DMP2066LDM-7 - Diodes Incorporated

DMP2066LDM
P-CHANNEL ENHANCEMENT MODE MOSFET
Features
•
•
•
•
•
•
•
•
Low RDS(ON):
•
40 mΩ @VGS = -4.5V
•
70 mΩ @VGS = -2.5V
Low Input/Output Leakage
Lead Free By Design/RoHS Compliant (Note 1)
"Green" Device (Note 2)
Qualified to AEC-Q101 Standards for High Reliability
•
•
Case: SOT26
Case Material – Molded Plastic. UL Flammability Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: Finish - Matte Tin Solderable per MIL-STD-202,
Method 208
Terminal Connections: See Diagram
Weight: 0.008 grams (approximate)
SOT26
Top View
D
D
S
D
D
G
Top View
Internal Schematic
Ordering Information (Note 3)
Part Number
DMP2066LDM-7
DMP2066LDMQ-7
Notes:
Case
SOT26
SOT26
Packaging
3000/Tape & Reel
3000/Tape & Reel
1. No purposefully added lead.
2. Diodes Inc's "Green" policy can be found on our website at http://www.diodes.com.
3. For packaging details, go to our website at http://www.diodes.com.
Marking Information
DMC
Date Code Key
Year
Code
Month
Code
2008
V
Jan
1
DMP2066LDM
Document number: DS31464 Rev. 4 - 2
2009
W
Feb
2
Mar
3
YM
NEW PRODUCT
•
Mechanical Data
DMC = Product Type Marking Code
YM = Date Code Marking
Y = Year (ex: V = 2008)
M = Month (ex: 9 = September)
2010
X
Apr
4
2011
Y
May
5
Jun
6
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2012
Z
Jul
7
2013
A
Aug
8
Sep
9
2014
B
Oct
O
2015
C
Nov
N
Dec
D
December 2011
© Diodes Incorporated
DMP2066LDM
NEW PRODUCT
Maximum Ratings @TA = 25°C unless otherwise specified
Characteristic
Drain-Source Voltage
Gate-Source Voltage
Drain Current (Note 4) Continuous
Symbol
VDSS
VGSS
TA = 25°C
TA = 70°C
Value
-20
±12
-4.6
-3.7
-18
2.0
ID
Pulsed Drain Current (Note 5)
Body-Diode Continuous Current (Note 4)
IDM
IS
Unit
V
V
A
A
A
Thermal Characteristics
Characteristic
Total Power Dissipation (Note 4)
Thermal Resistance, Junction to Ambient (Note 4); Steady-State
Operating and Storage Temperature Range
Symbol
PD
RθJA
TJ, TSTG
Value
1.25
100
-55 to +150
Unit
W
°C/W
°C
Electrical Characteristics @TA = 25°C unless otherwise specified
Characteristic
STATIC PARAMETERS
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Body Leakage Current
Gate Threshold Voltage
On State Drain Current (Note 6)
Symbol
Min
Typ
Max
Unit
BVDSS
IDSS
IGSS
VGS(th)
ID (ON)
-20
⎯
⎯
-0.6
-15
V
μA
nA
V
A
RDS (ON)
⎯
⎯
-1
±100
-1.2
⎯
40
70
Forward Transconductance (Note 6)
Diode Forward Voltage (Note 6)
Maximum Body-Diode Continuous Current (Note 4)
DYNAMIC PARAMETERS (Note 7)
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
gFS
VSD
IS
⎯
-0.5
⎯
⎯
⎯
-0.96
⎯
29
55
9
-0.72
⎯
Ciss
Coss
Crss
Gate Resistance
TJ = 25°C
Static Drain-Source On-Resistance (Note 6)
SWITCHING CHARACTERISTICS
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Notes:
mΩ
Test Condition
ID = -250μA, VGS = 0V
VDS = -20V, VGS = 0V
VDS = 0V, VGS = ±12V
VDS = VGS, ID = -250μA
VGS = -4.5V, VDS = -5V
VGS = -4.5V, ID = -4.6A
VGS = -2.5V, ID = -3.8A
VDS = -10V, ID = -4.6A
IS = -2.1A, VGS = 0V
⎯
⎯
-1.4
1.7
S
V
A
⎯
⎯
⎯
820
200
160
⎯
⎯
⎯
pF
pF
pF
VDS = -15V, VGS = 0V
f = 1.0MHz
RG
⎯
2.5
⎯
Ω
VDS = 0V, VGS = 0V
f = 1.0MHz
QG
QGS
QGD
td(on)
tr
td(off)
