DMP2160UFDBQ NEWPRODUCT Product Summary Description

DMP2160UFDBQ
DUAL P-CHANNEL ENHANCEMENT MODE MOSFET
Product Summary
Features
V(BR)DSS
RDS(ON) max
ID MAX
TA = +25°C

Low On-Resistance

Low Gate Threshold Voltage, -0.9V Max
-20V
70mΩ @ VGS = -4.5V
85mΩ @ VGS = -2.5V
-3.8A
-3.3A

Fast Switching Speed

Low Input/Output Leakage

Low Profile, 0.5mm Max Height

Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)

Halogen and Antimony Free. “Green” Device (Note 3)

Qualified to AEC-Q101 Standards for High Reliability

PPAP Capable (Note 4)
NEW PRODUCT
Description
This MOSFET is designed to minimize the on-state resistance
(RDS(on)) and yet maintain superior switching performance, making it
ideal for high efficiency power management applications.
Mechanical Data
Applications

Load Switch

Power Management Functions

Portable Power Adaptors
U-DFN2020-6
Type B
D
G
S
3
2
1

Case: U-DFN2020-6 Type B

Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0

Moisture Sensitivity: Level 1 per J-STD-020

Terminal Connections: See Diagram

Terminals: Finish – NiPdAu Annealed over Copper Leadframe.
Solderable per MIL-STD-202, Method 208 e4

Weight: 0.0065 grams (Approximate)
D2
D1
S2
G2
D2
D1
D2
4
5
6
S
G
D
G1
S1
Pin1
G2
G1
D1
Top View
Internal Schematic
Bottom View
S2
S1
Q1 P-CHANNEL
Q2 P-CHANNEL
Internal Schematic
Ordering Information (Note 5)
Part Number
DMP2160UFDBQ-7
Notes:
Case
U-DFN2020-6 Type B
Packaging
3000/Tape & Reel
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. Automotive products are AEC-Q101 qualified and are PPAP capable. Automotive, AEC-Q101 and standard products are electrically and thermally the
same, except where specified. For more information, please refer to http://www.diodes.com/quality/product_grade_definitions/
5. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
DMP2160UFDBQ
Document Number: DS37546 Rev. 1 - 2
1 of 6
www.diodes.com
January 2015
© Diodes Incorporated
DMP2160UFDBQ
Marking Information
NEW PRODUCT
Date Code Key
Year
Code
2008
V
2009
W
Month
Code
Jan
1
Feb
2
2010
X
Mar
3
2011
Y
Apr
4
YM
P2
P2 = Marking Code
YM = Date Marking
Y = Year (ex: V = 2008)
M = Month (ex: 9 = September)
Dot denotes Pin 1
2012
Z
May
5
2013
A
Jun
6
2014
B
Jul
7
2015
C
Aug
8
2016
D
Sep
9
Oct
O
2017
E
2018
F
Nov
N
Dec
D
Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Characteristic
Drain-Source Voltage
Gate-Source Voltage
Drain Current (Note 6)
Pulsed Drain Current (Note 7)
Symbol
VDSS
VGSS
ID
IDM
Value
-20
±12
-3.8
-13
Units
V
V
A
A
Value
1.4
89
-55 to +150
Unit
W
°C/W
°C
Thermal Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
Power Dissipation (Note 6)
Thermal Resistance, Junction to Ambient
Operating and Storage Temperature Range
Electrical Characteristics
(@TA = +25°C, unless otherwise specified.)
Characteristic
OFF CHARACTERISTICS (Note 8)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Source Leakage
ON CHARACTERISTICS (Note 8)
Gate Threshold Voltage
Static Drain-Source On-Resistance
Forward Transfer Admittance
Diode Forward Voltage (Note 8)
DYNAMIC CHARACTERISTICS
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Symbol
PD
RJA
TJ, TSTG
Symbol
Min
Typ
Max
Unit
BVDSS
IDSS
-20








