Suggested Pad Layout - Diodes Incorporated

PACKAGE OUTLINE DIMENSIONS(AP02002)
SUGGESTED PAD LAYOUT(AP02001)
(Based on IPC-7351A)
Table of Contents
X4‐DFN0402‐2/SWP ................................................................................................................................................................ 10 X2‐DFN0603‐2 ......................................................................................................................................................................... 11 X3‐DFN0603‐2 ......................................................................................................................................................................... 12 X2‐DFN0606‐3 ......................................................................................................................................................................... 13 X2‐DFN0806‐3 ......................................................................................................................................................................... 14 X2‐DFN0808‐4 ......................................................................................................................................................................... 15 X2‐DFN0910‐6 ......................................................................................................................................................................... 16 U‐DFN1006‐2/SWP ................................................................................................................................................................. 17 X1‐DFN1006‐2 ......................................................................................................................................................................... 18 X2‐DFN1006‐2 ......................................................................................................................................................................... 19 X1‐DFN1006‐3 ......................................................................................................................................................................... 20 X2‐DFN1006‐3 ......................................................................................................................................................................... 21 X2‐DFN1010‐3 ......................................................................................................................................................................... 22 X2‐DFN1010‐4 ......................................................................................................................................................................... 23 X1‐DFN1010‐6 (TYPE B) ........................................................................................................................................................... 24 X2‐DFN1010‐6 ......................................................................................................................................................................... 25 X2‐DFN1010‐6 (TYPE C) ........................................................................................................................................................... 26 W‐DFN1114‐3 ......................................................................................................................................................................... 27 X2‐DFN1210‐6 ......................................................................................................................................................................... 28 X2‐DFN1210‐8 ......................................................................................................................................................................... 29 X1‐DFN1212‐3 ......................................................................................................................................................................... 30 X1‐DFN1212‐3(TYPE B) ............................................................................................................................................................ 31 X2‐DFN1212‐6 ......................................................................................................................................................................... 32 U‐DFN1212‐3 (TYPE C) ............................................................................................................................................................ 33 X1‐DFN1216‐4 ......................................................................................................................................................................... 34 X2‐DFN1310‐6 ......................................................................................................................................................................... 35 X2‐DFN1409‐6 ......................................................................................................................................................................... 36 X2‐DFN1410‐6 ......................................................................................................................................................................... 37 X1‐DFN1411‐3 ......................................................................................................................................................................... 38 U‐DFN1510‐6 .......................................................................................................................................................................... 39 U‐DFN1610‐6 .......................................................................................................................................................................... 40 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may
be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to
the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid
details, please see document IEC, Publication 97.
Rev. 84
1 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
X1‐DFN1612‐6 ......................................................................................................................................................................... 41 X2‐DFN1612‐8 ......................................................................................................................................................................... 42 U‐DFN1616‐6 .......................................................................................................................................................................... 43 U‐DFN1616‐6 (TYPE E) ............................................................................................................................................................. 44 X1‐DFN1616‐6 (TYPE E) ........................................................................................................................................................... 45 U‐DFN1616‐6 (TYPE F) ............................................................................................................................................................. 46 U‐DFN1616‐8 .......................................................................................................................................................................... 47 X2‐DFN2015‐3 ......................................................................................................................................................................... 48 X2‐DFN2015‐6 ......................................................................................................................................................................... 49 X2‐DFN2015‐8 ......................................................................................................................................................................... 50 U‐DFN2018‐6 .......................................................................................................................................................................... 51 X2‐DFN2018‐8 ......................................................................................................................................................................... 52 U‐DFN2020‐2 (TYPE B) ............................................................................................................................................................ 53 U‐DFN2020‐3 .......................................................................................................................................................................... 55 U‐DFN2020‐3 (TYPE B) ............................................................................................................................................................ 56 V‐DFN2020‐3 .......................................................................................................................................................................... 57 U‐DFN2020‐6 .......................................................................................................................................................................... 58 U‐DFN2020‐6/SWP ................................................................................................................................................................. 59 U‐DFN2020‐6 (TYPE B) ............................................................................................................................................................ 60 U‐DFN2020‐6 (TYPE C) ............................................................................................................................................................ 61 U‐DFN2020‐6 (TYPE E) ............................................................................................................................................................. 62 U‐DFN2020‐6 (TYPE F) ............................................................................................................................................................. 63 X2‐DFN2020‐6 ......................................................................................................................................................................... 65 U‐DFN2020‐8 .......................................................................................................................................................................... 66 W‐DFN2020‐6 (TYPE US) ......................................................................................................................................................... 67 W‐DFN2020‐8 (TYPE C) ........................................................................................................................................................... 68 U‐DFN2030‐6 (TYPE B) ............................................................................................................................................................ 69 U‐DFN2030‐6 (TYPE C) ............................................................................................................................................................ 70 U‐DFN2030‐8 .......................................................................................................................................................................... 71 X1‐DFN2030‐8 ......................................................................................................................................................................... 72 U‐DFN2510‐10 ........................................................................................................................................................................ 73 U‐DFN2535‐6 .......................................................................................................................................................................... 74 U‐DFN2535‐6(TYPE B) ............................................................................................................................................................. 75 V‐DFN2050‐4 .......................................................................................................................................................................... 76 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
2 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
U‐DFN2116‐8 .......................................................................................................................................................................... 77 U‐DFN2523‐6 .......................................................................................................................................................................... 78 U‐DFN2626‐10 ........................................................................................................................................................................ 79 U‐DFN3016‐12 ........................................................................................................................................................................ 80 X2‐DFN3020‐6 ......................................................................................................................................................................... 81 V‐DFN3020‐8 .......................................................................................................................................................................... 82 W‐DFN3020‐8 (TYPE B) ........................................................................................................................................................... 83 W‐DFN3020‐8 (TYPE K) ........................................................................................................................................................... 84 V‐DFN3020‐8 (TYPE N) ........................................................................................................................................................... 85 U‐DFN3020‐10 ........................................................................................................................................................................ 86 V‐DFN3020‐10 ......................................................................................................................................................................... 87 V‐DFN3020‐14 ......................................................................................................................................................................... 88 U‐DFN3030‐4 .......................................................................................................................................................................... 89 U‐DFN3030‐6 .......................................................................................................................................................................... 90 V‐DFN3030‐6 .......................................................................................................................................................................... 91 U‐DFN3030‐8 .......................................................................................................................................................................... 92 U‐DFN3030‐8 (TYPE D) ............................................................................................................................................................ 93 U‐DFN3030‐8 (TYPE E) ............................................................................................................................................................. 94 V‐DFN3030‐8 .......................................................................................................................................................................... 95 V‐DFN3030‐8 TYPE H ............................................................................................................................................................... 96 V‐DFN3030‐8 TYPE J ................................................................................................................................................................ 97 V‐DFN3030‐8 TYPE K ............................................................................................................................................................... 98 V‐DFN3030‐8 TYPE M .............................................................................................................................................................. 99 U‐DFN3030‐10 ...................................................................................................................................................................... 100 U‐DFN3030‐12 ...................................................................................................................................................................... 101 W‐DFN3030‐12 ..................................................................................................................................................................... 102 U‐DFN3030‐14 ...................................................................................................................................................................... 103 W‐DFN3030‐16 (TYPE US) ..................................................................................................................................................... 104 U‐QFN3030‐16 (TYPE B) ........................................................................................................................................................ 105 U‐QFN3030‐20 ...................................................................................................................................................................... 106 U‐DFN3216‐14 ...................................................................................................................................................................... 107 DFN322 ................................................................................................................................................................................. 108 X1‐DFN3313‐8 ....................................................................................................................................................................... 109 V‐DFN3535‐14 ....................................................................................................................................................................... 110 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
3 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
U‐DFN4030‐12 ...................................................................................................................................................................... 111 U‐DFN4030‐12 (TYPE B) ........................................................................................................................................................ 112 U‐DFN4030‐12 (TYPE C)......................................................................................................................................................... 113 U‐DFN4030‐12 (TYPE D) ........................................................................................................................................................ 114 V‐DFN4030‐14 ....................................................................................................................................................................... 115 W‐DFN4030‐14 ..................................................................................................................................................................... 116 U‐DFN4040‐8 ........................................................................................................................................................................ 117 W‐DFN5020‐6 ....................................................................................................................................................................... 118 V‐DFN5045‐12 ....................................................................................................................................................................... 119 V‐DFN5045‐12 (TYPE B) ......................................................................................................................................................... 120 V‐DFN5060‐4 ........................................................................................................................................................................ 121 U‐DFN6040‐12 ...................................................................................................................................................................... 122 V‐DFN6040‐22 ....................................................................................................................................................................... 123 D‐FLAT .................................................................................................................................................................................. 124 DF‐S ...................................................................................................................................................................................... 125 U‐FLGA1515‐9 ....................................................................................................................................................................... 126 W‐FLGA2520‐17 .................................................................................................................................................................... 127 MINIDIP ................................................................................................................................................................................ 128 MINIMELF ............................................................................................................................................................................. 129 MELF ..................................................................................................................................................................................... 130 MSB ...................................................................................................................................................................................... 131 MSOP‐8 ................................................................................................................................................................................ 132 MSOP‐8EP ............................................................................................................................................................................. 133 MSOP‐10 ............................................................................................................................................................................... 134 POWERDI®5 ........................................................................................................................................................................... 135 POWERDI®123 ....................................................................................................................................................................... 136 POWERDI®123(TYPE B) .......................................................................................................................................................... 137 POWERDI®323 ....................................................................................................................................................................... 138 POWERDI®3333‐8 .................................................................................................................................................................. 139 POWERDI®3333‐8(TYPE B) ..................................................................................................................................................... 140 POWERDI®5060‐8 .................................................................................................................................................................. 141 POWERDI®5060‐8 (TYPE B) ................................................................................................................................................... 142 POWERDI5060‐8 (TYPE C) ..................................................................................................................................................... 143 POWERDI®5SP ....................................................................................................................................................................... 144 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
4 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
POWERDI®5SP (TYPE B) ......................................................................................................................................................... 145 W‐QFN3020‐12 ..................................................................................................................................................................... 146 U‐QFN4040‐16 (TYPE C) ........................................................................................................................................................ 147 U‐QFN4040‐20 ...................................................................................................................................................................... 148 V‐QFN4525‐20 ...................................................................................................................................................................... 149 QSOP‐16 ............................................................................................................................................................................... 150 QSOP‐20 ............................................................................................................................................................................... 151 SM‐8 ..................................................................................................................................................................................... 152 SMA ...................................................................................................................................................................................... 153 SMAF .................................................................................................................................................................................... 154 SMB ...................................................................................................................................................................................... 155 SMC ...................................................................................................................................................................................... 156 SO‐8 ...................................................................................................................................................................................... 157 SO‐8EP .................................................................................................................................................................................. 158 SO‐8EP .................................................................................................................................................................................. 159 SO‐14 .................................................................................................................................................................................... 160 SO‐16 .................................................................................................................................................................................... 161 SO‐20 .................................................................................................................................................................................... 162 SO‐24 (TYPE TH) .................................................................................................................................................................... 163 SOD123 ................................................................................................................................................................................. 164 SOD123F ............................................................................................................................................................................... 165 SOD323 ................................................................................................................................................................................. 166 SOD323F ............................................................................................................................................................................... 167 SOD523 ................................................................................................................................................................................. 168 SOD923 (0.2MM LEAD WIDTH) ............................................................................................................................................. 169 SOD923 (0.3MM LEAD WIDTH) ............................................................................................................................................. 170 SOT143 ................................................................................................................................................................................. 171 SOT223 ................................................................................................................................................................................. 172 SOT25 ................................................................................................................................................................................... 173 SOT353 ................................................................................................................................................................................. 174 SC74R / SOT26 ...................................................................................................................................................................... 175 SOT363 ................................................................................................................................................................................. 176 SC59 ...................................................................................................................................................................................... 177 SOT523 ................................................................................................................................................................................. 178 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
5 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
SOT323 ................................................................................................................................................................................. 179 SOT23 ................................................................................................................................................................................... 180 SOT23F ................................................................................................................................................................................. 181 SOT543 ................................................................................................................................................................................. 182 SOT553 ................................................................................................................................................................................. 183 SOT563 ................................................................................................................................................................................. 184 SOT666 ................................................................................................................................................................................. 185 SOT953 ................................................................................................................................................................................. 186 SOT963 ................................................................................................................................................................................. 187 SOT89 ................................................................................................................................................................................... 188 SOT89‐5 ................................................................................................................................................................................ 189 TO220AC (TYPE A4) ............................................................................................................................................................... 191 TO220AC (TYPE BR) ............................................................................................................................................................... 192 TO220AC (TYPE E) ................................................................................................................................................................. 193 TO252 (DPAK) ....................................................................................................................................................................... 194 TO252 TYPE B (DPAK)............................................................................................................................................................ 196 TO252 (DPAK) (TYPE BR) ....................................................................................................................................................... 197 TO252 TYPE C (DPAK) ............................................................................................................................................................ 198 TO252 (DPAK) (TYPE TH) ....................................................................................................................................................... 199 TO252‐4 ................................................................................................................................................................................ 200 TO252‐5 ................................................................................................................................................................................ 201 TO263AB (D2PAK) ................................................................................................................................................................. 202 TO263AB TYPE B (D2PAK) ...................................................................................................................................................... 203 TO263AB (D2PAK)(TYPE BR) .................................................................................................................................................. 204 TO263AB TYPE C (D2PAK) ...................................................................................................................................................... 205 TO263AB (D2PAK) (TYPE TH) ................................................................................................................................................. 206 TO263‐5 ................................................................................................................................................................................ 207 T‐MINIDIP ............................................................................................................................................................................. 208 TSSOP‐8 ................................................................................................................................................................................ 209 TSSOP‐14 .............................................................................................................................................................................. 210 TSSOP‐16 .............................................................................................................................................................................. 211 TSSOP‐16EP .......................................................................................................................................................................... 212 TSSOP‐20 .............................................................................................................................................................................. 213 TSSOP‐20EP .......................................................................................................................................................................... 214 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
6 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
TSOT25 ................................................................................................................................................................................. 215 TSOT25F ................................................................................................................................................................................ 216 TSOT26 ................................................................................................................................................................................. 217 TSOT26F ................................................................................................................................................................................ 218 X4‐WLB0402‐2/SWP ............................................................................................................................................................. 219 X2‐WLB0505‐3 ...................................................................................................................................................................... 220 X2‐WLB0603‐2 ...................................................................................................................................................................... 221 X3‐WLB0603‐2 ...................................................................................................................................................................... 222 X4‐WLB0603‐2 ...................................................................................................................................................................... 223 X3‐WLB0603‐3 ...................................................................................................................................................................... 224 U‐WLB0808‐4 ........................................................................................................................................................................ 225 W‐WLB0808‐4 ....................................................................................................................................................................... 226 X1‐WLB0808‐4 ...................................................................................................................................................................... 227 X2‐WLB1006‐2 ...................................................................................................................................................................... 228 X3‐WLB1006‐2 ...................................................................................................................................................................... 229 X3‐WLB1006‐2(TYPE B) ......................................................................................................................................................... 230 U‐WLB1010‐4 ........................................................................................................................................................................ 231 U‐WLB1010‐4 (TYPE B) .......................................................................................................................................................... 232 X2‐WLB1406‐2 ...................................................................................................................................................................... 233 X3‐WLB1406‐2 ...................................................................................................................................................................... 234 X3‐WLB1408‐2 ...................................................................................................................................................................... 235 U‐WLB1510‐6 ........................................................................................................................................................................ 236 U‐WLB1515‐9 ........................................................................................................................................................................ 237 X3‐WLB1608‐2 ...................................................................................................................................................................... 238 X2‐WLB1608‐3 ...................................................................................................................................................................... 239 U‐WLB1818‐4 ........................................................................................................................................................................ 240 X1‐WLB1818‐4 ...................................................................................................................................................................... 241 X2‐WLB2010‐2 ...................................................................................................................................................................... 242 X2‐WLB2718‐6 ...................................................................................................................................................................... 243 X4‐WLCUP0505‐3 .................................................................................................................................................................. 244 X2‐WLCUP2010‐2 .................................................................................................................................................................. 245 X4‐WLCUS0603‐2 .................................................................................................................................................................. 246 X3‐WLCUS0603‐3 .................................................................................................................................................................. 247 X4‐WLCUS1006‐2 .................................................................................................................................................................. 248 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
