Datasheet - Diodes Incorporated

DMN2016LHAB
DUAL N-CHANNEL ENHANCEMENT MODE MOSFET
Features
V(BR)DSS
RDS(on)max
20V
15.5mΩ @ VGS = 4.5V
16.5mΩ @ VGS = 4.0V
19mΩ @ VGS = 3.1V
20mΩ @ VGS = 2.5V
30mΩ @ VGS = 1.8V
ID
TA = +25°C
7.5A
7.3A
6.9A
6.7A
5.4A
•
Low On-Resistance
•
Low Gate Threshold Voltage
•
Low Input Capacitance
•
Fast Switching Speed
•
ESD Protected Gate
•
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
•
Halogen and Antimony Free. “Green” Device (Note 3)
Description
Mechanical Data
This new generation MOSFET has been designed to minimize the onstate resistance (RDS(ON)) and yet maintain superior switching
•
•
performance, making it ideal for high efficiency power management
applications.
Applications
•
Power Management Functions
•
Battery Pack
•
Load Switch
Case: U-DFN2030-6
Case Material: Molded Plastic, “Green” Molding Compound. UL
Flammability Classification Rating 94V-0
•
Moisture Sensitivity: Level 1 per J-STD-020
•
Terminals: Finish – NiPdAu over Copper leadframe. Solderable
•
per MIL-STD-202, Method 208 e4
Weight: 0.012 grams (approximate)
Bottom Drain Contact
G1
S1
S1
U-DFN2030-6
G2
D1/D2
G1
D2
D1
S2
S2
D1/D2
G2
G1
S1
ESD PROTECTED TO 2kV
S1
Gate Protection
Diode
S1
Gate Protection
Diode
S2
Bottom View
G2
S2
S2
Top View
Pin Configuration
Ordering Information (Note 4)
Part Number
DMN2016LHAB-7
Notes:
Case
U-DFN2030-6
Packaging
3,000 / Tape & Reel
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
Marking Information
YYWW
ADVANCE
INFORMATION
NEW
PRODUCT
Product Summary
26W = Product Type Marking Code
YYWW = Date Code Marking
YY = Last digit of year (ex: 12 for 2012)
WW = Week code (01 to 53)
26W
DMN2016LHAB
Document number: DS36133 Rev. 5 - 2
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July 2014
© Diodes Incorporated
DMN2016LHAB
Maximum Ratings (@TA = +25°C, unless otherwise specified.)
ADVANCE
INFORMATION
NEW
PRODUCT
Characteristic
Symbol
VDSS
VGSS
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current (Note 6) VGS = 4.5V
TA = +25°C
TA = +70°C
TA = +25°C
TA = +70°C
Steady
State
t < 10s
Value
20
±12
7.5
5.8
ID
A
7.7
6.0
45
ID
Pulsed Drain Current (10μs pulse, duty cycle = 1% )
Unit
V
V
IDM
A
A
Thermal Characteristics
Characteristic
Total Power Dissipation (Note 5)
Thermal Resistance, Junction to Ambient (Note 5)
Total Power Dissipation (Note 6)
Thermal Resistance, Junction to Ambient (Note 6)
Symbol
TA = +25°C
TA = +70°C
Steady State
t < 10s
TA = +25°C
TA = +70°C
Steady State
t < 10s
Thermal Resistance, Junction to Case
Operating and Storage Temperature Range
Value
1.2
0.75
106
100
1.65
1
78
72
11.4
-55 to 150
PD
RθJA
PD
RθJA
RθJC
TJ, TSTG
Units
W
°C/W
W
°C/W
°C
Electrical Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current TJ = +25°C
Gate-Source Leakage
ON CHARACTERISTICS (Note 7)