-1
100
800
V
A
VGS(th)
-0.45

-0.9
V
RDS (ON)



54
68
86
70
85

mΩ
VDS = VGS, ID = -250A
VGS = -4.5V, ID = -2.8A
VGS = -2.5V, ID = -2.0A
|Yfs|
VSD


8
0.7

-1.2
S
V
VGS = -1.8V, ID = -1.0A
VDS = -5V, ID = -2.8A
VGS = 0V, IS = -1.6A
Ciss
Coss
Crss



536
68
59
8.72



pF
pF
pF
VDS = -10V, VGS = 0V
f = 1.0MHz


Ω
VDS = 0V, VGS = 0V, f = 1MHz
nC


nC
nC

ns



ns
ns
ns
IGSS
Total Gate Charge
Qg


Gate-Source Charge
Gate-Drain Charge
Qgs
Qgd


Turn-On Delay Time
tD(on)

Turn-On Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
tr
Gate Resistance
Notes:
6.
7.
8.
Rg
tD(off)
tf



6.5
0.8
1.4
11.51
12.09
55.34
27.54
nA
Test Condition
VGS = 0V, ID = -250µA
VDS = -20V, VGS = 0V
VGS = 8V, VDS = 0V
VGS = 12V, VDS = 0V
VGS = -4.5V, VDD = -10V,
ID = -1.5A
VGEN = -4.5V, VDD = -10V,
RL = 10Ω, RG = 6Ω
Device mounted on FR-4 PCB, on minimum recommended, 2oz Copper pad layout.
Repetitive rating, pulse width limited by junction temperature.
Short duration pulse test used to minimize self-heating effect.
DMP2160UFDBQ
Document Number: DS37546 Rev. 1 - 2
2 of 6
www.diodes.com
January 2015
© Diodes Incorporated
DMP2160UFDBQ
10
10
VGS = -8.0V
VDS = -5V
VGS = -4.5V
-ID, DRAIN CURRENT (A)
-ID, DRAIN CURRENT (A)
8
VGS = -2.5V
VGS = -2.0V
6
VGS = -1.5V
4
VGS = -1.0V
0
0
4
TA = 150°C
VGS = -1.2V
1
2
3
4
-VDS, DRAIN-SOURCE VOLTAGE (V)
Fig. 1 Typical Output Characteristics
5
0.1
0.06
VGS = -2.5V
VGS = -4.5V
0.04
0.02
0
0
1
2
3
4
5
6
7
-ID, DRAIN CURRENT (A)
Fig. 3 Typical On-Resistance
vs. Drain Current and Gate Voltage
VGS = -2.5V
ID = -2A
VGS = -4.5V
ID = -5A
1.0
0.8
-25
0
25
50
75 100 125 150
TJ, JUNCTION TEMPERATURE (°C)
Fig. 5 On-Resistance Variation with Temperature
DMP2160UFDBQ
Document Number: DS37546 Rev. 1 - 2
0.12
0.1
TA = 150°C
TA = 125°C
0.08
TA = 85°C
0.06
TA = 25°C
0.04
TA = -55°C
0.02
0
0
RDS(ON), DRAIN-SOURCE ON-RESISTANCE ()
1.4
0.6
-50
2
0.14
8
1.6
1.2
1
1.5
-VGS, GATE SOURCE VOLTAGE (V)
Fig. 2 Typical Transfer Characteristics
0.12
VGS = -1.8V
TA = 85°C
TA = -55°C
0
0.5
0.14
0.08
TA = 125°C
TA = 25°C
R DS(ON), DRAIN-SOURCE ON-RESISTANCE ()
RDS(ON), DRAIN-SOURCE ON-RESISTANCE ()
6
2
2
R DS(ON), DRAIN-SOURCE
ON-RESISTANCE (NORMALIZED)
NEW PRODUCT
8
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1
2
3
4
5
6
7
-ID, DRAIN CURRENT (A)
Fig. 4 Typical Drain-Source On-Resistance
vs. Drain Current and Temperature
8
0.11
0.09
VGS = -2.5V
ID = -2A
0.07
VGS = -4.5V
ID = -5A
0.05
0.03
-50
-25
0
25
50
75 100 125 150
TJ, JUNCTION TEMPERATURE (°C)
Fig. 6 On-Resistance Variation with Temperature