7 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
X4‐WLCUS1406‐2 .................................................................................................................................................................. 249 X4‐WLCUS1408‐2 .................................................................................................................................................................. 250 A‐405 .................................................................................................................................................................................... 251 DO‐35 ................................................................................................................................................................................... 252 DO‐41 PLASTIC ...................................................................................................................................................................... 253 DO‐41 GLASS ......................................................................................................................................................................... 254 DO‐15 ................................................................................................................................................................................... 255 DO‐201 ................................................................................................................................................................................. 256 DO‐201AD ............................................................................................................................................................................. 257 R‐6 ........................................................................................................................................................................................ 258 T‐1 ........................................................................................................................................................................................ 259 DF‐M ..................................................................................................................................................................................... 260 E‐LINE ................................................................................................................................................................................... 261 GBJ ....................................................................................................................................................................................... 262 GBPC ..................................................................................................................................................................................... 263 GBPC‐W ................................................................................................................................................................................ 264 GBU ...................................................................................................................................................................................... 265 ITO220AB .............................................................................................................................................................................. 266 ITO220AB .............................................................................................................................................................................. 267 ITO220AB (TO220F‐3) ........................................................................................................................................................... 268 ITO220S ................................................................................................................................................................................ 269 ITO220AC‐S ........................................................................................................................................................................... 270 KBJ ........................................................................................................................................................................................ 271 KBP ....................................................................................................................................................................................... 272 MB ........................................................................................................................................................................................ 273 MB‐W ................................................................................................................................................................................... 274 PBPC‐3 / PBPC‐6 ................................................................................................................................................................... 275 PBPC‐8 .................................................................................................................................................................................. 276 PBU ....................................................................................................................................................................................... 277 PDIP‐8 ................................................................................................................................................................................... 278 PDIP‐14 ................................................................................................................................................................................. 279 SIP‐3 (AMMO PACK) ............................................................................................................................................................. 280 SIP‐3 (BULK PACK) ................................................................................................................................................................. 281 SIP‐4 ..................................................................................................................................................................................... 282 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
8 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
SIP‐5 ..................................................................................................................................................................................... 283 TO126 ................................................................................................................................................................................... 284 TO220‐3 ................................................................................................................................................................................ 285 TO220‐5 ................................................................................................................................................................................ 286 TO220‐5(R) ........................................................................................................................................................................... 287 TO220AB ............................................................................................................................................................................... 288 TO220AB(TYPE C) .................................................................................................................................................................. 289 TO220AC ............................................................................................................................................................................... 290 TO220AC (13.7MM MIN LEAD LENGTH) .............................................................................................................................. 291 TO247 ................................................................................................................................................................................... 292 TO251 ................................................................................................................................................................................... 293 TO262 ................................................................................................................................................................................... 294 TO3P ..................................................................................................................................................................................... 295 TO92 ..................................................................................................................................................................................... 296 TO92 (TYPE B) ....................................................................................................................................................................... 297 TO92 (TYPE C) ....................................................................................................................................................................... 298 TO92L ................................................................................................................................................................................... 299 TO92S (TYPE A ...................................................................................................................................................................... 300 TO92S (TYPE B) ..................................................................................................................................................................... 301 TO94 ..................................................................................................................................................................................... 302 WOG ..................................................................................................................................................................................... 303 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
9 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
SURFACE MOUNT PACKAGES
Package Outline Dimensions
X4-DFN0402-2/SWP
2
A
1
A
A
e
n
a
l
P
g
n
i
t
a
e
S
X4-DFN0402-2/SWP
D
Dim Min
Max
Typ
A
0.150 0.200 0.175
A1
0.00 0.020 0.010
A2 0.010 0.040 0.025
b
0.110 0.170 0.140
D
0.375 0.425 0.400
E
0.175 0.225 0.200
e
0.260
L
0.080 0.100 0.090
z
0.010 0.040 0.025
All Dimensions in mm
e
D
I
y
t
i
r
a
l
o
P
b
E
z
L
Suggested Pad Layout
X4-DFN0402-2/SWP
1
X
Dimensions
Y
G
X
X1
Y
G
X
Value
(in mm)
0.110
0.200
0.510
0.200
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
10 of 303
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
X2-DFN0603-2
A
e
n
a
l
P
g
n
i
t
a
e
S
D e
x
2
b
E
︵ ︶
X2-DFN0603-2
Dim Min
Max
Typ
A
0.27
0.35
0.30
A1 0.00
0.03
0.02
b
0.19
0.29
0.24
D 0.595 0.645 0.62
E 0.295 0.345 0.32
e
0.355
L3
0.14
0.24
0.19
All Dimensions in mm
x
2
3
L
︵ ︶
Suggested Pad Layout
X2-DFN0603-2
1
X
Dimensions
Y
X
X1
Y
Value
(in mm)
0.230
0.610
0.300
X
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
11 of 303
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
X3-DFN0603-2
A
A1
D
e
E
b (2X)
X3-DFN0603-2
Dim
Min
Max
Typ
A
0.27
0.35
0.30
A1
0.00
0.03
0.02
b
0.19
0.29
0.24
D
0.595 0.645
0.62
E
0.295 0.345
0.32
e
0.355
L
0.14
0.24
0.19
All Dimensions in mm
L (2x)
Suggested Pad Layout
1
X
X3-DFN0603-2
X
Dimensions
Y
C
X
X1
Y
Value
(in mm)
0.380
0.230
0.610
0.300
C
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
12 of 303
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
X2-DFN0606-3
1
A
A
X2-DFN0606-3
Dim
Min
Max
Typ
A
0.36
0.42
0.39
A1
0
0.05
0.02
b
0.10
0.20
0.15
D
0.57
0.67
0.62
D2
0.155 BSC
D3
0.185 BSC
E
0.57
0.67
0.62
E2
0.40
0.60
0.50
e
0.35 BSC
k
0.16 REF
L
0.09
0.21
0.15
L2
0.11
0.31
0.21
All Dimensions in mm
Seating Plane
D
2
D
3
D
2
/
e
E
2
E
e
k
x
2
b
2
L
︵ ︶
x
2
L
︵ ︶
Suggested Pad Layout
X2-DFN0606-3
Dimensions
C
X
X1
X2
Y
Y1
Value (in mm)
0.350
0.280
0.350
0.760
0.200
0.600
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
13 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
X2-DFN0806-3
A1
A3
A
Seating Plane
D
e
L (2x)
b (2x)
K
E
E1
Pin#1
R0.075
X2-DFN0806-3
Dim Min
Max
Typ
A
0.375 0.40
0.39
A1
0
0.05
0.02
A3
0.10
b
0.10 0.20
0.15
D
0.55 0.65
0.60
D1
0.35 0.45
0.40
E
0.75 0.85
0.80
E1
0.20 0.30
0.25
e
0.35
K
0.20
L
0.20 0.30
0.25
All Dimensions in mm
D1
Suggested Pad Layout
X2-DFN0806-3
X1
Dimensions
Y1
C
X
X1
X2
Y
Y1
Y2
Y2
X
Y
Value
(in mm)
0.350
0.200
0.450
0.550
0.375
0.475
1.000
C
X2
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
14 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
X2-DFN0808-4
3
A
1
A
A
e
n
a
l
P
g
n
i
t
a
e
S
D
I
1
#
n
i
P
D e
Dim
A
A1
A3
b
D
D2
E
E2
e
k
L
L1
z
P
Y
T
5
0
.
0
R
k
E
1
L
2
D
2
E
L
X2-DFN0808-4
Min
Max
Typ
0.25
0.35
0.30
0
0.04
0.02
0.13
0.17
0.27
0.22
0.75
0.85
0.80
0.15
0.35
0.25
0.75
0.85
0.80
0.15
0.35
0.25
0.48
0.20
0.17
0.27
0.22
0.02
0.12
0.07
0.05
All Dimensions in mm
b
Z
Suggested Pad Layout
3
X C
X2-DFN0808-4
2
Y
3
Y
2
X
1
Y
Y
1
X
Dimensions
C
X
X1
X2
X3
Y
Y1
Y2
Y3
Value
0.480
0.320
0.300
0.106
0.800
0.320
0.300
0.106
0.900
X
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
15 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
X2-DFN0910-6
1
A
A
Seating Plane
D
1
Z
e
Z
K
1
K
E
1
L
L
b
(Pin #1 ID)
C0.5X45°
X2-DFN0910-6
Dim Min Max Typ
A
0.35 0.30
A1
0
0.03 0.02
b
0.10 0.20 0.15
D
0.85 0.95 0.90
E
0.95 1.05 1.00
e
0.30
K
0.20
K1 0.25
L
0.25 0.35 0.30
L1 0.30 0.40 0.35
Z
0.075
Z1
0.075
All Dimensions in mm
Suggested Pad Layout
X2-DFN0910-6
X1
Dimensions
Y1
G1
Y2
G
Y
G
G1
G2
X
X1
Y
Y1
Y2
Value
(in mm)
0.100
0.050
0.150
0.150
0.750
0.525
0.475
1.150
Pin1
G2
X
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
16 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
U-DFN1006-2/SWP
c
1
A
A
h
e
n
a
l
P
g
n
i
t
a
e
S
D D
I
1
#
n
i
P
x
2
b
E
︵ ︶
U-DFN1006-2/SWP
Dim Min Max
Typ
A
0.47 0.53
0.50
A1
0.0
0.05
0.03
b
0.45 0.55
0.50
c
0.55 REF
D
0.95 1.05
1.00
E
0.55 0.65
0.60
h
0.17 REF
k
0.37 REF
L
0.25 0.35
0.30
All Dimensions in mm
x
2
L
k
︵
︶
Suggested Pad Layout
U- DFN1006-2/SWP
1
X
x
2
X
︵
︶
Y
Dimensions
X
X1
Y
Value (in mm)
0.45
1.20
0.60
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
17 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
X1-DFN1006-2
A
X1-DFN1006-2
Dim Min Max Typ
A 0.47 0.53 0.50
A1
0
0.05 0.03
b
0.45 0.55 0.50
D 0.95 1.075 1.00
E 0.55 0.675 0.60
e
0.40
L
0.20 0.30 0.25
R 0.05 0.15 0.10
All Dimensions in mm
A1
D
R
E
b
e
L
Suggested Pad Layout
X1-DFN1006-2
1
X
X
Dimensions
Y
C
G
X
X1
Y
G
Value
(in mm)
0.70
0.30
0.40
1.10
0.70
C
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
18 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
X2-DFN1006-2
A
A1
D
R
E
b
L
X2-DFN1006-2
Dim Min Max Typ
A 0.34 0.4 0.37
A1
0
0.05 0.03
b
0.45 0.55 0.50
D 0.95 1.075 1.00
E 0.55 0.675 0.60
e
0.40
L
0.20 0.30 0.25
R 0.05 0.15 0.10
All Dimensions in mm
e
Suggested Pad Layout
X2-DFN1006-2
1
X
X
Dimensions
Y
C
G
X
X1
Y
G
Value
(in mm)
0.70
0.30
0.40
1.10
0.70
C
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
19 of 303
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
X1-DFN1006-3
1
A
A
e
n
a
l
P
g
n
i
t
a
e
S
D
I
1
#
b
D n
i
P
e
2
b
E
X1-DFN1006-3
Dim Min Max Typ
A 0.47 0.53 0.50
A1 0.00 0.05 0.03
b
0.10 0.20 0.15
b2 0.45 0.55 0.50
D 0.95 1.075 1.00
E 0.55 0.675 0.60
e
0.35
L1 0.20 0.30 0.25
L2 0.20 0.30 0.25
L3
0.40
z
0.02 0.08 0.05
All Dimensions in mm
1
L
3
L
2
L
z
Suggested Pad Layout
X1-DFN1006-3
C
Y
1
Y
2
G
1
G
X
1
X
Dimensions
C
G1
G2
X
X1
Y
Y1
Value (in mm)
0.70
0.30
0.20
0.40
1.10
0.25
0.70
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
20 of 303
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
X2-DFN1006-3
1
A
A
e
n
a
l
P
g
n
i
t
a
e
S
X
2
1
b
D
I
1
#
n
D i
P
︵
︶
e
E
2
b
X2-DFN1006-3
Dim Min Max Typ
A
 0.40 
A1
0
0.05 0.03
b1 0.10 0.20 0.15
b2 0.45 0.55 0.50
D 0.95 1.05 1.00
E 0.55 0.65 0.60
e
0.35
L1 0.20 0.30 0.25
L2 0.20 0.30 0.25
L3
0.40
All Dimensions in mm
1
L
2
L
3
L
Z
Suggested Pad Layout
X2-DFN1006-3
C
Dimensions
X1
X
Z
G1
G2
X
X1
Y
C
G2
G1
Y
Value
(in mm)
1.1
0.3
0.2
0.7
0.25
0.4
0.7
Z
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
21 of 303
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
A
1
A
3
A
X2-DFN1010-3
Seating Plane
D
2
E
(Pin #1 ID)
E
K
2
D
L
b
e
X2-DFN1010-3
Dim
Min
Max
Typ
A
0.40
0.39
A1
0.00
0.05
0.02
A3
0.13
b
0.18
0.28
0.23
D
0.95
1.05
1.00
D2
0.70
0.90
0.80
E
0.95
1.05
1.00
E2
0.36
0.56
0.46
e
0.50
K
0.20
L
0.195 0.295 0.245
All Dimensions in mm
Suggested Pad Layout
X
X2-DFN1010-3
2
Y
1
Y
1
X
X
G
X2-DFN1010-3
Dimensions
Value
C
0.500
G
0.150
X
0.330
X1
0.900
Y
0.445
Y1
0.505
Y2
0.200
All Dimensions in mm
Y
C
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
22 of 303
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
X2-DFN1010-4
3
A
1
A
A
e
n
a
l
P
g
n
i
t
a
e
S
D e
︶
x
3
8
1
.
0
C
︵
5
2
.
0
C
1
L
E
2
L
2
D
2
E
L
X2-DFN1010-4
Dim
Min
Max
Typ
A
0.40
0.39
A1
0.00
0.05
0.02
A3
0.13
b
0.20
0.30
0.25
D
0.95
1.05
1.00
D2
0.38
0.58
0.48
E
0.95
1.05
1.00
E2
0.38
0.58
0.48
e
0.65
L
0.20
0.30
0.25
L1
0.27
0.37
0.32
L2
0.02
0.12
0.07
Z
0.050
All Dimensions in mm
b
Z
Suggested Pad Layout
2
X C
X2-DFN1010-4
2
Y
Dimensions
1
Y
3
Y
4
Y
1
X
Y
C
X
X1
X2
Y
Y1
Y2
Y3
Y4
Value
(in mm)
0.650
0.250
0.480
0.900
0.400
0.470
0.220
0.480
1.300
X
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
23 of 303
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
X1-DFN1010-6 (Type B)
1
A
A
e
n
a
l
P
g
n
i
t
a
e
S
D
X1-DFN1010-6
(Type B)
Dim Min Max
Typ
A
-
0.50
0.39
A1
0.04
b
0.12 0.20
0.15
D
0.95 1.050 1.00
E
0.95 1.050 1.00
e
0.35 BSC
e1
0.55 BSC
L3 0.27 0.30
0.30
L3a 0.32 0.40
0.35
All Dimensions in mm
x
5
3
L
e
a
3
L
︵ ︶
1
e
E
D
I
1
#
n
i
P
︵
︶
b
Suggested Pad Layout
X1-DFN1010-6 (Type B)
1
X
x
4
Y
C
︵
︶
Dimensions
2
Y
3
Y
1
G
1
Y
G
X
1
n
i
P
C
G
G1
X
X1
Y
Y1
Y2
Y3
Value
(in mm)
0.350
0.150
0.150
0.200
0.900
0.500
0.525
0.475
1.150
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
24 of 303
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
X2-DFN1010-6
A1
A
A3
D
(Pin #1 ID)
e
b1
E
K
L(6x)
X2-DFN1010-6
Dim
Min
Max
Typ
A
––
0.40
0.39
A1
0.00
0.05
0.02
A3
––
––
0.13
b
0.14
0.20
0.17
b1
0.05
0.15
0.10
D
0.95
1.05
1.00
E
0.95
1.05
1.00
e
––
––
0.35
L
0.35
0.45
0.40
K
0.15
––
––
Z
––
––
0.065
All Dimensions in mm
b(6x)
Z(4x)
Suggested Pad Layout
X1
C
Y(6x)
Y1
1
G(4x)
Dimensions
Value
(in mm)
C
0.350
G
0.150
X
0.200
X1
0.900
Y
0.550
Y1
1.250
X(6x)
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
25 of 303
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
X2-DFN1010-6 (Type C)
1
A
A
e
n
a
l
P
g
n
i
t
a
e
S
x
5
3
L
D
︵
e
a
3
L
︶
1
e
E
D
I
1
#
n
i
P
︵
X2-DFN1010-6
(Type C)
Dim Min Max
Typ
A
-
0.35
-
A1
0.04
b
0.12 0.20
0.15
D
0.95 1.050 1.00
E
0.95 1.050 1.00
e
0.35 BSC
e1
0.55 BSC
L3 0.27 0.30
0.30
L3a 0.32 0.40
0.35
All Dimensions in mm
︶
b
Suggested Pad Layout
X2-DFN1010-6 (Type C)
1
X
x
4
Y
C
︵
︶
Dimensions
2
Y
3
Y
1
G
1
Y
G
1
n
i
P
X
C
G
G1
X
X1
Y
Y1
Y2
Y3
Value
(in mm)
0.350
0.150
0.150
0.200
0.900
0.500
0.525
0.475
1.150
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
26 of 303
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
W-DFN1114-3
1
A
3
A
A
e
n
a
l
P
g
n
i
t
a
e
S
L
D e
x
2
b
5
6
2
.
0
D
I
1
#
n
i
P
︵
︶
︵ ︶
E
1
E
W-DFN1114-3
Dim Min Max
Typ
A 0.77 0.83
0.80
A1
0
0.05
0.02
A3
0.152
b 0.25 0.35
0.30
D 1.05 1.15
1.10
D1 0.70 0.80
0.75
e
0.55
E 1.35 1.45
1.40
E1 0.66 0.76
0.71
L 0.20 0.30
0.25
All Dimensions in mm
0
5
1
.
0
R
1
D
Suggested Pad Layout
W-DFN1114-3
1
Y
1
X
2
Y
X
Y
Dimensions
C
X
X1
X2
Y
Y1
Y2
Value(in mm)
0.550
0.400
0.750
0.950
0.450
0.710
1.375
2
C X
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
27 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
X2-DFN1210-6
3
A
1
A
A
e
n
a
l
P
g
n
i
t
a
e
S
D
X2-DFN1210-6
Dim
Min
Max
Typ
A
0.40
A1
0.00
0.05
0.03
A3
0.13
b
0.15
0.25
0.20
D
1.15 1.275 1.20
E
0.95 1.075 1.00
e
0.40
L
0.325 0.425 0.375
z
0.100
All Dimensions in mm
D
I
1
n
i
P
E
L
z
e
b
Suggested Pad Layout
X2-DFN1210-6
1
X
C
1
G
Dimensions
G
1
Y
Y
C
G
G1
X
X1
Y
Y1
Value
(in mm)
0.400
0.230
0.180
0.220
1.020
0.420
1.070
X
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
28 of 303
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
X2-DFN1210-8
1
A
A
X2-DFN1210-8
Dim
Min
Max
Typ
A
0.35 0.30
A1
0
0.03 0.02
b
0.10 0.20 0.15
D
1.15 1.25 1.20
E
0.95 1.05 1.00
e
0.30
K
0.25
K1
0.20
L
0.25 0.35 0.30
L1
0.30 0.40 0.35
Z
0.050 0.100 0.075
Z1
0.050 0.100 0.075
All Dimensions in mm
Seating Plane
D
X
4
Z
e
(Pin #1 ID)
C0.5X45°
︵
︶
X
4
1
Z
1
L
︵
︶
K
1
K
E
b
x
7
L
︵ ︶
Suggested Pad Layout
X2-DFN1210-8
1
X
Dimensions
G
2
Y
Y
C
G
X
X1
Y
Y1
Value
(in mm)
0.300
0.150
0.150
1.050
0.500
1.150
X
C
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
29 of 303
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
A
X1-DFN1212-3
3
A
1
A
e
n
a
l
P
g
n
i
t
a
e
S
D
e
x
2
1
b
︵ ︶
E
X1-DFN1212-3
Dim Min Max Typ
A
0.47 0.53 0.50
A1
0 0.05 0.02
A3
0.13
b
0.27 0.37 0.32
b1
0.17 0.27 0.22
D
1.15 1.25 1.20
E
1.15 1.25 1.20
e
0.80
L
0.25 0.35 0.30
All Dimensions in mm
x
3
L
b
︵ ︶
Suggested Pad Layout
X1-DFN1212-3
X
Dimensions Value (in mm)
C
0.80
X
0.42
X1
0.32
Y
0.50
Y1
0.50
Y2
1.50
Y
X1
(2x)
Y2
Y1
(2x)
C
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
30 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
X1-DFN1212-3(Type B)
A
A1
X1-DFN1212-3
Type B
Dim Min
Max
Typ
A
0.47 0.53 0.50
A1
0
0.05 0.02
A3
0.13
b
0.27 0.37 0.32
b1
0.17 0.27 0.22
D
1.15 1.25 1.20
D2 0.70 0.90 0.80
E
1.15 1.25 1.20
E2
0.10 0.30 0.20
e
0.80
L
0.25 0.35 0.30
All Dimensions in mm
A3
D
e
b1(2x)
E2
E
D2
L(3x)
b
Suggested Pad Layout
X1-DFN1212-3 (Type B)
X
Dimensions Value (in mm)
C
0.80
X
0.42
X1
0.32
X2
0.90
Y
0.50
Y1
0.50
Y2
0.20
Y3
1.50
Y
X2
Y3
Y2
X1(2x)
Y1
(2x)
C
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
31 of 303
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
X2-DFN1212-6
3
A
1
A
A
e
n
a
l
P
g
n
i
t
a
e
S
X2-DFN1212-6
D
Dim Min
Max
Typ
A
-
0.40
0.39
A1
0.00
0.05 0.020
A3
0.13
b
0.13
0.23
0.18
D
1.15
1.25
1.20
D2
0.89
0.99
0.94
E
1.15
1.25
1.20
E2
0.25
0.35
0.30
e
0.40
k
0.15
0.25
0.20
L
0.15
0.25
0.20
z
0.11
z1
0.05
All Dimensions in mm
1
z
2
D
5
1
.
0
C
D
I
1
n
i
P
k
2
E
E
L
b
z
e
Suggested Pad Layout
X2-DFN1212-6
2
X
C
Dimensions
G
1
X
1
Y
2
Y
Y
C
G
X
X1
X2
Y
Y1
Y2
Value
(in mm)
0.400
0.150
0.250
0.940
1.050
0.400
0.300
1.400
X
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
32 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
U-DFN1212-3 (Type C)
3
A
1
A
A
U-DFN1212-3
Type C
Dim Min
Max
Typ
A
0.47 0.53 0.50
A1
0
0.05 0.02
A3
0.13
b
0.27 0.37 0.32
b1
0.17 0.27 0.22
D
1.15 1.25 1.20
D2 0.75 0.95 0.85
e
0.80
E
1.15 1.25 1.20
E2
0.40 0.60 0.50
L
0.25 0.35 0.30
L1
0.65 0.75 0.70
All Dimensions in mm
e
n
a
l
P
g
n
i
t
a
e
S
D e
L
1
b
E
2
E
2
D
1
L
b
Suggested Pad Layout
U-DFN1212-3 (Type C)
2
X
1
X
1
Y
Dimensions
2
Y
X
G
Y
C
C
G
X
X1
X2
Y
Y1
Y2
Value
(in mm)
0.800
0.200
0.320
0.520
1.050
0.450
0.250
0.850
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
33 of 303
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
A
X1-DFN1216-4
3
A
1
A
e
n
a
l
P
g
n
i
t
a
e
S
De
X1-DFN1216-4
Dim
Min
Max
Typ
A
0.47
0.53 0.50
A1
0.00
0.05 0.02
A3
--0.13
b
0.15
0.25 0.20
D
1.15
1.25 1.20
D2
0.75
0.95 0.85
E
1.55
1.65 1.60
E2
0.55
0.75 0.65
e
0.65
L
0.20
0.30 0.25
Z
0.175
All Dimensions in mm
D
I
1
#
n
i
P
︶
°
5
4
x
2
.
0
'
C
︵
2
E
E
L
2
D
b
Z
Suggested Pad Layout
1
XC
X1-DFN1216-4
1
Y
2
Y
Y
X1-DFN1216-4
Value
Dimensions
(in mm)
C
0.65
X
0.25
X1
0.90
Y
0.50
Y1
0.70
Y2
2.00
X
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
34 of 303
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
X2-DFN1310-6
3
A
1
A
A
X2-DFN1310-6
Dim Min Max Typ
A
0.40
A1
0
0.05 0.02
A3
0.13
b
0.10 0.20 0.15
D
1.25 1.38 1.30
d
0.25
D2
0.30 0.50 0.40
E
0.95 1.075 1.00
e
0.35
E2
0.30 0.50 0.40
f
0.10
L
0.20 0.30 0.25
Z
0.05
All Dimensions in mm
e
n
a
l
P
g
n
i
t
a
e
S
D
2
D
f
f
b
z
0
5
1
.
0
R
2
E
E
D
I
1
#
n
i
P
︵
︶
d
L
z
d
f
e
f
Suggested Pad Layout
X2-DFN1310-6
G2
X2
Dimensions
G1
G2
G3
X1
X2
Y1
Y2
a
b
Y2
G1
b
Y1
G3
a
X1
X2- DFN1310-6
0.16
0.17
0.15
0.52
0.20
0.52
0.375
0.09
0.06
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
35 of 303
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
X2-DFN1409-6
3
A
1
A
A
e
n
a
l
P
g
n
i
t
a
e
S
D
X2-DFN1409-6
Dim Min Max
Typ
A
0.40
0.39
A1
0
0.05
0.02
A3
0.13
Ø
0.20 0.30
0.25
D
1.35 1.45
1.40
E
0.85 0.95
0.90
e1
0.50
e2
0.50
Z1
0.075
Z2
0.075
All Dimensions in mm
x
6
2
Ø e
1
e
︵ ︶
D
I
1
#
n
i
P
︵
︶
E
x
4
2
Z
x
4
1
Z
︵ ︶
︵
︶
Suggested Pad Layout
X2-DFN1409-6
C
x
6
D
︵ ︶
Dimensions
Y
1
C
1
G
1
n
i
P
G
X
C
C1
D
G
G1
X
Y
Value
(in mm)
1.000
0.500
0.300
0.200
0.200
0.400
0.150
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
36 of 303
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
X2-DFN1410-6
A1
A3
X2-DFN1410-6
Dim
Min
Max
Typ
A
––
0.40
0.39
A1
0.00
0.05
0.02
A3
––
––
0.13
b
0.15
0.25
0.20
D
1.35
1.45
1.40
E
0.95
1.05
1.00
e
––
––
0.50
L
0.25
0.35
0.30
Z
––
––
0.10
Z1
0.045 0.105 0.075
All Dimensions in mm
A
Seating Plane
D
(Pin #1 ID)
e
L(6x)
E
Z1(4x)
Z(4x)
b(6x)
Suggested Pad Layout
1
X
X2-DFN1410-6
C
Y
Dimensions
1
Y
C
G
X
X1
Y
Y1
Value
(in mm)
0.500
0.250
0.250
1.250
0.525
1.250
X
G
1
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
37 of 303
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
X1-DFN1411-3
A
X1-DFN1411-3
Dim Min Max
Typ
A
0.47 0.53
0.50
A1
0
0.05
0.02
b
0.25 0.35
0.30
D
1.35 1.475
1.40
D2 0.65 0.85
0.75
E
1.05 1.175
1.10
E2 0.65 0.85
0.75
e
0.55
L 0.225 0.325 0.275
L1
0.20
All Dimensions in mm
A1
D
b
E
E2
e
D2
L1
L
Suggested Pad Layout
X1-DFN1411-3
C
X2
X1
G2 X
Y
G1
Dimensions
Z
G1
G2
X
X1
X2
Y
C
Value (in mm)
1.38
0.15
0.15
0.95
0.75
0.40
0.75
0.76
Z
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
38 of 303
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
U-DFN1510-6
1
A
A
e
n
a
l
P
g
n
i
t
a
e
S
3
A
D
E
L
Z
U-DFN1510-6
Dim
Min
Max
Typ
A
0.545 0.605 0.575
A1
0.05 0.03
A3
0.13
b
0.20 0.30 0.25
D
1.40 1.525 1.45
E
0.95 1.075 1.00
e
0.50
L
0.325 0.425 0.375
Z
0.100
All Dimensions in mm
b
e
Suggested Pad Layout
U-DFN1510-6
C
X
Dimensions
1
Y
Y
C
X
X1
Y
Y1
Value
(in mm)
0.500
0.350
1.350
0.575
1.300
1
X
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
39 of 303
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
U-DFN1610-6
3
A
1
A
U-DFN1610-6
A
e
n
a
l
P
g
n
i
t
a
e
S
Dim
Min
Max
Typ
D
e
5
2
1
.
0
R
5
7
0
.
0
R
E
A
0.545 0.605
0.575
A1
0.00
0.05
0.03
A3
-
-
0.13
b
0.15
0.25
0.20
b2
0.35
0.45
0.40
D
1.550 1.675
1.600
E
0.950 1.075
1.000
L
e
L
2
b
Z
z
0.50 BSC
0.325 0.425
-
-
0.375
0.150
b
All Dimensions in mm
Suggested Pad Layout
U-DFN1610-6
2
X
C
Dimensions
1
Y
Y
C
X
X1
X2
Y
Y1
Value
(in mm)
0.500
0.250
0.450
1.350
0.625
1.400
1
X
X
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
40 of 303
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
X1-DFN1612-6
3
A
1
A
A
X1-DFN1612-6
Dim Min Max Typ
A 0.47 0.53 0.50
A1
0
0.05 0.02
A3
0.13
b
0.15 0.25 0.20
D 1.55 1.675 1.60
d
0.25
D2 0.40 0.60 0.50
E 1.15 1.28 1.20
e
0.40
E2 0.45 0.65 0.55
f
0.15
L
0.20 0.30 0.25
Z
0.10
All Dimensions in mm
e
n
a
l
P
g
n
i
t
a
e
S
D
2
D
f
f
b
z
0
5
1
.
0
R
2
E
E
D
I
1
#
n
i
P
︵
︶
d
L
z
d
f
e
f
Suggested Pad Layout
X1-DFN1612-6
G2
X2
Dimensions
G1
G2
G3
X1
X2
Y1
Y2
a
b
Y2
G1
b
Y1
G3
a
X1
X1-DFN1612-6
0.15
0.175
0.15
0.60
0.25
0.65
0.45
0.10
0.15
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
41 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
X2-DFN1612-8
1
A
A
e
n
a
l
P
g
n
i
t
a
e
S
X2-DFN1612-8
D
Dim
Min
Max
Typ
A
––
0.40
0.39
A1
0.00
0.05
0.02
b
0.13
0.23
0.18
D
1.55
1.65
1.60
D2
1.25
1.35
1.30
E
1.15
1.25
1.20
E2
0.25
0.35
0.30
e
––
––
0.40
L
0.15
0.25
0.20
z
––
––
0.11
z1
––
––
0.05
All Dimensions in mm
2
D
L
2
E
E
5
1
.
0
C
z b
e
1
z
Suggested Pad Layout
X2-DFN1612-8
2
X
C
Dimensions
1
Y
1
X
2
Y
Y
C
X
X1
X2
Y
Y1
Y2
Value
(in mm)
0.400
0.230
1.300
1.430
0.400
0.300
1.400
X
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
42 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
U-DFN1616-6
A
A3
A1
U-DFN1616-6
Dim Min
Max
Typ
A 0.545 0.605 0.575
A1
0
0.05 0.02
A3
0.13
b
0.20 0.30 0.25
D
1.55 1.675 1.60
D2 1.10 1.30 1.20
E
1.55 1.675 1.60
e
0.50
E2
0.30 0.50 0.40
L
0.275 0.375 0.325
All Dimensions in mm
D
e
E E2
L
b
D2
Suggested Pad Layout
U-DFN1616-6
Y
C
Dimensions Value (in mm)
Z
1.3
G
0.175
X1
0.50
X2
0.525
Y
0.30
C
0.50
X2
G
X1
Z
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
43 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
U-DFN1616-6 (Type E)
A1
A3
A
D
D2
b1
E
E2
L1
L(2X)
e
Z(4X)
X1-DFN1616-6
Type E
Dim Min Max Typ
A
0.47 0.53 0.50
A1
0
0.05 0.02
A3
—
—
0.13
b
0.20 0.30 0.25
b1
0.10 0.30 0.20
D
1.55 1.65 1.60
D2
0.57 0.77 0.67
E
1.55 1.65 1.60
E2
1.30 1.50 1.40
e
—
—
0.50
L
0.25 0.35 0.30
L1
0.52 0.72 0.62
Z
—
—
0.175
All Dimensions in mm
b(6X)
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
44 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
X1-DFN1616-6 (Type E)
A3
A1
A
D
D2
b1
E
E2
L1
L(2X)
e
Z(4X)
b(6X)
X1-DFN1616-6
Type E
Dim Min Max Typ
A
0.47 0.53 0.50
A1
0
0.05 0.02
A3
—
—
0.13
b
0.20 0.30 0.25
b1
0.10 0.30 0.20
D
1.55 1.65 1.60
D2
0.57 0.77 0.67
E
1.55 1.65 1.60
E2
1.30 1.50 1.40
e
—
—
0.50
L
0.25 0.35 0.30
L1
0.52 0.72 0.62
Z
—
—
0.175
All Dimensions in mm
Suggested Pad Layout
X1-DFN1616-6 (Type E)
X3
Y (2x)
Dimensions
C
X
X1
X2
X3
Y
Y1
Y2
Y1
Y2
X2
X1
X (6x)
Value
(in mm)
0.500
0.300
0.200
0.720
0.400
0.475
0.620
1.900
C
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
45 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
U-DFN1616-6 (Type F)
3
A
1
A
A
e
n
a
l
P
g
n
i
t
a
e
S
1
D D
X
2
2
D
︵
︶
D
I
1
#
n
i
P
x
2
2
E
0
0
1
.
0
R
E
︵ ︶
K
L
e
b
x
4
Z
︵ ︶
U-DFN1616-6
Type F
Dim Min Max Typ
A
0.45 0.55 0.50
A1
0
0.05 0.02
A3
—
—
0.127
b
0.20 0.30 0.25
D
1.55 1.65 1.60
D1
1.14 1.34 1.24
D2
0.38 0.58 0.48
E
1.55 1.65 1.60
E2
0.54 0.74 0.64
e
—
—
0.50
K
—
—
0.23
L
0.15 0.35 0.25
Z
—
—
0.175
All Dimensions in mm
Suggested Pad Layout
2 1
X G
U-DFN1616-6 (Type F)
1
X
2
Y
G
1
Y
Y
Dimensions
C
G
G1
X
X1
X2
Y
Y1
Y
Value(in mm)
0.500
0.150
0.180
0.320
0.580
1.320
0.450
0.700
1.900
C
X
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
46 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
U-DFN1616-8
A
A3
A1
D
e
L
E2
E
D2
U-DFN1616-8
Dim Min Max
Typ
A 0.545 0.605 0.575
A1
0
0.05
0.02
A3
0.13
b
0.15 0.25
0.20
D
1.55 1.675 1.60
D2 0.35 0.55
0.45
E
1.55 1.675 1.60
e
0.40
E2 0.90 1.10
1.00
L
0.25 0.35
0.30
All Dimensions in mm
e
b
Suggested Pad Layout
U-DFN1616-8
X2
a
G2
Dimensions Value (in mm)
G1
0.15
G2
0.20
X1
0.65
X2
0.25
Y1
1.25
Y2
0.50
C
0.40
a
0.10
Y2
Y1
G1
X1
C
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
47 of 303
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
X2-DFN2015-3
A3
A
SEATING PLANE
A1
D
z
L
e
E2
E
D2
X2-DFN2015-3
Dim Min Max
Typ
A
-
0.40
-
A1
0
0.05
0.02
A3
0.13
b
0.20 0.30
0.25
D
1.45 1.575
1.5
D2 1.00 1.20
1.10
e
0.50
E
1.95 2.075 2.00
E2 0.70 0.90
0.80
L
0.25 0.35
0.30
z
0.125
All Dimensions in mm
b
Suggested Pad Layout
X2-DFN2015-3
X
1
Y
X2-DFN2015-3
Value
(in mm)
C
1.000
G
0.150
X
0.310
X1
1.300
Y
0.500
Y1
0.650
Y2
1.000
Dimensions
2
Y
1
X
x
2
Y
G
︵ ︶
C
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
48 of 303
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
3
A
1
A
X2-DFN2015-6
A
X2-DFN2015-6
Dim Min Max Typ
A 0.375 0.40 0.390
A1
0
0.05 0.02
A3
0.13
b
0.20 0.30 0.25
D
1.45 1.575 1.50
D2 1.00 1.20 1.10
e
0.50
E
1.95 2.075 2.00
E2 0.70 0.90 0.80
L
0.25 0.35 0.30
Z
0.125
Z1
0.075
All Dimensions in mm
e
n
a
l
P
g
n
i
t
a
e
S
L
D
z
0
0
2
.
0
R
D
I
1
#
n
i
P
︵
︶
2
E
E
2
D
1
z
b
e
Suggested Pad Layout
X2-DFN2015-6
2
X
C
X
Y
X2-DFN2015-6
Value
(in mm)
C
0.500
X
0.350
X1
1.150
X2
1.350
Y
0.500
Y1
0.850
Y2
2.150
Dimensions
2
Y
1
Y
1
X
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
49 of 303
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
X2-DFN2015-8
A
A3
A1
SIDE VIEW
D
D1
L
E1
E
D3
D2
E2
e
Z
E3
b
BOTTOM VIEW
X2-DFN2015-8
Dim Min Max Typ
D
1.95 2.05 2.00
E
1.45 1.55 1.50
D1 0.23 0.43 0.33
E1 0.55 0.75 0.65
D2 0.52 0.72 0.62
E2 0.38 0.58 0.48
D3 0.40 0.60 0.50
E3 0.35 0.55 0.45
A
0.40 0.39
A1
0
0.05 0.02
A3
0.127
b
0.20 0.30 0.25
L
0.25 0.35 0.30
e
0.65
Z
0.225
All Dimensions in mm
Suggested Pad Layout
X2-DFN2015-8
C
X1 (4x)
X
Y1 (4x)
Y
Y2
G (4x)
X2
G1
X3
R
Y3
Y
X
Dimensions Value (in mm)
C
0.650
G
0.150
G1
0.150
X
0.410
X1
0.350
X2
0.795
X3
0.700
Y
0.825
Y1
0.500
Y2
0.480
Y3
0.500
R
R0.125
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
50 of 303
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
U-DFN2018-6
A3
A
U-DFN2018-6
Dim Min Max Typ
A 0.545 0.605 0.575
A1
0
0.05 0.02
A3
0.13
b
0.15 0.25 0.20
D 1.750 1.875 1.80
D2 1.30 1.50 1.40
e
0.50
E 1.95 2.075 2.00
E2 0.90 1.10 1.00
L
0.20 0.30 0.25
z
0.30
All Dimensions in mm
SEATING PLANE
A1
Pin#1 ID
D
D2
L
E2
E
z
b
e
Suggested Pad Layout
U-DFN2018-6
X
C
Y
Dimensions
C
G
X
X1
Y
Y1
Y1
G
Value
(in mm)
0.50
0.20
0.25
1.60
0.35
1.20
X1
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
51 of 303
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
X2-DFN2018-8
F
G H
SIDE VIEW
B
D
C
L3
D
L1
L4
A E
D
L5
L6
L2
N
D
K
D
M
BOTTOM VIEW
X2-DFN2018-8
Dim
Min
Max
Typ
A
1.95 2.08 2.00
B
1.75 1.88 1.80
C
0.25 0.35 0.30
D
0.20
E
0.30
F
0.26
G
0.36 0.40 0.39
H
0
0.05 0.02
K
0.15 0.25 0.20
L1
0.40 0.60 0.50
L2
0.90 1.10 1.00
L3
0.50 0.70 0.60
L4
0.30 0.50 0.40
L5
0.25 0.45 0.35
L6
0.20 0.40 0.30
M
0.40
N
0.30
All Dimensions in mm
TOP VIEW
Suggested Pad Layout
X2-DFN2018-8
X
C
Dimensions
C
G1
G2
G3
G4
X
X1
X2
X3
Y
Y1
Y2
Y3
Y
Y3
G3
X3
X2
G4
Y2
G1
Y1
X1
G2
Value (in mm)
0.40
0.10
0.20
0.10
0.20
0.25
0.60
0.50
0.35
0.50
0.40
1.00
0.30
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
52 of 303
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
U-DFN2020-2 (Type B)
A
1
A
e
n
a
l
P
g
n
i
t
a
e
S
1
Z
2
D D
2
E
k
E
L
U-DFN2020-2
(Type B)
Dim Min Max
Typ
A
0.47 0.53
0.50
A1 0.00 0.05
0.02
b
1.55 1.65
1.60
D
1.95 2.05
2.00
D2 1.50 1.70
1.60
E
1.95 2.05
2.00
E2 1.22 1.42
1.32
k
0.25 BSC
L
0.23 0.33
0.28
Z
0.20 BSC
Z1
0.075 BSC
All Dimensions in mm
b
Z
U-DFN2020-2 (Type B)
A
1
A
e
n
a
l
P
g
n
i
t
a
e
S
1
Z
2
D D
2
E
k
E
L
U-DFN2020-2
(Type B)
Dim Min Max
Typ
A
0.47 0.53
0.50
A1 0.00 0.05
0.02
b
1.55 1.65
1.60
D
1.95 2.05
2.00
D2 1.50 1.70
1.60
E
1.95 2.05
2.00
E2 1.22 1.42
1.32
k
0.25 BSC
L
0.23 0.33
0.28
Z
0.20 BSC
Z1
0.075 BSC
All Dimensions in mm
b
Z
Suggested Pad Layout
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
53 of 303
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
U-DFN2020-2 (Type B)
X
Y
Dimensions
2
Y
G
1
Y
G
X
X1
Y
Y1
Y2
Value
(in mm)
0.150
1.700
1.700
0.480
1.520
2.150
1
X
U-DFN2020-2 (Type B)
X
Y
Dimensions
2
Y
G
1
Y
G
X
X1
Y
Y1
Y2
Value
(in mm)
0.150
1.700
1.700
0.480
1.520
2.150
1
X
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
54 of 303
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
U-DFN2020-3
3
A
1
A
A
e
n
a
l
P
g
n
i
t
a
e
S
L
D 2
D
3
E
0
0
D
2
I
.
0
1
R #
n
i
P
2
E
E
U-DFN2020-3
Dim Min Max
Typ
A
0.57 0.63
0.60
A1
0
0.05
0.02
A3
0.152
b
0.20 0.30
0.25
D 1.950 2.075 2.00
D2 1.10 1.30
1.20
D3
0.325 REF
e
0.50
E 1.950 2.075 2.00
E2 0.80 1.00
0.90
E3
0.138 REF
L
0.35 0.45
0.40
All Dimensions in mm
3
D
L
b
e
Suggested Pad Layout
U-DFN2020-3
3
X
1
X
1
Y
0
0
2
.
0
R
0
5
0
.
0
R
Dimensions
5
2
2
.
0
R
2
X
4
Y
0
0
2
.
0
R
2
Y
G
3
Y
Y
C
G
X
X1
X2
X3
Y
Y1
Y2
Y3
Y4
Value
(in mm)
1.000
0.150
0.350
0.450
1.400
1.724
0.600
0.450
1.100
0.450
2.300
X
C
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
55 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
U-DFN2020-3 (Type B)
3
A
1
A
A
e
n
a
l
P
g
n
i
t
a
e
S
D
e
e
Z
L
4
D
2
D
2
E
E
4
E
U-DFN2020-3
(Type B)
Dim
Min
Max
Typ
A
0.57
0.63
0.60
A1
0.00
0.05
0.02
A3
––
––
0.152
b
0.20
0.30
0.25
D
1.950 2.075
2.00
D2
1.22
1.42
1.32
D4
0.56
0.76
0.66
E
1.950 2.075
2.00
E2
0.79
0.99
0.89
E4
0.48
0.68
0.58
e
––
––
0.65
L
0.25
0.35
0.30
Z
––
––
0.225
All Dimensions in mm
b
Suggested Pad Layout
U-DFN2020-3 (Type B)
X
1
Y
Dimensions
1
X
2
Y
G
Y
C
G
X
X1
X2
Y
Y1
Y2
Value
(in mm)
1.300
0.240
0.350
1.520
1.700
0.500
0.470
1.090
C
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
56 of 303
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Suggested Pad Layout
V-DFN2020-3
C
C
X (3x)
Dimensions
Y (2x)
G
Y4
Y3
Y1
Y2
X1
C
G
X
X1
Y
Y1
Y2
Y3
Y4
Value
(in mm)
0.65
0.20
0.35
1.52
0.55
0.98
0.47
0.63
2.20
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
57 of 303
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
U-DFN2020-6
1
A
3
A
A
e
n
a
l
P
g
n
i
t
a
e
S
2
D D
2
/
2
D
0
0
1
.
0
R
2
/
2
E
D
I
1
#
n
i
P
2
E
E
U-DFN2020-6
Dim Min Max Typ
A
0.57 0.63 0.60
A1
0
0.05 0.03
A3
0.15
b
0.20 0.30 0.25
D
1.95 2.075 2.00
D2 1.45 1.65 1.55
e
0.65
E
1.95 2.075 2.00
E2
0.76 0.96 0.86
L
0.30 0.40 0.35
All Dimensions in mm
L
b
e
Suggested Pad Layout
U-DFN2020-6
C
X
G
Y
Dimensions
1
Y
G
C
G
X
X1
Y
Y1
Value
(in mm)
0.65
0.15
0.37
1.67
0.45
0.90
X
1
X
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
58 of 303
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
U-DFN2020-6/SWP
3
A
1
A
A
e
n
a
l
P
g
n
i
t
a
e
S
A
D
U-DFN2020-6/SWP
Dim Min Max
Typ
A
0.59 0.65
0.62
A1
0
0.05
0.03
A3
0.19
b
0.28 0.38
0.33
D
1.95 2.05
2.00
D2 0.87 1.07
0.97
D2a 0.205 0.305 0.255
E
1.95 2.05
2.00
E2 1.42 1.62
1.52
E2a 0.69 0.79
0.74
e
0.65 BSC
L
0.28 0.38
0.33
k
0.450 BSC
k1
0.225 BSC
Z
0.20
All Dimensions in mm
2
D
Detail A
k
a
2
D
1
k
a
2
E
2
E
E
x
2
L
︵ ︶
e
b
z
Suggested Pad Layout
U-DFN2020-6/SWP
1
X
1
Y
1
G
Dimensions
3
Y
2
Y
Y
G
C
G
G1
X
X1
Y
Y1
Y2
Y3
Value
(in mm)
0.650
0.125
0.350
0.400
1.700
0.365
0.515
0.825
2.330
X
C
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
59 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
U-DFN2020-6 (Type B)
A
A3
SEATING PLANE
A1
D
Pin#1 ID
D2
z
d
E
E2
f
f
L
e
b
U-DFN2020-6
Type B
Dim
Min
Max
Typ
A
0.545 0.605 0.575
A1
0
0.05 0.02
A3
0.13
b
0.20 0.30 0.25
D
1.95 2.075 2.00
d
0.45
D2
0.50 0.70 0.60
e
0.65
E
1.95 2.075 2.00
E2
0.90 1.10 1.00
f
0.15
L
0.25 0.35 0.30
z
0.225
All Dimensions in mm
Suggested Pad Layout
U-DFN2020-6 (Type B)
C
Y
Dimensions
G
X2
Z
G
G1
X1
X2
Y
Y1
C
G1
X1
G
Y1
Z
Value
(in mm)
1.67
0.20
0.40
1.0
0.45
0.37
0.70
0.65
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
60 of 303
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
U-DFN2020-6 (Type C)
A1
A
A3
Seating Plane
D
D2
Pin #1 ID
E
E2
Z(4x)
L
U-DFN2020-6
Type C
Dim
Min
Max
Typ
A
0.57
0.63
0.60
A1
0.00
0.05
0.02
A3
––
––
0.15
b
0.25
0.35
0.30
D
1.95 2.075
2.00
D2
1.55
1.75
1.65
E
1.95 2.075
2.00
E2
0.86
1.06
0.96
e
––
––
0.65
L
0.25
0.35
0.30
Z
––
––
0.20
All Dimensions in mm
b
e
Suggested Pad Layout
U-DFN2020-6 (Type C)
X2
X1
Y
Y2
Y1
X
Dimensions
C
X
X1
X2
Y
Y1
Y2
Value
(in mm)
0.650
0.350
1.650
1.700
0.525
1.010
2.400
C
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
61 of 303
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
U-DFN2020-6 (Type E)
3
A
1
A
A
D
1
K
1
b
2
D
X
2
L
1
L
2
E
E
︵
︶
2
K
︵
X
6
b
︶
e
X
4
Z
︵
︶
U-DFN2020-6
Type E
Dim Min Max
Typ
A
0.57 0.63
0.60
A1
0
0.05
0.03
A3
0.15


b
0.25 0.35
0.30
b1 0.185 0.285 0.235
D
1.95 2.05
2.00
D2
0.85 1.05
0.95
E
1.95 2.05
2.00
E2
1.40 1.60
1.50
e
0.65


