T5V0DLP - Diodes Incorporated

T5V0DLP
ADVANCE INFORMATION
LOW CAPACITANCE SURFACE MOUNT DUAL TVS
Features
Mechanical Data

25 Watts Peak Pulse Power (tp = 8x20µs)


IEC 61000-4-2 (ESD): Air – 15kV, Contact – 8kV


IEC61000-4-4 (EFT): 40A 5/50ns

Dual TVS for protection of up to two data lines

Moisture Sensitivity: Level 1 per J-STD-020

Low Capacitance (9pF typ), suitable for USB2.0 dataline

Terminal Connections Indicator: Cathode Bar
protection

Terminals: Finish  NiPdAu over Copper leadframe. Solderable

per MIL-STD-202, Method 208 e4
Weight: 0.0009 grams

Case: X1-DFN1006-3
Case Material: Molded Plastic, "Green" Molding Compound.
UL Flammability Classification Rating 94V-0
Subminiature, low-profile package suitable for portable
applications - case outline of only 1.0 * 0.6 * 0.5mm

Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)

Halogen and Antimony Free. “Green” Device (Note 3)
X1-DFN1006-3
Bottom View
Ordering Information
(Note 4)
Part Number
T5V0DLP-7B
Notes:
Device Schematic
Case
X1-DFN1006-3
Packaging
10,000/Tape & Reel
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
Marking Information
AB
AB = Product Type Marking Code
Bar Denotes
Cathode Side
T5V0DLP
Document number: DS31906 Rev. 3 - 2
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March 2014
© Diodes Incorporated
T5V0DLP
Thermal Characteristics
Characteristic
Value
(Note 5) TA = +25°C
Ppk
25
W
Power dissipation
(Note 5) TA = +25°C
PD
385
mW
Thermal Resistance, Junction to Ambient
(Note 5) TA = +25°C
RθJA
325
°C/W
TJ, TSTG
-55 to +150
°C
Operating and Storage Temperature Range
Unit
Electrical Characteristics (@TA = +25°C, unless otherwise specified.)
Breakdown
Voltage
VBR @ IT
Reverse
Standoff
Voltage
Test
Current
Max. Reverse
Leakage @ VRWM
(Note 6)
Max. Clamping Voltage
VC @ IPP (Note 7)
Max Total
Capacitance CT
(Note 8) VR = 0V
Typical Total
Capacitance CT
(Note 8) VR = 3.3V
VRWM (V)
Min (V)
Max (V)
IT (mA)
IR (µA)
VC (V)
IPP (A)
(pF)
(pF)
5
6.1
8
1.0
0.25
12.5
2
9
4.5
Notes:
5. Device mounted on FR-4 PC board with suggested pad layout, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
6. Short duration pulse test used to minimize self-heating effect.
7. Clamping voltage value is based on an 8x20µs peak pulse current (Ipp) waveform.
8. f = 1MHz
10
100
Peak Value I pp
CT, TOTAL CAPACITANCE (pF)
Ipp, PEAK PULSE CURRENT (%Ipp)
f = 1MHz
Half Value Ipp/2
50
0
0
8
6
4
2
8x20 Waveform
as defined by R.E.A.
20
40
t, TIME (s)
Figure 1 Pulse Waveform
0
60
0
1
2
3
4
5
VR, REVERSE VOLTAGE (V)
Figure 2 Total Capacitance
6
1000
10000
1000
IR, LEAKAGE CURRENT (nA)
IF, INSTANTANEOUS FORWARD CURRENT (mA)
ADVANCE INFORMATION
Symbol
Peak Pulse Power (tp = 8x20µs)
100
100
10
TA = 150°C
TA = 125°C
1
TA = 85°C
TA = 25°C
0.1
T A = -55°C
TA = 150°C
10
T A = 85°C
TA = 25°C
TA = -55°C
1
0.01
0.001
100
300
500
700
900
1100
1300
VF, INSTANTANEOUS FORWARD VOLTAGE (mV)
Figure 3 Typical Forward Characteristics
T5V0DLP
Document number: DS31906 Rev. 3 - 2
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0.1
0
1
2
3
4
5
6
7
VR, REVERSE VOLTAGE (V)
Figure 4 Typical Reverse Characteristics
8
March 2014
© Diodes Incorporated
T5V0DLP
500
PD,POWER DISSIPATION (mW)
ADVANCE INFORMATION
Note 5
400
300
200
100
0
0
40
80
120
160
TA, AMBIENT TEMPERATURE (°C)
Figure 5 Power Derating Curve
200
Package Outline Dimensions
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.
A
A1
D
b1
E
e
b2
L2
L3
X1-DFN1006-3
Dim Min
Max Typ
A
0.47
0.53 0.50
A1
0
0.05 0.03
b1
0.10
0.20 0.15
b2
0.45
0.55 0.50
D
0.95 1.075 1.00
E
0.55 0.675 0.60
e
0.35


L1
0.20
0.30 0.25
L2
0.20
0.30 0.25
L3
0.40


All Dimensions in mm
L1
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for latest version.
C
X1
X
Dimensions
Z
G1
G2
X
X1
Y
C
G2
G1
Y
Z
T5V0DLP
Document number: DS31906 Rev. 3 - 2
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www.diodes.com
Value (in mm)
1.1
0.3
0.2
0.7
0.25
0.4
0.7
March 2014
© Diodes Incorporated
T5V0DLP
ADVANCE INFORMATION
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the
final and determinative format released by Diodes Incorporated.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2014, Diodes Incorporated
www.diodes.com
T5V0DLP
Document number: DS31906 Rev. 3 - 2
4 of 4
www.diodes.com
March 2014
© Diodes Incorporated