January 2015
© Diodes Incorporated
DMP2160UFDBQ
10,000
1
-VGS(TH), GATE THRESHOLD VOLTAGE (V)
1,000
Ciss
100
Coss
Crss
0
4
8
12
16
-V DS, DRAIN-SOURCE VOLTAGE (V)
Fig. 7 Typical Capacitance
0.9
0.8
0.7
0.6
ID = -1mA
0.5
ID = -250µA
0.4
0.3
0.2
-50
10
-25
0
25
50
75 100 125 150
TA, AMBIENT TEMPERATURE (°C)
Fig. 8 Gate Threshold Variation vs. Ambient Temperature
20
10,000
-IDSS, LEAKAGE CURRENT (nA)
10
-IS, SOURCE CURRENT (A)
8
6
TA = 25°C
4
2
TA = 150°C
1,000
TA = 125°C
TA = 85°C
100
0
10
TA = 25°C
1
0
0
4
8
12
16
20
-VDS, DRAIN-SOURCE VOLTAGE (V)
Fig. 10 Typical Drain-Source Leakage Current vs. Voltage
0.2 0.4 0.6 0.8
1
1.2
1.4 1.6
-V SD, SOURCE-DRAIN VOLTAGE (V)
Fig. 9 Diode Forward Voltage vs. Current
1
r(t), TRANSIENT THERMAL RESISTANCE
NEW PRODUCT
C, CAPACITANCE (pF)
f = 1MHz
D = 0.7
D = 0.5
D = 0.3
0.1
D = 0.9
D = 0.1
D = 0.05
RJA(t) = r(t) * RJA
RJA = 146°C/W
D = 0.02
0.01
P(pk)
D = 0.01
t2
TJ - TA = P * RJA(t)
Duty Cycle, D = t 1/t2
D = 0.005
0.001
0.00001
t1
0.0001
0.001
0.01
0.1
1
t1, PULSE DURATION TIME (s)
10
100
1,000
Fig. 11 Transient Thermal Response
DMP2160UFDBQ
Document Number: DS37546 Rev. 1 - 2
4 of 6
www.diodes.com
January 2015
© Diodes Incorporated
DMP2160UFDBQ
Package Outline Dimensions
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for the latest version.
A
A3
SEATING PLANE
A1
NEW PRODUCT
D
Pin#1 ID
D2
z
d
E
E2
f
f
L
e
b
U-DFN2020-6
Type B
Dim
Min
Max Typ
A
0.545 0.605 0.575
A1
0
0.05 0.02
A3
0.13


b
0.20 0.30 0.25
D
1.95 2.075 2.00
d
0.45


D2
0.50 0.70 0.60
e
0.65


E
1.95 2.075 2.00
E2
0.90 1.10 1.00
f
0.15


L
0.25 0.35 0.30
z

 0.225
All Dimensions in mm
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
C
Y
Dimensions
Z
G
G1
X1
X2
Y
Y1
C
G
X2
G1
X1
G
Y1
Value (in mm)
1.67
0.20
0.40
1.0
0.45
0.37
0.70
0.65
Z
DMP2160UFDBQ
Document Number: DS37546 Rev. 1 - 2
5 of 6
www.diodes.com
January 2015
© Diodes Incorporated
DMP2160UFDBQ
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
NEW PRODUCT
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
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This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the
final and determinative format released by Diodes Incorporated.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
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representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2014, Diodes Incorporated
www.diodes.com
DMP2160UFDBQ
Document Number: DS37546 Rev. 1 - 2
6 of 6
www.diodes.com
January 2015
© Diodes Incorporated