L
0.25 0.35
0.30
L1
0.82 0.92
0.87
K1
0.305


K2
0.225


Z
0.20


All Dimensions in mm
Suggested Pad Layout
U-DFN2020-6 (Type E)
Dimensions
1
Y
2
X
2
Y
3
Y
C
X
X1
X2
Y
Y1
Y2
Y3
1
X
︵
x
2
Y
︶
C
x
6
X
︵
Value
(in mm)
0.650
0.400
0.285
1.050
0.500
0.920
1.600
2.300
︶
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
62 of 303
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
U-DFN2020-6 (Type F)
A
3
A
1
A
e
n
a
l
P
g
n
i
t
a
e
S
D
3
D
3
E
2
D
2
E
E
L
2
e
1
Z
b
e
X
4
Z
︵
U-DFN2020-6
(Type F)
Dim Min Max
Typ
A
0.57 0.63
0.60
A1
0
0.05
0.03
A3
0.15
b
0.25 0.35
0.30
D
1.95 2.05
2.00
D2 0.85 1.05
0.95
D3 0.33 0.43
0.38
e
0.65 BSC
e2
0.863 BSC
E
1.95 2.05
2.00
E2 1.05 1.25
1.15
E3 0.65 0.75
0.70
L 0.225 0.325 0.275
Z
0.20 BSC
Z1
0.110 BSC
All Dimensions in mm
︶
U-DFN2020-6 (Type F)
A
3
A
1
A
e
n
a
l
P
g
n
i
t
a
e
S
D
3
D
3
E
2
D
2
E
E
L
2
e
1
Z
b
e
X
4
Z
︵
U-DFN2020-6
(Type F)
Dim Min Max
Typ
A
0.57 0.63
0.60
A1
0
0.05
0.03
A3
0.15
b
0.25 0.35
0.30
D
1.95 2.05
2.00
D2 0.85 1.05
0.95
D3 0.33 0.43
0.38
e
0.65 BSC
e2
0.863 BSC
E
1.95 2.05
2.00
E2 1.05 1.25
1.15
E3 0.65 0.75
0.70
L 0.225 0.325 0.275
Z
0.20 BSC
Z1
0.110 BSC
All Dimensions in mm
︶
Suggested Pad Layout
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
63 of 303
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
U-DFN2020-6 (Type F)
3
X
Y
X
C
Dimensions
4
Y
1
Y
2
Y
3
Y
1
X
1
n
i
P
C
X
X1
X2
X3
Y
Y1
Y2
Y3
Y4
Value
(in mm)
0.650
0.400
0.480
0.950
1.700
0.425
0.800
1.150
1.450
2.300
2
X
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
64 of 303
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
X2-DFN2020-6
3
A
1
A
A
D
e
L
2
D
2
E
E
1
L
X
6
b
e
X
3
Z
︵
︶
X2-DFN2020-6
Dim Min
Max
Typ
A
0.40


A1
0
0.05
0.03
A3
0.13


b
0.25 0.35
0.30
D
1.95 2.05
2.00
D2 0.85 1.05
0.95
E
1.95 2.05
2.00
E2 1.40 1.60
1.50
e
0.65


L
0.25 0.35
0.30
L1 1.35 1.45
1.40
Z
0.20


All Dimensions in mm
︵
︶
Suggested Pad Layout
X2-DFN2020-6
X2
X1
Y
C
X
X1
X2
Y
Y1
Y2
Y3
Y3 Y2
Y1
X (6x)
Dimensions
Value
(in mm)
0.650
0.400
1.050
1.700
0.500
1.600
1.600
2.300
C
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
65 of 303
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Suggested Pad Layout
U-DFN2020-8
3
A
1
A
A
e
n
a
l
P
g
n
i
t
a
e
S
U-DFN2020-8
Dim Min Max
Typ
A
0.57 0.63
0.60
A1
0
0.05
0.02
A3
0.152
b
0.20 0.30
0.25
D
1.95 2.05
2.00
D2 0.54 0.74
0.64
e
0.500 BSC
E
1.95 2.05
2.00
E2 0.86 1.06
0.96
K
0.23
K1
0.32
L
0.24 0.34
0.29
Z
0.125
All Dimensions in mm
D
2
D
D
I
1
#
n
i
P
K
1
K
0
5
1
.
0
R
2
E
E
L
b
e
Z
Suggested Pad Layout
U-DFN2020-8
3
X
C
X
G
Y
Dimensions
1
X
C
G
X
X1
X2
Y
Y1
Y1
1
Y
2
Y
Value
(in mm)
0.500
0.150
0.350
0.700
1.660
0.490
1.020
2.300
2
X
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
66 of 303
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
W-DFN2020-6 (Type US)
A1
A
A3
Seating Plane
D
D2
Pin #1 ID
E
E2
W-DFN2020-6
(Type US)
Dim
Min
Max
Typ
A
0.70
0.80
0.75
A1
0.00
0.05
-A3
0.20 REF
b
0.25
0.35
0.30
D
1.95 2.075
2.00
D2
1.35
1.60
1.50
E
1.95 2.075
2.00
E2
0.65
0.90
0.80
e
0.65 BSC
L
0.25
0.45
0.35
All Dimensions in mm
L
b
e
Suggested Pad Layout
W-DFN2020-6 (Type US)
X1
X2
Y
Dimensions
C
X
X1
X2
Y
Y1
Y2
Y2
Y1
Value
(in mm)
0.650
0.350
1.650
1.550
0.545
0.850
2.350
X
C
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
67 of 303
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
W-DFN2020-8 (Type C)
1
A
A
e
n
a
l
P
g
n
i
t
a
e
S
3
A
D 2
* D
2
/
2
D
K
D
I
1
#
n
i
P
2
/
2
E
2
E
0
0
2
.
0
R
E
L
W-DFN2020-8
Type C
Dim Min
Max
Typ
A
0.770 0.830 0.800
A1
0
0.05 0.02
A3
0.152
b
0.20 0.30 0.25
D
1.950 2.075 2.000
D2
1.50 1.70 1.60
E
1.950 2.075 2.000
E2
0.80 1.00 0.90
e
0.50
K
0.125
L
0.240 0.340 0.290
All Dimensions in mm
b
e
Suggested Pad Layout
W-DFN2020-8
Y
2 G
X
1
Y
2
Y
1
G
Dimensions Value (in mm)
C
0.500
G
0.200
G1
0.210
X
0.300
X1
1.600
X2
1.750
Y
0.490
Y1
0.900
Y2
2.300
1
X
C
X
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
68 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
3
A
1
A
U-DFN2030-6 (Type B)
A
e
n
a
l
P
g
n
i
t
a
e
S
D
e
D
I
1
#
n
i
P
︵
︶
2
E
E
L
2
D
b
x
4
Z
U-DFN2030-6
Type B
Dim Min Max Typ
A
0.55 0.65 0.60
A1
0
0.05 0.02
A3
0.15
b
0.25 0.35 0.30
D
1.95 2.05 2.00
D2 1.40 1.60 1.50
E
2.95 3.05 3.00
E2 1.74 1.94 1.84
e
0.65
L
0.28 0.38 0.33
Z
0.20
All Dimensions in mm
︵ ︶
Suggested Pad Layout
U-DFN2030-6 (Type B)
2
X
Y
G
Dimensions
1
X
C
G
X
X1
X2
Y
Y1
Y2
1
Y
2
Y
Value
(in mm)
0.650
0.150
0.400
1.600
1.700
0.530
1.940
3.300
X
C
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
69 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
U-DFN2030-6 (Type C)
3
A
1
A
A
e
n
a
l
P
g
n
i
t
a
e
S
D
L
e
1
1
e
0
5D
1I
.
1
0
n
R i
P
2
E
E
2
D
z
Dim
A
A1
A3
b
b2
D
D2
E
E2
e
e1
L
z
U-DFN2030-6
(Type C)
Min
Max
Typ
0.50
0.60
-0.00
0.05
0.02
--0.127
0.25
0.35
0.30
0.60
0.70
0.65
1.90
2.10
2.00
1.60
1.80
1.70
2.90
3.10
3.00
1.60
1.80
1.70
--0.60
--0.775
0.25
0.35
0.30
0.0500 Ref
All Dimensions in mm
b
2
b
Suggested Pad Layout
U-DFN2030-6 (Type C)
1
G
X
1
X
Y
Dimensions
G
1
Y
2
X
C
C1
G
G1
X
X1
X2
Y
Y1
Value
(in mm)
0.600
0.775
0.200
0.200
0.400
0.750
1.800
0.500
1.800
C
1
C
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
70 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
U-DFN2030-8
A
3
A
1
A
e
n
a
l
P
g
n
i
t
a
e
S
D
L
e
D
I
1
#
n
i
P
︵
︶
2
D
2
E
°
5
4
*
5
2
.
0
'
C
E
b
Z
U-DFN2030-8
Dim Min Max Typ
A 0.57 0.63 0.60
A1
0
0.05 0.02
A3
0.15
b 0.20 0.30 0.25
D 1.95 2.05 2.00
D2 1.40 1.60 1.50
e
0.50
E 2.95 3.05 3.00
E2 1.50 1.70 1.60
L 0.35 0.45 0.40
Z
0.125
All Dimensions in mm
Suggested Pad Layout
U-DFN2030-8
2
X
Y
C
Dimensions
1
Y
2
Y
C
G
X
X1
X2
Y
Y1
Y2
1
X
G
Value
(in mm)
0.500
0.250
0.350
1.500
1.850
0.600
1.600
3.300
X
1
n
i
P
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
71 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
X1-DFN2030-8
1
A
A
Seating Plane
X
4
1
Z
︵
X
4
Z
D
e
(Pin #1 ID)
C0.5X45°
︵
︶
︶
1
L
K
1
K
E
x
7
L
X1-DFN2030-8
Dim
Min
Max
Typ
A
0.470 0.530 0.50
A1
0
0.05 0.02
b
0.20 0.30 0.25
D
1.95 2.05 2.00
E
2.95 3.05 3.00
e
0.50
K
2.00
K1
1.90
L
0.35 0.45 0.40
L1
0.45 0.55 0.50
Z
0.125
Z1
0.100
All Dimensions in mm
︵ ︶
b
Suggested Pad Layout
X1-DFN2030-8
1
X
1
Y
Dimensions
G
2
Y
C
G
X
X1
Y
Y1
Y2
Y
Value
(in mm)
0.500
1.900
0.350
1.850
0.500
0.700
3.100
X
C
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
72 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
U-DFN2510-10
3
A
1
A
A
e
n
a
l
P
g
n
i
t
a
e
S
1
D b
5
7
0
.
0
R
E
L
Z
U-DFN2510-10
Dim
Min Max Typ
A
0.545 0.605 0.575
A1
0
0.05 0.03
A3
0.13
b
0.15 0.25 0.20
b1
035 0.45 0.40
D
2.450 2.575 2.500
e
0.50
E
0.950 1.075 1.000
L
0.325 0.425 0.375
Z
0.150
All Dimensions in mm
5
2
1
.
0
R
b
e
Suggested Pad Layout
U-DFN2510-10
2
X
X
1
X
Y
1
Y
Dimensions
3
Y
C
X
X1
X2
Y
Y1
Y2
Y3
2
Y
C
Value
(in mm)
0.500
0.250
0.450
2.250
0.625
0.575
0.700
1.400
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
73 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
U-DFN2535-6
A
3
A
1
A
e
n
a
l
P
g
n
i
t
a
e
S
D
L
e
D
I
1
#
n
i
P
︵
︶
1
0
5
1
.
0
R
2
E
E
2
D
U-DFN2535-6
Dim Min Max
Typ
A
0.50 0.60
-A1
0.00 0.05
0.02
A3
0.127
b
0.25 0.35
0.30
D
2.45 2.55
2.50
D2
1.87 2.07
1.97
E
3.45 3.55
3.50
E2
1.20 1.40
1.30
e
0.65
L
0.33 0.43
0.38
Z
0.45
All Dimensions in mm
b
Z
Suggested Pad Layout
U-DFN2535-6
X
G
Dimensions
1
Y
C
G
X
X1
Y
Y1
1
X
Value
(in mm)
0.650
0.620
0.400
2.070
0.610
1.400
Y
C
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
74 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
U-DFN2535-6(Type B)
3
A
A
e
n
a
l
P
g
n
i
t
a
e
S
D
1
A
e
︶
D
I
01
5#
1n
.
0
i
R P
︵
6
X
L
1
e
︵
︶
2
E
E
2
D
b
z
U-DFN2535-6
(Type B)
Dim
Min
Max
Typ
A
0.50
0.60
A1
0.00
0.05
0.02
A3
0.127
b
0.25
0.35
0.30
b2
1.05
1.15
1.10
D
2.45
2.55
2.50
D2
2.01
2.21
2.11
E
3.45
3.55
3.50
E2
2.20
2.40
2.30
e
0.55
e1
0.95
L
0.25
0.35
0.30
z
0.15
All Dimensions in mm
2
b
Suggested Pad Layout
U-DFN2535-6
(Type B)
X
1
X
2
X
Dimensions
1
Y
C
C1
X
X1
X2
Y
Y1
Y
Value
(in mm)
0.550
0.950
0.400
1.200
2.210
0.500
2.400
C
1
C
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
75 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
V-DFN2050-4
1
A
3
A
A
e
n
a
l
P
g
n
i
t
a
e
S
D
e
D
I
1
#
n
i
P
V-DFN2050-4
Dim
Min
Max
Typ
A
0.75
0.85
0.80
A1
0
0.05
0.02
A3
0.15
b
0.20
0.30
0.25
b1
0.70
0.80
0.75
D
1.90
2.10
2.00
D2
1.40
1.60
1.50
E
4.90
5.10
5.00
E2
3.46
3.66
3.56
e
0.50 BSC
L
0.35
0.65
0.50
Z
0.375
All Dimensions in mm
2
D
2
E
E
L
b
Z
1
b
Suggested Pad Layout
V-DFN2050-4
X
1
X
G
Y
C
Dimensions
1
Y
C
G
X
X1
X2
X3
Y
Y1
Y2
2
Y
2
X
Value
(in mm)
0.500
0.150
0.350
0.850
1.540
0.175
0.700
3.600
5.300
3
X
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
76 of 303
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
U-DFN2116-8
3
A
1
A
A
U-DFN2116-8
e
n
a
l
P
g
n
i
t
a
e
S
D 2
D
2
/
2
D
°
5
D4
I
x
12
#.
0
n'
i
C
P
︵
︶
0
0
1
.
0
R
2
/
2
E
2
E
E
0
0
6
.
0
︶
L
︵
Dim
Min
Max
Typ
A
0.545
0.605
0.575
A1
0.000
0.050
0.020
A3
-
-
0.130
b
0.200
0.300
0.250
D
2.050
2.175
2.100
D2
1.600
1.800
1.700
E
1.550
1.675
1.600
E2
0.300
0.500
0.400
e
-
-
0.500
L
0.275
0.375
0.325
Z
-
-
0.175
b
e
All Dimensions in mm
Z
Suggested Pad Layout
U-DFN2116-8
2
X
C
Y
Dimensions
1
Y
2
Y
1
X
C
X
X1
X2
Y
Y1
Y2
Value
(in mm)
0.500
0.300
1.750
1.800
0.600
0.450
2.050
1
n
i
P
X
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
77 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
U-DFN2523-6
A
A3
A1
D
e
L (3x)
Pin #1 ID
R0.150
E
E1
D1
L1 (2x)
U-DFN2523-6
Dim
Min Max
Typ
A
0.57 0.63 0.60
A1
0
0.05 0.02
A3
0.152
b
0.25 0.35 0.30
D
2.45 2.55 2.50
D1
1.55 1.65 1.60
e
0.65
E
2.25 2.35 2.30
E1
1.18 1.28 1.23
L
0.30 0.40 0.35
L1
0.30 0.40 0.35
All Dimensions in mm
b (6x)
Suggested Pad Layout
U-DFN2523-6
X1
Y1
Dimensions Value (in mm)
C
0.650
X
0.400
X1
1.700
Y
0.650
Y1
0.450
Y2
1.830
Y3
2.700
Y2
Y3
Y
C
X
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
78 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
U-DFN2626-10
A
A3
A1
Seating Plane
D
D2
U-DFN2626-10
Dim Min Max
Typ
A
0.57 0.63
0.60
A1
0
0.05
0.03
A3
0.15
b
0.20 0.30
0.25
D
2.55 2.675 2.60
D2 2.05 2.25
2.15
E
2.55 2.675 2.60
E2 1.16 1.36
1.26
e
0.50 BSC
L
0.30 0.40
0.35
All Dimensions in mm
C'0.2x45°
(Pin #1 ID)
D2/2
E
E2/2
E2
0
.10
R0
L
e
b
Suggested Pad Layout
U-DFN2626-10
X2
Y
Dimensions
C
X
X1
X2
Y
Y1
Y2
X1
Y2
Y1
Pin1
Value
(in mm)
0.500
0.300
2.250
2.300
0.600
1.360
3.000
C
X
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
79 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
U-DFN3016-12
A
A3
A1
D
E
E2
D2
L (12x)
U-DFN3016-12
Dim Min
Max Typ
A
0.545 0.605 0.575
A1
0
0.05 0.02
A3
0.13
b
0.20
0.30 0.25
D
2.95 3.075 3.00
D2
2.10
2.30 2.20
e
0.50
E
1.55 1.675 1.60
E2
0.30
0.50 0.40
L
0.28
0.38 0.33
All Dimensions in mm
b (12x)
e
Suggested Pad Layout
U-DFN3016-12
X1
Y
(12x)
Dimensions
X2
C
Y1
Y2
C
X
X1
X2
Y
Y1
Y2
Value
(in mm)
0.500
0.300
2.800
2.250
0.600
0.450
2.050
X
(12x)
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
80 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
X2-DFN3020-6
A
A1
A3
D
e
Pin #1 ID
D1
E
E1
L
Z
X2-DFN3020-6
Dim Min Max
Typ
A
-
0.40
A1
0
0.05
0.02
A3
0.15
b
0.20 0.30
0.25
D
1.95 2.075 2.00
D1 0.942 1.142 1.042
e
0.50
E
2.95 3.075 3.00
E1 1.124 1.324 1.224
L
0.50 0.60
0.55
Z
0.375
All Dimensions in mm
b
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
81 of 303
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
A
V-DFN3020-8
3
A
1
A
e
n
a
l
P
g
n
i
t
a
e
S
D
e
D
I
1
#
n
i
P
︵
︶
E
L
V-DFN3020-8
Dim Min Max Typ
A
0.77 0.83 0.80
A1
0
0.05 0.02
A3
0.203
b
0.25 0.35 0.30
D
2.95 3.05 3.00
e
0.65
E
1.95 2.05 2.00
L
0.30 0.40 0.35
Z
0.375
All Dimensions in mm
b
Z
Suggested Pad Layout
V-DFN3020-8
1
X
Y
X
G
1
Y
Dimensions
C
G
X
X1
Y
Y1
Value (in mm)
0.650
1.000
0.400
2.350
0.650
2.300
C
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
82 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
W-DFN3020-8 (Type B)
A
W-DFN3020-8
Type B
Dim Min Max Typ
A
0.77 0.83 0.80
A1
0
0.05 0.02
A3
0.15
b
0.25 0.35 0.30
D
2.95 3.075 3.00
D2 0.82 1.02 0.92
D4 1.01 1.21 1.11
e
0.65
E
1.95 2.075 2.00
E2 0.43 0.63 0.53
L
0.25 0.35 0.30
Z
0.375
All Dimensions in mm
A3
A1
Seating Plane
D
D4
D4
(Pin #1 ID)
E
E2
E2
D2
D2
L
e
e
e
b
Z
Suggested Pad Layout
W-DFN3020-8 (Type B)
C
X
Y1
G1
G
Y2
Y
X1
Dimensions Value (in mm)
C
0.650
G
0.285
G1
0.090
X
0.400
X1
1.120
Y
0.730
Y1
0.500
Y2
0.365
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
83 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
W-DFN3020-8 (Type K)
A
A3
A1
D
e
D3
L1
L2
E
E3
E1
E2
D2
D1
E4
(2x)
L (4x)
Dim Min
A
0.77
A1 0.00
A3
b
0.25
D
2.95
D1 1.025
D2 1.05
D3 0.375
D4 0.40
E
1.95
D4 (2x)
W-DFN3020-8
Type K
Max Typ Dim Min Max Typ
E1
0.83 0.80
0.56 0.76 0.66
E2
0.05 0.02
0.26 0.46 0.36
E3 0.605 0.805 0.705
0.15
E4 0.275 0.475 0.375
0.35 0.30
L
3.05 3.00
0.425 0.525 0.475
1.225 1.125 L1
0.30 0.40 0.35
L2
1.25 1.15
0.60 0.70 0.65
Z
0.575 0.475
0.375
e
0.60 0.50
0.65
2.05 2.00
All Dimensions in mm
b
Z (4x)
Suggested Pad Layout
W-DFN3020-8 (Type K)
Dimensions Value (in mm)
C
0.650
X
0.600
X1
0.400
X2
0.825
X3
0.675
X4
1.250
X5
2.750
Y
0.675
Y1
0.550
Y2
0.850
Y3
0.755
Y4
1.455
Y5
1.000
Y6
0.650
Y7
1.455
Y8
2.300
X5
X (2x)
C
Y (4x)
X4
Y8
Y7
Y6
Y5
X3
Y4
Y3
X2
Y2
X1 (6x)
Y1
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
84 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
V-DFN3020-8 (Type N)
3
A
1
A
A
e
n
a
l
P
g
n
i
t
a
e
S
D
e
D
I
1
#
n
i
P
︵
︶
L
K
2
D
1
L
E
2
E
b
x
4
Z
V-DFN3020-8
(Type N)
Dim Min Max
Typ
A
0.77 0.83
0.80
A1
0
0.05
0.02
A3
0.203
b
0.24 0.34
0.29
D
2.95 3.05
3.00
D2 0.84 1.04
0.94
e
0.65
E
1.95 2.05
2.00
E2 0.70 0.90
0.80
L
0.27 0.37
0.32
L1 0.15 0.25
0.20
K
0.68
Z
0.38
All Dimensions in mm
︵ ︶
Suggested Pad Layout
V-DFN3020-8
(Type N)
2
X
Y
X
C
Dimensions
G
1
X
3
Y
1
Y
2
Y
C
G
X
X1
X2
Y
Y1
Y2
Y3
Value
(in mm)
0.650
0.580
0.390
1.040
2.340
0.520
0.900
0.300
2.300
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
85 of 303
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
U-DFN3020-10
3
A
1
A
A
e
n
a
l
P
g
n
i
t
a
e
S
U-DFN3020-10
Dim Min Max Typ
A 0.57 0.63 0.60
A1
0
0.05 0.02
A3
0.15
b 0.15 0.25 0.20
D 2.95 3.05 3.00
D1 0.25 0.45 0.35
E 1.95 2.05 2.00
E1 0.90 1.10 1.00
e
0.60
e1
0.65
e2 0.50 0.70 0.60
L 0.25 0.35 0.30
Z
0.15
All Dimensions in mm
D
e
°
5
4
X
2
.
0
'
C
x
3
1
D
D
I
1
#
n
i
P
︵
︶
︵ ︶
x
3
1
E
E
x
0
1
L
︵ ︶
2
e
︵
︶
1
e
x
0
1
b
x
4
Z
︵ ︶
︵
︶
Suggested Pad Layout
U-DFN3020-10
2
X
Dimensions
Y
1
G
C
G
G1
X
X1
X2
Y
Y1
Y2
1
Y
2
Y
G
1
X
X
C
Value
(in mm)
0.650
0.150
0.600
0.300
0.350
2.800
0.500
1.000
2.300
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
86 of 303
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
V-DFN3020-10
3
A
1
A
A
e
n
a
l
P
g
n
i
t
a
e
S
D
e
a
L
c
L
2
E
0D
5
I
1
.
1
0
#
Rn
i
P
︵
2
E
2
E
︶
a
2
D
2
D
2
E
a
L
a
2
E
c
2
D
d
2
D
E
b
2
D
2
E
e
2
D
b
L
x
6
L
︵ ︶
x
0
1
b
x
4
Z
︵ ︶
︵
︶
V-DFN3020-10
Dim
Min
Max
Typ
A
0.75
0.85
0.80
A1
0
0.05
0.02
A3
0.15
b
0.15
0.25
0.20
D
2.95 3.075 3.00
D2
1.000
D2a
0.400
D2b
0.500
D2c
0.850
D2d
0.320
D2e
0.400
E
1.95 2.075 2.00
E2
0.200
E2a
0.450
e
0.60
L
0.25
0.35
0.30
La
0.460
Lb
0.550
Lc
0.548
Z
0.175 0.225 0.20
All Dimensions in mm
Suggested Pad Layout
V-DFN3020-10
Dimensions
︵
x
0
1
X
x
6
Y
︵ ︶
︶
2
Y
1
Y
G
5
Y
4
Y
3
G
2
X
1
X
1
G
3
Y
5
X
3
X
6
Y
1
1
Y
6
X
9
Y
8
Y
4
X
2
G
0
1
Y
7
Y
C
C
G, G2, G3
G1
X
X1
X2
X3
X4
X5
X6
Y
Y1
Y2
Y3
Y4, Y5, Y6
Y7
Y8, Y9
Y10
Y11
Value
(in mm)
0.600
0.150
0.240
0.300
0.950
0.500
0.600
1.100
0.500
0.420
0.500
0.650
0.560
0.550
0.300
0.650
0.300
0.560
2.300
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
87 of 303
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
V-DFN3020-14
3
A
1
A
A
e
n
a
l
P
g
n
i
t
a
e
S
D
e
D
I
1
#
n
i
P
︶
2
D
︵
0
0
2
.
0
R
1
E
E
L
b
Z
V-DFN3020-14
Dim Min Max Typ
A 0.77 0.83 0.80
A1
0
0.05 0.02
A3
0.15
b 0.15 0.25 0.20
D 2.95 3.05 3.00
D2 2.40 2.60 2.50
E 1.95 2.05 2.00
E1 0.80 1.00 0.90
e
0.40
L 0.30 0.40 0.35
Z
0.20
All Dimensions in mm
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
88 of 303
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
U-DFN3030-4
A3
A
A1
U-DFN3030-4
Dim Min Max Typ Dim Min
A
E1 0.615
0.57 0.63 0.60
A1
E2
0
0.05 0.02
1.78
A3
E3 0.715
0.15
B
H
0.35 0.45 0.40
0.05
D
I
2.90 3.10 3.00
0.20
D1 1.075 1.275 1.175
J
0.185
D2 0.925 1.125 1.025 K 0.065
D3 1.075 1.275 1.175
L
0.30
E
M
2.90 3.10 3.00
0.05
e
Z
1.30
All Dimensions in mm
Side View
D
e
H
D3
E3
E
K
I
E2
D2
J
D1
E1
M
L
Z
Max
0.815
1.98
0.915
0.15
0.30
0.285
0.165
0.60
0.15
-
Typ
0.715
1.88
0.815
0.10
0.25
0.235
0.115
0.45
0.10
0.65
b
Bottom View
Suggested Pad Layout
U-DFN3030-4
C
Y3 (2x)
G6
G4
Y2
Dimensions
C
G1
G2
G3
G4
G5
G6
G7
G8
R
X
X1
X2
X3
Y
Y1
Y2
Y3
G1
X3
G3
R
Y
G2
G5
Y1
X2
X1
G7
G8
X (4x)
Value (in mm)
1.300
0.100
0.150
0.830
0.115
0.135
0.170
0.500
0.500
0.150
0.500
1.375
1.225
1.175
1.980
1.015
0.715
0.650
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
89 of 303
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
U-DFN3030-6
3
A
1
A
A
e
n
a
l
P
g
n
i
t
a
e
S
U-DFN3030-6
Dim Min
Max
Typ
A
0.57 0.63 0.60
A1
0
0.05 0.02
A3
0.15
b
0.35 0.45 0.40
D
2.95 3.05 3.00
D2 2.25 2.45 2.35
E
2.95 3.05 3.00
E2 1.48 1.68 1.58
e
0.95
L
0.35 0.45 0.40
Z
0.35
All Dimensions in mm
2
D D
D
I
1
#
n
i
P
︵
︶
5
3
.
0
*
5
3
.
0
°
5
4
︵
︶
L
E
2
E
e
b
x
4
Z
︵ ︶
Suggested Pad Layout
U-DFN3030-6
21
XX
C
Dimensions
2
Y
1
Y
C
X
X1
X2
Y
Y1
Y2
9
0
4
.
0
C
Y
Value
(in mm)
0.950
0.500
2.400
2.550
0.600
1.780
3.300
X
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
90 of 303
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
V-DFN3030-6
1
A
3
A
D
A
e
n
a
l
P
g
n
i
t
a
e
S
V-DFN3030-6
Dim Min Max Typ
A 0.80 0.90 0.85
A1
0
0.05
A3
0.203
b 0.30 0.40 0.35
D 2.95 3.05 3.00
D2 1.95 2.05 2.00
E 2.95 3.05 3.00
E2 1.15 1.25 1.20
e
0.95
e1
1.90
L 0.45 0.55 0.50
All Dimensions in mm
e
L
2
D
2
E
E
°
5
4
X
0
0
3
.
0
Dr
I
e
1f
#m
a
nh
i
P
C
1
b e
Suggested Pad Layout
V-DFN3030-6
Y
Dimensions
1
X
1
Y
2
Y
C
X
X1
Y
Y1
Y2
9
2
3
.
0
C
Value
(in mm)
0.950
0.450
2.100
0.630
1.300
3.160
X
C
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
91 of 303
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
U-DFN3030-8
3
A
1
A
A
e
n
a
l
P
g
n
i
t
a
e
S
2
DD
2
E
E
L
0
0
2
.
0
R
D
I
1
#
n
i
P
b
︶
e
︵
U-DFN3030-8
Dim Min Max Typ
A
0.57 0.63 0.60
A1
0
0.05 0.02
A3
0.15
b
0.29 0.39 0.34
D
2.90 3.10 3.00
D2 2.19 2.39 2.29
e
0.65
E
2.90 3.10 3.00
E2
1.64 1.84 1.74
L
0.30 0.60 0.45
All Dimensions in mm
Suggested Pad Layout
U-DFN3030-8
Z
Dimensions Value (in mm)
Z
2.59
G
0.11
X1
2.49
X2
0.65
Y
0.39
C
0.65
X1
X2
G
Y
C
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
92 of 303
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
A
U-DFN3030-8 (Type D)
3
A
1
A
e
n
a
l
P
g
n
i
t
a
e
S
D
3
D
2 e
/
D
3
E
4
E
4
D
5
E
1
D
7
E
1
E
E
2
E
2
D
6
E
2
/
E
L
Dim
A
A1
A3
b
D
D1
D2
D3
D4
D5
e
Min
0.570
0
0.290
2.950
2.175
0.980
0.105
-
5
D
U-DFN3030-8
Type D
Max
Typ
Dim Min
E 2.950
0.630 0.600
E1 1.800
0.050 0.020
E2 0.290
0.150
E3 0.175
0.390 0.340
E4
3.075 3.000
E5
2.375 2.275
E6
1.180 1.080
E7
0.305 0.205
L
0.925
0.300
Z
1.330
0.650
All Dimensions in mm
Max
3.075
2.000
0.490
0.375
0.40
-
Typ
3.000
1.900
0.390
0.275
0.550
0.815
0.150
0.135
0.350
0.355
Z
X
8
b
︵
︶
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
93 of 303
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
U-DFN3030-8 (Type E)
A
A3
U-DFN3030-8
Type E
Dim Min Max Typ
A
0.57 0.63 0.60
A1
0
0.05 0.02
A3
0.15
b
0.20 0.30 0.25
D
2.95 3.05 3.00
D2 2.15 2.35 2.25
E
2.95 3.05 3.00
e
0.65
E2 1.40 1.60 1.50
L
0.30 0.60 0.45
Z
0.40
All Dimensions in mm
A1
D
D2
L (x8)
E
E2
Z (x4)
e
b (x8)
Suggested Pad Layout
U-DFN3030-8 (Type E)
X (x8)
C
Y
(x8)
Y1
Y2
Dimensions
C
C1
X
Y
Y1
Y2
Value (in mm)
0.65
2.35
0.30
0.65
1.60
2.75
C1
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
94 of 303
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
V-DFN3030-8
3
A
1
A
A
e
n
a
l
P
g
n
i
t
a
e
S
D
V-DFN3030-8
Dim Min Max
Typ
A
0.75 0.85
0.80
A1
0.00 0.05
0.02
A3
0.203
b
0.25 0.35
0.30
D
2.95 3.05
3.00
E
2.95 3.05
3.00
e
0.65
L
0.55 0.65
0.60
Z
0.375
All Dimensions in mm
e
L
10
#1
.
n0
i
P
C
E
b
X
4
Z
︵
︶
Suggested Pad Layout
V-DFN3030-8
C
Dimensions
1
Y
X
C
X
Y
Y1
Value
(in mm)
0.650
0.400
0.850
3.400
Y
1
n
i
P
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
95 of 303
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
V-DFN3030-8 Type H
3
A
1
A
A
e
n
a
l
P
g
n
i
t
a
e
S
D
1
Z
e
K
1
K
E
2
D
2
E
L
V-DFN3030-8
(Type H)
Dim Min Max Typ
A
0.75 0.85 0.80
A1
0
0.05 0.02
A3
0.203 BSC
b
0.27 0.37 0.32
D
2.95 3.05 3.00
D2 2.50 2.70 2.60
e
0.65 BSC
E
2.95 3.05 3.00
E2
0.59 0.79 0.69
L
0.30 0.40 0.35
K
0.28 BSC
K1
0.36 BSC
Z
0.365 BSC
Z1
0.24 BSC
All Dimensions in mm
x
8
b
Z
︵ ︶
Suggested Pad Layout
V-DFN3030-8 Type H
3
X C
G
2
X
1
Y
1
G
2
Y
1
Y
Y
Dimensions Value (in mm)
C
0.650
G
0.180
G1
0.260
X
0.420
X1
1.920
X2
2.700
X3
2.495
Y
0.550
Y1
0.790
Y2
3.300
1
X
X
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
96 of 303
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
V-DFN3030-8 Type J
3
A
1
A
A
e
n
a
l
P
g
n
i
t
a
e
S
D
e
2
/
D
D
I
#
1
N
I
P
a
2
D
L
k
2
E
E
a
2
E
2
D
2
/
E
V-DFN3030-8
(Type J)
Dim
Min
Max
Typ
A
0.77
0.83
0.80
A1
0.00
0.05
0.02
A3
0.203 BSC
b
0.20
0.30
0.25
D
2.95 3.050 3.00
D2
0.90
1.10
1.00
D2a
0.90
1.10
1.00
E
2.95 3.050 3.00
E2
1.72
1.92
1.82
E2a
1.72
1.92
1.82
e
0.65BSC
L
0.27
0.38
0.33
La
0.15
0.25
0.20
k
0.35 TYP
z
0.40 BSC
All Dimensions in mm
a
L
b
z
Suggested Pad Layout
V-DFN3030-8 Type J
1
Y
Dimensions
1
G
4
Y
3
Y
5
Y
1
X
2
Y
G
X
2
X
Y
C
3
X
C
G
G1
X
X1
X2
X3
X4
Y
Y1
Y2
Y3
Y4
Y5
Value
(in mm)
0.650
0.250
0.550
0.350
1.100
1.100
1.225
2.375
0.530
0.300
1.920
1.920
1.650
3.300
4
X
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
97 of 303
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
V-DFN3030-8 Type K
3
A
1
A
A
e
n
a
l
P
g
n
i
t
a
e
S
D
2
/
D
e
2
E
k
2
D
E
a
2
E
a
2
D
2
/
E
L
V-DFN3030-8
(Type K)
Dim
Min
Max
Typ
A
0.77
0.83
0.80
A1
0
0.05
0.02
A3
0.20BSC
b
0.35
0.45
0.40
D
2.95 3.050 3.00
D2
2.30
2.50
2.40
D2a
2.30
2.50
2.40
E
2.95 3.050 3.00
E2
0.42
0.62
0.52
E2a
0.89 0.109 0.99
e
0.65BSC
k
0.35
L
0.30
0.40
0.35
z
0.325BSC
All Dimensions in mm
b
Z
Suggested Pad Layout
V-DFN3030-8 Type K
1
X
C
X
Y
Dimensions
4
Y
5
Y
1
Y
6
Y
3
Y
2
Y
C
G
G1
X
X1
Y
Y1
Y2
Y3
Y4
Y5
Y6
Value
(in mm)
0.650
0.195
0.200
0.450
2.550
0.450
1.044
0.566
0.389
0.089
1.150
3.200
G
1
G
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
98 of 303
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
V-DFN3030-8 Type M
3
A
1
A
A
e
n
a
l
P
g
n
i
t
a
e
S
D
2
/
D
k
1
k
2
E
2
D
a
2
E
E
a
2
D
2
/
E
L
V-DFN3030-8
(Type M)
Dim Min Max Typ
A
0.75 0.85 0.80
A1
0.00 0.05 0.02
A3
0.203 BSC
b
0.27 0.37 0.32
D
2.95 3.05 3.00
D2 2.50 2.70 2.60
D2a 2.50 2.70 2.60
e
0.65 BSC
E
2.95 3.05 3.00
E2
0.59 0.79 0.69
E2a 0.59 0.79 0.69
L
0.30 0.40 0.35
k
0.180 0.280 0.230
k1 0.205 0.305 0.255
z
0.365 BSC
All Dimensions in mm
e
b
z
Suggested Pad Layout
V-DFN3030-8 Type M
3
X
2
X
X
1
X
Y
1
Y
G
3
Y
2
Y
2
G
1
G
1
C
C
Dimensions Value (in mm)
C
0.650
C1
0.688
G
0.260
G1
0.180
G2
0.325
X
0.370
X1
0.470
X2
0.545
X3
2.700
X4
2.470
Y
0.550
Y1
0.790
Y2
0.790
Y3
3.300
4
X
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
99 of 303
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
U-DFN3030-10
A3
A
U-DFN3030-10
Dim Min Max Typ
A
0.57 0.63 0.60
A1
0
0.05 0.02
A3
0.15
b
0.20 0.30 0.25
D
2.90 3.10 3.00
D2 2.30 2.50 2.40
e
0.50
E
2.90 3.10 3.00
E2
1.50 1.70 1.60
L
0.25 0.55 0.40
z
0.375
All Dimensions in mm
SEATING PLANE
A1
D
D2
Pin#1 ID
E E2
L
z
b
e
Suggested Pad Layout
U-DFN3030-10
Y
C
X1
G
X
G
Dimensions Value (in mm)
Z
2.60
G
0.15
X
1.80
X1
0.60
Y
0.30
C
0.50
Z
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
100 of 303
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
A
U-DFN3030-12
3
A
e
n
a
l
P
g
n
i
t
a
e
S
1
A
2
D D
0
0
3
.
0
R
D
I
1
#
n
i
P
︵
︶
2
E
E
U-DFN3030-12
Dim Min Max Typ
A
0.57 0.63 0.60
A1
0
0.05 0.02
A3
0.15
b
0.18 0.28 0.23
D
2.90 3.10 3.00
D2 2.30 2.50 2.40
e
0.45
E
2.90 3.10 3.00
E2
1.50 1.70 1.60
L
0.25 0.55 0.40
All Dimensions in mm
L
b
e
Suggested Pad Layout
U-DFN3030-12
C
G
1
Y
G
1
X
Dimensions Value (in mm)
C
0.45
G
0.15
X
0.28
X1
2.60
Y
0.60
Y1
1.80
Y
X
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
101 of 303
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
W-DFN3030-12
3
A
A
e
n
a
l
P
g
n
i
t
a
e
S
1
A
2
D D
D
I
1
#
n
i
P
2
E
E
W-DFN3030-12
Dim Min Max Typ
A
0.70 0.80
-A1
0
0.05
-A3 0.175 0.250
-b
0.150 0.250
-D 2.950 3.050
-D2 2.30 2.65
-e
0.45
E
2.950 3.050
-E2
1.40 1.75
-L
0.35 0.45
-All Dimensions in mm
L
b
e
Suggested Pad Layout
W-DFN3030-12
C
G
1
Y
G
1
X
Dimensions Value (in mm)
C
0.45
G
0.15
X
0.28
X1
2.60
Y
0.60
Y1
1.80
Y
X
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
102 of 303
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
U-DFN3030-14
A1
A
A3
DFN3030-14
Dim Min Max
Typ
A
0.57 0.63
0.60
A1
0
0.05
0.02
A3
0.15
b
0.15 0.25
0.20
D
2.95 3.05
3.00
D2 2.20 2.40
2.30
E
2.95 3.05
3.00
E2 1.60 1.80
1.70
e
0.40
L
0.30 0.40
0.35
Z
0.20
All Dimensions in mm
D
e
(Pin #1 ID)
E2
E
D2
L(14x)
b (14x)
Z(4x)
Suggested Pad Layout
U-DFN3030-14
X2
Y (14x)
Dimensions
C
X
X1
X2
Y
Y1
Y2
X1
Y2
Y1
Value
(in mm)
0.400
0.250
2.350
2.650
0.600
1.750
3.400
Pin1
C
X (14x)
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
103 of 303
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
D
W-DFN3030-16 (Type US)
k
r
a
DM
Ir
1e
#s
a
nL
i
P
E
︵
︶
3
A
A
e
n
a
l
P
g
n
i
t
a
e
S
1
A
2
D
2
/
e
2
/
E
2
E
W-DFN3030-16
(Type US)
Dim Min Max Typ
A
0.70 0.80 0.75
A1
0
0.05 0.02
A3
0.20 REF
b
0.18 0.30 0.25
D
2.90 3.10 3.00
D2 1.55 1.80 1.70
e
0.50 BSC
E
2.90 3.10 3.00
E2
1.55 1.80 1.70
L
0.30 0.50 0.40
All Dimensions in mm
L
b
e 2
/
D
Suggested Pad Layout
W-DFN3030-16 (Type US)
3
X
1
X
1
Y
2
Y
Dimensions Value (in mm)
C
0.500
X
0.350
X1
0.570
X2
1.800
X3
3.300
Y
0.570
Y1
1.800
Y2
3.300
2
X
Y
X
C
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
104 of 303
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
U-QFN3030-16 (Type B)
A3
A1
A
U-QFN3030-16
Type B
Dim
Min
Max
Typ
A
0.55
0.65
0.60
A1
0
0.05
0.02
A3
0.15
b
0.18
0.28
0.23
D
2.95
3.05
3.00
D2
1.40
1.60
1.50
E
2.95
3.05
3.00
E2
1.40
1.60
1.50
e
0.50
L
0.35
0.45
0.40
Z
0.625
All Dimensions in mm
Side View
D
e
(Pin #1 ID)
E
0.450
00
R0.2
E2
D2
L (16x)
Z (8x)
b (16x)
Bottom View
Suggested Pad Layout
U-QFN3030-16(Type B)
C
G
G1
Dimensions
C
G
G1
X
X1
Y
Y1
Y1
X1
Value
(in mm)
0.500
0.150
0.150
0.350
1.800
0.600
1.800
Y (16x)
X (16x)
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
105 of 303
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
U-QFN3030-20
3
A
1
A
A
e
n
a
l
P
g
n
i
t
a
e
S
D
2
D
U-QFN3030-20
Dim Min Max Typ
A
0.57 0.63 0.60
A1
0.00 0.05 0.02
A3
0.15
b
0.16 0.26 0.21
D
2.95 3.05 3.00
D2 1.70 1.90 1.80
E
2.95 3.05 3.00
E2
1.70 1.90 1.80
e
0.40
L
0.30 0.40 0.35
z
0.595
All Dimensions in mm
e
D
I
1
#
n
i
P
︶
e
2
E
E
°
5
4
X
2
.
0
'
C
︵
L
b
z
Suggested Pad Layout
U-QFN3030-20
C
X
Y
1
Y
Dimensions Value (in mm)
C
0.400
X
0.250
X1
1.900
X2
3.300
Y
0.550
Y1
1.900
Y2
3.300
2
Y
1
X
2
X
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
106 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
U-DFN3216-14
3
A
1
A
A
U-DFN3216-14
Dim
Min
Max
Typ
A
0.545 0.605 0.575
A1
0
0.05 0.02
A3
0.127
b
0.15 0.25 0.20
D
3.15 3.275 3.20
D2
2.70 2.90 2.80
E
1.55 1.675 1.60
E2
0.45 0.65 0.55
e
0.40
L
0.275 0.375 0.325
Z
0.25 0.35 0.30
All Dimensions in mm
e
n
a
l
P
g
n
i
t
a
e
S
2
D D
°
D5
I
4
1x
#2
.
n0
i
P
C
︵
︶
2
/
2
E
2
E
E
L
Z
e
b
Suggested Pad Layout
U-DFN3216-14
2
X
Y
C
Dimensions
2
Y
1
Y
X
1
n
i
P
C
X
X1
X2
Y
Y1
Y2
Value
(in mm)
0.400
0.250
2.850
2.650
0.525
0.550
1.900
1
X
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
107 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
DFN322
e
D
e
b (3x)
DFN322
Dim Min Max
Typ
A 0.800 1.00 0.850
A
0.050
A3 0.153 0.253 0.203
b
0.180 0.300 0.230
D 1.900 2.100 2.000
D2 1.220 1.420 1.320
e
0.650
E
1.900 2.100 2.000
E2 0.780 0.990 0.880
E4 0.480 0.680 0.580
L
0.300 0.500 0.400
All Dimensions in mm
L (3x)
E
E4
E2
D2
A
A1
A3
Suggested Pad Layout
DFN322
C
C
X (3x)
Dimensions
C
G
X
X1
Y
Y1
Y2
Y3
Y4
Y (2x)
G
Y4
Y3
Y1
Y2
X1
Value
(in mm)
0.65
0.20
0.35
1.52
0.55
0.98
0.47
0.63
2.20
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
108 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
X1-DFN3313-8
A
3
A
1
A
e
n
a
l
P
g
n
i
t
a
e
S
D
1
x
6
L
︵
︶
e
E
8
1
e
x
2
a
L
︵
︶
b
X1-DFN3313-8
Dim Min Max
Typ
A
0.37 0.48
0.42
A1
0
0.05
0.02
A3
0.13
b
0.20 0.30
0.25
D
3.25 3.38
3.30
E
1.25 1.38
1.30
e
0.50 BSC
e1
1.25 BSC
L
0.30 0.43
0.38
La
0.57 0.70
0.65
All Dimensions in mm
Suggested Pad Layout
X1-DFN3313-8
A
3
A
1
A
e
n
a
l
P
g
n
i
t
a
e
S
D
1
x
6
L
︵
︶
e
E
8
︶
1
e
x
2
a
L
︵
b
X1-DFN3313-8
Dim Min Max
Typ
A
0.37 0.48
0.42
A1
0
0.05
0.02
A3
0.13
b
0.20 0.30
0.25
D
3.25 3.38
3.30
E
1.25 1.38
1.30
e
0.50 BSC
e1
1.25 BSC
L
0.30 0.43
0.38
La
0.57 0.70
0.65
All Dimensions in mm
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
109 of 303
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
V-DFN3535-14
1
A
3
A
A
e
n
a
l
P
g
n
i
t
a
e
S
D
e
D
I
1
#
n
i
P
︶
1
e
2
E
E
︵
2
D
V-DFN3535-14
Dim
Min
Max
Typ
A
0.75
0.85
0.80
A1
0.00
0.05
0.02
A3
0.15
b
0.20
0.30
0.25
D
3.45
3.55
3.50
D2
1.90
2.10
2.00
E
3.45
3.55
3.50
E2
1.90
2.10
2.00
e
0.50
e1
1.50
L
0.35
0.45
0.40
Z
0.625
All Dimensions in mm
L
b
Z
Suggested Pad Layout
V-DFN3535-14
3
X
C
1
G
Dimensions
1
X
2
X
1
Y
1
C
2
Y
3
Y
G
Y
C
C1
G
G1
X
X1
X2
X3
Y
Y1
Y2
Y3
Value
(in mm)
0.500
1.500
0.250
0.250
0.350
0.600
2.100
2.350
0.600
0.350
2.100
3.800
X
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
110 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
U-DFN4030-12
A1
A
A3
U-DFN4030-12
Dim Min
Max
Typ
A
0.55
0.65
0.60
A1
0
0.05
0.02
A3
0.15
b
0.20
0.30
0.25
D
3.95
4.05
4.00
D2
3.20
3.40
3.30
e
0.50
E
2.95
3.05
3.00
E2
1.60
1.80
1.70
L
0.30
0.40
0.35
Z
0.625
All Dimensions in mm
D
e
E
E2
D2
L (12x)
Z (4x)
b (12x)
Suggested Pad Layout
U-DFN4030-12
X2
Y (12x)
Dimensions
X1
Y1
Y2
Pin1
C
C
X
X1
X2
Y
Y1
Y2
Value
(in mm)
0.500
0.300
2.800
3.350
0.600
1.750
3.400
X (12x)
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
111 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
U-DFN4030-12 (Type B)
A
A3
A1
D
e
L1 (6x)
E5
D1 (2x)
E2
E
Dim
A
A1
A3
B
D
D1
D2
D3
D4
E
D4 (4x)
E1
E3
D2 (2x)
D3
L2
E4
Z (4x)
L (5x)
Min
0.55
0.00
0.20
3.95
1.52
0.96
0.70
0.65
2.95
U-DFN4030-12
Type B
Max Typ Dim Min
e
0.65 0.60
0.05 0.02 E1 1.51
0.15 E2 0.35
0.30 0.25 E3 0.74
4.05 4.00 E4 0.30
1.72 1.62 E5 0.15
L 0.45
1.16 1.06
0.90 0.80 L1 0.30
0.85 0.75 L2 0.72
Z
3.05 3.00
All Dimensions in mm
Max
1.71
0.55
0.94
0.50
0.35
0.55
0.40
0.82
-
Typ
0.50
1.61
0.45
0.84
0.40
0.25
0.50
0.35
0.77
0.625
b (12x)
Suggested Pad Layout
U-DFN4030-12 (Type B)
Dimensions
X (12X)
C
Y
Y2
Y1
X1(2x)
X2
Y6
Y7
Y5 (2x)
X3 (2x)
Y3
1
X4
Y4
X5
C
X
X1
X2
X3
X4
X5
Y
Y1
Y2
Y3
Y4
Y5
Y6
Y7
Value
(in mm)
0.500
0.350
1.160
0.900
1.720
0.850
3.700
0.700
0.870
0.500
0.550
0.350
1.710
0.940
3.300
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
112 of 303
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
U-DFN4030-12 (Type C)
3
A
A
1
A
D
x
2
1
b
e
︵
︶
1
n
i
P
L
1
K
2
E
2
D
0
5
1
.
0
R
4
E
1
D
1
E
E
3
D
4
D
1
L
3
E
Dim
A
A1
A3
B
D
D1
D2
D3
D4
E
Min
0.57
0

