DMG6402LVT-7 - Diodes Incorporated

DMG6402LVT
30V N-CHANNEL ENHANCEMENT MODE MOSFET
Product Summary
RDS(on) max
ID
TA = +25°C

Low Input Capacitance

Low On-Resistance
30m @ VGS = 10V
6A

Fast Switching Speed
42m @ VGS = 4.5V
5A

Totally Lead-Free Finish; RoHS compliant (Note 1 & 2)

Halogen and Antimony Free. “Green” Device (Note 3)

Qualified to AEC-Q101 Standards for High Reliability
Description
Mechanical Data
This new generation MOSFET has been designed to minimize the onstate resistance (RDS(on)) and yet maintain superior switching

performance, making it ideal for high efficiency power management
Case: TSOT26

applications.
Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
Applications

DC-DC Converters

Power Management Functions

Backlighting

Moisture Sensitivity: Level 1 per J-STD-020

Terminal Connections: See Diagram

Terminals: Finish – Tin Finish annealed over Copper leadframe.
Solderable per MIL-STD-202, Method 208 e3

Weight: 0.013 grams (approximate)
Drain
TSOT26
D 1
6
D
D 2
5
D
G 3
4
S
Body
Diode
Gate
Source
Top View
Pin Configuration
Top View
Equivalent Circuit
Ordering Information (Note 4)
Part Number
DMG6402LVT-7
DMG6402LVT-13
Notes:
Case
TSOT26
TSOT26
Packaging
3,000/Tape & Reel
10,000/Tape & Reel
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at http”//www.diodes.com/products/packages.html.
Marking Information
6402
Date Code Key
Year
Code
Month
Code
2011
Y
Jan
1
2012
Z
Feb
2
DMG6402LVT
Document number: DS35831 Rev. 3 - 2
Mar
3
YM
ADVANCE INFORMATION
NEW PRODUCT
V(BR)DSS
30V
Features and Benefits
6402 = Product Type Marking Code
YM = Date Code Marking
Y = Year (ex: Y = 2011)
M = Month (ex: 9 = September)
2013
A
Apr
4
May
5
2014
B
Jun
6
2015
C
Jul
7
1 of 6
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Aug
8
2016
D
Sep
9
Oct
O
2017
E
Nov
N
Dec
D
May 2013
© Diodes Incorporated
DMG6402LVT
Maximum Ratings (@TA = +25°C, unless otherwise specified.)
ADVANCE INFORMATION
NEW PRODUCT
Characteristic
Symbol
VDSS
VGSS
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current (Note 5) VGS = 10V
TA = +25°C
TA = +70°C
TA = +25°C
TA = +70°C
TA = +25°C
TA = +70°C
TA = +25°C
TA = +70°C
Steady
State
t<10s
Continuous Drain Current (Note 5) VGS = 4.5V
Steady
State
t<10s
ID
Value
30
±20
6.0
4.8
ID
7.5
5.9
A
ID
5.0
4.0
A
A
6
4.8
2
31
ID
Maximum Body Diode Forward Current (Note 5)
Pulsed Drain Current (10μs pulse, duty cycle = 1%)
Units
V
V
IS
IDM
A
A
A
Thermal Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
TA = +25°C
TA = +70°C
Steady state
t<10s
Total Power Dissipation (Note 5)
Thermal Resistance, Junction to Ambient (Note 5)
PD
RJA
Thermal Resistance, Junction to Case (Note 5)
Operating and Storage Temperature Range
RJC
TJ, TSTG
Value
1.75
1.1
72
50
23
-55 to +150
Units
W
°C/W
°C
Electrical Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
OFF CHARACTERISTICS (Note 6)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Source Leakage
ON CHARACTERISTICS (Note 6)
Gate Threshold Voltage
Symbol
Min
Typ
Max
Unit
BVDSS
IDSS
IGSS
30






1
100
μA
VGS(th)
Static Drain-Source On-Resistance
RDS(ON)
|Yfs|
VSD
1




1.5
22
32
10
0.75
2
30
42

1.0
Ciss
Coss
Crss
RG
Qg
Qgs
Qgd
tD(on)
tr
tD(off)
tf











498
52
45
2.4
11.4
1.4
2
3.4
6.2
13.9
2.8











Forward Transfer Admittance
Diode Forward Voltage
DYNAMIC CHARACTERISTICS (Note 7)
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Gate Resistance
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Turn-On Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
Notes:
V
nA
V
m
S
V
Test Condition
VGS = 0V, ID = 250μA
VDS = 30V, VGS = 0V
VGS = 20V, VDS = 0V
VDS = VGS, ID = 250μA
VGS = 10V, ID = 7A
VGS = 4.5V, ID = 5.6A
VDS = 5V, ID = 7A
VGS = 0V, IS = 1A
pF
VDS = 15V, VGS = 0V
f = 1.0MHz