Gate Threshold Voltage
Symbol
Min
Typ
Max
Unit
BVDSS
IDSS
IGSS
20
—
—
—
—
—
—
1.0
±10
V
μA
μA
VGS = 0V, ID = 250μA
VDS = 20V, VGS = 0V
VGS = ±8V, VDS = 0V
VGS(th)
0.5
RDS(ON)
—
|Yfs|
VSD
—
—
1.1
15.5
16.5
19
20
30
—
1.0
V
Static Drain-Source On-Resistance
0.71
13
13.5
14
15
21
25
0.75
VDS = VGS, ID = 250μA
VGS = 4.5V, ID = 4.0A
VGS = 4.0V, ID = 4.0A
VGS = 3.1V, ID = 4.0A
VGS = 2.5V, ID = 4.0A
VGS = 1.8V, ID = 3.5A
VDS = 5V, ID = 6A
VGS = 0V, IS = 1A
Ciss
Coss
Crss
Rg
Qg
Qg
Qgs
Qgd
tD(on)
tr
tD(off)
tf
—
—
—
—
—
—
—
—
—
—
—
—
1550
166
145
1.37
8.4
16
2.3
2.5
6.9
15.5
40.9
12
—
—
—
—
—
—
—
—
—
—
—
—
Forward Transfer Admittance
Diode Forward Voltage
DYNAMIC CHARACTERISTICS (Note 8)
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Gate Resistance
Total Gate Charge (VGS = 2.5V)
Total Gate Charge (VGS = 4.5V)
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Turn-On Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
Notes:
mΩ
S
V
pF
pF
pF
Ω
nC
nC
nC
nC
ns
ns
ns
ns
Test Condition
VDS = 10V, VGS = 0V,
f = 1.0MHz
VDS = 0V, VGS = 0V, f = 1MHz
VDS = 10V, ID = 6A
VDD = 10V, RL = 1.7Ω,
VGS = 5.0V, RG = 3Ω
5. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout
6. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper pad
7. Repetitive rating, pulse width limited by junction temperature
8. Guaranteed by design. Not subject to product testing
DMN2016LHAB
Document number: DS36133 Rev. 5 - 2
2 of 6
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July 2014
© Diodes Incorporated
DMN2016LHAB
30
18
20
VGS = 1.8V
15
VGS = 1.5V
10
0
0.5
1.0
1.5
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 1 Typical Output Characteristic
10
8
6
TA = 150°C
TA = 125°C
0.016
0.014
VGS = 2.5V
0.010
VGS = 4.5V
0.008
0.006
0.004
0
5
10
15
20
25
ID, DRAIN-SOURCE CURRENT (A)
Figure 3 Typical On-Resistance vs.
Drain Current and Gate Voltage
VGS = 4.5V
ID = 5A
VGS = 3.6V
ID = 3A
1.4
VGS = 2 .5V
ID = 1A
1.2
1.0
0.8
0.6
-50
-25
0
25
50
75 100 125 150
TJ, JUNCTION TEMPERATURE (°C)
Figure 5 On-Resistance Variation with Temperature
DMN2016LHAB
Document number: DS36133 Rev. 5 - 2
T A = -55°C
0
0.5
1.0
1.5
VGS, GATE-SOURCE VOLTAGE (V)
Figure 2 Typical Transfer Characteristics
2.0
VGS = 4.5V
T A = 150°C
0.015
TA = 125°C
T A = 85°C
0.010
TA = 25°C
TA = -55°C
0.005
0
30
1.8
1.6
T A = 85°C
TA = 25°C
0.020
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω)
0.018
0.012
0
2.0
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω)
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω)
12
2
VGS = 1.2V
RDS(ON), DRAIN-SOURCE
ON-RESISTANCE (NORMALIZED)
14
4
5
0
VDS = 5.0V
16
ID, DRAIN CURRENT (A)
ID, DRAIN CURRENT (A)
25
ADVANCE
INFORMATION
NEW
PRODUCT
20
VGS = 2.5V
VGS = 3.0V
VGS = 3.5V
VGS = 4.0V
VGS = 4.5V
VGS = 10V
0
5
10
15
ID, DRAIN CURRENT (A)
Figure 4 Typical On-Resistance vs.