0.20
3.95
0.74
1.00
1.00
0.84
2.95
U-DFN4030-12
Type C
Max Typ Dim Min
0.63 0.60 E1 1.60
0.05 0.02 E2 0.88
 0.015 E3 0.29
0.30 0.25 E4 1.60
e
4.05 4.00

L 0.30
0.94 0.84
L1 0.05
1.20 1.10
1.20 1.10 K1

1.04 0.94 K2

Z
3.05 3.00

All Dimensions in mm
Max
1.80
1.08
0.49
1.80

0.40
0.15



Typ
1.70
0.98
0.39
1.70
0.50
0.35
0.10
0.30
0.33
0.23
2
K
Z
Suggested Pad Layout
U-DFN4030-12 (Type C)
X5
Dimensions
G
Y6
X1
Y
X2
Y2
X3
Y4
Y5
Y3
X4
Y1 (6x)
1
C
X (12x)
C
G
X
X1
X2
X3
X4
X5
Y
Y1
Y2
Y3
Y4
Y5
Y6
Value
(in mm)
0.500
0.225
0.300
0.800
0.890
0.990
1.150
3.590
0.600
0.600
0.440
1.030
1.750
3.400
0.275
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
113 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
U-DFN4030-12 (Type D)
3
A
1
A
A
e
n
a
l
P
g
n
i
t
a
e
S
U-DFN4030-12
Type D
Dim Min
Max
Typ
A
0.55 0.65
0.60
A1
0
0.05
0.02
A3
0.15
b
0.23 0.33
0.28
D
3.95 4.05
4.00
D2 3.46 3.66
3.56
E
2.95 3.05
3.00
E2 1.043 1.243
1.143
e
0.65
L
0.40 0.50
0.45
Z
0.235
All Dimensions in mm
D
e
D
I
1
#
n
i
P
︵
︶
2
D
2
E
E
L
b
Z
Suggested Pad Layout
U-DFN4030-12 (Type D)
2
X
Y
C
Dimensions
2
Y
1
Y
1
X
C
X
X1
X2
Y
Y1
Y2
Value
(in mm)
0.650
0.330
3.610
3.580
0.700
1.193
3.400
X
C
1
n
i
P
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
114 of 303
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
V-DFN4030-14
L
D
2
D
V-DFN4030-14
Dim Min Max
Typ
A 0.80 0.90
0.85
A1
0
0.05
0.02
A3
0.203
b 0.20 0.30
0.25
D 3.95 4.05
4.00
D2 3.15 3.25
3.20
E 2.95 3.05
3.00
E2 1.65 1.75
1.70
e
0.50
L 0.35 0.45
0.40
All Dimensions in mm
2
E
E
b
e
G
TN
I
OK
DR
A
1M
NY
I
P
B
°
5
D4
I
X
10
#0
N3
.
I
0
P
R
E
F
M
A
H
C
3
A
1
A
A
Suggested Pad Layout
V-DFN4030-14
1
X
G
Y
Dimensions
2
Y
1
Y
G
C
G
X
X1
Y
Y1
Y2
Value
(in mm)
0.50
0.20
0.30
3.30
0.55
1.80
3.30
X
C
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
115 of 303
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
W-DFN4030-14
L
D
2
D
W-DFN4030-14
Dim Min Max Typ
A
0.70 0.80 0.75
A1
0
0.05 0.02
A3
0.203
b
0.20 0.30 0.25
D
3.95 4.05 4.00
D2
3.15 3.25 3.20
E
2.95 3.05 3.00
E2
1.65 1.75 1.70
e
0.50
L
0.35 0.45 0.40
All Dimensions in mm
2
E
E
b
e
G
TN
I
OK
R
DA
1M
NY
I
P
B
°
5
D4
IX
10
#0
3
N.
I0
P
R
E
F
M
A
H
C
3
A
1
A
A
Suggested Pad Layout
W-DFN4030-14
1
X
G
Y
Dimensions
2
Y
1
Y
G
C
G
X
X1
Y
Y1
Y2
Value
(in mm)
0.50
0.20
0.30
3.30
0.55
1.80
3.30
X
C
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
116 of 303
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
3
A
1
A
U-DFN4040-8
A
e
n
a
l
P
g
n
i
t
a
e
S
D
U-DFN4040-8
Dim Min Max
Typ
A 0.57 0.63
0.60
A1
0
0.05
0.02
A3
0.15
b 0.20 0.30
0.25
D 3.95 4.05
4.00
D1 2.05 2.25
2.15
D2 0.90 1.10
1.00
E 3.95 4.05
4.00
E1 1.00 1.20
1.10
E2 2.50 2.70
2.60
e
0.80
L 0.35 0.45
0.40
Z
0.675
All Dimensions in mm
e
D
I
1
#
n
i
P
︵
︶
2
E
E
2
D
b
Z
Suggested Pad Layout
U-DFN4040-8
C
X
1
Y
1
X
9
7
2
.
0
C
Dimensions
2
Y
2
X
3
X
4
Y
3
Y
1
Y
2
Y
3
X
1
X
C
X
X1
X2
X3
X4
X5
Y
Y1
Y2
Y3
Y4
Value
(in mm)
0.800
0.350
1.150
1.100
2.250
2.750
3.650
0.600
2.700
1.200
2.700
4.300
4 5
X X
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
117 of 303
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
W-DFN5020-6
A
A3
A1
W-DFN5020-6
Dim
Min
Max
Typ
A
0.75 0.85 0.80
A1
0
0.05 0.02
A3
0.15
b
0.20 0.30 0.25
D
1.90 2.10 2.00
D2
1.40 1.60 1.50
e
0.50
E
4.90 5.10 5.00
E2
2.80 3.00 2.90
L
0.35 0.65 0.50
Z
0.375
All Dimensions in mm
D
e
D2
Pin 1 ID
E
E2
L
Z
b
Suggested Pad Layout
W-DFN5020-6
Y
X
C
X1
Dimensions
G
C
G
X
X1
X2
Y
Y2
Y3
Y2
Y3
X2
Value (in
mm)
0.50
0.35
0.35
0.90
1.80
0.70
1.60
3.20
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
118 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
V-DFN5045-12
A3
A1
A
Seating Plane
D
D2(4x)
k1
E2(4x)
k
E
L
V-DFN5045-12
Dim
Min
Max
Typ
A
0.75
0.85
0.80
A1
0.00
0.05
0.02
A3
0.203
b
0.25
0.35
0.30
D
4.95
5.05
5.00
D2
1.80
2.00
1.90
E
4.45
4.55
4.50
E2
0.90
1.10
1.00
e
0.80
k
0.50
k1
0.50
k2
0.50
L
0.45
0.55
0.50
z
0.35
All Dimensions in mm
k2
z
b
e
Suggested Pad Layout
V-DFN5045-12
2
X
C
x
4
1
X
︵ ︶
x
4
1
Y
︵ ︶
3
Y
2
Y
Dimensions
C
X
X1
X2
Y
Y1
Y2
Y3
Value (in mm)
0.800
0.400
2.100
4.500
0.700
1.200
2.700
4.800
Y
X
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
119 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
V-DFN5045-12 (Type B)
A3
A1
A
Seating Plane
D
D2(2x)
D2a
E2(2x)
E
k1
E2a
k2
L
k
b
V-DFN5045-12
(Type B)
Dim
Min
Max
Typ
A
0.75
0.85
0.80
A1
0.00
0.05
0.02
A3
0.203
b
0.25
0.35
0.30
D
4.95
5.05
5.00
D2
2.00
2.20
2.10
D2a
1.60
1.80
1.70
E
4.45
4.55
4.50
E2
0.90
1.10
1.00
E2a
2.40
2.60
2.50
e
0.80
k
0.50
k1
0.50
k2
0.50
L
0.45
0.55
0.50
z
0.35
All Dimensions in mm
e
z
Suggested Pad Layout
V-DFN5045-12 (Type B)
3
X
C
1
G
2
G
1
Y
1
X
2
X
2
Y
3
Y
G
Y
Dimensions
C
G
G1
G2
X
X1
X2
X3
Y
Y1
Y2
Y3
Value (in mm)
0.800
0.40
0.40
0.40
0.40
2.20
1.80
4.40
0.700
1.100
2.600
4.800
X
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
120 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
V-DFN5060-4
1
A
3
A
A
e
n
a
l
P
g
n
i
t
a
e
S
1
L
D e
1
L
D
I
1
#
n
i
P
E
W-DFN5060-4
Dim
Min
Max
Typ
A
0.75 0.85 0.80
A1
0
0.05 0.02
A3
0.203
b
0.65 0.75 0.70
D
4.95 5.05 5.00
e
4.00
E
5.95 6.05 6.00
L
0.65 0.75 0.70
L1
0.05 0.15 0.10
All Dimensions in mm
b
4
Suggested Pad Layout
V-DFN5060-4
Z
C
Dimensions
C
X
Y
Y1
Z
Y1
X (4x)
Value (in
mm)
4.00
0.75
0.95
6.20
4.75
Y (4x)
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
121 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
U-DFN6040-12
A1
A3
A
Seating Plane
D
e
D2
D1
E
E2
E1
L
b
Z
U-DFN6040-12
Dim Min
Max
Typ
A
0.55
0.65
0.60
A1
0
0.05
0.02
A3
0.15
b
0.35
0.45
0.40
D
5.95
6.05
6.00
D1
1.95
2.15
2.05
D2
2.35
2.55
2.45
e
1.00
E
3.95
4.05
4.00
E1
2.10
2.30
2.20
E2
1.80
2.00
1.90
L
0.35
0.45
0.40
Z
0.30
All Dimensions in mm
Suggested Pad Layout
U-DFN6040-12
3
X
Y
C
G
Dimensions
3
Y
2
Y
2
X
1
X
1
G
1
Y
1
n
i
P
X
C
G
G1
X
X1
X2
X3
Y
Y1
Y2
Y3
Value
(in mm)
0.500
0.650
0.350
0.250
1.075
1.275
2.750
0.400
1.150
1.000
2.300
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
122 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
V-DFN6040-22
1
A
3
A
A
e
n
a
l
P
g
n
i
t
a
e
S
D
V-DFN6040-22
Dim
Min
Max
Typ
A
0.75
0.85
0.80
A1
0.00
0.05
0.02
A3
0.203 BSC
b
0.20
0.30
0.25
D
5.95
6.05
6.00
D2
3.82
4.02
3.92
D2a
1.10
1.30
1.20
E
3.95
4.05
4.00
E2
2.44
2.64
2.54
e
0.50 BSC
L
0.35
0.45
0.40
Z
0.375
All Dimensions in mm
e
L
2
D
2
E
E
a
2
D
.
D
.
I
1
#3
.
N0
I
C
P
b
Z
Suggested Pad Layout
V-DFN6040-22
3
X
2
X
1
X
1
G
Dimensions
G
2
Y
1
Y
Y
C
G
G1
X
X1
X2
X3
Y
Y1
Y2
Value
(in mm)
0.500
0.280
0.200
0.350
1.330
4.050
5.660
0.650
0.270
4.400
C
X
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
123 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
D-FLAT
k
L
E
H E
b
D
D-FLAT
Dim
Min
Max
A
0.90
1.10
b
1.25
1.65
c
0.10
0.40
D
2.25
2.95
E
3.95
4.60
k
2.80
HE
5.00
5.60
L
0.50
1.30
All Dimensions in mm
A
c
Suggested Pad Layout
D-FLAT
1
X
X
Dimensions
Y
G C
C
G
X
X1
Y
Value
(in mm)
4.65
2.80
1.85
6.50
1.70
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
124 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
DF-S
L
G
A
B
D
DF-S
Dim
Min
Max
A
7.40
7.90
B
6.20
6.50
C
0.22
0.30
D
0.076
0.33
E
-
10.40
G
1.02
1.53
H
8.13
8.51
J
2.40
2.60
K
5.00
5.20
L
1.00
1.20
All Dimensions in mm
E
C
H
J
K
Suggested Pad Layout
DF-S
X
Dimensions DF-S
Z
10.26
X
1.2
Y
1.52
C
5.2
Z
Y
C
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
125 of 303
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
U-FLGA1515-9
3
A
1
A
A
e
n
a
l
P
g
n
i
t
a
e
S
D
e
U-FLGA1515-9
Dim Min Max
Typ
A
0.55 0.65
0.60
A1
0
0.05
0.02
A3
0.13 BSC
b
0.20 0.30
0.25
D
1.45 1.55
1.50
E
1.45 1.55
1.50
e
0.50 BSC
Z
0.125 BSC
All Dimensions in mm
1
.
0
R
E
︶
e
D
I
1
#
n
i
P
︵
Z
.
Q
S
b
Suggested Pad Layout
U-FLGA1515-9
1
X
X
Y
G
Dimensions
1
Y
2
Y
C
G
G1
X
X1
X2
Y
Y1
Y2
1
G
C
Value
(in mm)
0.587
0.150
0.150
0.525
0.350
1.700
0.525
0.350
1.700
2
X
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
126 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
3
A
W-FLGA2520-17
1
A
e
n
a
l
P
g
n
i
t
a
e
S
e
E
A
D
I
1
#
n
i
P
D
I
1
#
n
i
P
L
D
a
L
W-FLGA2520-17
Dim
Min
Max
A
0.700 0.800
A1
0
0.050
A3
0.0203REF
b
0.200 0.300
D
2.420 2.580
E
1.950 2.050
e
0.500TYP
L
0.320 0.480
La
0.424 0.576
All Dimensions in mm
b
Suggested Pad Layout
W-FLGA2520-17
3 2
X X
Dimensions
Y
x
8
3
Y
x
9
2
Y
1
X
︵ ︶
x
9
1
Y
︵ ︶
︵ ︶
︶
C
x
8
X
︵
C
X
X1
X2
X3
Y
Y1
Y2
Y3
Value
(in mm)
0.500
0.350
0.600
1.850
2.320
0.600
0.350
1.350
2.800
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
127 of 303
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
MiniDIP
L
G
A
B
D
MiniDIP
Dim
Min
Max
A
5.43
5.75
B
3.6
4.0
C
0.15
0.35
D
0.05
0.20
E
7.0
G
0.70
1.10
H
4.5
4.9
J
2.3
2.7
K
2.3
2.7
L
0.50
0.80
All Dimensions in mm
E
C
H
J
K
Suggested Pad Layout
MiniDIP
X
Dimensions DF-S MiniDIP
Z
10.26
6.91
X
1.2
0.60
Y
1.52
0.76
C
5.2
2.67
Z
Y
C
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
128 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
MiniMELF
A
B
C
MiniMELF
Dim
Min
Max
A
3.30
3.70
B
1.30
1.60
C
0.28
0.50
All Dimensions in mm
Suggested Pad Layout
MiniMELF
1
X
X
Dimensions
Y
G
C
G
X
X1
Y
C
Value (in mm)
MiniMELF
3.50
2.10
1.30
4.70
1.70
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
129 of 303
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
MELF
A
MELF
Dim
Min
Max
A
4.80
5.20
B
2.40
2.60
C
0.55 Typ
All Dimensions in mm
B
C
Suggested Pad Layout
MELF
1
X
X
Dimensions
Y
C
G
X
X1
Y
G
Value (in mm)
MELF
4.80
3.30
1.50
6.30
2.70
C
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
130 of 303
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
e
n
a
l
P
g
n
i
t
a
e
S
D
MSB
4 1
A A
x
y
°
0
1
°
7
3
E
1
#
n
i
P
E
1
E
MSB
Dim Min Max
Typ
A
1.10 1.20
1.30
A1 0.00 0.02
0.05
A4 0.05
0.08
A5 0.03 0.05
0.08
b
0.55 0.60
0.70
c
0.12 0.15
0.18
D
4.40 4.50
4.60
E
4.90 5.00
5.10
E1 5.60 5.70
5.80
E3 2.95 3.00
3.05
e
3.45 3.50
3.55
L
0.65 0.70
0.75
x
0.60 0.65
0.70
y
0.60 0.65
0.70
All Dimensions in mm
5
A
c
e
A
b
L
Suggested Pad Layout
MSB
C
Dimensions
1
Y
Y
C
X
Y
Y1
Value
(in mm)
3.55
0.90
1.05
6.10
X
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
131 of 303
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
MSOP-8
D
5
2
.
0
4X
10
°
e
n
a
l
P
e
g
u
a
G
E
x
e
n
a
l
P
g
n
i
t
a
e
S
y
L
C
l
i
a
t
e
D
4X10°
a
3
E
b
1
3
A
A
2
A
C
l
c i
a
t
e
D
e
e
S
1
A
1
E
e
MSOP-8
Dim Min Max Typ
A
1.10
A1 0.05 0.15 0.10
A2 0.75 0.95 0.86
A3 0.29 0.49 0.39
b 0.22 0.38 0.30
c 0.08 0.23 0.15
D 2.90 3.10 3.00
E 4.70 5.10 4.90
E1 2.90 3.10 3.00
E3 2.85 3.05 2.95
e
0.65
L 0.40 0.80 0.60
a
0°
8°
4°
x
0.750
y
0.750
All Dimensions in mm
Suggested Pad Layout
MSOP-8
C
X
Y
Dimensions
1
Y
C
X
Y
Y1
Value
(in mm)
0.650
0.450
1.350
5.300
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
132 of 303
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
MSOP-8EP
D
1
D
MSOP-8EP
Dim Min Max
Typ
A
1.10
A1 0.05 0.15 0.10
A2 0.75 0.95 0.86
A3 0.29 0.49 0.39
b
0.22 0.38 0.30
c
0.08 0.23 0.15
D
2.90 3.10 3.00
D1 1.60 2.00 1.80
E
4.70 5.10 4.90
E1 2.90 3.10 3.00
E2 1.30 1.70 1.50
E3 2.85 3.05 2.95
e
0.65
L
0.40 0.80 0.60
a
0°
8°
4°
x
0.750
y
0.750
All Dimensions in mm
4X
10
°
x
5
2
.
0
2
E
E
e
n
a
l
P
e
g
u
a
G
e
n
a
l
P
g
n
i
t
a
e
S
y
a
L
10°
3
E
C
l
i
a
t
e
D
b
X
8
e
1
4X
c
3
A
1
A
2
A
A
1
E
D
C
l
i
a
t
e
D
e
e
S
Suggested Pad Layout
MSOP8-EP
C
X
Y
G
Dimensions
1
Y
2
Y
C
G
X
X1
Y
Y1
Y2
1
X
Value
(in mm)
0.650
0.450
0.450
2.000
1.350
1.700
5.300
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
133 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
MSOP-10
D
4X10
°
E
Dim
a
A
A1
A
b
c
D
e
E
E1
L
0.25
X
Seating Plane
4X1
0°
L
a
Gauge Plane
Y
1
e
b (10X)
E3
A2
A
MSOP-10
Min Max
8°
0
1.10
0.05 0.15
0.75 0.95
0.17 0.27
0.08 0.23
2.95 3.05
4.80 5.00
2.95 3.05
0.40 0.80
Typ
4°
0.10
0.86
0.20
0.15
3.00
0.50
4.90
3.00
0.60
All Dimensions in mm
A3
D
A1
E1
c
Suggested Pad Layout
MSOP-10
X
Dimensions
X
Y
C1
C2
C1
C2
Value
(in mm)
0.30
1.4
4.4
0.50
Y
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
134 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
®
1
E
POWERDI 5
1
A
2
/
1
E
e
D
2
b
1
b
X
2
°
1
±
°
0
1
®
A
2
/
E
E
°
1
±
°
5
2
A
°
1
±
°
0
1
°
1
±
°
5
2
E
1
L
1
L
W
2
D
POWERDI 5
Dim
Min
Max
Typ
A
1.05 1.15
1.10
A2
0.33 0.43 0.381
b1
0.80 0.99
0.89
b2
1.70 1.88
1.78
D
3.90 4.05 3.966
D2
3.054
E
6.40 6.60 6.504
e
1.84
E1
5.30 5.45
5.37
E2
3.549
L
0.75 0.95
0.85
L1
0.50 0.65
0.57
W
1.10 1.41 1.255
All Dimensions in mm
L
L
Suggested Pad Layout
®
POWERDI 5
X
Dimensions
C
G
X
X1
Y
Y1
Y
X1
(2x)
Value (in mm)
1.840
0.852
3.360
1.390
4.860
1.400
G
Y1
(2x)
C
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
135 of 303
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
®
POWERDI 123
D
®
1
E
POWERDI 123
Min
Max
Typ
0.93
1.00
0.98
0.15
0.25
0.20
0.85
1.25
1.00
1.025 1.125
1.10
1.63
1.93
1.78
3.50
3.90
3.70
2.60
3.00
2.80
0.40
0.50
0.45
1.25
1.40
1.35
0.125 0.275
0.20
All Dimensions in mm
3
A
Dim
A
A3
b
b2
D
E
E1
L
L1
L3
A
X
2
L
︶
1
L
︵
2
b
b
3
L
3
L
E
Suggested Pad Layout
®
POWERDI 123
2
X
Dimensions
1
Y
Y
1
X
G
X
G
X
X1
X2
Y
Y1
Value
(in mm)
0.65
1.05
2.40
4.10
1.50
1.50
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
136 of 303
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
®
POWERDI 123(Type B)
®
C
POWERDI 123
Type B
Dim Min Max Typ
A 3.50 3.90 3.70
B 2.60 3.00 2.80
C 1.63 1.93 1.78
D 0.93 1.00 0.98
E 0.85 1.25 1.00
H 0.15 0.25 0.20
L 0.50 0.80 0.65
All Dimensions in mm
E
B
H
D
L
E
A
Suggested Pad Layout
®
POWERDI 123 (Type B)
X
Dimensions
Y
G
X
X1
Y
G
Value
(in mm)
2.000
1.050
4.100
1.500
X1
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
137 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
®
POWERDI 323
C
®
POWERDI 323
Dim Min Max
Typ
A
2.40 2.60 2.50
B
1.85 1.95 1.90
C
1.20 1.30 1.25
D
0.60 0.70 0.65
E
0.78 0.98 0.88
E1
0.50 0.70 0.60
E2
0.60 1.00 0.80
H
0.08 0.18 0.13
L
0.20 0.40 0.30
L1
1.40
L3
0.20
L4
0.40 0.80 0.60
All Dimensions in mm
B
D
H
L
L
E
E2
E1
L4
L1
L1
L3
A
Suggested Pad Layout
®
POWERDI 323
X1
G
X2
Dimensions
Y2
G
X1
X2
Y1
Y2
Y1
®
POWERDI 123
1.0
2.2
0.9
1.4
1.4
®
POWERDI 323
0.5
2.0
0.8
0.8
1.1
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
138 of 303
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
®
POWERDI 3333-8
®
POWERDI 3333-8
Dim Min Max Typ
D
3.25 3.35 3.30
E
3.2
3.35 3.30
D2 2.22 2.32 2.27
E2 1.56 1.66 1.61
A
0.75 0.85 0.80
A1
0
0.05 0.02
A3
0.203
b
0.27 0.37 0.32
b2
0.20
L
0.35 0.45 0.40
L1
0.39
e
0.65
Z
0.515
All Dimensions in mm
A
A3
A1
D
D2
L
(4x)
1
Pin 1 ID
4
b2
(4x)
E
E2
8
5
Z (4x) e
L1
(3x)
b (8x)
Suggested Pad Layout
®
POWERDI 3333-8
X
G
8
Y2
Dimensions
C
G
G1
Y
Y1
Y2
Y3
X
X2
5
G1
Y1
Y
1
4
Y3
X2
Value (in mm)
0.650
0.230
0.420
3.700
2.250
1.850
0.700
2.370
0.420
C
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
139 of 303
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
®
POWERDI 3333-8(Type B)
®
POWERDI 3333-8
Type B
Dim Min Max Typ
A
0.75 0.85 0.80
A1
0
0.05 0.02
A3