VDS = 0V, VGS = 0V, f = 1.0MHz
nC
VGS = 10V, VDS = 15V, ID = 5.8A
nS
VDD = 15V, VGS = 10V,
RL = 2.6Ω, RG = 3Ω
5. Device mounted on FR-4 substrate PC board, 2oz copper, with thermal vias to bottom layer 1inch square copper plate.
6. Short duration pulse test used to minimize self-heating effect.
7. Guaranteed by design. Not subject to production testing.
DMG6402LVT
Document number: DS35831 Rev. 3 - 2
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DMG6402LVT
30
20
VGS = 8.0V
VGS = 4.5V
ID, DRAIN CURRENT (A)
ID, DRAIN CURRENT (A)
16
VGS = 4.0V
20
15
VGS = 3.5V
10
VGS = 3.0V
5
12
8
TA = 150°C
TA = 125°C
4
T A = 85°C
0.5
1
1.5
VDS, DRAIN-SOURCE VOLTAGE (V)
Fig. 1 Typical Output Characteristics
RDS(ON), DRAIN-SOURCE ON-RESISTANCE ()
0.06
0.05
0.04
VGS = 4.5V
VGS = 8.0V
0.02
0.01
0
5
10
15
20
25
ID, DRAIN-SOURCE CURRENT (A)
Fig. 3 Typical On-Resistance
vs. Drain Current and Gate Voltage
30
RDS(ON), DRAIN-SOURCE ON-RESISTANCE ()
1.7
1.5
VGS = 4.5V
ID = 5A
1.3
VGS = 10V
ID = 10A
1.1
0.9
0.7
0.5
-50
-25
0
25
50
75 100 125 150
TJ, JUNCTION TEMPERATURE (°C)
Fig. 5 On-Resistance Variation with Temperature
DMG6402LVT
Document number: DS35831 Rev. 3 - 2
0
0.5
1
1.5
2
2.5
3
3.5
VGS, GATE SOURCE VOLTAGE (V)
4
Fig. 2 Typical Transfer Characteristics
0.07
0
0
2
0.08
0.03
T A = 25°C
TA = -55°C
VGS = 2.5V
0
RDS(ON), DRAIN-SOURCE ON-RESISTANCE ()
VDS = 5V
VGS = 2.8V
0
RDS(ON), DRAIN-SOURCE
ON-RESISTANCE (NORMALIZED)
ADVANCE INFORMATION
NEW PRODUCT
25
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0.08
VGS = 4.5V
TA = 150°C
0.06
T A = 125°C
TA = 85°C
0.04
T A = 25°C
TA = -55°C
0.02
0
0
4
8
12
16
20
ID, DRAIN CURRENT (A)
Fig. 4 Typical Drain-Source On-Resistance
vs. Drain Current and Temperature
0.08
0.07
0.06
0.05
VGS = 4.5V
ID = 5A
0.04
0.03
VGS = 10V
ID = 10A
0.02
0.01
0
-50
-25
0
25
50
75 100 125 150
TJ, JUNCTION TEMPERATURE (°C)
Fig. 6 On-Resistance Variation with Temperature
May 2013
© Diodes Incorporated
DMG6402LVT
20
1.6
16
IS, SOURCE CURRENT (A)
VGS(TH), GATE THRESHOLD VOLTAGE (V)
18
ID = 1mA
ID = 250µA
1.2
0.8
0.4
14
12
10
T A = 25°C
8
6
4
2
0
0.2
0
-50
-25
0
25
50
75 100 125 150
TA, AMBIENT TEMPERATURE (°C)
Fig. 7 Gate Threshold Variation vs. Ambient Temperature
1,000
C iss
100
Coss
Crss
f = 1MHz
10
0.4
0.6
0.8
1
1.2
VSD, SOURCE-DRAIN VOLTAGE (V)
Fig. 8 Diode Forward Voltage vs. Current
10
VGS, GATE-SOURCE VOLTAGE (V)
C, CAPACITANCE (pF)
0
5
10
15
20
25
VDS, DRAIN-SOURCE VOLTAGE (V)
Fig. 9 Typical Capacitance
8
4
2
0
30
VDS = 15V
ID = 5.8A
6
0
2
4
6
8
Qg, TOTAL GATE CHARGE (nC)
Fig. 10 Gate-Charge Characteristics
10
1
r(t), TRANSIENT THERMAL RESISTANCE
ADVANCE INFORMATION
NEW PRODUCT
2.0
D = 0.7
D = 0.5
D = 0.3
0.1
D = 0.9
D = 0.1
D = 0.05
D = 0.02
0.01
D = 0.01
RJA(t) = r(t) * RJA
RJA = 54°C/W
Duty Cycle, D = t1/ t2
D = 0.005
Single Pulse
0.001
0.00001
0.0001
DMG6402LVT
Document number: DS35831 Rev. 3 - 2
0.001
0.01
0.1
1
t1, PULSE DURATION TIMES (sec)
Fig. 11 Transient Thermal Resistance
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10
100
1,000
May 2013
© Diodes Incorporated
DMG6402LVT
ADVANCE INFORMATION
NEW PRODUCT
Package Outline Dimensions
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.
TSOT26
Dim Min Max Typ
A
— 1.00 —
A1 0.01 0.10 —
A2 0.84 0.90 —
D
—
— 2.90
E
—
— 2.80
E1
—
— 1.60
b
0.30 0.45 —
c
0.12 0.20 —
e
—
— 0.95
e1
—
— 1.90
L
0.30 0.50 —
L2
—
— 0.25
θ
0°
8°
4°
θ1
4°
12°
—
All Dimensions in mm
D
e1
E
E1
L2
c
4x1
e
L

6x b
A
A2
A1
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
C
C
Dimensions Value (in mm)
C
0.950
X
0.700
Y
1.000
Y1
3.199
Y1
Y (6x)
X (6x)
DMG6402LVT
Document number: DS35831 Rev. 3 - 2
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DMG6402LVT
ADVANCE INFORMATION
NEW PRODUCT
IMPORTANT NOTICE
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INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
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Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
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indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the
final and determinative format released by Diodes Incorporated.
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Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2013, Diodes Incorporated
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DMG6402LVT
Document number: DS35831 Rev. 3 - 2
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May 2013
© Diodes Incorporated