tf
⎯
⎯
⎯
⎯
⎯
⎯
⎯
10.1
1.5
4.3
4.4
9.9
28.0
23.4
⎯
⎯
⎯
⎯
⎯
⎯
⎯
nC
VDS = -10V, VGS = -4.5V,
ID = -4.5A
ns
VDS = -10V, VGS = -4.5V,
ID = -1A, RG = 6.0Ω
⎯
4. Device mounted on 1"x1", FR-4 PC board with 2 oz. Copper and test pulse width t ≤10s.
5. Repetitive Rating, pulse width limited by junction temperature.
6. Test pulse width t = 300μs.
7. Guaranteed by design. Not subject to production testing.
DMP2066LDM
Document number: DS31464 Rev. 4 - 2
2 of 5
www.diodes.com
December 2011
© Diodes Incorporated
DMP2066LDM
30
20
VGS = 10V
VGS = 4.5V
VDS = 5.0V
16
ID , DRAIN CURRENT (A)
ID, DRAIN CURRENT (A)
VGS = 3.0V
18
12
12
VGS = 2.5V
6
8
4
TA = 150°C
VGS = 2.0V
0
5
1
0.1
VGS = 2.5V
VGS = 4.5V
VGS = 10V
0.01
0
0
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω)
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω)
0.5 1 1.5 2 2.5 3 3.5 4 4.5
VDS, DRAIN-SOURCE VOLTAGE (V)
Fig. 1 Typical Output Characteristic
6
12
18
24
ID, DRAIN-SOURCE CURRENT (A)
Fig. 3 Typical On-Resistance
vs. Drain Current and Gate Voltage
VGS = 10V
ID = 10A
1.2
VGS = 4.5V
ID = 5A
1.0
0.8
0.6
-50 -25
0
25
50
75 100 125 150
TA, AMBIENT TEMPERATURE (°C)
Fig. 5 Normalized On-Resistance vs. Ambient Temperature
DMP2066LDM
Document number: DS31464 Rev. 4 - 2
4
VGS = 4.5V
0.06
TA = 150°C
TA = 125°C
0.04
TA = 85°C
TA = 25°C
TA = -55°C
0.02
0
0
6
12
18
24
-ID, DRAIN CURRENT (A)
Fig. 4 Typical On-Resistance
vs. Drain Current and Temperature
30
2.4
VGS(TH), GATE THRESHOLD VOLTAGE (V)
1.4
0.5
1
1.5
2
2.5
3
3.5
VGS, GATE-SOURCE VOLTAGE (V)
Fig. 2 Typical Transfer Characteristic
0.08
30
1.6
TA = 25°C
TA = -55°C
0
0
T A = 85°C
TA = 125°C
VGS = 1.5V
RDS(ON), DRAIN-SOURCE
ON-RESISTANCE (NORMALIZED)
NEW PRODUCT
24
2.0
1.6
1.2
0.8
ID = 1mA
ID = 250µA
0.4
0
-50 -25
0
25
50
75 100 125 150
TA, AMBIENT TEMPERATURE (°C)
Fig. 6 Gate Threshold Variation vs. Ambient Temperature
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December 2011
© Diodes Incorporated
DMP2066LDM
10,000
20
T A = 25°C
f = 1MHz
CT, TOTAL CAPACITANCE (pF)
IS, SOURCE CURRENT (A)
12
1,000
8
Ciss
4
Coss
Crss
100
0
0
0.2
0.4
0.6
0.8
1
VSD, SOURCE-DRAIN VOLTAGE (V)
Fig. 7 Diode Forward Voltage vs. Current
0
1.2
5
10
15
VDS, DRAIN-SOURCE VOLTAGE (V)
Fig. 8 Typical Total Capacitance
20
1
r(t), TRANSIENT THERMAL RESISTANCE
NEW PRODUCT
16
D = 0.7
D = 0.5
D = 0.3
0.1
D = 0.1
D = 0.9
D = 0.05
RθJA(t) = r(t) * RθJA
RθJA = 120°C/W
D = 0.02
0.01
P(pk)
D = 0.01
t1
t2
TJ - TA = P * RθJA(t)
Duty Cycle, D = t1/t2
D = 0.005
D = Single Pulse
0.001
0.00001
0.0001
0.001
0.01
0.1
1
t1, PULSE DURATION TIME (s)
10
100
1,000
Fig. 9 Transient Thermal Response
Package Outline Dimensions
A
B C
H
K
J
DMP2066LDM
Document number: DS31464 Rev. 4 - 2
M
D
L
4 of 5
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SOT26
Dim Min Max Typ
A
0.35 0.50 0.38
B
1.50 1.70 1.60
C
2.70 3.00 2.80
D
⎯
⎯ 0.95
H
2.90 3.10 3.00
J
0.013 0.10 0.05
K
1.00 1.30 1.10
L
0.35 0.55 0.40
M
0.10 0.20 0.15
0°
8°
α
⎯
All Dimensions in mm
December 2011
© Diodes Incorporated
DMP2066LDM
Suggested Pad Layout
NEW PRODUCT
E
Z
E
Dimensions Value (in mm)
Z
3.20
G
1.60
X
0.55
Y
0.80
C
G
C
E
2.40
0.95
Y
X
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DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
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without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
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indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2011, Diodes Incorporated
www.diodes.com
DMP2066LDM
Document number: DS31464 Rev. 4 - 2
5 of 5
www.diodes.com
December 2011
© Diodes Incorporated