 0.203
b
0.27 0.37 0.32
b2
0.20


D
3.25 3.35 3.30
D1 2.55 2.66 2.61
D2 1.74 1.84 1.79
e
0.65


E
3.25 3.35 3.30
E1 1.14 1.24 1.19
E2 0.61 0.71 0.66
K1
0.41


K2
0.38


L
0.35 0.45 0.40
L1
0.25


Z

 0.515
All Dimensions in mm
A
A3
A1
D
D1
L (5x)
K1
E
E1
b2 (4x)
K2
D2
E2
L1 (2x)
Z (4x) e
b (8x)
Suggested Pad Layout
®
POWERDI 3333-8 (Type B)
X1
G
Dimensions
C
G
X
X1
X2
X3
X4
Y
Y1
Y2
Y3
Y4
Y5
Y6
X2 (3x)
Y1
Y2
X3
Y3
Y4
Y6
X4
Y5
Y
(5x)
X (5x)
Value (in mm)
0.650
0.230
0.420
2.370
0.420
1.890
2.710
0.700
0.400
1.160
1.850
0.405
1.295
3.700
C
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
140 of 303
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
®
POWERDI 5060-8
®
A
l
i
a
t
e
D
1
D D
X
4
0
︵
︶
1
A
c
E
1
E
e
︶
2
/
e
X
8
b
︵
X
4
1
0
1
︵
︶
1
X
4
2
b
L
K
3
D
︵
︶
X
4
M
3
b
2
D
2
E
3
E
A
︵
︶
1
M
A
l
i
a
t
e
D
1
L
G
POWERDI 5060-8
Dim
Min
Max
Typ
A
0.90
1.10
1.00
A1
0.00
0.05

b
0.33
0.51
0.41
b2
0.200
0.350 0.273
b3
0.40
0.80
0.60
c
0.230
0.330 0.277
D
5.15 BSC
D1
4.70
5.10
4.90
D2
3.70
4.10
3.90
D3
3.90
4.30
4.10
E
6.15 BSC
E1
5.60
6.00
5.80
E2
3.28
3.68
3.48
E3
3.99
4.39
4.19
e
1.27 BSC
G
0.51
0.71
0.61
K
0.51


L
0.51
0.71
0.61
L1
0.100
0.200 0.175
M
3.235
4.035 3.635
M1
1.00
1.40
1.21
Θ
10º
12º
11º
Θ1
6º
8º
7º
All Dimensions in mm
Suggested Pad Layout
®
4
X
POWERDI 5060-8
2
Y
3
X
1
Y
3
Y
2
X
1
X
4
Y
5
Y
7
Y
1
G
C
6
Y
x
4
Y
G
X
︵ ︶
Dimensions
C
G
G1
X
X1
X2
X3
X4
Y
Y1
Y2
Y3
Y4
Y5
Y6
Y7
Value (in mm)
1.270
0.660
0.820
0.610
4.100
0.755
4.420
5.610
1.270
0.600
1.020
0.295
1.825
3.810
0.180
6.610
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
141 of 303
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
POWERDI®5060-8 (Type B)
®
X
8
b
︵
︶
2
/
e
K
1
D D
POWERDI 5060-8
TYPE B
Dim
Min
Max
Typ
A
0.90
1.10
1.00
A1
0.00
0.05
––
b
0.33
0.51
0.41
b2
0.20
0.40
0.273
c
0.230 0.330 0.273
D
5.15 BSC
D1
4.70
5.10
4.90
D2
3.50
4.40
3.90
E
6.15 BSC
E1
5.60
6.00
5.80
E2
2.25
2.65
2.45
E3
0.595 0.995 0.795
e
1.27 BSC
G
0.51
0.71
0.61
K
0.51
––
––
K1
0.51
––
––
L
0.51
0.71
0.61
L1
0.05
0.20
0.175
M
3.235 4.035 3.635
M1
1.00
1.40
1.21
θ1
10°
12°
11°
θ2
6°
8°
7°
All Dimensions in mm
X
4
2
b
L
2
D
︵
︶
2
E
E
1
E
0
0
4
.
1
3
E
M
1
K
0
0
9
.
1
1
M
1
L
e
G
0
3
0
.
0
±
7
0
.
0
h
t
p
e
D
0
0
0
.
1
Ø
X
 
1
A
c
A
A
L
I
A
T
E
D
X
 
Suggested Pad Layout
®
POWERDI 5060-8 (Type B)
1
X
1
Y
3
Y
2
Y
Dimensions
C
X
X1
Y
Y1
Y2
Y3
Y4
Y5
Y6
6
Y
5
Y
4
Y
x
5
Y
Value (in mm)
1.270
0.610
4.420
0.910
0.910
0.895
2.130
0.585
2.550
6.550
︵ ︶
X
C
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
142 of 303
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
PowerDI5060-8 (Type C)
D
1
D
x
4
0
︵ ︶
E
1
E
1
A
c
x
e
n
a
l
P
g
n
i
t
a
e
S
y
e
1
x
4
1
0
0
3
0
.
0
±
7
0
.
0
h
t
p
e
D
0
0
0
.
1
Ø
︵ ︶
A
L
I
A
T
E
D
x
8
1
b
︵ ︶
2
/
e
x
8 1
b
︵ ︶
x
2
2
b
L
k
3
D
︵ ︶
A
1
k
4
L
A
L
I
A
T
E
D
2
D
M
2
D
2
E
1
L
a
L
PowerDI5060-8 (Type C)
Dim
Min
Max
Typ
A
0.90
1.10
1.00
A1
0
0.05
0.02
b
0.33
0.51
0.41
b1
0.300 0.366 0.333
b2
0.20
0.35
0.25
c
0.23
0.33 0.277
D
5.15 BSC
D1
4.85
4.95
4.90
D2
1.40
1.60
1.50
D3
3.98
E
6.15 BSC
E1
5.75
5.85
5.80
E2
3.56
3.76
3.66
e
1.27BSC
k
1.27
k1
0.56
L
0.51
0.71
0.61
La
0.51
0.71
0.61
L1
0.05
0.20 0.175
L4
0.125
M
3.50
3.71 3.605
x
1.400
y
1.900
θ
10°
12°
11°
θ1
6°
8°
7°
All Dimensions in mm
Suggested Pad Layout
8
4
X
PowerDI5060-8 (Type C)
Dimensions
1
Y
2
X
3
X
2
Y
3
Y
1
G
1
X
x
4
Y
︵ ︶
1
G
C
G
G1
X
X1
X2
X3
X4
Y
Y1
Y2
Y3
Value
(in mm)
1.270
0.660
0.820
0.610
3.910
1.650
1.650
4.420
1.270
1.020
3.810
6.610
C
X
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
143 of 303
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
®
POWERDI 5SP
®
E
E/2
b 2x
R1
K 4x
J 4x
M 4x
c
R3
N 8x
D
R2
E1
TOP VIEW
?
A
Cutting Burr Side
H1
' ?1
8x cut faces are not
tin plated
E2
R
L 2x
D2
L1
W
POWERDI 5SP
Dim
Min
Max
Typ
A
0.75


b
4.30
4.50
4.40
c
0.155 0.195

D
5.70
5.90
5.80
D2
4.40


E
23.6
24.0
23.8
E1
5.70
5.90
5.80
E2
2.74


H1
0.19
0.21
0.20
J
0.20


K
0.30


L
9.00


L1
2.50


M
0.30


N
0
0.20

R
0.40


R1
0.15


R2
0.25


R3
0.40


W
1.66
2.06

θ
8º
12º

θ1
3º
7º

All Dimensions in mm
BOTTOM VIEW
Suggested Pad Layout
X
G
Y
Dimensions
Value
(in mm)
G
X
Y
8.101
8.100
5.100
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
144 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
®
POWERDI 5SP (Type B)
E1/2
®
E/2
J 4x
M 4x
N 8x
K 4x
R2
E1
TOP VIEW
A
H1
Cutting Burr Side
ø
ø1
8x cut faces are not
tin plated
V Groove Inner Line
E2
R
L 2x
D2
W
R1
c
R3
D b 2x
E
L1
BOTTOM VIEW
POWERDI 5SP
Type B
Dim
Min
Max
Typ
A
0.75


b
4.30
4.50
4.40
c
0.155 0.191

D
5.70
5.90
5.80
D2
4.40


E
20.8
21.2
21.0
E1
5.70
5.90
5.80
E2
2.90


H1
0.19
0.21
0.20
J
0.20


K
0.30


L
7.60


L1
2.50


M
0.30


N
0
0.20

R
0.40


R1
0.15


R2
0.25


R3
0.40


W
1.63
1.97
1.80
Ø
8º
12º

Ø1
3º
7º

All Dimensions in mm
Suggested Pad Layout
X
G
Y
Dimensions
Value
(in mm)
G
X
Y
8.101
8.100
5.100
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
145 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
1
L
L
E
W-QFN3020-12
D
I
1
#
N
I
P
2
L
b
e
D
1
e
1
b
b
3
A
A
A
-QFN3020-12
Dim
Min
Max
Typ
A
0.700 0.800
-
A1
0
0.05
A3
0.203REF
b
0.200 0.300
b1
0.350 0.450
D
1.900 2.100 2.000
E
2.900 3.100 3.000
e
0.500
e1
0.575
L
0.350 0.450
L1
0.450 0.550
L2
0.750 0.850
All Dimensions in mm
Suggested Pad Layout
W-QFN3020-12
X
1
X
Dimensions
Y
C
2
Y
4
Y
1
C
3
Y
1
Y
2 3
X X
C
G
X
X1
X2
X3
Y
Y1
Y2
Y3
Y4
Value
(in mm)
0.500
0.575
0.650
0.750
0.350
2.400
0.300
0.450
0.900
1.050
3.400
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
146 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
U-QFN4040-16 (Type C)
A1
A3
U-QFN4040-16
Type C
Dim Min Max Typ
A
0.57 0.63 0.60
A1
0
0.05 0.02
A3
0.15
b
0.25 0.35 0.30
D
3.95 4.05 4.00
D2 1.04 1.24 1.14
E
3.95 4.05 4.00
E2 1.01 1.21 1.11
e
0.65
K
0.30
K1
0.32
K2
0.38
L
0.35 0.45 0.40
All Dimensions in mm
A
D
Pin #1 ID
C 0.2
K1
1
K
E2(4x)
E
e
K2
D2(4x)
L
b
K
Suggested Pad Layout
U-QFN4040-16 (Type C)
C
X (8x)
Y (4x)
Y1 (8x)
Dimensions
Y5
Y2
Y3
X1
X2 (8x)
Y4 (4x)
1
C
X
X1
X2
X3
X4
Y
Y1
Y2
Y3
Y4
Y5
Value
(in mm)
0.650
0.400
2.075
0.550
2.075
4.400
0.650
0.400
1.225
2.075
0.550
4.400
X3
X4
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
U-QFN4040-20
A1
A3
A
Seating Plane
D
(Pin #1 ID)
e
E2
E
D2
L
U-QFN4040-20
Dim Min
Max
Typ
A
0.55 0.65 0.60
A1
0
0.05 0.02
A3
0.15
b
0.20 0.30 0.25
D
3.95 4.05 4.00
D2
2.40 2.60 2.50
E
3.95 4.05 4.00
E2
2.40 2.60 2.50
e
0.50 BSC
L
0.35 0.45 0.40
Z
0.875
All Dimensions in mm
b
Z (8x)
Suggested Pad Layout
U-QFN4040-20
X3
X1
Dimensions
C
X
X1
X2
X3
Y
Y1
Y2
Y3
Y1
Y2
Y3
X2
Y
X
1
Value
(in mm)
0.500
0.350
0.600
2.500
4.300
0.600
0.350
2.500
4.300
C
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
148 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
V-QFN4525-20
3
A
1
A
A
e
n
a
l
P
g
n
i
t
a
e
S
D
D
I
1
#
n
i
P
︵
︶
e
1
Z
E
2
E
2
D
L
V-QFN4525-20
Dim
Min
Max
Typ
A
0.75
0.85
0.80
A1
0.00
0.05
0.02
A3
0.15
b
0.18
0.30
0.23
D
4.45
4.55
4.50
D2
2.85
3.15
3.00
E
2.45
2.55
2.50
E2
0.85
1.15
1.00
e
0.50BSC
L
0.30
0.50
0.40
Z
0.385
Z1
0.885
All Dimensions in mm
b
Z
Suggested Pad Layout
V-QFN4525-20
4
X
3
X
Dimensions
1
X
2
X
3
Y
1
Y
2
Y
Y
C
X
X1
X2
X3
X4
Y
Y1
Y2
Y3
Value
(in mm)
0.500
0.330
0.600
3.200
3.830
4.800
0.600
1.200
0.830
2.800
C
X
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
149 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
D
QSOP-16
D
Z
2
/
E
Dim
A
A1
A2
b
c
D
E
E1
e
h
L
L1
L2
R
R1
ZD
θ
θ1
θ2
2
/
1
E
'
A
'
L
I
A
T
E
D
E
E
S
E
h
1
E
h
1
N
I
P
c
b
e
x
4 2
︵

︶
1
R R
2
A

E
N
A
L
P
G
N
I
T
A
E
S
L
2
L
x
4
A
︵

E
N
A
L
P
E
G
U
A
G

︶
1
L
1
A
QSOP-16
Min
Max
Typ
1.55
1.73
0.10
0.25
1.40
1.50
0.20
0.30
0.18
0.25
4.80
5.00
5.79
6.20
3.81
3.99
0.635 BSC
0.254
0.508
0.41
1.27
1.03 REF
0.254 BSC
0.0762
0.0762
0.23 REF
0°
8°
5°
15°
0°
All Dimensions in mm
Suggested Pad Layout
1
X
QSOP-16
Y
Dimensions
Y
C
X
X1
Y
Y1
C
Value
(in mm)
0.635
0.350
4.795
1.450
6.400
1
X
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
150 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
D
QSOP-20
D
Z
QSOP-20
Dim
Min
Max
Typ
A
1.55
1.73
A1
0.10
0.25
A2
1.40
1.50
b
0.20
0.30
c
0.18
0.25
D
8.56
8.74
E
5.79
6.20
E1
3.81
3.99
e
0.635 BSC
h
0.254
0.508
L
0.41
1.27
L1
1.03 REF
L2
0.254 BSC
R
0.0762
R1
0.0762
ZD
1.47 REF
θ
0°
8°
θ1
5°
15°
θ2
0°
All Dimensions in mm
2
/
E
2
/
1
E
'
A
'
L
I
A
T
E
D
E
E
S
h
E
1
E
h
1
N
I
P
b
c
e
x
4
1
2
︵ ︶
A
2
A
1 R
R

E
N
A
L
P
E
G
U
A
G

E
N
A
L
P
G
N
I
T
A
E
S
2
L
L
x
4
1
1
A
1
L
︵ ︶
Suggested Pad Layout
1
X
QSOP-20
Y
Dimensions
1
Y
C
X
X1
Y
Y1
C
Value
(in mm)
0.635
0.350
6.065
1.450
6.400
1
X
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
151 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
SM-8
1
A
A
e
n
a
l
P
g
n
i
t
a
e
S
1
D e
L
ø
1
E
E
1
ø
c
SM-8
Dim Min Max
Typ
A
--
1.70
1.60
A1
0.02 0.10
0.04
b
0.70 0.90
0.80
c
0.24 0.32
0.28
D
6.30 6.70
6.60
e
1.53 REF
e1
4.59 REF
E
6.70 7.30
7.00
E1
3.30 3.70
3.50
L
0.75 1.00
0.90
Ø
--45°
Ø1
-15°
-Ø2
--10°
All Dimensions in mm
2
ø
e
b
Suggested Pad Layout
SM-8
Y
1
Y
1
C
Dimensions
C
C1
X
Y
Y1
Value (in mm)
1.52
4.60
0.95
2.80
6.80
C
X
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
SMA
B
C
A
SMA
D
Dim
Min
Max
A
2.29
2.92
B
4.00
4.60
C
1.27
1.63
D
0.15
0.31
E
4.80
5.59
G
0.05
0.20
H
0.76
1.52
J
1.96
2.40
All Dimensions in mm
J
G
H
E
Suggested Pad Layout
SMA
1
X
X
Dimensions
Y
C
G
X
X1
Y
G
Value
(in mm)
4.00
1.50
2.50
6.50
1.70
C
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
SMAF
L
E
HE
b
D
SMAF
Dim
Min
Max
A
0.90
1.10
b
1.25
1.65
c
0.10
0.40
D
2.25
2.95
E
3.95
4.60
HE
4.80
5.60
L
0.50
1.50
All Dimensions in mm
c
A
Suggested Pad Layout
SMAF
1
X
X
Y
G
C
Dimensions
Value (in mm)
C
G
X
X1
Y
4.00
1.50
2.50
6.50
1.70
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
154 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
SMB
B
A
SMB
Dim
Min
Max
A
3.30
3.94
B
4.06
4.57
C
1.96
2.21
D
0.15
0.31
E
5.00
5.59
G
0.05
0.20
H
0.76
1.52
J
2.00
2.50
All Dimensions in mm
C
D
J
G
H
E
Suggested Pad Layout
SMB
1
X
X
Y
G
C
Dimensions
Value (in mm)
C
G
X
X1
Y
4.30
1.80
2.50
6.80
2.30
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
155 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
SMC
B
A
SMC
Dim
Min
Max
A
5.59
6.22
B
6.60
7.11
C
2.75
3.18
D
0.15
0.31
E
7.75
8.13
G
0.10
0.20
H
0.76
1.52
J
2.00
2.50
All Dimensions in mm
C
D
J
G
H
E
Suggested Pad Layout
SMC
1
X
X
Dimensions
Y
G
C
G
X
X1
Y
C
Value
(in mm)
6.90
4.40
2.50
9.40
3.30
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
156 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
0.254
SO-8
E1 E
Gauge Plane
Seating Plane
A1
L
Detail ‘A’
7°~9°
h
45°
Detail ‘A’
A2 A A3
b
e
D
SO-8
Dim
Min
Max
A
1.75
A1
0.10
0.20
A2
1.30
1.50
A3
0.15
0.25
b
0.3
0.5
D
4.85
4.95
E
5.90
6.10
E1
3.85
3.95
e
1.27 Typ
h
0.35
L
0.62
0.82
0
8

All Dimensions in mm
Suggested Pad Layout
SO-8
X
Dimensions Value (in mm)
X
0.60
Y
1.55
C1
5.4
C2
1.27
C1
C2
Y
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
157 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
SO-8EP
F
D
A
P
D
E
S
O
P
X
E
SO-8EP
Dim Min Max Typ
A
1.40 1.50 1.45
A1 0.00 0.13
b
0.30 0.50 0.40
C
0.15 0.25 0.20
D
4.85 4.95 4.90
E
3.80 3.90 3.85
E0 3.85 3.95 3.90
E1 5.90 6.10 6.00
e
1.27
F
2.75 3.35 3.05
H
2.11 2.71 2.41
L
0.62 0.82 0.72
N
0.35
Q
0.60 0.70 0.65
All Dimensions in mm
1
E
H
1
b
E
Q
N
e
d
i
s
l
l
A
°
9
︵
°
7
︶
C
°
5
4
°
3
±
°
4
L
1
A
Gauge Plane
Seating Plane
0
E
e
1
.
0
R
A
D
Suggested Pad Layout
2
X
SO-8EP
Dimensions
2
Y
1
Y
C
X
X1
X2
Y
Y1
Y2
1
X
Y
Value
(in mm)
1.270
0.802
3.502
4.612
1.505
2.613
6.500
X
C
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
SO-8EP
Detail ‘A’
7°~ 9°
E1 E
45°
h
A3
0.254
A2 A
b
e
A1
D
Detail ‘A’
L
Gauge Plane
Seating Plane
Exposed Pad
F
P3
P1
SO-8EP
Min
Max
Dim
Min
Max
e
1.75
1.27 Typ
F1
0.10
0.20
0.685 Typ
F2
1.30
1.50
0.713 Typ
G
0.15
0.25
0.20 Typ
h
0.3
0.5
0.35
L
1.7 Typ
0.62
0.82
P1
0.9 Typ
2.05 Typ
P2
4.85
4.95
1.15 Typ
P3
5.90
6.10
2.15 Typ
3.85
3.95
0
8

All Dimensions in mm
P2
G
C1
Dim
A
A1
A2
A3
b
C1
C2
D
E
E1
C2
C1
F2
Bottom View
Suggested Pad Layout
2
X
SO-8EP
Dimensions
2
Y
1
Y
C
X
X1
X2
Y
Y1
Y2
1
X
Y
Value
(in mm)
1.270
0.802
3.502
4.612
1.505
2.613
6.500
X
C
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
159 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
SO-14
E
H
SO-14
Dim
Min
Max
A
1.47
1.73
A1
0.10
0.25
A2
1.45 Typ
B
0.33
0.51
D
8.53
8.74
E
3.80
3.99
e
1.27 Typ
H
5.80
6.20
L
0.38
1.27
0
8

All Dimensions in mm
Gauge Plane
L

Detail “A”
D
7°
(4
x)
A2
A
e
B
A1
Detail “A”
Suggested Pad Layout
SO-14
X
C1
C2
Dimensions Value (in mm)
X
0.60
Y
1.50
C1
5.4
C2
1.27
Y
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
SO-16
SO-16
Dim
Min
Max
A
1.40
1.75
A1
0.1
0.25
A2
1.30
1.50
B
0.33
0.51
C
0.19
0.25
D
9.80
10.00
E
3.80
4.00
e
1.27 Typ
H
5.80
6.20
L
0.38
1.27
0
8

All Dimensions in mm
H
E
Gauge Plane

L
Detail ‘A’
D
A
A2
e
B
A1
C
Detail ‘A’
Suggested Pad Layout
1
X
SO-16
Dimensions
1
Y
Y
1
n
i
P
C
X
X1
Y
Y1
Value
(in mm)
1.270
0.670
9.560
1.450
6.400
C
X
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
SO-20
D
R
Ø
1
R
1
L
Ø1
Ø2
E
1
E
x
e
d
n
I
L
c
1
A
3
A
Ø3
A
2
A
e
n
a
l
P
g
n
i
t
a
e
S
e
b
Ø4
Dim
A
A1
A2
A3
b
c
D
E
E1
e
L
L1
R/R1





