afterwards. Miscellaneous Design Notes 5.Optimal usage of high-power LED devices requires 1.Protective current-limiting resistors may be neces- careful design by the end-user to optimize heat dis- sary to operate the LEDs within the specified range. sipation, such as increasing the size of the metal backing around the soldering pad. Refer to the 2.LEDs mounted in parallel should each be placed in product datasheet for specific design recommenda- series with its own current-limiting resistor. tions regarding heat dissipation. 3.The driving circuit should be designed to avoid re- 6.High temperatures can reduce device performance verse voltages and transient voltage spikes when the circuit is powered up or shut down. and reliability Keep LED devices away from heat Http://www.foryard.com sources for best performance. Page ： 5/5