QUAD FLAT PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN PLASTIC FPT-256P-M09 256-pin plastic QFP (FPT-256P-M09) 256-pin plastic QFP (FPT-256P-M09) Lead pitch 0.40 mm Package width package length 28.0 28.0 mm Lead shape Gullwing Sealing method Plastic mold Mounting height 4.03 mm MAX Weight 5.74g Remark Low heat resistance type Code(Reference) P-FQFP256-28 28-0.40 Note 1) * : These dimensions do not include resin protrusion. Note 2) Pins width and pins thickness include plating thickness. Note 3) Pins width do not include tie bar cutting remainder. 30.60±0.20(1.205±.008)SQ * 28.00±0.10(1.102±.004)SQ 192 0.145±0.055 (.006±.002) 129 193 128 0.08(.003) Details of "A" part 3.73±0.30 (Mounting height) (.147±.012) +0.10 0.40 –0.15 INDEX +.004 0°~8° 256 .016 –.006 (Stand off) 65 "A" LEAD No. 1 C (0.50(.020)) 64 0.40(.016) 0.18±0.05 (.007±.002) 2003-2010 FUJITSU SEMICONDUCTOR LIMITED F256025S-c-3-6 0.07(.003) M 0.25(.010) 0.60±0.15 (.024±.006) Dimensions in mm (inches). Note: The values in parentheses are reference values. The contents of this document are subject to change without notice. Customers are advised to consult with FUJITSU SEMICONDUCTOR sales representatives before ordering. FUJITSU SEMICONDUCTOR is unable to assume responsibility for infringement of any patent rights or other rights of third parties arising from the use of the information or package dimensions in this document. 0212