SO-20
Max
Typ
2.65
2.52
0.30
0.20
2.55
2.35
1.10
1.00
0.49
0.32
12.80
12.70
10.60
10.20
7.60
7.50
1.27 BSC
0.50
1.27
0.80
1.35 REF
0.07
0
8
10
14
12
6
10
8
9
14
11.5
6
10
8
All Dimensions in mm
Min
2.35
0.10
2.05
0.90
0.35
0.23
12.60
10.00
7.40
Suggested Pad Layout
SO-20
Y
Dimensions
G
1
Y
C
G
X
Y
Y1
Value
(in mm)
1.27
8.00
0.60
1.50
11.00
C
X
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
SO-24 (Type TH)
3
A
A
D
e
n
a
l
P
g
n
i
t
a
e
S
2
A
'
A
'
L
I
A
T
E
D
1
A
h
h
c
5
2
.
0
0
L
'
A
'
L
I
A
T
E
D
1
e
b
1
L
SO-24 (Type TH)
Dim
Min Max Typ
A
2.36 2.64 2.54
A1
0.10 0.30 0.20
A2
2.26 2.35 2.30
A3
0.97 1.07 1.02
b
0.39 0.48
c
0.25 0.31
D
15.20 15.60 15.40
e
1.27BSC
E
10.10 10.50 10.30
E1
7.40 7.60 7.50
h
0.25 0.75
L
0.70 1.00
L1
1.40 BSC
θ
0°
8°
All Dimensions in mm
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
SOD123
C
H
SOD123
Dim
Min
Max
A
0.55 Typ
B
1.40
1.70
C
3.55
3.85
H
2.55
2.85
J
0.00
0.10
K
1.00
1.35
L
0.25
0.40
M
0.10
0.15
0
8°

All Dimensions in mm
A
B
K
M
L
Suggested Pad Layout
1
X
SOD123
X
Y
G
Dimensions Value(in mm)
G
2.250
X
0.900
X1
4.050
Y
0.950
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
SOD123F
2
L
E
D
b
SOD123F
Dim Min Max Typ
A 0.81 1.15
b 0.80 1.35
c 0.05 0.30
D 1.70 1.90 1.80
E 2.60 2.80 2.70
He 3.30 3.70 3.50
L2 0.35 0.85
All Dimensions in mm
e
H
A
c
Suggested Pad Layout
C
SOD123F
Y
Dimensions Value (in mm)
C
2.86
G
1.52
X
1.34
X1
4.20
Y
1.80
1
G X
X
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
SOD323
C
H
A
B
K
M
J
SOD323
Dim
Min
Max
A
0.25
0.35
B
1.20
1.40
C
2.30
2.70
H
1.60
1.80
J
.00
0.10
K
1.0
1.1
L
0.20
0.40
M
0.10
0.15
0°
8°

All Dimensions in mm
L
Suggested Pad Layout
1
X
SOD323
X
Y
G
Dimensions Value (in mm)
G
1.520
X
0.590
X1
2.700
Y
0.450
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
SOD323F
c
D
2
1
He
L2 (2x)
E
L1
b (2x)
b (2x)
1
A
SOD323F
Dim
Min
Max
Typ
A
0.60 0.75
-
b
0.25 0.35
c
0.05 0.26
D
1.15 1.35 1.25
E
1.60 1.80 1.70
He
2.30 2.70 2.50
L1
0.30 0.50 0.40
L2
0.41 0.61 0.51
α1
7°
α2
3°
β1
7°
β2
3°
All Dimensions in mm
2
Suggested Pad Layout
1
X
SOD323F
X
Y
G
Dimensions Value (in mm)
G
1.280
X
0.710
X1
2.700
Y
0.403
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
167 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
SOD523
L
C
SOD523
Dim
Min
Max
A
0.25
0.35
B
0.70
0.90
C
1.50
1.70
H
1.10
1.30
K
0.55
0.65
L
0.10
0.30
M
0.10
0.12
All Dimensions in mm
H
M
A
K
B
Suggested Pad Layout
1
X
SOD523
X
Y
G
Dimensions Value (in mm)
G
0.80
X
0.60
X1
2.00
Y
0.70
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
168 of 303
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
SOD923 (0.2mm Lead Width)
2
L
x
2
b
E
︵ ︶
D
SOD923
(0.2mm Lead Width)
Dim Min
Max Typ
A
0.34 0.40 0.37
b
0.15 0.25 0.20
c
0.070 0.170 0.120
D
0.55 0.65 0.60
E
0.75 0.85 0.80
He
0.95 1.05 1.00
L
0.05 0.15 0.10
L2
0.190 REF
a1
0°
8°
7°
a2
2°
4°
3°
All Dimensions in mm
e
H
A
A
1
a
2
a
L
c
Suggested Pad Layout
X
X
SOD923 (0.2mm Lead Width)
Y
Dimensions
C
C
X
Y
Value
(in mm)
0.900
0.300
0.400
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
2
L
x
2
b
E
SOD923 (0.3mm Lead Width)
︵ ︶
D
SOD923
(0.3mm Lead Width)
Dim Min Max Typ
A
0.34 0.40 0.37
b
0.25 0.35 0.30
c
0.05 0.15 0.10
D
0.55 0.65 0.60
E
0.75 0.85 0.80
He
0.95 1.05 1.00
L
0.05 0.15 0.10
L2
0.190 REF
a1
0°
8°
7°
a2
2°
4°
3°
All Dimensions in mm
e
H
A
A
1
a
2
a
c
Suggested Pad Layout
X
X
SOD923 (0.3mm Lead Width)
Y
Dimensions
C
C
X
Y
Value
(in mm)
0.900
0.400
0.600
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
SOT143
F
1
A G
5
2
.
0
M
B
C
E
N
A
L
P
E
G
U
A
G
a
E
N
A
L
P
G
N
I
T
A
E
S
L
2
DA
H
K
J
SOT143
Dim Min
Max
Typ
A1 0.37 0.51 0.400
A2 0.77 0.93 0.800
B
1.20 1.40 1.30
C
2.28 2.48 2.38
D
1.58 1.83 1.72
F
0.45 0.60 0.49
G
1.78 2.03 1.92
H
2.80 3.00 2.90
J 0.013 0.10 0.05
K
0.89 1.00
L
0.46 0.60 0.50
M 0.085 0.18 0.11
a
0°
8°
All Dimensions in mm
Suggested Pad Layout
SOT143
X2
X
Dimensions
Z
G
X
X1
X2
Y
C
Y
Z
C
G
X1
Value (in mm)
2.70
1.30
2.50
1.0
0.60
0.70
2.0
X2
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
171 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
SOT223
D
Q
b1
C
E
Gauge
Plane
0.25
Seating
Plane
e1
L
b
0°
-1
0°
e
A1
7°
7°
A
E1
SOT223
Dim
Min Max Typ
A
1.55 1.65 1.60
A1 0.010 0.15 0.05
b
0.60 0.80 0.70
b1
2.90 3.10 3.00
C
0.20 0.30 0.25
D
6.45 6.55 6.50
E
3.45 3.55 3.50
E1
6.90 7.10 7.00
e
4.60
e1
2.30
L
0.85 1.05 0.95
Q
0.84 0.94 0.89
All Dimensions in mm
Suggested Pad Layout
SOT223
1
X
1
Y
2
Y
1
C
Dimensions Value (in mm)
C
2.30
C1
6.40
X
1.20
X1
3.30
Y
1.60
Y1
1.60
C2
8.00
Y
C
X
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
172 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
SOT25
A
SOT25
Dim Min Max Typ
A
0.35 0.50 0.38
B
1.50 1.70 1.60
C
2.70 3.00 2.80
D
0.95
H
2.90 3.10 3.00
J
0.013 0.10 0.05
K
1.00 1.30 1.10
L
0.35 0.55 0.40
M
0.10 0.20 0.15
N
0.70 0.80 0.75
0°
8°
-

All Dimensions in mm
B C
H
K
M
N
J
L
D
Suggested Pad Layout
SOT25
C2
Z
C2
Dimensions
Z
G
X
Y
C1
C2
C1
G
Y
X
SOT25
3.20
1.60
0.55
0.80
2.40
0.95
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
SOT353
A
SOT353
Min Max Typ
0.10 0.30 0.25
1.15 1.35 1.30
2.00 2.20 2.10
0.65 Typ
0.40 0.45 0.425
1.80 2.20 2.15
0
0.10 0.05
0.90 1.00 1.00
0.25 0.40 0.30
0.10 0.22 0.11
0°
8°
All Dimensions in mm
Dim
A
B
C
D
F
H
J
K
L
M
B C
H
K
M
N
J
L
D
Suggested Pad Layout
SOT353
C2
Z
C2
Dimensions
Z
G
X
Y
C1
C2
C1
G
Y
SOT353
2.5
1.3
0.42
0.6
1.9
0.65
X
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
SC74R / SOT26
A
SC74R / SOT26
Dim Min Max Typ
A
0.35 0.50 0.38
B
1.50 1.70 1.60
C
2.70 3.00 2.80
D
0.95
F
H
2.90 3.10 3.00
J
0.013 0.10 0.05
K
1.00 1.30 1.10
L
0.35 0.55 0.40
M
0.10 0.20 0.15
0°
8°
-

All Dimensions in mm
B C
H
K
M
J
D
F
L
Suggested Pad Layout
SC74R / SOT26
C2
Z
C2
Dimensions
Z
G
X
Y
C1
C2
C1
G
Y
SC74R / SOT26
3.20
1.60
0.55
0.80
2.40
0.95
X
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
SOT363
A
SOT363
Dim Min Max Typ
A 0.10 0.30 0.25
B 1.15 1.35 1.30
C 2.00 2.20 2.10
D
0.65 Typ
F 0.40 0.45 0.425
H 1.80 2.20 2.15
J
0
0.10 0.05
K 0.90 1.00 1.00
L 0.25 0.40 0.30
M 0.10 0.22 0.11
0°
8°

All Dimensions in mm
B C
H
K
M
J
D
F
L
Suggested Pad Layout
SOT363
C2
Z
C2
C1
G
Y
Dimensions
Z
G
X
Y
C1
C2
SOT363
2.5
1.3
0.42
0.6
1.9
0.65
X
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
SC59
A
SC59
Dim Min Max Typ
A
0.35 0.50 0.38
B
1.50 1.70 1.60
C
2.70 3.00 2.80
D
0.95
G
1.90
H
2.90 3.10 3.00
J
0.013 0.10 0.05
K
1.00 1.30 1.10
L
0.35 0.55 0.40
M
0.10 0.20 0.15
N
0.70 0.80 0.75
0°
8°

All Dimensions in mm
B C
G
H
K
M
N
J
L
D
Suggested Pad Layout
SC59
Y
Z
Dimensions
Z
X
Y
C
E
C
X
SC59
3.4
0.8
1.0
2.4
1.35
E
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
SOT523
A
SOT523
Dim Min Max Typ
A
0.15 0.30 0.22
B
0.75 0.85 0.80
C
1.45 1.75 1.60
D
0.50
G
0.90 1.10 1.00
H
1.50 1.70 1.60
J
0.00 0.10 0.05
K
0.60 0.80 0.75
L
0.10 0.30 0.22
M
0.10 0.20 0.12
N
0.45 0.65 0.50
0°
8°
-

All Dimensions in mm
B C
G
H
K
M
N
J
L
D
Suggested Pad Layout
SOT523
Y
Z
Dimensions
Z
X
Y
C
E
C
X
SOT523
1.8
0.4
0.51
1.3
0.7
E
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
SOT323
H
K
a
M
L
D
J
A
B
C
SOT323
Dim
Min
Max
Typ
A
0.25 0.40 0.30
B
1.15 1.35 1.30
C
2.00 2.20 2.10
D
0.650 BSC
F
0.375 0.475 0.425
G
1.20 1.40 1.30
H
1.80 2.20 2.15
J
0.00 0.10 0.05
K
0.90 1.00 0.95
L
0.25 0.40 0.30
M
0.10 0.18 0.11
a
8°C
All Dimensions in mm
G
Suggested Pad Layout
SOT323
Y
Z
Dimensions
Z
X
Y
C
E
C
X
SOT323
2.8
0.7
0.9
1.9
1.0
E
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
SOT23
°
7
l
l
A
H
E
N
A
L
5
P2
E.
G0
U
A
G
J
K
1
K
a
M
A
1
L
L
B
C
D
G
F
SOT23
Dim
Min
Max
Typ
A
0.37
0.51
0.40
B
1.20
1.40
1.30
C
2.30
2.50
2.40
D
0.89
1.03 0.915
F
0.45
0.60 0.535
G
1.78
2.05
1.83
H
2.80
3.00
2.90
J
0.013 0.10
0.05
K
0.890 1.00 0.975
K1
0.903 1.10 1.025
L
0.45
0.61
0.55
L1
0.25
0.55
0.40
M
0.085 0.150 0.110
a
8°
All Dimensions in mm
Suggested Pad Layout
SOT23
Y
Z
C
X
Dimensions
Z
X
Y
C
E
Value (in mm)
2.9
0.8
0.9
2.0
1.35
E
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
g
ne
i
t
n
a
a
el
SP
D
c
SOT23F
b
1
L
E
1
E
1
e
e
A
L
R
k
SOT23F
Dim Min Max
Typ
A
0.80 1.00
0.90
b
0.35 0.45
0.40
c
0.06 0.16
0.11
D
2.80 3.00
2.90
e
0.95
e1
1.90
E
2.30 2.50
2.40
E1 1.50 1.70
1.60
k
1.10 1.26
1.18
L
0.48 0.68
0.58
L1 0.39 0.41
0.40
R
0.05 0.15
0.10
All Dimensions in mm
Suggested Pad Layout
C
X
SOT23F
1
Y
Y
Dimensions Value (in mm)
C
0.95
X
0.80
Y
1.110
Y1
3.000
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
SOT543
D
e1
SOT543
Dim Min Max Typ
A
0.55 0.60 0.60
b
0.15 0.30 0.20
c
0.10 0.18 0.15
D
1.50 1.70 1.60
E
1.55 1.70 1.60
E1 1.10 1.25 1.20
e
0.50 BSC
e1
1.00 BSC
L
0.10 0.30 0.20
L1 0.06 0.10 0.08
a
6°
8°
7°
All Dimensions in mm
E/2
E1/2
E1
E
e
L
c
b
L1
R0.1 MAX.
TYP.
a
7°
A
TYP.
Suggested Pad Layout
C
SOT543
2
Y
Dimensions
Y
C
X
Y
Y1
Y2
Value
(in mm)
0.500
0.300
0.670
0.550
1.940
X
1
Y
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
SOT553
D
e1
e
E1/2
E/2
E1
E
L (5x)
b (5x)
F
R0.1 MAX.
TYP.
c
a
7°
A
SOT553
Dim Min Max Typ
A
0.55 0.62 0.60
b
0.15 0.30 0.20
c
0.10 0.18 0.15
D
1.50 1.70 1.60
E
1.55 1.70 1.60
E1 1.10 1.25 1.20
e
0.50 BSC
e1
1.00 BSC
F
0.00 0.10 ––
L
0.10 0.30 0.20
a
6°
8°
7°
All Dimensions in mm
TYP.
Suggested Pad Layout
SOT553
C2
Z
C2
Dimensions
Z
G
X
Y
C1
C2
C1
G
Y
SOT553
2.2
1.2
0.375
0.5
1.7
0.5
X
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
SOT563
A
B
C
D
G
M
K
SOT563
Dim Min
Max
Typ
A
0.15 0.30 0.20
B
1.10 1.25 1.20
C
1.55 1.70 1.60
D
0.50
G
0.90 1.10 1.00
H
1.50 1.70 1.60
K
0.55 0.60 0.60
L
0.10 0.30 0.20
M
0.10 0.18 0.11
All Dimensions in mm
H
L
Suggested Pad Layout
SOT563
C2
Z
C2
Dimensions
Z
G
X
Y
C1
C2
C1
G
SOT563
2.2
1.2
0.375
0.5
1.7
0.5
Y
X
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
SOT666
A
SOT666
Dim Min
Max Typ
A
0.15
0.30 0.20
B
1.10
1.25 1.20
C
1.55
1.70 1.60
D
-
0.50
G
0.90
1.10 1.00
H
1.50
1.70 1.60
K
0.55
0.60 0.60
L
0.10
0.30 0.20
M
0.10
0.18 0.15
All Dimensions in mm
B C
D
G
M
K
H
L
Suggested Pad Layout
SOT666
C
Y (6x)
Dimensions Value (in mm)
C
0.50
G
0.80
X
0.35
Y
0.50
G
X
(6x)
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
SOT953
D
e1
L
E
E1
e
b (5 places)
c
A
SOT953
Dim Min
Max
Typ
A
0.40 0.50 0.45
A1
0
0.05
-
b
0.10 0.20 0.15
c
0.12 0.18 0.15
D
0.95 1.05 1.00
E
0.95 1.05 1.00
E1
0.75 0.85 0.80
e
0.35
e1
0.70
L
0.05 0.15 0.10
All Dimensions in mm
A1
Suggested Pad Layout
SOT953
C
C
Dimensions
C
X
Y
Y1
Y1
Y (5X)
Value
(in mm)
0.350
0.200
0.200
1.100
X (5X)
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
186 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
SOT963
D
e1
L
E
E1
e
b (6 places)
c
A
SOT963
Dim Min
Max Typ
A
0.40
0.50 0.45
A1
0
0.05
c
0.120 0.180 0.150
D
0.95
1.05 1.00
E
0.95
1.05 1.00
E1
0.75
0.85 0.80
L
0.05
0.15 0.10
b
0.10
0.20 0.15
e
0.35 Typ
e1
0.70 Typ
All Dimensions in mm
A1
Suggested Pad Layout
SOT963
C
C
Dimensions
C
X
Y
Y1
Y1
Y (6X)
Value
(in mm)
0.350
0.200
0.200
1.100
X (6X)
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
187 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
c
0
0
2
.
0
R
1
D
SOT89
E
H
SOT89
Dim Min Max
Typ
A
1.40 1.60
1.50
B
0.50 0.62
0.56
B1 0.42 0.54
0.48
c
0.35 0.43
0.38
D
4.40 4.60
4.50
D1 1.62 1.83 1.733
D2 1.61 1.81
1.71
E
2.40 2.60
2.50
E2 2.05 2.35
2.20
e
1.50
H
3.95 4.25
4.10
H1 2.63 2.93
2.78
L
0.90 1.20
1.05
L1 0.327 0.527 0.427
z
0.20 0.40
0.30
All Dimensions in mm
L
1
B
B
e
2
D
X
4
°
8
︵
2
E
1
H
︶
A
1
L
z
D
Suggested Pad Layout
2
X
SOT89
3
Y
Dimensions
1
Y
G
X
4
Y
2
Y
Y
1
X
C
G
X
X1
X2
Y
Y1
Y2
Y3
Y4
Value
(in mm)
1.500
0.244
0.580
0.760
1.933
1.730
3.030
1.500
0.770
4.530
C
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
188 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
SOT89-5
C
1
D
0
0
2
.
0
R
L
E
H
SOT89-5
Dim
Min
Max
Typ
A
1.40
1.60
1.50
B
0.50
0.62
0.56
B1
0.44
0.54
0.48
C
0.35
0.43
0.38
D
4.40
4.60
4.50
D1
1.62
1.83 1.733
E
2.40
2.60
2.50
e
1.50
H
3.95
4.25
4.10
L
0.65
0.95
0.80
All Dimensions in mm
L
B
1
B
e
x
4
°
8
︵
︶
A
D
Suggested Pad Layout
SOT89-5
C
1
C
Dimensions
2
X
C
C1
X
X1
X2
X3
Y
Y1
Y2
Y3
3
Y
1
Y
2
Y
1
X
Y
X
Value
(in mm)
1.500
1.050
0.680
0.760
1.930
3.680
1.200
1.200
4.250
4.500
3
X
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
189 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
TO220AB
A
a
2
E
1
A
P
Ø
Q
1
H
2
E
1
P
Ø
01
D
1
Q
1
D
01
1
L
2
A
2
b
L
c
b
e
1
e
x
2
2
0︵
︶
TO220AB
Dim
Min Max Typ
A
4.40 4.70 4.57
A1
1.22 1.33 1.27
A2
2.59 2.79 2.69
b
0.77 0.90 0.813
b2
1.20 1.36 1.27
c
0.340 0.470 0.381
D
14.70 15.30 15.00
D1
8.60 8.80 8.70
e
2.54 BSC
e1
5.08 BSC
E
10.00 10.20 10.10
E2
10.06 10.26 10.16
E2a 10.10 10.35 10.25
H1
6.10 6.50 6.30
L
13.20 13.50 13.40
L1
4.00 3.75
Q
2.60 2.90 2.743
Q1
2.50 REF
ØP
3.76 3.88 3.84
ØP1 1.40 1.60 1.50
θ1
5°
9°
7°
θ2
1°
5°
3°
All Dimensions in mm
E
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
190 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline
TO220AC (Type A4)
A
1
A
E
P
Q
a
1
H
1
D
2
L
0
5
.
1
O
2
A
1
L
2
b
L
b
e
c
1
e
TO220AC
(Type A4)
Dim
Min
Max
Typ
A
4.470 4.670
A1
1.170 1.370
A2
2.520 2.820
b
0.710 0.910
0.813
b2
1.170 1.370
1.270
c
0.279 0.483
D1
8.763 9.017
8.890
E
10.010 10.310
e
2.54BSC
e1
4.980 5.180
H1a 12.294 12.548 12.446
L
13.700 14.100
L1
4.04
4.19
4.11
L2
1.60
Q
2.642 2.946
2.743
ØP
3.790 3.890
All Dimensions in mm
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
191 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline
TO220AC (Type BR)
A
1
A
E
1
H
P
TO220AC
(Type BR)
Dim
Min
Max
Typ
A
4.30
4.70
4.50
A1
1.20
1.40
1.30
A2
2.20
2.60
2.40
b
0.70
0.90
0.80
b2
1.27
c
0.40
0.60
0.50
D1
9.00
9.40
9.20
E
9.80
10.20
10.00
e
4.88
5.28
5.08
H1
6.30
6.70
6.50
H1a 10.90 11.30
11.10
H1b 15.70 16.10
15.90
L
12.60 13.60
13.10
L1
9.60
10.60
10.10
P
3.56
3.64
3.60
All Dimensions in mm
°
3
a
1
H
1
D
b
1
H
°
3
°
3
2
A
2
b
L
1
L
c
b
e
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
192 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline
TO220AC (Type E)
A
E
1
A
1
H
P
Q
D
2
L
1
L
2
b
L
c
b
2
A
1
e
TO220AC
(Type E)
Dim Min Typ Max
A
4.40
4.82
A1
1.1
1.40
A2 2.05
2.92
b
0.72
1.00
b2 1.16
1.45
c
0.36
0.68
D 14.70
- 15.87
e1
5.08
E
9.80
- 10.26
H1 5.80
6.40
L 12.70
- 13.96
L1 3.56
4.50
L2
1.30
P
3.70
3.90
Q
2.54
3.30
All Dimensions in mm
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
193 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
E
TO252 (DPAK)
A
3
b
c
°
1
±
°
7
3
L
4
L
H
2
A
D
x
3
b
e
︵
︶
x
2
2
b
︵
︶
8
0
5
.
0
e
n
a
l
P
e
g
u
a
G
e
n
a
l
P
g
n
i
t
a
e
S
1
D
1
E
1
A
L
a
F
E
R
4
7
.
2
TO252 (DPAK)
Dim Min Max Typ
A 2.19 2.39 2.29
A1 0.00 0.13 0.08
A2 0.97 1.17 1.07
b
0.64 0.88 0.783
b2 0.76 1.14 0.95
b3 5.21 5.46 5.33
c
0.45 0.58 0.531
D 6.00 6.20 6.10
D1 5.21
e
2.286
E 6.45 6.70 6.58
E1 4.32
H 9.40 10.41 9.91
L
1.40 1.78 1.59
L3 0.88 1.27 1.08
L4 0.64 1.02 0.83
a
0°
10°
All Dimensions in mm
Suggested Pad Layout
1
X
TO252 (DPAK)
1
Y
2
Y
Dimensions
C
X
X1
Y
Y1
Y2
C
Value (in mm)
4.572
1.060
5.632
2.600
5.700
10.700
Y
X
TO252 (DPAK)
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
194 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
1
X
1
Y
2
Y
Dimensions
C
X
X1
Y
Y1
Y2
C
Value (in mm)
4.572
1.060
5.632
2.600
5.700
10.700
Y
X
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
195 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
E
TO252 Type B (DPAK)
A
3
b
3
L
c
°
2
±
°
7
4
A
D
5
L
H
2
A
0
0
2
.
1
Ø
4
L
°
2
±
°
7
°
2
±
°
7
x
3
b
e
︵ ︶
2
L
e
n
a
l
P
e
g
u
a
G
e
n
a
l
P
g
n
i
t
a
e
S
1
D
1
E
1
A
L
a
F
E
R
0
9
.
2
TO252 (DPAK)
(Type B)
Dim Min Max Typ
A 2.20 2.38 2.30
A1 0.00 0.10
A2 0.97 1.17 1.07
A4
0.10 REF
b
0.72 0.85 0.78
b3 5.23 5.45 5.33
c
0.47 0.58 0.53
D 6.00 6.20 6.10
D1
5.30 REF
e
2.286 BSC
E 6.50 6.70 6.60
E1 4.70 4.92 4.83
H 9.90 10.10 10.30
L
1.40 1.70 1.60
L2
0.51 BSC
L3 0.90 1.25
L4 0.60 1.00 0.80
L5 1.70 1.90 1.80
a
0°
8°
All Dimensions in mm
Suggested Pad Layout
TO252 Type B (DPAK)
1
X
1
Y
2
Y
C
Dimensions
C
X
X1
Y
Y1
Y2
Value (in mm)
4.572
1.060
5.632
2.600
5.700
10.700
Y
X
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
196 of 303
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
E
TO252 (DPAK) (Type BR)
A
3
b
c
3
L
D
H
4
L
L
x
3
b
e
x
2
2
b
1
A
︵ ︶
︵ ︶
1
D
1
E
TO252 (DPAK)
(Type BR)
Dim Min Max Typ
A 2.20 2.40
A1 0.00 0.10
b
0.50 0.70
b3 5.20 5.40
c
0.45 0.55
D 5.95 6.25
D1 5.10 5.50
E 6.45 6.70
E1 4.71 4.91
e
2.24 2.34
H 9.45 9.95
L
1.25 1.75
L3 0.95 1.25
L4 0.60 0.90
All Dimensions in mm
Suggested Pad Layout
1
X
TO252 (DPAK)
1
Y
2
Y
Dimensions
C
X
X1
Y
Y1
Y2
C
Value (in mm)
4.572
1.060
5.632
2.600
5.700
10.700
Y
X
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
197 of 303
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
E
TO252 Type C (DPAK)
A
3
b
c
3
L
D
H
4
L
L
x
3
b
e
x
2
2
b
1
A
︵ ︶
︵ ︶
1
D
1
E
TO252 (DPAK)
(Type C)
Dim Min Max Typ
A 2.20 2.40
A1 0.00 0.10
b
0.50 0.70
b3 5.20 5.40
c
0.45 0.55
D 5.95 6.25
D1 5.10 5.50
E 6.45 6.70
E1 4.71 4.91
e
2.24 2.34
H 9.45 9.95
L
1.25 1.75
L3 0.95 1.25
L4 0.60 0.90
All Dimensions in mm
Suggested Pad Layout
TO252 Type C (DPAK)
1
X
1
Y
2
Y
C
Dimensions
C
X
X1
Y
Y1
Y2
Value (in mm)
4.572
1.060
5.632
2.600
5.700
10.700
Y
X
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
198 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
E
TO252 (DPAK) (Type TH)
A
3
b
3
L
c
°
2
±
°
7
4
A
D
5
L
H
2
A
0
0
2
.
1
Ø
4
L
°
2
±
°
7
°
2
±
°
7
x
3
b
e
︵ ︶
2
L
e
n
a
l
P
e
g
u
a
G
e
n
a
l
P
g
n
i
t
a
e
S
1
D
1
E
1
A
L
a
F
E
R
0
9
.
2
TO252 (DPAK)
(Type TH)
Dim Min Max Typ
A 2.20 2.38 2.30
A1 0.00 0.10
A2 0.97 1.17 1.07
A4
0.10 REF
b
0.72 0.85 0.78
b3 5.23 5.45 5.33
c
0.47 0.58 0.53
D 6.00 6.20 6.10
D1
5.30 REF
e
2.286 BSC
E 6.50 6.70 6.60
E1 4.70 4.92 4.83
H 9.90 10.10 10.30
L
1.40 1.70 1.60
L2
0.51 BSC
L3 0.90 1.25
L4 0.60 1.00 0.80
L5 1.70 1.90 1.80
a
0°
8°
All Dimensions in mm
Suggested Pad Layout
1
X
TO252 (DPAK)
1
Y
2
Y
Dimensions
C
X
X1
Y
Y1
Y2
C
Value (in mm)
4.572
1.060
5.632
2.600
5.700
10.700
Y
X
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
TO252-4
E
A
b3
c2
L3
A2
D
E1
H
L4
A1
L
4X b2
e
5X b
a
TO252-4
Dim Min Max Typ
A 2.19 2.39 2.29
A1 0.00 0.13 0.08
A2 0.97 1.17 1.07
b
0.51 0.71 0.583
b2 0.61 0.79 0.70
b3 5.21 5.46 5.33
c2 0.45 0.58 0.531
D 6.00 6.20 6.10
D1 5.21
e
1.27
E 6.45 6.70 6.58
E1 4.32
H 9.40 10.41 9.91
L
1.40 1.78 1.59
L3 0.88 1.27 1.08
L4 0.64 1.02 0.83
a
0°
10°
All Dimensions in mm
Suggested Pad Layout
TO252-4
1
X
1
Y
Dimensions
2
Y
C
C1
X
X1
Y
Y1
Y2
Y3
3
Y
1
C
Y
Value
(in mm)
1.27
2.54
1.00
5.73
2.00
6.17
1.64
2.66
C
X
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
200 of 303
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
E
TO252-5
A
3
b
°
1
±
°
7
2
c
3
L
D
H
2
A
b
e
2
b
1
D
1
E
1
A
8
0
5
.
0
a
E
N
A
L
P
E
G
U
A
G
E
N
A
L
P
G
N
I
T
A
E
S
L
F
E
R
4
7
.
2
TO252-5
Dim Min Max Typ
A 2.19 2.39 2.29
A1 0.00 0.13 0.08
A2 0.97 1.17 1.07
b
0.51 0.71 0.583
b2 0.61 0.79 0.70
b3 5.21 5.46 5.33
c2 0.45 0.58 0.531
D 6.00 6.20 6.10
D1 5.21
e
1.27
E 6.45 6.70 6.58
E1 4.32
H 9.40 10.41 9.91
L
1.40 1.78 1.59
L3 0.88 1.27 1.08
a
0°
10°
All Dimensions in mm
Suggested Pad Layout
TO252-5
1
X
1
Y
Dimensions
2
Y
C
X
X1
Y
Y1
Y2
Y3
3
Y
Y
Value
(in mm)
1.27
1.00
5.73
2.00
6.17
1.64
2.66
C
X
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
201 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
TO263AB (D2PAK)
A
E
2
c
1
L
TO263AB (D2PAK)
Dim
Min Max
Typ
A
4.07 4.82
A1
0.00 0.25
b
0.51 0.99
b2
1.15 1.77
c
0.356 0.73
c2
1.143 1.65
D
8.39 9.65
D1
6.55 6.95
e
2.54 TYP
E
9.66 10.66
E1
6.23 8.23
H
14.61 15.87
L
1.78 2.79
L1
1.67
L2
1.77
L3
0.254
a
0°
8°
All Dimensions in mm
°
1
±
°
7
D
H
2
L
e
c
B
l
i
a
t
e
D
e
e
S
b
2
b
3
1
D
1
E
L e
n
a
l
P
e
g
u
a
G
g
ne
i
t
n
a
a
el
SP
a
1
A
L
B
l
i
a
t
e
D
Suggested Pad Layout
TO263AB (D2PAK)
1
X
1
Y
2
Y
X
Dimensions
C
X
X1
Y
Y1
Y2
Value (in mm)
5.08
1.10
10.41
3.50
7.01
15.99
Y
C
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
202 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
2
TO263AB Type B (D PAK)
2
c
E
A
TO263AB (D2PAK)
(Type B)
Dim
Min Max Typ
A
4.40 4.70 4.57
A1
0.00 0.20 0.10
A2
2.59 2.79 2.69
b
0.77 0.90 0.813
b2
1.20 1.36 1.27
c
0.356 0.47 0.381
c2
1.22 1.32 1.27
D
8.60 8.80 8.70
D1
6.60 7.80 7.60
D1a
5.33 6.53 6.33
D1b
4.54 5.74 5.54
e
2.54 BSC
E
10.00 10.20 10.10
E1
6.67 7.87 7.67
E1a
4.94 6.14 5.94
E1b
7.06 8.26 8.06
H
14.70 15.50 15.10
L
2.00 2.60 2.30
L1
1.17 1.40 1.27
L2
1.45 1.70 1.55
L3
0.25 BSC
L4
2.50 REF
θ
0°
8°
5°
θ1
5°
9°
7°
θ2
1°
5°
3°
All Dimensions in mm
1
L
1
0
4
L
2
A
D
0
5
.
1
Ø
H
2
0
1
0
2
L
e
c
B
l
i
a
t
e
D
e
e
S
b
2
b
a
1
E
1
E
3
a
1
D
b
1
D
1
D
L e
n
a
l
P
e
g
u
a
G
1
A
L
b
1
E
g
ne
i
t
n
aa
el
SP
0
B
l
i
a
t
e
D
Suggested Pad Layout
2
TO263 Type B (D PAK)
1
X
Y
Dimensions
2
Y
C
X
X1
Y
Y1
Y2
X
1
Y
Value
(in mm)
5.08
1.10
10.41
3.50
7.01
15.99
C
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
203 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
E
A
TO263AB (D2PAK)(Type BR)
2
c
1
L
D
H
2
L
L
e
c
b
2
b
1
D
1
E
TO263AB (D2PAK)
Type BR
Dim
Min Max Typ
A
4.30 4.70
b
0.70 0.90
b2
1.15 1.35
c
0.40 0.60
c2
1.20 1.40
D
9.00 9.40
D1
7.96 8.36
E
9.80 10.20
E1
7.85 8.05
e
2.34 2.74
H
15.00 15.87
L
2.24 2.84
L1
1.00 1.40
L2
1.20 1.60
All Dimensions in mm
Suggested Pad Layout
1
X
TO263AB (D2PAK)
Y
Dimensions
C
X
X1
Y
Y1
Y2
Value (in mm)
5.08
1.10
10.41
3.50
7.01
15.99
2
Y
X
1
Y
C
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
204 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
2
A
E
TO263AB Type C (D PAK)
2
c
1
L
D
TO263AB (D2PAK)
Type C
Dim
Min Max Typ
A
4.30 4.70
b
0.70 0.90
b2
1.15 1.35
c
0.40 0.60
c2
1.20 1.40
D
9.00 9.40
D1
7.96 8.36
E
9.80 10.20
E1
7.85 8.05
e
2.34 2.74
H
15.00 15.87
L
2.24 2.84
L1
1.00 1.40
L2
1.20 1.60
All Dimensions in mm
H
2
L
L
e
c
b
2
b
1
D
1
E
Suggested Pad Layout
2
TO263AB Type C (D PAK)
1
X
Y
Dimensions
2
Y
C
X
X1
Y
Y1
Y2
X
1
Y
Value
(in mm)
5.08
1.10
10.41
3.50
7.01
15.99
C
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
205 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
TO263AB (D2PAK) (Type TH)
A
2
c
E
1
L
1
0
4
L
2
A
D
0
5
.
1
Ø
H
2
0
1
0
2
L
e
c
B
l
i
a
t
e
D
e
e
S
b
2
b
a
1
E
1
E
3
a
1
D
b
1
D
1
D
L e
n
a
l
P
e
g
u
a
G
1
A
L
b
1
E
g
ne
i
t
n
a
a
el
SP
0
B
l
i
a
t
e
D
TO263AB (D2PAK)
(Type TH)
Dim
Min Max Typ
A
4.40 4.70 4.57
A1
0.00 0.20 0.10
A2
2.59 2.79 2.69
b
0.77 0.90 0.813
b2
1.20 1.36 1.27
c
0.356 0.47 0.381
c2
1.22 1.32 1.27
D
8.60 8.80 8.70
D1
6.60 7.80 7.60
D1a
5.33 6.53 6.33
D1b
4.54 5.74 5.54
e
2.54 BSC
E
10.00 10.20 10.10
E1
6.67 7.87 7.67
E1a
4.94 6.14 5.94
E1b
7.06 8.26 8.06
H
14.70 15.50 15.10
L
2.00 2.60 2.30
L1
1.17 1.40 1.27
L2
1.45 1.70 1.55
L3
0.25 BSC
L4
2.50 REF
θ
0°
8°
5°
θ1
5°
9°
7°
θ2
1°
5°
3°
All Dimensions in mm
Suggested Pad Layout
1
X
TO263AB (D2PAK)
Y
Dimensions
C
X
X1
Y
Y1
Y2
Value (in mm)
5.08
1.10
10.41
3.50
7.01
15.99
2
Y
X
1
Y
C
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
206 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
TO263-5
A
E
TO263-5
Dim
Min
Max
A
4.07
4.85
A1
1.14
1.40
b
0.66
1.02
c
0.36
0.64
D
8.65
9.65
E
9.78
10.54
e
1.57
1.85
L
14.61 15.88
L1
2.29
2.79
L2
-
2.92
All Dimensions in mm
A1
L2
D
L
L1
b
e
c
Suggested Pad Layout
TO263-5
X
Dimensions
Y1
X
X1
Y
Y1
Y2
C
Y
Y2
Value
(in mm)
10.9
1.05
15.7
9.1
2.5
1.7
X1
C
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
207 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
b
T-MiniDIP
1
E
E
L
1
L
c
1
D e
D
T-MiniDIP
Dim
Min
Max
A
1.15
1.27
b
0.60
0.70
c
0.15
0.25
D
4.90
5.10
D1
3.20
3.50
E
5.30
5.50
E1
6.00
6.40
e
3.90
4.10
L
0.25
0.80
L1
0.25
0.55
All Dimensions in mm
A
Suggested Pad Layout
T-MiniDIP
X
1
C
Dimensions
C
C1
X
Y
Value(in mm)
4.00
5.60
0.750
0.450
Y
C
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
208 of 303
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
TSSOP-8
D
TSSOP-8
Dim Min Max Typ
a
0.09