Drain Current and Temperature
20
0.020
0.018
VGS = 2.5 V
ID = 1A
0.016
VGS = 3.6V
ID = 3A
0.014
0.012
VGS = 4.5V
ID = 5A
0.010
0.008
0.006
0.004
-50
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-25
0
25
50
75 100 125 150
TJ, JUNCTION TEMPERATURE (°C)
Figure 6 On-Resistance Variation with Temperature
July 2014
© Diodes Incorporated
DMN2016LHAB
VGS GATE THRESHOLD VOLTAGE (V)
CT, JUNCTION CAPACITANCE (pF)
10
Ciss
1,000
C oss
100
Crss
f = 1MHz
10
0
2
4
6
8 10 12 14 16 18
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 7 Typical Junction Capacitance
VDS = 10V
ID = 6 A
8
6
4
2
0
20
100
0
5
10
15
20
25
30
35
Qg, TOTAL GATE CHARGE (nC)
Figure 8 Gate Charge
40
100
RDS(on)
Limited
R DS(on)
Limited
10
ID, DRAIN CURRENT (A)
ID, DRAIN CURRENT (A)
DC
PW = 10s
1
PW = 1s
PW = 100ms
PW = 10ms
PW = 1ms
0.1 TJ(max) = 150°C
PW = 100µs
TA = 25°C
VGS = 12V
Single Pulse
0.01 DUT on 1 * MRP Board
0.1
1
10
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 9 SOA, Safe Operation Area
1
r(t), TRANSIENT THERMAL RESISTANCE
ADVANCE
INFORMATION
NEW
PRODUCT
1,000
100
10
DC
1
PW = 10s
PW = 1s
PW = 100ms
PW = 10ms
PW = 1ms
0.1 T
J(max) = 150°C
PW = 100µs
TA = 60°C
VGS = 12V
Single Pulse
0.01 DUT on 1 * MRP Board
0.1
1
10
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 10 SOA, Safe Operation Area
100
D = 0.9
D = 0.7
D = 0.5
D = 0.3
0.1
D = 0.1
D = 0.05
D = 0.02
0.01
D = 0.01
RθJA(t) = r(t) * RθJA
RθJA = 100°C/W
Duty Cycle, D = t1/ t2
D = 0.005
D = Single Pulse
0.001
0.00001
0.0001
DMN2016LHAB
Document number: DS36133 Rev. 5 - 2
0.001
0.01
0.1
1
t1, PULSE DURATION TIME (sec)
Figure 11 Transient Thermal Resistance
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10
100
1,000
July 2014
© Diodes Incorporated
DMN2016LHAB
Package Outline Dimensions
ADVANCE
INFORMATION
NEW
PRODUCT
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.
A1
A3
A
U-DFN2030-6
Type B
Dim Min Max Typ
A
0.55 0.65 0.60
A1
0
0.05 0.02
A3
0.15
b
0.25 0.35 0.30
D
1.95 2.05 2.00
D2 1.40 1.60 1.50
E
2.95 3.05 3.00
E2 1.74 1.94 1.84
e
0.65
L
0.28 0.38 0.33
Z
0.20
All Dimensions in mm
Seating Plane
D
e
(Pin #1 ID)
E2
E
L
D2
b
Z (4x)
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
X2
Y
G
Dimensions
C
G
X
X1
X2
Y
Y1
Y2
X1
Y2
Y1
C
DMN2016LHAB
Document number: DS36133 Rev. 5 - 2
Value
(in mm)
0.650
0.150
0.400
1.600
1.700
0.530
1.940
3.300
X
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DMN2016LHAB
ADVANCE
INFORMATION
NEW
PRODUCT
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
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This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the
final and determinative format released by Diodes Incorporated.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2014, Diodes Incorporated
www.diodes.com
DMN2016LHAB
Document number: DS36133 Rev. 5 - 2
6 of 6
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July 2014
© Diodes Incorporated