A
1.20


A1 0.05 0.15

A2 0.825 1.025 0.925
b
0.19 0.30

c
0.09 0.20

D
2.90 3.10 3.025
e
0.65


E
6.40


E1 4.30 4.50 4.425
L
0.45 0.75 0.60
All Dimensions in mm
See Detail C
E
E1
e
c
b
Gauge plane
a
A2
A
L
D
A1
Detail C
Suggested Pad Layout
TSSOP-8
Y
X
C3
C1
C2
G
Dimensions Value (in mm)
X
0.45
Y
1.78
C1
7.72
C2
0.65
C3
4.16
G
0.20
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
209 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
0.25
TSSOP-14
B
Gauge Plane
Seating Plane
L
F1
a2
Pin# 1 Indent
F
Detail ‘A’
G
K
A
a1
D
C
TSSOP-14
Dim
Min
Max
a1
7° (4X)
a2
8°
0
A
4.9
5.10
B
4.30
4.50
C
-
1.2
D
0.8
1.05
F
1.00 Typ
F1
0.45
0.75
G
0.65 Typ
K
0.19
0.30
L
6.40 Typ
All Dimensions in mm
Detail ‘A’
Suggested Pad Layout
TSSOP-14
X
C1
C2
Dimensions Value (in mm)
X
0.45
Y
1.45
C1
5.9
C2
0.65
Y
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
210 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
TSSOP-16
2
/
E
'
A
'
L
I
A
T
E
D
E
E
S
1
E
Y
E
X
1
N
I
P
b
e
x)

2
L
C
A
EE
GN
UA
AL
GP
1
R R
D
2
A
Ø0.760Depth0.050±0.02
L
E
N
A
L
P
G
N
I
T
A
E
S

1
L
1
A
'
A
'
L
I
A
T
E
D
TSSOP-16
Dim
Min Max Typ
A
1.08
A1
0.05 0.15
A2
0.80 0.93
b
0.19 0.30
c
0.09 0.20
D
4.90 5.10
E
6.40 BSC
E1
4.30 4.50
e
0.65 BSC
L
0.45 0.75
L1
1.00 REF
L2
0.25 BSC
R / R1 0.09
X
1.350
Y
1.050
θ
0°
8°
θ1
5°
15°
θ2
0°
All Dimensions in mm
Suggested Pad Layout
TSSOP-16
X1
Dimensions
C
X
X1
Y
Y1
Y1
Y
Value
(in mm)
0.650
0.350
4.900
1.400
6.800
1
X
C
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
211 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
TSSOP-16EP
X
D
e
TSSOP-16EP
Dim
Min
Max
Typ
A
1.20
A1
0.025 0.100
A2
0.80
1.05
0.90
b
0.19
0.30
c
0.09
0.20
D
4.90
5.10
5.00
E
6.20
6.60
6.40
E1
4.30
4.50
4.40
e
0.65 BSC
L
0.45
0.75
0.60
L1
1.0 REF
L2
0.65 BSC
X
2.997
Y
2.997
θ1
0°
8°
All Dimensions in mm
Y
E
1
E
K
1R
A
NM
I
P
D
I
2
A
e
n
a
l
5P
2e
.
0
g
u
a
G
A
e
n
a
l
P
g
n
i
t
a
e
S

L
L
I
A
T
E
D
1
A
b
1
L
Suggested Pad Layout
TSSOP-16EP
X2
Y
Y3
Y1
X1
X
Dimensions
C
X
X1
X2
Y
Y1
Y2
Y3
Y2
Value
(in mm)
0.650
0.450
3.290
5.000
1.450
3.290
4.450
7.350
C
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
212 of 303
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
TSSOP-20
TSSOP-20
Dim
Min
Max
Typ
A
1.20
A1
0.05
0.15
A2
0.80
1.05
b
0.19
0.30
c
0.09
0.20
D
6.40
6.60
6.50
E
6.20
6.60
6.40
E1
4.30
4.50
4.40
e
0.65 BSC
L
0.45
0.75
0.60
L1
1.0 REF
θ1
0°
8°
θ2
10°
14°
12°
θ3
10°
14°
12°
All Dimensions in mm
D
E1
E

PIN 1
ID MARK
0.25
Gauge Plane
e

A2
b
A

Seating Plane
L
L1
A1
DETAIL
Suggested Pad Layout
TSSOP-20
X
C
Dimensions
Y1
Y2
Y
C
X
X1
Y
Y1
Y2
Value
(in mm)
0.650
0.420
6.270
1.780
4.160
7.720
X1
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
213 of 303
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
TSSOP-20EP
X
D
Y
E
1
E
TSSOP-20EP
Dim
Min
Max
Typ
A
1.20
A1
0.025 0.100
A2
0.80
1.05
0.90
b
0.19
0.30
c
0.09
0.20
D
6.40
6.60
6.50
E
6.20
6.60
6.40
E1
4.30
4.50
4.40
L
0.45
0.75
0.60
L1
1.0 REF
L2
0.65 BSC
X
4.191
Y
2.997
θ1
0°
8°
All Dimensions in mm
K
1R
NA
IM
P
D
I
e
e
n
a
l
5P
2e
.
0
g
u
a
G
A
2
A
e
n
a
l
P
g
n
i
t
a
e
S
L
L
I
A
T
E
D
1
L
1
A
b

Suggested Pad Layout
TSSOP-20EP
X (20x)
C
Dimensions
Y1
Y2
Y3
X1
Y (20x)
C
X
X1
X2
Y
Y1
Y2
Y3
Value
(in mm)
0.650
0.420
4.490
6.270
1.780
3.290
4.160
7.720
X2
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
214 of 303
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
TSOT25
x
4
1
0
1
De
︵ ︶
2
/
1
E
2
/
E
c
E
1
E
e
n
a
l
P
e
g
u
a
G
e
n
a
l
P
g
n
i
t
a
e
S
0
2
L
L
x
4
1
0
b
e
︵ ︶
2
A
1
A
A
e
n
a
l
P
g
n
i
t
a
e
S
TSOT25
Dim
Min
Max
Typ
A
-
1.00
A1
0.01 0.10
A2
0.84 0.90
b
0.30 0.45
c
0.12 0.20
D
2.90
E
2.80
E1
1.60
e
0.95 BSC
e1
1.90 BSC
L
0.30 0.50
L2
0.25 BSC
θ
0°
8°
4°
θ1
4°
12°
All Dimensions in mm
TSOT25 (Type A2)
Dim
Min
Max Typ
A
-
1.10
A1
0.01 0.10
A2
0.70 1.00
b
0.30 0.50
c
0.12 REF
D
2.70 3.10
E
2.60 3.00
E1
1.40 1.80
e
0.95 REF
e1
1.90 REF
L
0.45 REF
L2
0.25 REF
θ
0°
8°
4°
All Dimensions in mm
Suggested Pad Layout
TSOT25
C
1
Y
Dimensions Value (in mm)
C
0.950
X
0.700
Y
1.000
Y1
3.199
Y
X
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
215 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
TSOT25F
D
TSOT25F
Dim
E
1
E
A
C
W
E
I
V
E
E
S
c
e
b
0
x
4
C
W
E
I
V
1
e
︵ ︶
Min
Max
Typ
0.700 0.775 0.750
b
0.350 0.500
-
c
0.100 0.200
-
D
2.800 3.100 2.900
E
3.700 3.900 3.800
E1
1.500 1.700 1.600
e
-
-
0.950
e1
-
-
1.900
θ
4°
12°
10°
A
All Dimensions in mm
x
4
0
︵ ︶
Suggested Pad Layout
TSOT25F
1
C
Y
X
Dimensions
1
Y
C
C1
X
X1
Y
Y1
C
Value
(in mm)
0.950
1.900
0.700
2.600
1.000
4.220
1
X
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
216 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
TSOT26
TSOT26
Dim Min Max Typ
A
-
1.00
A1
0.01 0.10
A2
0.84 0.90
D
2.90
E
2.80
E1
1.60
b
0.30 0.45
c
0.12 0.20
e
0.95
e1
1.90
L
0.30 0.50
L2
.25
θ
0°
8°
4°
θ1
4°
12°
All Dimensions in mm
D
e1
E
E1
L2
c
4x1
e
L

6x b
A
A2
A1
Suggested Pad Layout
TSOT26
C
C
Dimensions
C
X
Y
Y1
Y1
Y (6x)
Value
(in mm)
0.950
0.700
1.000
3.199
X (6x)
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
217 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
TSOT26F
D
TSOT26F
Dim
E
1
E
A
C
W
E
I
V
E
E
S
c
e
b
0
x
4
C
W
E
I
V
1
e
︵ ︶
Min
Max
Typ
0.700 0.775 0.750
b
0.350 0.500
-
c
0.100 0.200
-
D
2.800 3.100 2.900
E
3.700 3.900 3.800
E1
1.500 1.700 1.600
e
-
-
0.950
e1
-
-
1.900
θ
4°
12°
10°
A
All Dimensions in mm
x
4
0
︵ ︶
Suggested Pad Layout
TSOT26F
X
C
Y
Dimensions
1
Y
C
X
X1
Y
Y1
Value
(in mm)
0.950
0.700
2.600
1.000
4.220
1
X
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
218 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
X4-WLB0402-2/SWP
2
A
1
A
A
e
n
a
l
P
g
n
i
t
a
e
S
X4-WLB0402-2/SWP
D
Dim Min
Max
Typ
A
0.150 0.200 0.175
A1
0.00 0.020 0.010
A2 0.010 0.040 0.025
b
0.110 0.170 0.140
D
0.375 0.425 0.400
E
0.175 0.225 0.200
e
0.260
L
0.080 0.100 0.090
z
0.010 0.040 0.025
All Dimensions in mm
e
D
I
y
t
i
r
a
l
o
P
b
E
z
L
Suggested Pad Layout
X4-WLB0402-2/SWP
1
X
Dimensions
Y
G
X
X1
Y
G
X
Value
(in mm)
0.110
0.200
0.510
0.200
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
219 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
X2-WLB0505-3
D
A1
A
X2-WLB0505-3
Dim
Min
Max
Typ
A
0.35
0.40

A1
0.00
0.01

b
0.12
0.18
0.15
D
0.50


E
0.50


K
0.16


L
0.43
0.49
0.46
L1
0.07
0.13
0.10
L2
0.17
0.23
0.20
All Dimensions in mm
E
L1
SEATING PLANE
K
L
L2
b
b
K
Suggested Pad Layout
X2-WLB0505-3
X1
Y
Dimensions
X
X1
Y
Y1
Y2
Y2
Y1
X
Value
(in mm)
0.17
0.50
0.22
0.12
0.50
X
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
220 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
D
X2-WLB0603-2
e
E
L
X2-WLB0603-2
Dim Min Max
Typ
A
0.26 0.34
0.30
A1
0
0.02
0.01
b
0.20 0.28
0.24
D
0.28 0.32
0.30
E
0.58 0.62
0.60
e
0.42 0.34
0.38
L
0.11 0.15
0.13
All Dimensions in mm
b
D
I
1
#
n
i
P
A
1
A
e
n
a
l
P
g
n
i
t
a
e
S
Suggested Pad Layout
X2-WLB0603-2
1
Y
Dimensions
Y
X
Y
Y1
Value
(in mm)
0.300
0.210
0.610
X
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
221 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
X3-WLB0603-2
1
A
A
X3-WLB0603-2
e
n
a
l
P
g
n
i
t
a
e
S
Dim
A
D k
A1
b
Min
Max
0.250 0.300
0.00
0.01
0.220 0.290
Typ
0.275
0.241
D
0.575 0.625
0.600
E
0.275 0.325
0.300
E
b
k
L
-
-
0.120 0.190
0.256
0.144
All Dimensions in mm
L
L
Suggested Pad Layout
X3-WLB0603-2
1
X G
Dimensions
Y
G
X
Y
X1
Value
(in mm)
0.206
0.194
0.291
0.594
X
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
222 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
X4-WLB0603-2
1
A
A
e
n
a
l
P
g
n
i
t
a
e
S
D e
x
2
b
E
︵ ︶
X4-WLB0603-2
Dim Min
Max
Typ
A
--0.20
A1 0.006 0.01 0.008
b
0.19 0.29
0.24
D 0.595 0.645 0.62
E 0.295 0.345 0.320
e
0.355
L3
0.14 0.24
0.19
All Dimensions in mm
x
2
3
L
︵ ︶
Suggested Pad Layout
X4-WLB0603-2
1
X
Dimensions
Y
X
X1
Y
Value
(in mm)
0.230
0.610
0.300
X
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
223 of 303
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
X3-WLB0603-3
D
b
L
(3x)
E
e
e1
b1
A
X3-WLB0603-3
Dim Min Max
Typ
A
0.24 0.30

A1 0.00 0.01

b
0.23 0.29 0.26
b1 0.075 0.135 0.105
D
0.30


E
0.60


e
0.40


e1
0.155


L
0.13 0.19 0.16
All Dimensions in mm
A1
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
224 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
D
U-WLB0808-4
e
D
I
1
#
N
I
P
e
E
U-WLB0808-4
Dim
Min
Max
Typ
A
0.511 REF
A2
0.336 0.366 0.351
A3
0.15
0.17
0.16
b
0.205 0.225 0.215
D
0.795 0.825
0.81
E
0.795 0.825
0.81
e
—
—
0.40
All Dimensions in mm
4
X
b
Ø
︵
︶
2
A
A
3
A
E
N
A
L
P
G
N
I
T
A
E
S
Suggested Pad Layout
X
4
D
Ø
U-WLB0808-4
C
Dimensions
C
D
Value
(in mm)
0.40
0.172
C
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
225 of 303
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
W-WLB0808-4
e
D
1
#
n
i
P
W-WLB0808-4
x
4
b
Ø
E
e
︵ ︶
Min
Max
Typ
A
0.550
0.660
0.605
A1
0.180
0.220
0.200
A2
0.355
0.405
0.380
A3
0.020
0.030
0.025
b
0.240
0.280
0.260
b1
0.235
0.245
0.240
D
0.790
0.850
0.820
E
0.790
0.850
0.820
M
B
U
,
x
4
1
b
Ø
Dim
︵ ︶
g
n
i
t
a
o
C
e
d
i
s
k
c
a
B
3
A
︵
︶
2
A
A
e
0.400 BSC
1
A
All Dimensions in mm
e
n
a
l
P
g
n
i
t
a
e
S
Suggested Pad Layout
W-WLB0808-4
x
4
D
Ø
︵ ︶
C
Dimensions
C
D
Value
(in mm)
0.400
0.220
C
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
226 of 303
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
X1-WLB0808-4
x
4
b
Ø
e
E
︵ ︶
1
n
i
P
D
X1-WLB0808-4
Dim
Min
Max
Typ
A
0.3320 0.4180 0.3750
A1 0.1350 0.1650 0.1500
A2 0.1750 0.2250 0.2000
A3 0.0220 0.0280 0.0250
b
0.1971 0.2409 0.2190
D
0.7900 0.8100 0.8000
E
0.7900 0.8100 0.8000
e
0.400 BSC
All Dimensions in mm
e
g
n
i
t
a
o
C
e
d
i
s
k
c
a
B
3
A
︵
︶
A
2
A
1
A
e
n
a
l
P
g
n
i
t
a
e
S
Suggested Pad Layout
x
4
D
Ø
X1-WLB0808-4
︵ ︶
C
Dimensions
C
D
Value
(in mm)
0.4000
0.2190
C
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
227 of 303
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
X2-WLB1006-2
1
A
A
e
n
a
l
P
g
n
i
t
a
e
S
X2-WLB1006-2
Dim Min
Max
Typ
A
0.27 0.35 0.30
A1
00
0.03 0.02
b 0.459 0.559 0.509
D
0.95 1.05 1.000
E
0.55 0.65 0.600
e
0.578
L1 0.194 0.294 0.244
L2 0.369 0.469 0.419
Z1 0.016 0.076 0.046
Z2 0.016 0.076 0.046
All Dimensions in mm
D
2
Z
e
x
2
b
E
︵ ︶
1
Z
2
L
1
L
Suggested Pad Layout
X2-WLB1006-2
2
X
Dimensions
Y
X
X1
X2
Y
Value
(in mm)
0.332
0.507
0.989
0.579
1
X
X
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
228 of 303
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
X3-WLB1006-2
1
A
A
e
n
a
l
P
g
n
i
t
a
e
S
D
R
x
2
b
E
︵ ︶
a
3
L
k
3
L
X3-WLB1006-2
Dim Min
Max
Typ
A
0.25 0.30 0.275
A1 0.00 0.01
b 0.450 0.550 0.500
D
0.95 1.05 1.000
E
0.55 0.65 0.600
k
0.288
L3 0.194 0.294 0.244
L3a 0.350 0.450 0.400
R
0.100
All Dimensions in mm
Suggested Pad Layout
X3-WLB1006-2
2
X
Dimensions
Y
X
X1
X2
Y
Value
(in mm)
0.332
0.507
0.989
0.579
1
X
X
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
229 of 303
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
X3-WLB1006-2(Type B)
1
A
A
e
n
a
l
P
g
n
i
t
a
e
S
D
b
E
a
3
L
3
L
X3-WLB1006-2
(Type B)
Dim
Min
Max
Typ
A
0.250 0.300 0.275
A1
0.00 0.015
b
0.459 0.559 0.509
D
0.95 1.050 1.000
E
0.55
0.65
0.600
L3
0.194 0.294 0.244
L3a
0.369 0.469 0.419
LD
0.909
All Dimensions in mm
D
L
Suggested Pad Layout
X3-WLB1006-2
(Type B)
2
X
Dimensions
Y
X
X1
X2
Y
Value
(in mm)
0.332
0.507
0.989
0.579
1
X
X
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
230 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
U-WLB1010-4
x
4
b
1
2
2
1
1
n
i
P
︵ ︶
A
A
e
E
B
B
D
3
A
A
2
A
1
A
U-WLB1010-4
Dim Min
Max
Typ
A 0.4535 0.5565 0.5050
A1 0.2115 0.2585 0.2350
A2 0.2200 0.2700 0.2450
A3 0.0220 0.0280 0.0250
b 0.2880 0.3520 0.3200
D 1.0300 1.0500 1.0400
e
0.500 BSC
E 1.0300 1.0500 1.0400
All Dimensions in mm
Suggested Pad Layout
U-WLB1010-4
x
4
X
︵ ︶
C
Dimensions
C
X
Value (in mm)
0.500
0.3200
C
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
231 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
U-WLB1010-4 (Type B)
x
4
b
1
2
2
1
1
n
i
P
︵ ︶
A
A
e
E
B
B
D
3
A
A
2
A
1
A
U-WLB1010-4 (Type B)
Dim Min
Max
Typ
A 0.4535 0.5565 0.5050
A1 0.2115 0.2585 0.2350
A2 0.2200 0.2700 0.2450
A3 0.0220 0.0280 0.0250
b 0.2880 0.3520 0.3200
D
1.030
1.050
1.040
e
0.500 BSC
E
1.030
1.050
1.040
All Dimensions in mm
Suggested Pad Layout
U-WLB1010-4 (Type B)
x
4
X
︵ ︶
C
Dimensions
C
X
Value
(in mm)
0.500
0.3200
C
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
232 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
X2-WLB1406-2
1
A
A
e
n
a
l
P
g
n
i
t
a
e
S
X2-WLB1406-2
Dim
Min
Max
Typ
A
0.27
0.35
0.30
A1
00
0.03
0.02
b
0.459 0.559 0.509
D
1.35
1.45
1.40
E
0.55
0.65
0.60
e
0.812
L1
0.194 0.294 0.244
L2
0.700 0.800 0.750
Z1
0.016 0.076 0.046
Z2
0.016 0.076 0.046
All Dimensions in mm
2
Z
D
e
x
2
b
E
︵ ︶
1
Z
2
L
1
L
Suggested Pad Layout
X2-WLB1406-2
2
X
Dimensions
Y
X
X1
X2
Y
Value
(in mm)
0.334
0.840
1.386
0.589
1
X
X
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
233 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
X3-WLB1406-2
1
A
A
e
n
a
l
P
g
n
i
t
a
e
S
D
0
0
1
=
R
b
E
1
b
2
L
k
1
L
X3-WLB1406-2
Dim
Min
Max
Typ
A
0.250 0.300 0.275
A1
0.000 0.015
b
0.45 0.55
b1
0.45 0.55
D
1.37 1.43 1.40
E
0.57 0.63 0.60
k
0.30
L1
0.20 0.26
L2
0.70 0.80
All Dimensions in mm
Suggested Pad Layout
X3-WLB1406-2
2
X
Dimensions
Y
1
X
X
X
X1
X2
Y
Value
(in mm)
0.304
0.840
1.352
0.580
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
234 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
X3-WLB1408-2
1
A
A
e
n
a
l
P
g
n
i
t
a
e
S
D
2
Z
e
0
e0
d1
o.
h0
t
R
a
C
1h
#c
no
t
i
P
N
︵
︶
x
2
b
E
︵ ︶
1
Z
1
L
L
X3-WLB1408-2
Dim Min Max
Typ
A
0.25 0.30 0.275
A1
0.01
b 0.659 0.759 0.709
D
1.35 1.45
1.40
E
0.75 0.85
0.80
e
0.855
L 0.194 0.294 0.244
L1 0.615 0.715 0.665
Z1 0.16 0.076 0.046
Z2 0.16 0.076 0.046
All Dimensions in mm
Anode
Cathode
Suggested Pad Layout
2
X
X3-WLB1408-2
Dimensions
Y
X
X1
X2
Y
Value
(in mm)
0.334
0.755
1.386
0.789
1
X
X
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
235 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
U-WLB1510-6
Øb (x6)
D
U-WLB1510-6
Dim Min Max
Typ
D
0.90 1.00 1.00
E
1.40 1.50 1.50
A
0.62


A2
0.38


b
0.27 0.37 0.32
e
0.50


All Dimensions in mm
e
E
e
e
A2
A
Seating Plane
Suggested Pad Layout
U-WLB1510-6
D
Dimensions
C1
C
C1
D
C
Value
(in mm)
0.50
1.00
0.25
C
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
236 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
U-WLB1515-9
D
6X-Ø b
PIN ID
e
U-WLB1515-9
Dim Min
Max
Typ
A
0.62
A2
0.36
0.36
A3 0.020 0.030 0.025
b
0.27
0.37
0.32
D
1.47
1.51
1.49
E
1.47
1.51
1.49
e
0.50
All Dimensions in mm
E
e
e
A3
A2
e
A
SEATING PLANE
Suggested Pad Layout
U-WLB1515-9
D
C1
Dimensions
Value
(in mm)
C
C1
C2
D
0.50
1.00
1.00
0.25
C
C
C2
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
237 of 303
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
X3-WLB1608-2
1
A
A
X3-WLB1608-2
e
n
a
l
P
g
n
i
t
a
e
S
Dim
A
Min
Max
Typ
0.250 0.300 0.275
D
0
1
.
0
=
R
E
b
1
b
A1
-
0.015
-
b
-
-
0.600
b1
-
-
0.600
D
1.57
1.63
1.60
E
0.77
0.83
0.80
K
-
-
0.282
L1
0.25
0.35
0.30
L2
0.90
1.00
0.95
2
L
1
L
All Dimensions in mm
K
Suggested Pad Layout
X3-WLB1608-2
2
X
Dimensions
Y
X
X1
X2
Y
Value
(in mm)
0.385
1.035
1.622
0.690
1
X
X
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
238 of 303
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
X2-WLB1608-3
1
A
A
X2-WLB1608-3
e
n
a
l
P
g
n
i
t
a
e
S
Dim
Min
Max
Typ
A

0.310

2
/
L
︵
X
2
1
Z
D L
A1
︶
K
1
b
E
X
2
b
︵
︶
0.015 0.025 0.020
b
0.190 0.250 0.220
b1
0.570 0.630 0.600
D
1.570 1.630 1.600
E
0.770 0.830 0.800
L
1.384 1.484 1.434
L2
0.784 0.844 0.814
L3
0.280 0.340 0.310
2
L
3
L
K
0.10
0.22
0.16
Z1
0.07
0.13
0.10
All Dimensions in mm
Suggested Pad Layout
X2-WLB1608-3
2
X
Dimensions
Y
X
X1
X2
Y3
Value
(in mm)
0.410
0.914
1.534
0.700
1
X
X
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
239 of 303
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
U-WLB1818-4
e
D
D
I
N
I
P
1
2
B
A
U-WLB1818-4
Dim
Min Max
Typ
A
0.62


A2
0.36


b
0.30


D
1.75 1.80
1.79
E
1.75 1.80
1.79
e
0.65


All Dimensions in mm
e
E
A
B
b
Ø
X
6
1
A
2
A
1
2
A
G
NE
I
T
N
AA
EL
SP
Suggested Pad Layout
U-WLB1818-4
1
C
x
4
D
︵ ︶
2
A
C
Dimensions
B
C
D
Value
(in mm)
0.65
0.30
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
240 of 303
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
e
D
b
Ø
x
4
X1-WLB1818-4
︵ ︶
X1-WLB1818-4
B
B
Dim
e
E
A
A
1
#
N
I
P
1
2
2
1
Max
Typ
0.3420 0.4080 0.3750
A1
0.1350 0.1650 0.1500
A2
0.1850 0.2150 0.2000
A3
0.0220 0.0280 0.0250
g
n
i
t
a
o
C
e
d
i
s
k
c
a
B
3
A
2
A
︵
Min
A
︶
A
e
n
a
l
P
g
n
i
t
a
e
S
b
0.2700 0.3300 0.3000
D
1.7800 1.8000 1.7900
E
1.7800 1.8000 1.7900
e
0.650 BSC
1
A
All Dimensions in mm
Suggested Pad Layout
X1-WLB1818-4
1
C
x
4
D
︵ ︶
2
A
C
Dimensions
B
C
D
Value
(in mm)
0.65
0.30
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
241 of 303
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
X2-WLB2010-2
1
A
e
n
a
l
P
g
n
i
t
a
e
S
A
D
e
d
o
h
t
a
C
k
0
0
1
.
0
R
h
c
t
o
N
X2-WLB2010-2
Dim Min
Max Typ
A
0.305 0.290

A1
0.02 0.011

b
0.48


D
1.950 2.050 2.000
E
0.950 1.050 1.000
k
0.972


L
0.932


All Dimensions in mm
L
E
x
2
b
︵ ︶
Suggested Pad Layout
X2-WLB2010-2
X
Y
1
G X
Dimensions
G
X
X1
Y
Value (in mm)
0.872
0.580
2.032
1.032
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
242 of 303
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
D
I
N
I
P
1
e
D
X2-WLB2718-6
2
C
A
e
X2-WLB2718-6
Dim
Min
Max
Typ
A
0.40
0.35

A1
0.15


A2
0.20


b
0.25
0.35
0.30
D
1.75
1.80
1.79
E
2.65
2.70
2.69
e
0.65


All Dimensions in mm
B
E
B
A
C
1
A
2
A
1
2
A
G
NE
I
T
N
AA
EL
SP
Suggested Pad Layout
X2-WLB2718-6
x
6
D
︵ ︶
1
2
A
C
C
C
D
C
B
Dimensions
Value
(in mm)
0.65
0.30
C
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
243 of 303
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
D
X4-WLCUP0505-3
1
A
E
A
X4-WLCUP0505-3
Dim
Min
Max
Typ
A
0.22
0.20

A1
0.006 0.001 0.008
b
0.12 0.18
0.15
D
0.54


E
0.54


K
0.20


L
0.47 0.53
0.50
L1
0.12 0.18
0.15
L2
0.12 0.18
0.15
All Dimensions in mm
E
N
A
L
P
G
N
I
T
A
E
S
1
L
K
L
2
L
b
b
K
Suggested Pad Layout
X4-WLCUP0505-3
1
X
Y
Dimensions
1
Y
X
X1
Y
Y1
Y
Value
(in mm)
0.17
0.54
0.17
0.54
X
X
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
244 of 303
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
X2-WLCUP2010-2
1
A
e
n
a
l
P
g
n
i
t
a
e
S
A
D
e
d
o
h
t
a
C
k
0
0
1
.
0
R
h
c
t
o
N
X2-WLCUP2010-2
Dim
Min
Max
Typ
A
0.305 0.290

A1
0.02 0.011

b
0.48


D
1.950 2.050 2.000
E
0.950 1.050 1.000
k
0.972


L
0.932


All Dimensions in mm
L
E
x
2
b
︵ ︶
Suggested Pad Layout
X2-WLCUP2010-2
X
Y
Dimensions
G
X
X1
Y
1
G X
Value (in mm)
0.872
0.580
2.032
1.032
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
245 of 303
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
X4-WLCUS0603-2
A1
A
X4-WLCUS0603-2
Dim
Min
Max Typ
A
0.20
A1
0.006 0.01 0.008
b
0.19
0.29 0.24
D
0.595 0.645 0.62
E
0.295 0.345 0.32
e
0.355
L
0.14
0.24 0.19
All Dimensions in mm
D
e
E
b (2X)
L (2x)
Suggested Pad Layout
X4-WLCUS0603-2
1
X
X
Y
Dimensions
C
X
X1
Y
Value (in mm)
0.380
0.230
0.610
0.300
C
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
246 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
b
D
X3-WLCUS0603-3
e
d
o
h
t
a
C
X
3
L
︵
︶
X3-WLCUS0603-3
e
1
e
E
e
dt
oo
hD
t
a
C
e
d
o
n
A
X
2
1
b
︵
︶
Dim
Min
Max
Typ

A
0.24
0.30
A1
0.00
0.01

b
0.23
0.29
0.26
b1
0.075
0.135
0.105
D
0.290
0.300
0.295
E
0.590
0.600
0.595
A
1
A
e
n
a
l
P
g
n
i
t
a
e
S
e


0.40
e1


0.155
L
0.13
0.19
0.16
All Dimensions in mm
Suggested Pad Layout
X3-WLCUS0603-3
Y
1
Y
Dimensions
X
Y
Y1
Y
Value (in mm)
0.30
0.21
0.60
X
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
A
1
A
X4-WLCUS1006-2
e
n
a
l
P
g
n
i
t
a
e
S
Z
D e
x
2
b
R
E
︵ ︶
X4-WLCUS1006-2
Dim
Min
Max
Typ
A
0.18 0.22
0.20
A1
0.006 0.01 0.008
b
0.48 0.58
0.53
D
0.95 1.075 1.00
E
0.55 0.675 0.60
e
0.40
L
0.23 0.33
0.28
R
0.05 0.15
0.10
Z
0.02 0.08
0.05
All Dimensions in mm
e
dx
o2
h
t
a
CL
e
d
o
n
A
︵ ︶
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
248 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
X4-WLCUS1406-2
1
A
A
e
n
a
l
P
g
n
i
t
a
e
S
D
X4-WLCUS1406-2
Dim
Min
Max
Typ
A
0.17
0.25 0.20
A1
0.006 0.01 0.008
b
0.459 0.559 0.509
D
1.35
1.45 1.40
E
0.550 0.650 0.600
e
0.812
L1
0.194 0.294 0.244
L2
0.700 0.800 0.750
Z1
0.016 0.076 0.046
Z2
0.016 0.076 0.046
All Dimensions in mm
2
Z
e
e0
0
d1
o.
h0
t
a
CR
1h
#c
no
t
i
P
N
︵
︶
x
2
b
E
︵ ︶
1
Z
e
d
o
h
t
a
C
e
d
2 o
L n
A
1
L
Suggested Pad Layout
X4-WLCUS1406-2
2
X
Dimensions
Y
X
X1
X2
Y
Value
(in mm)
0.334
0.840
1.386
0.589
1
X
X
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
249 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
X4-WLCUS1408-2
1
A
A
e
n
a
l
P
g
n
i
t
a
e
S
2
Z
D
e
e0
d0
o1
.
h0
t
a
CR
1h
#c
no
t
i
P
N
︵
X4-WLCUS1408-2
Dim Min Max Typ
A
0.17 0.25 0.20
A1 0.006 0.01 0.008
b
0.659 0.759 0.709
D
1.35 1.45 1.40
E
0.75 0.85 0.80
e
0.855
L1 0.194 0.294 0.244
L2 0.615 0.715 0.665
Z1 0.016 0.076 0.046
Z2 0.016 0.076 0.046
All Dimensions in mm
︶
x
2
b
E
︵ ︶
1
Z
e
d
2 o
L n
A
1
L
e
d
o
h
t
a
C
Suggested Pad Layout
X4-WLCUS1408-2
Y
Dimensions
1
X
X
X
X1
X2
Y
Value
(in mm)
0.334
0.755
1.386
0.789
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
AXIAL / THROUGH-HOLE PACKAGES
Package Outline Dimensions
A-405
Dim
A
B
C
D
A-405
Min
25.40
4.10
0.53
2.00
All Dimensions in mm
Max

5.20
0.64
2.70
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
251 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
DO-35
Dim
A
B
C
D
DO-35
Min
25.40
All Dimensions in mm
Max
-
4.00
0.60
2.00
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
252 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
DO-41 Plastic
Dim
A
B
C
D
DO-41 Plastic
Min
Max
25.40
-
4.06
5.21
0.71
0.864
2.00
2.72
All Dimensions in mm
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
253 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
DO-41 Glass
Dim
A
B
C
D
DO-41 Glass
Min
Max
25.40
-
4.70
0.863
2.71
All Dimensions in mm
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
254 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
DO-15
Dim
A
B
C
D
DO-15
Min
Max
25.40
-
5.50
7.62
0.686
0.889
2.60
3.60
All Dimensions in mm
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
255 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
DO-201
Dim
A
B
C
D
DO-201
Min
25.40
8.50
0.96
4.80
All Dimensions in mm
Max
-
9.53
1.06
5.21
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
256 of 303
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
DO-201AD
Dim
A
B
C
D
DO-201AD
Min
25.40
7.20
1.20
4.80
All Dimensions in mm
Max
-
9.50
1.30
5.30
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
257 of 303
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
R-6
Dim
A
B
C
D
R-6
Min
25.40
8.60
1.20
8.60
All Dimensions in mm
Max
-
9.10
1.30
9.10
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
258 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
T-1
Dim
A
B
C
D
T-1
Min
25.40
2.60
0.53
2.20
All Dimensions in mm
Max
-
3.20
0.64
2.60
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
259 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
DF-M
C
B
A
E
H
D
J
G
L
DF-M
Dim
Min
Max
A
7.40
7.90
B
6.20
6.50
C
0.22
0.30
D
1.27
2.03
E
7.60
8.90
G
3.81
4.69
H
8.13
8.51
J
2.40
3.40
K
5.00
5.20
L
0.46
0.58
All Dimensions in mm
K
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
E-Line
D
A
D
EJECTION MARK
E
E
F
L1
L
L*
b
SEATING PLANE
e
e2
e
BULK
e2
AMMO
E-Line
Dim Min
Max
Typ
A
2.16 2.41

b
0.41 0.495

b1
0.41 0.495

D
4.37 4.77

E
3.61 4.01

e
1.27


e2
2.54


F
2.50


L
13.00 13.97

L1
2.50 3.50

All Dimensions in mm
b1
R 1.14 (.045)
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
261 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
GBJ
GBJ
Dim
Min
Max
A
29.70
30.30
B
19.70
20.30
C
17.00
18.00
D
3.80
4.20
E
7.30
7.70
G
9.80
10.20
H
2.00
2.40
I
0.90
1.10
J
2.30
2.70
K
3.0 X 45
L
4.40
4.80
M
3.40
3.80
N
3.10
3.40
P
2.50
2.90
R
0.60
0.80
S
10.80
11.20
All Dimensions in mm
L
A
K
M
B
S
_
J
P
D
H
N
C
R
I
G
E
E
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
262 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
GBPC
H
E
F
A
C
H
(AC)
(+)
J
GBPC
Min
Max
28.30
28.80
7.40
8.00
16.10
17.10
18.80
21.30
13.80
14.80
Hole for #10 screw
H
5.08
5.59
J
17.60
18.60
F
6.30
6.50
All Dimensions in mm
Dim
A
B
C
E
G
B
C
A
(AC)
(-)
G
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
263 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
GBPC-W
H
GBPC-W
Min
Max
28.30
28.80
7.40
8.00
Hole for #10 screw
H
5.08
5.59
J
17.60
18.60
K
10.90
11.90
L
0.97
1.07
M
31.80
All Dimensions in mm
Dim
A
B
B
M
L
A
H
J
(AC)
( +)
J
K
(-)
A
(AC)
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
GBU
A
B
K
M
C
L
O
-
~ ~ +
D
E
F
J
N
G
P
H
GBU
Dim
Min
Max
A
21.8
22.3
B
3.5
4.1
C
7.4
7.9
D
1.65
2.16
E
2.25
2.75
F
1.95
2.35
G
1.02
1.27
H
4.83
5.33
J
17.5
18.0
K
3.2 X 45
L
18.3
18.8
M
3.30
3.56
N
0.46
0.56
O
1.90R
P
0.76
1.0
All Dimensions in mm
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
ITO220AB
A
1
A
P
Ø
°
5
E
°
0
5
°
5
3
B
°
5
Q
°
5
D
B
1
L
1
D
°
5
°
5
x
3
1
b
2
A
L
x
3
b
e
e
c
°
5
°
3
ITO220AB
Dim Min Typ Max
A
4.50 4.70 4.90
A1 3.04 3.24 3.44
A2 2.56 2.76 2.96
b
0.50 0.60 0.75
b1 1.10 1.20 1.35
c
0.50 0.60 0.70
D 15.67 15.87 16.07
D1 8.99 9.19 9.39
e
2.54
E
9.91 10.11 10.31
L
9.45 9.75 10.05
L1 15.80 16.00 16.20
P
2.98 3.18 3.38
Q
3.10 3.30 3.50
All Dimensions in mm
°
5
P
Ø
°
5
°
5
SECTION B-B
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
266 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
ITO220AB
A
ØP
E
Q
A1
D
L1
D1
A2
b1
L
e
b
ITO220AB
Dim
Min
Max
A
4.36
4.77
A1
2.54
3.10
A2
2.54
2.80
b
0.55
0.75
b1
1.20
1.50
c
0.38
0.68
D
14.50
15.50
D1
8.38
8.89
e
2.41
2.67
E
9.72
10.27
L
9.87
10.67
L1
15.8
17.00
P
3.08
3.39
Q
2.60
3.00
All Dimensions in mm
c
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
ITO220AB (TO220F-3)
D
3
A
X
Y
ITO220AB (TO220F-3)
1
Y
E
A
ø
2
b
2
A
1
b
Dim
A
A2
A3
b
b1
b2
c
D
E
e
L
Min
4.300
2.520
2.350
0.550
1.000
1.100
0.450
9.70
14.70
12.50
Max Typ
4.900
2.920
2.900
0.900
1.400
1.500
0.600
10.30
16.00
2.54
13.50
-
1
L
L
L1
2.790 4.500
X
6.90
7.10
Y
3.000 3.400
Y1
3.370 3.900
ø
3.000 3.550
All Dimensions in mm
b
e
e
c
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
ITO220S
A
E
Q
A1
+
7 Ref
H1
+
ØP
D
Ø1.5
Dp 0.1 max
D1
D2
1.7 Ref
5 Ref
E1
5 Ref
A2
L1
b2
L
e
5 Ref
b
c
e1
5 Ref
ITO220S
Dim
Min
Max
Typ
A
4.52
4.62
4.57
A1
1.17
1.39
A2
2.57
2.77
2.67
b
0.72
0.95
0.84
b2
1.15
1.34
1.26
c
0.356 0.61
D
14.22 16.51 15.00
D1
8.60
8.80
8.70
D2
13.68 14.08
e
2.49
2.59
2.54
e1
4.98
5.18
5.08
E
10.01 10.21 10.11
E1
6.86
8.89
H1
5.85
6.85
L
13.30 13.90 13.60
L1
4.00
P
3.54
4.08
Q
2.54
3.42
All Dimensions in mm
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
ITO220AC-S
A
E/2
A1
ØP
Q
7°
Re
f
E
H1
D2
D
E1
5°
Re
f
D1
1.7 Ref
L1
L
5°Ref
A2
L2
Ø1.5 x Dp 0.1 max
3xb2
2xe
2xb
c
e1
ITO220AC-S
Dim
Min
Max Typ
A
4.52 4.62 4.57
A1
0.51 1.39
-A2
2.57 2.77 2.67
b
0.72 0.95 0.84
b2
1.15 1.34 1.26
c
0.356 0.61
-D
14.22 16.51 15.00
D1
8.60 8.80 8.70
D2
13.68 14.08
-e
2.49 2.59 2.54
e1
4.98 5.18 5.08
E
10.01 10.21 10.11
E1
6.86 8.89
-H1
5.85 6.85
-L
13.30 13.90 13.60
L1
-4.00
-L2
0.70 1.30 1.00
P
3.54 4.08
-Q
2.54 3.42
-All Dimensions in mm
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
KBJ
P
N
A
O
B
H
C
_
K
L
J
E
D
G
R
M
KBJ
Dim
Min
Max
A
24.80
25.20
B
14.70
15.30
C
3.90
4.10
D
17.20
17.80
E
0.90
1.10
G
7.30
7.70
H
3.10
3.40
J
3.30
3.70
K
1.50
1.90
L
9.30
9.70
M
2.50
2.90
N
3.40
3.80
O
3.0 x 45
P
4.40
4.80
R
0.60
0.80
All Dimensions in mm
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
KBP
KBP
Dim
Min
Max
A
14.25 14.75
B
10.20 10.60
C
1.80
2.20
D
14.25 14.73
E
3.56
4.06
G
0.76
0.86
H
1.17
1.42
J
2.8 X 45
K
0.80
1.10
L
3.35
3.65
M
3 Typ
N
2 Typ
P
0.30
0.64
All Dimensions in mm
L
A
K
J
M
_
+
B
N
C
H
D
G
P
E
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
MB
H
MB
Min
Max
28.40
28.70
10.97
11.23
15.50
17.60
22.86
25.40
13.30
15.30
Hole for #10 screw
H
4.85
5.59
J
17.10
19.10
K
10.40
12.40
L 0.97 Typ 1.07
M
30.50
N
10.97
11.23
All Dimensions in mm
Dim
A
B
C
E
G
B
E
A
C
H
(AC)
(+)
J
C
A
(AC)
(-)
G
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
MB-W
H
MB-W
Min
Max
28.40
28.70
10.97
11.23
15.50
17.60
22.86
25.40
13.30
15.30
Hole for #10 screw
H
4.85
5.59
J
17.10
19.10
K
10.40
12.40
L 0.97 Typ 1.07
M
30.50
N
10.97
11.23
All Dimensions in mm
Dim
A
B
C
E
G
N
M
L
A
H
J
(AC)
(+)
J
K
(-)
A
(AC)
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
PBPC-3 / PBPC-6
H
+
G
PBPC-3 / PBPC-6
Dim
Min
Max
A
14.73
15.75
B
5.84
6.86
C
19.00
-
D
0.76 Typ
E
1.70
3.20
Hole for #6
screw
G
3.60 4.00
H
10.30
11.30
All Dimensions in mm
AC
A
-
AC
E
E
D
C
B
A
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
PBPC-8
H
J
+
G
PBPC-8
Dim
Min
Max
A
18.54
19.56
B
6.35
7.60
C
22.20
-
D
1.27 Typ
E
5.33
7.37
G
3.60
4.00
H
12.70 Typ
J
2.38 X 45 Typ
All Dimensions in mm
AC
A
-
AC
E
E
D
C
B
A
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
PBU
PBU
Dim
Min
Max
A
22.70 23.70
B
3.80
4.10
C
4.20
4.70
D
1.70
2.20
E
10.30 11.30
G
4.50
6.80
H
4.80
5.80
J
25.40
-
K
-
19.30
L
16.80 17.80
M
6.60
7.10
N
4.70
5.20
P
1.20
1.30
All Dimensions in mm
A
C
M
B
D
K
L
-
E
~ ~ +
N
J
G
P
H
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
PDIP-8
A
PDIP-8
Dim
Min
Max
A
9.02
9.53
B
6.15
6.35
C
3.10
3.50
D
0.36
0.56
F
1.40
1.65
G
2.54 typ.
H
0.71
0.97
J
0.20
0.36
K
2.92
3.81
L
7.62
8.26
M
-
15°
N
0.38 (min)
All Dimensions in mm
B
L
G
M
C
N
K
H
J
D
F
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
PDIP-14
E
c
2
A
A
1
A
L
2
E
e
B
1
B
D
1
E
PDIP-14
Dim
Min
Max
A
3.710
4.310
A1
0.510
A2
3.200
3.600
B
0.380
0.570
B1
1.524 (BSC)
c
0.204
0.360
D
18.800
19.200
E
6.200
6.600
E1
7.320
7.920
E2
8.400
9.000
e
2.540 (BSC)
L
3.000
3.600
All Dimensions in mm
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
SIP-3 (Ammo Pack)
EF
N
D
C
A
G
a1
a2
B
P
SIP-3
(Ammo Pack)
Dim
Min
Max
A
3.9
4.3
a1
45 Typ
a2
3 Typ
B
2.8
3.2
C
1.40
1.60
D
0.35
0.41
E
0.43
0.48
F
0
0.2
G
2.4
2.9
N
0.63
0.84
P
1.55
All Dimensions in mm
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
SIP-3 (Bulk Pack)
L
a1
J
a2
B
P
N
D
C
a3
A
E
F
G H
a4
SIP-3
(Bulk Pack)
Dim
Min
Max
A
3.9
4.3
a1
5 Typ
a2
5 Typ
a3
45 Typ
a4
3 Typ
B
2.8
3.2
C
1.40
1.60
D
0.33
0.432
E
0.40
0.508
F
0
0.2
G
1.24
1.30
H
2.51
2.57
J
0.35
0.43
L
14.0
15.0
N
0.63
0.84
P
1.55
All Dimensions in mm
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
SIP-4
x
2
1
a
L
︵ ︶
c
A
S
x
2
2
a
x
2
°
5
4
x
3
.
0
︵
︶
︵ ︶
1
b
2
b
E
x
2
4
a
x
2
3
a
D
J
1
e
︵ ︶
︵ ︶
F
1
L
SIP-4
Dim
Min
Max
Typ
A
1.45
1.65
1.55
b1
0.38
0.44
0.40
b2
0.48
c
0.35
0.45
0.40
D
5.12
5.32
5.22
e1
1.24
1.30
1.27
E
3.55
3.75
3.65
F
0.00
0.20
J
4.10
4.30
4.20
L
14.00 14.60 14.30
L1
1.32
1.52
1.42
S
0.63
0.83
0.73
a1
5°
3°
a2
4°
7°
5°
a3
4°
7°
5°
a4
5°
3°
All Dimensions in mm
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
SIP-5
K
C
a1
E
I
a2
H
L
D
45°
A
B
F
45°
J
SIP-5
Dim
Min
Max
A
5.12
5.32
B
4.10
4.30
C
3.55
3.75
D
0.38
0.44
E
0.35
0.41
F
0.92
0.98
H
1.32
1.52
I
1.45
1.65
J
0.00
0.2
K
13.00
15.5
L
0.63
0.83
a1
3°
5°
a2
5°
7°
All Dimensions in mm
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
A
TO126
a
2
E
2
D
2
A
D
R1
TO126
h
Y
b
2
E
E
2
b
ø
R
1
L
b
Dim
A
A2
b
b2
c
D
D2
E
E2a
E2b
e
e1
Min
2.400
1.060
0.660
1.170
0.400
7.400
5.010
10.60
2.850
4.850
-
Max
2.900
1.500
0.860
1.470
0.600
8.200
5.310
11.20
3.150
5.150
-
Typ
2.280
4.560
L
h
0.00
0.30
-
L
14.50
15.90
-
c
e
L1
1.700 2.100
R
1.840
R1
0.760
Y
3.600 3.900
Ø
3.100 3.550
All Dimensions in mm
1
e
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
TO220-3
A
E
Q
F
SEATING PLANE
ØP
D1
D
L1
L
b1
e
b
C
J1
e1
TO220-3
Dim
Min
Max
A
3.55
4.85
b
0.51
1.14
b1
1.14
1.78
C
0.31
1.14
D
14.20 16.50
D1
5.84
6.86
E
9.70
10.70
e
2.79
2.99
e1
4.83
5.33
F
0.51
1.40
J1
2.03
2.92
L
12.72 14.72
L1
3.66
6.35
P
3.53
4.09
Q
2.54
3.43
All Dimensions in mm
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
TO220-5
A
E
F
SEATING PLANE
ØP
Q
D1
D
L1
L
b1
b
e
C
J1
e1
TO220-5
Dim
Min
Max
A
3.55
4.85
b
0.51
1.14
b1
1.14
1.78
C
0.31
1.14
D
14.20
16.50
D1
5.84
6.86
E
9.78
10.54
e
1.6
1.8
e1
6.6
7.0
F
0.51
1.40
J1
2.03
2.92
L
12.72
14.72
L1
3.66
6.35
P
3.53
4.09
Q
2.54
3.43
All Dimensions in mm
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
TO220-5(R)
A
ØP
E
A1
Q
H1
D
D1
L1
H2
H3
A2
L
e
b
c
A3
A4
TO220-5(R)
Dim Min Typ Max
A
4.37 4.57 4.77
A1
1.12 1.27 1.40
A2
2.45 2.65 2.85
A3
4.10 4.40 4.70
A4
7.95 8.25 8.55
b
0.64 0.79 0.94
c
0.35 0.38 0.55
D
14.80 15.00 15.20
D1
8.50 8.70 8.90
e
1.70
E
9.96 10.16 10.36
H1
6.10 6.30 6.50
H2 21.32 22.12 22.92
H3 24.15 24.95 25.75
L
6.30
L1 13.10 13.50 13.90
P
3.64 3.84 4.04
Q
2.55 2.75 2.95
All Dimensions in mm
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
TO220AB
A
E
1
A
P
2 Ø
/
E
Q
1
H
1
H
2
D
D
1
E
2
L
1
D
1
L
2
A
2
b
L
c
b
e
1
e
TO220AB
Dim Min Max
Typ
A
3.56 4.82
A1 0.51 1.39
A2 2.04 2.92
b
0.39 1.01
0.81
b2 1.15 1.77
1.24
c 0.356 0.61
D 14.22 16.51
D1 8.39 9.01
D2 11.45 12.87
e
2.54
e1
5.08
E
9.66 10.66
E1 6.86 8.89
H1 5.85 6.85
L 12.70 14.73
L1
6.35
L2 15.80 16.20 16.00
P
3.54 4.08
Q
2.54 3.42
All Dimensions in mm
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
3
A
0
7
.
1
0
6
.
D 0
TO220AB(Type C)
0
3
.
1
1
H
Y
°
3
ø
A
E
°
3
°
3
1
b
2
A
L
Dim
A
A2
A3
b
b1
c
D
E
e
H1
L
TO220AB
Type C
Min
Max
0.700 0.900
0.400 0.600
9.800 10.20
9.00
9.40
6.30
6.70
12.60 13.60
Typ
4.500
2.400
1.300
1.270
2.54
-
1
L
b
L1
9.60
10.60
-
Y
-
-
11.10
e
Ø
c
e
3.560 3.640
All Dimensions in mm
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
A
TO220AC
E
1
A
1
H
P
Q
D
2
L
1
L
2
b
L
c
b
2
A
1
e
TO220AC
Dim
Min
Typ
Max
A
4.40
4.82
A1
1.1
1.40
A2
2.05
2.92
b
0.72
1.00
b2
1.16
1.45
c
0.36
0.68
D
14.70
15.87
e1
5.08
E
9.80
10.26
H1
5.80
6.40
L
12.70
13.96
L1
3.56
4.50
P
3.70
3.90
Q
2.54
3.30
All Dimensions in mm
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
TO220AC (13.7mm Min Lead Length)
A
2
c
D
P
Q
TO220AC
(13.7mm Min Lead Length)
1
E
E
2
L
0
5
.
1
O
1
A
1
L
2
b
L
b
Dim
Min
Max
Typ
A
4.470 4.670
A1
2.520 2.820
b
0.710 0.910
0.813
b2
1.170 1.370
1.270
c
0.279 0.483
c2
1.170 1.370
D
10.010 10.310
E
8.763 9.017
8.890
E1
12.294 12.548 12.446
e
2.54BSC
e1
4.980 5.180
L
13.700 14.100
L1
4.04
4.19
4.11
L2
1.60
ØP
3.790 3.890
Q
2.642 2.946
2.743
All Dimensions in mm
e
c
1
e
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
TO247
A
H
B
J
S
C
K
P
Q
L
G
D
N
E
M
M
TO247
Dim
Min
Max
A
1.9
2.1
B
4.85
5.15
C
20.3
21.75
D
19.60
20.1
E
2.2
2.6
G
0.51
0.76
H
15.45
16.25
J
1.93
2.18
K
2.9
3.2
L
3.78
4.38
M
5.2
5.7
N
1.0
1.4
P
1.8
2.2
Q
2.8
3.2
S
4.4 Typ
All Dimensions in mm
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
TO251
A
D
2
n
o
i
t
p
O
3
A
2
D
2
E
TO251
°
5
4
E
3
n
o
i
t
p
O
L
b
Dim
A
A2
A3
b
c
D
D2
E
E2
e
e1
L
Min
2.200
0.890
0.450
0.550
0.450
6.400
5.200
5.950
0.900
2.240
4.430
8.900
Max
2.400
1.150
0.550
0.740
0.570
6.750
5.400
6.250
1.250
2.340
4.730
9.500
c
e
All Dimensions in mm
2
A
1
e
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
TO262
L1
E
A
c2
TO262
Dim Min
Max
Typ
A
4.06
4.83
4.57
A2
2.03
2.79
2.67
b
0.64
0.99
b2
1.14
1.40
1.24
c
0.356 0.74
c2
1.14
1.40
1.27
D
8.64
9.65
8.70
E
9.65 10.29 10.11
e
2.54 Typ
L
12.70 14.73 13.60
L1
1.67
L2
-
4.00
All Dimensions in mm
D
L2
A2
L
b2
c
b
e
Suggested Pad Layout
TO262
Z
C
E1
X2
X1
Y1
Y2
Dimensions
Z
X1
X2
Y1
Y2
C
E1
Value (in mm)
16.9
1.1
10.8
3.5
11.4
9.5
2.5
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
TO3P
A
B
H
J
S
C
K
R
P
Q
L
G
D
N
E
M
M
TO-3P
Dim
Min
Max
A
1.88
2.08
B
4.68
5.36
C
20.63
22.38
D
18.5
21.5
E
2.10
2.40
G
0.51
0.76
H
15.38
16.25
J
1.90
2.70
K
2.90
3.65
L
3.78
4.50
M
5.20
5.70
N
0.89
1.53
P
1.82
2.46
Q
2.92
3.23
R
11.70
12.84
S
6.10
All Dimensions in mm
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
TO92
A
D
K
R
A
M
N
O
I
T
C
E
J
E
K
R
A
M
N
O
I
T
C
E
J
E
E
E
1
b
2
L
3
L
1
L
L
b
2
e
c
e
2
e
e
O
M
M
A
K
L
U
B
1
D
2
A
TO92
Dim
Min
Max
Typ
A
3.45
3.66
A2
1.22
1.37
b
0.38
c
0.38
D
4.27
4.78
D1
3.87
E
4.32
4.83
e
1.27
e2
2.40
2.90
L
12.98 15.00
L1
12.80 15.00
L2
0.80
L3
2.00
3.00
All Dimensions in mm
h
ø
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
A
D
TO92 (Type B)
K
R
A
M
N
O
I
T
C
E
J
E
K
R
A
M
N
O
I
T
C
E
J
E
E
E
1
b
2
L
3
L
1
L
L
b
2
e
c
e
2
e
e
O
M
M
A
K
L
U
B
1
D
TO92 Type B
Dim
Min
Max
Typ
A
3.30
3.70
A2
1.00
1.40
b
0.38
0.55
b1
0.36
0.76
c
0.32
0.51
D
4.40
4.80
D1
3.430
E
4.30
4.70
e
1.27
e2
2.54
h
0.00
0.38
L
12.50 15.50
L1
12.50 14.50
L3
2.50
4.00
ø
1.60
All Dimensions in mm
2
A
h
ø
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
A
D
TO92 (Type C)
K
R
A
M
N
O
I
T
C
E
J
E
K
R
A
M
N
O
I
T
C
E
J
E
E
E
1
b
2
L
3
L
1
L
L
b
2
e
c
e
2
e
e
O
M
M
A
K
L
U
B
1
D
TO92 Type C
Dim
Min
Max
Typ
A
3.30
3.70
A2
1.10
1.40
b
0.38
0.55
c
0.36
0.51
D
4.40
4.70
D1
3.430
E
4.30
4.70
e
1.27
e2
2.440 2.640
h
0.00
0.38
L
14.10 14.50
L1
12.50 14.50
L3
2.50
3.50
ø
1.60
All Dimensions in mm
2
A
h
ø
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
D
TO92L
k
r
a
M
n
o
i
t
c
e
j
E
O
h
k
r
a
M
n
o
i
t
c
e
j
E
c
A
E
1
A
1
b
1
D
1
L
L
b
TO92L
Dim
Min
Max
A
3.70
4.10
A1
1.28
1.58
b
0.35
0.55
b1
0.60
0.80
c
0.35
0.45
D
4.70
5.10
D1
4.00
e1
2.30
2.70
E
7.80
8.20
L
10.10 10.70
L1
13.80 14.20
h
0.00
0.30
θ
1.60
All Dimensions in mm
1
e
1
e
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
TO92S (TYPE A)
L
c
A
2
A
E
b
e
D
0
Dim
A
A2
b
c
D
E
e
L
L1
θ
1
L
TO92S (TYPE A)
Min
Max
Typ
1.480
1.680
0.710
0.810
0.440
0.380
4.000
4.200
3.080
3.280
1.270
13.500 14.500
2.200
2.400
44°
46°
All Dimensions in mm
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
TO92S (TYPE B)
L
c
A
2
A
E
b
2
b
e
D
0
1
L
Dim
A
A2
b
b2
c
D
E
e
L
L1
θ
TO92S (TYPE B)
Min
Max
Typ
1.420
1.620
0.750
0.360
0.480
0.380
0.550
0.360
0.510
3.850
4.150
2.900
3.310
1.270
14.000 15.500
1.600
44°
46°
All Dimensions in mm
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
301 of 303
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
TO94
L
x
2
0
︵ ︶
c
b
2
b
E
3
AA
x
2
1
0
︵ ︶
1
e
e
D
x
2
3
0
x
2
2
0
L
︵ ︶
︵ ︶
TO94
Dim
Min
Max
Typ
A
1.46
1.66
1.56
A3
0.76
b
0.35
0.56
0.39
b2
0.46
c
0.36
0.51
0.38
D
5.12
5.32
5.22
E
3.55
3.75
3.65
e
1.27
e1
3.81
L
13.50 15.50 14.50
L1
1.42
S
0.63
0.83
0.73
θ
6°
θ1
4°
θ2
11°
θ3
6°
All Dimensions in mm
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
302 of 303
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
WOG
A
B
WOG
Dim
Min
Max
A
8.84
9.86
B
4.00
4.60
C
27.90
-
D
25.40
-
E
0.71
0.81
G
4.60
5.60
All Dimensions in mm
+
D
C
E
+
G
G
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 84
303 of 303
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated