[AP2063AEC] AP2063AEC 2.0A High-side LED Driver for Camera Flash with I2C 1. GENERAL DESCRIPTION The AP2063 is a white LED driver IC for camera flash applications in portable equipment. The device integrates a current mode synchronous boost DC-DC converter and maximum 2A current sources. The internal boost DC-DC converter integrates a switching FET and synchronous rectifier, and supports a small size multilayer inductor with 4MHz switching frequency. The internal current sources allow for grounded cathode connections for easier heat dissipation and simple LED arrangement. The AP2063 includes seven protections that are inductor current limitation, input voltage detection, over voltage protection, under voltage lock out, device thermal protection, LED open/short protection and output-ground short protection to avoid significant system problems. Flash current, torch current, inductor limit current and flash on-time is programmable through I2C interface. The device uses a small size package (CSP: 1.56mm x 1.64mm, 0.5mm pitch, 9pins) to utilize less board space. MS1637-E-00 2. FEATURE Power Supply Voltage: 2.7V~5.5V LED Current: max 2.0A High-Side Current Source Switching Frequency: 4.0 MHz - Support small size inductor Automatically Select Operating Mode (DC-DCBypass) Synchronized with RF power-Amplifier Pulse Input Voltage Detection Function I2C Function: - Flash LED current setting - Torch LED current setting - Flashing on-time setting - Current limit value setting - Battery detection voltage setting - Error read support Protection Function: - Inductor current limit - Input voltage detection - Over voltage protection (OVP) - Under voltage lock out (UVLO) - Thermal shutdown - LED open/short - Output-ground short Ta: -30 ~ 85C Package: 9-pin CSP (1.56 x 1.64mm, 0.5mm pitch) -1- 2014/04 [AP2063AEC] 3. TABLE OF CONTENTS 1. GENERAL DESCRIPTION ........................................................................................................................................... 1 2. FEATURE ...................................................................................................................................................................... 1 3. TABLE OF CONTENTS ............................................................................................................................................... 2 4. BLOCK DIAGRAM ....................................................................................................................................................... 3 5. PIN CONFIGURATIONS AND FUNCTIONS ............................................................................................................. 4 ■ Ordering Information................................................................................................................................................... 4 ■ PIN CONFIGURATION ............................................................................................................................................. 4 6. ABSOLUTE MAXIMUM RATING .............................................................................................................................. 5 7. RECOMMENDED OPERATING CONDITIONS ........................................................................................................ 5 ■ Thermal Properties ...................................................................................................................................................... 5 8. ELECTRICAL CHARACTERISTICS ........................................................................................................................... 6 ■ Logic Input/output Characteristics .............................................................................................................................. 7 ■ Timing Diagram .......................................................................................................................................................... 7 9. FUNCTIONAL DESCRIPTIONS .................................................................................................................................. 8 ■ Protection Function ..................................................................................................................................................... 8 ■ Recommend Sequence Examples ................................................................................................................................ 9 ■ Typical Performance Characteristics ......................................................................................................................... 14 ■ Serial Control Interface ............................................................................................................................................. 16 10. REGISTER MAP ....................................................................................................................................................... 19 ■ Register Map ............................................................................................................................................................. 19 ■ Register Map Details ................................................................................................................................................. 19 11. RECOMMEND EXTERNAL CIRCUITS ................................................................................................................. 24 12. PACKAGE ................................................................................................................................................................. 25 13. MARKING ................................................................................................................................................................. 25 14. REVISE HISTORY .................................................................................................................................................... 26 IMPORTANT NOTICE ................................................................................................................................................... 27 MS1637-E-00 -2- 2014/04 [AP2063AEC] 4. BLOCK DIAGRAM SW VIN UVLO OVP BULK CONT Cin VOUT OSC ∑ Cout CONT PWM COMPARATOR Current Limit Error Amp LED SCL SDA STROBE I2C I/F & Control TXON Current & Control GND Figure 1. AP2063 Block Diagram MS1637-E-00 -3- 2014/04 [AP2063AEC] 5. PIN CONFIGURATIONS AND FUNCTIONS ■ Ordering Information AP2063AEC Ta= -30 to 85℃ 9-pin CSP ■ PIN CONFIGURATION 3 GND Pin Name I/O A1 OUT O A2 A3 SW GND I - B1 LED O B2 STROBE I B3 VIN I C1 TXON I C2 C3 SDA SCL I/O I MS1637-E-00 SCL 2 SW STROBE SDA 1 OUT A No. VIN LED B TXON C (Top View) Function Voltage Output pin. Connect a 4.7F or larger ceramic capacitor between this pin and GND. Connect to coil pin. Ground pin. High-side Current Source Output pin for LED. This pin shall be open when unused. Flashing control input pin. This pin shall be connected to ground when unused. (Pull-down resistor between this pin and GND = 300kohm @typ) Input Voltage pin. Connect VIN to the input supply, and bypass to GND with a 4.7F or larger ceramic capacitor. Synchronization input pin for RF transmission signal. This pin shall be connected to ground when unused. (Pull-down resistor between this pin and GND = 300kohm @typ) I2C data input pin. I2C clock input pin -4- 2014/04 [AP2063AEC] 6. ABSOLUTE MAXIMUM RATING Parameter VIN, SW, VOUT, LED pins TXON, STROBE, SCL,SDA pins Symbol VIN1 min 0.3 VIN2 0.3 Junction Temperature TJMAX Storage Temperature TSTG 55 Note 1. All voltages are with respect to ground. Note 2. The maximum value is low value either (VIN+0.3)V or 6.5V. (GND=0V; (Note 1)) max Units 6.5 V VIN+0.3 V (Note 2) 125 C 150 C WARNING: Operation at or beyond these limits may result in permanent damage to the device. Normal operation is guaranteed at these extremes. 7. RECOMMENDED OPERATING CONDITIONS (GND=0V; (Note 1)) Parameter Symbol Min. Typ. Max. Units Input Voltage (VIN) Vbatt 2.7 3.7 5.5 V Operation Temperature Ta -30 25 85 C Note 3. When 4.7V < VIN < 5.5V, AP2063 can work normally in case of protection function not working, but the analog characteristics cannot be guaranteed. ■ Thermal Properties Parameter Symbol Thermal Junction-to-Ambient Resistance (Note 4) JA Note 4. This test board is a 4-layer FR-4 board measuring 40mm x 40mm x 2mm. Ambient temperature is 25C. Thicknesses of copper layers are 18um / 35um / 35um / 18um. Densities of copper layers are more than 80% / 80% / 80% / 80%. MS1637-E-00 -5- Typ. 75 Units C /W 2014/04 [AP2063AEC] 8. ELECTRICAL CHARACTERISTICS (GND=0V (Note 1), VIN=2.7~4.7V,Ta=-30~85 C, Recommend Parts, unless otherwise specified) Parameter Symbol Min. Typ. Max. Units Conditions LED1, LED2 bits = “0” Power-down Current ISB 1.0 5.0 SCL, SDA pins= VIN A VIN= 3.7V Quiescent Current LED=50mA setting IQ 1 2.5 mA (from VIN pin) VOUT= 4.5V ILED= 1600mA LED Current Accuracy1 (flash mode, VIN=3.7V, IACCU1 -8 8 % (flash mode) VOUT=3.85V, TA=25 C) LED Current Accuracy2 IACCU2 -10 10 % ILED= 1600mA (flash mode) LED Current Accuracy3 IACCU3 -12 12 % ILED= 380mA (torch mode) Current Source Dropped Voltage 1 2.8VVLED4.2V VDROP1 0.35 0.39 V (VOUT-LED pin voltage) CB bit= “0” Current Source Dropped Voltage 2 2.8VVLED4.2V VDROP2 0.43 0.47 V (VOUT-LED pin voltage) CB bit= “1” Over Voltage Protection 4.9 5.1 5.3 OVP V Hysteresis 0.21 Under Voltage Lock Out (UVLO) 2.4 2.5 2.6 VUVLO V Hysteresis 0.1 Boost Frequency FBOOST 2.6 4.0 4.4 MHz Timeout Time Accuracy TOUTA -10 35 % Inductor Current Limit Accuracy ILIMITA -30 30 % Ta=25C, VIN=3.7V TXON pin= “L” to “H” Time (Flash to Torch) TFtoT 5 s ILED1=ILED2=1000mA to 30mA VIN Detection Accuracy VDETA -5 5 % VIN Detection Hysteresis VDETH 0.1 V Thermal Protection Temperature Treg 140 170 C Hysteresis Tregh 15 - MS1637-E-00 -6- 2014/04 [AP2063AEC] ■ Logic Input/output Characteristics (Ta= -30 85C; VIN=2.7 5.5V), SCL, SDA, TXON, STROBE pins. Symbol Min. Typ. Max. Units VIH 1.2 VIN V VIL 0.4 V VOL 0.4 V Parameter High-Level Input Voltage Low-Level Input Voltage Low-Level Output Voltage (Iout= 3mA) (SDA pin) Input Leakage Current (SCL, SDA pins) Pull-down Resistance TXON, STROBE pins IIN1 -2 - 2 A RIN 100 300 700 k - 400 - kHz s - - s - 0.3 0.3 400 s s s s s s s s pF 50 ns Control Interface Timing: SCL Clock Frequency FSCL Bus Free Time Between Transmissions tBUF 1.3 Start Condition Hold Time tHD:STA 0.6 (prior to first clock pulse) Clock Low Time tLOW 1.3 Clock High Time tHIGH 0.6 Setup Time for Repeated Start Condition tSU:STA 0.6 SDA Hold Time from SCL Falling (Note 5) tHD:DAT 0 SDA Setup Time from SCL Rising tSU:DAT 0.1 Rise Time of Both SDA and SCL Lines tR Fall Time of Both SDA and SCL Lines tF Setup Time for Stop Condition tSU:STO 0.6 Capacitive load on bus Cb Pulse Width of Spike Noise Suppressed by Input tSP 0 Filter Note 5. Data must be held long enough to bridge the 300ns transition time of SCL. - ■ Timing Diagram VIH SDA VIL tLOW tBUF tR tHIGH tF tSP VIH SCL VIL tHD:STA Stop tHD:DAT tSU:DAT tSU:STA tSU:STO Start Stop Start Figure 2. I2C Bus Mode Timing MS1637-E-00 -7- 2014/04 [AP2063AEC] 9. FUNCTIONAL DESCRIPTIONS The AP2063 is a synchronically boost DC-DC converter with 4MHz switching frequency. The AP2063 can drive LED which connects to LED pin with internal regulated current sources. The regulated current sources (high-side current sources) use PMOS FETs, allowing the LED to be directly connected to ground and providing better LED heat dissipation and simpler LED arrangement. The AP2063 can automatically regulate output voltage with different LED Forward Voltages (VF). The AP2063 integrates a TXON input which can be used to change the LED current from flash mode to torch mode immediately in order to reduce the battery current during RF transmission or high current events. ■ Protection Function To protect against system trouble or device damage, the AP2063 protection functions are as shown below. (GND=0V; (Note 1), VIN=3.7V, Ta=25C, Recommend Parts, unless otherwise specified) Working condition Device status Return condition Inductor peak current Switching NMOSFET change to 1) Over current Return automatically > setting current off when inductor current reach protection (OCP) (1 cycle detected) (LIMIT[1:0]) to limited current In the case of flashing Next flash signal, 2) battery voltage VIN pin voltage Return automatically Change to torch mode detection protection < setting voltage VIN pin voltage (VIN[1:0]) >setting voltage+0.1V Return automatically 3) Over Voltage VOUT pin voltage Boost circuit power-down VOUT pin voltage Protection (OVP) > 5.1V < 5.1V–0.215V 4) Under Voltage VIN pin voltage All circuits power-down Set LED1= LED2= “0” Lock Out (UVLO) < 2.5V Address= “06H”, UVLO= “1” again TSDSEL bit= “0”: TSDSEL bit= “0”: Set LED1= LED2= “0” All circuits power-down again 5) Thermal Device temperature Address= “06H”, TSD= “1” TSDSEL bit= “1”: Shut-Down TSDSEL bit= “1”: > 170 C Return automatically (TSD) Boost circuit and current Device temperature source circuit power-down >170 C VOUT-LED1< 0.1V All circuit power-down 6) LED pin in the and OVP is detected Address= “06H”, LO= “1” state of open or short During 20us, All circuit power-down to GND LED pin < 1.0V Address= “06H”, LS= “1” Set LED1= LED2= “0” VOUT pin voltage< 1.0V again or in the case of start-up, 7) VOUT short to during 1ms, All circuit power-down GND VOUT voltage Address= “06H”, VOS= “1” < VIN-0.1V during 1ms (COUT<=10uF) Note 6. When set LED1=LED2= “0” again, the register will be reset too. Protection MS1637-E-00 -8- 2014/04 [AP2063AEC] ■ Recommend Sequence Examples The AP2063 deleted the enable pin and automatically power-up with internal power-on-reset for decreasing the load of CPU. AP2063 can select LEVEL control (EDGE bit= “0”) or EDGE control (EDGE bit= “1”) LEVEL control: Flashing: A) The time of STROBE pin= “H” or the time of FLASH bit= “1” < setting timer Driving LED while STROBE pin= “H” or FLASH bit= “1”. B) The time of STROBE pin= “H” or the time of FLASH bit= “1” > setting timer The time of driving LED= setting time (TIME [3-0] bits). Torching: Driving LED while TORCH bit= “1”. EDGE control: Flashing: Driving LED with the edge of STROBE pin= “L” to “H” or the edge of FLASH bit= “0” to“1”. Maximum driving time is limited by setting time. Torching: Driving LED while TORCH bit= “1”. 1) Flashing sequence（LEVEL control） Power Supply (1) LED1,LED2 Setting (2) Resister Setting Setting (3) STROBE pin or FLASH bit VIN VOUT pin Setting timer Setting timer Internal Timer LED Current (7) reset (4) (4) (7) reset (5) (6) (5) (6) Figure 3. Flashing sequence (LEVEL control) (1) After power supplied(VIN>=2.7V), for resetting AP2063 internal circuits, please wait 5ms, then set LED1, LED2 bits= “01” or “10” or “11”. (2) After LED1, LED2 bits are set, VOUT pin voltage change to VIN*95% within 5ms with inrush current< 500mA. (3) After register setting finished, Please set STROBE pin= “H” or FLASH bit= “1”. AP2063 can drive LED with STROBE pin or FLASH bit, did not depend on VOUT voltage. After LED1, LED2 bits is set, please wait 5ms, then set STROBE pin= “H” or FLASH bit= “1”. (4) After STROBE pin= “L” to “H” or FLASH bit= “0” to “1”, internal timer will start. (5) In the case of VOUT=VIN, after STROBE pin= “L” to “H” or FLASH bit= “0” to “1”, LED current will reach setting current within 1ms. (6) When STROBE pin= “H” to “L” or FLASH bit= “1” to “0”, The time of STROBE= “H” or the time of FLASH bit= “1” > setting time: After timer finished, LED current is change to 0mA immediately. The time of STROBE= “H” or the time of FLASH bit= “1” < setting time: LED current is change to 0mA immediately. (7) The timer will be reset wit STROBE pin= “H” to “L” or FLASH bit= “1” to “0”. MS1637-E-00 -9- 2014/04 [AP2063AEC] 2) Flashing sequence（EDGE control） Power Supply (1) LED1,LED2 Setting (2) Resister Setting Setting (3) STROBE pin or FLASH bit VIN VOUT pin Setting timer Setting timer Internal Timer LED Current (7) reset (4) (5) (6) (7) reset (4) (5) (6) Figure 4. Flashing sequence (EDGE control) (1) After power supplied(VIN>=2.7V), for resetting AP2063 internal circuits, please wait 5ms, then set LED1, LED2 bits= “01” or “10” or “11”. (2) After LED1, LED2 bits is set, VOUT pin voltage change to VIN*95% within 5ms, and inrush current< 500mA. (3) After register setting finished, Please set STROBE pin= “H” or FLASH bit= “1”. AP2063 can drive LED with STROBE pin or FLASH bit, did not depend on VOUT voltage. After LED1, LED2 bits is set, please wait 5ms, then set STROBE pin= “H” or FLASH bit= “1”. (4) After STROBE pin= “L” to “H” or FLASH bit= “0” to “1”, internal timer will start. (5) In the case of VOUT=VIN, after STROBE pin= “L” to “H” or FLASH bit= “0” to “1”, LED current will reach setting current within 1ms. (6) After timer finished, LED current will change to 0mA, even STROBE pin= “H” or FLASH bit= “1”. (7) When timer finished, it will be reset automatically. MS1637-E-00 - 10 - 2014/04 [AP2063AEC] 3) Torching sequence（LEVEL control or EDGE control） Power Supply (1) LED1,LED2 Setting (2) Resister Setting Setting (3) TORCH bit VIN VOUT pin LED Current (4) (5) Figure 5. Torching sequence (1) After power supplied(VIN>=2.7V), for resetting AP2063 internal circuits, please wait 5ms, then set LED1, LED2 bits= “01” or “10” or “11”. (2) After LED1, LED2 bits is set, VOUT pin voltage change to VIN*95% within 5ms, and inrush current< 500mA. (3) After register setting finished, please set TORCH bit= “1”. AP2063 can drive LED with TORCH bit, did not depend on VOUT voltage. After LED1, LED2 bits is set, please wait 5ms, then set TORCH bit= “1”. (4) In the case of VOUT=VIN, after TORCH bit= “0” to “1”, LED current will reach setting current within 300s. (5) After TORCH bit= “1” to “0”, LED current will change to 0mA. MS1637-E-00 - 11 - 2014/04 [AP2063AEC] 4) Off → Torch → Flash → Torch → OFF sequence (LEVEL control) Power Supply (1) LED1,LED2 Setting Resister Setting (2) Setting (3) TORCH bit STROBE pin or FLASH bit Setting timer Setting timer (8) reset (5) (5) (8) reset Internal Timer LED Current (6) (7) (4) (6) (7) Figure 6. Torching to flashing sequence (LEVEL control) (1) After power supplied(VIN>=2.7V), for resetting AP2063 internal circuits, please wait 5ms, then set LED1, LED2 bits= “01” or “10” or “11”. (2) After LED1, LED2 bits is set, VOUT pin voltage change to VIN*95% within 5ms, and inrush current< 500mA. (3) After register setting finished, please set TORCH bit= “1”. After LED1, LED2 bits is set, please wait 5ms, then set TORCH bit= “1”. (4) After TORCH bit= “0” to “1”, LED current will reach to setting current within 300s. (5) After STROBE pin= “L” to “H” or FLASH bit= “0” to “1”, internal timer will start. (6) After STROBE pin= “L” to “H” or FLASH bit= “0” to “1”, LED current will reach to setting current within 500s. (7) When STROBE pin= “H” to “L” or FLASH bit= “1” to “0”, The time of STROBE= “H” or the time of FLASH bit= “1” > setting time: After timer finished, LED current is change to 0mA. The time of STROBE= “H” or the time of FLASH bit= “1” < setting time: LED current is change to 0mA immediately”. (8) The timer will be reset wit STROBE pin= “H” to “L” or FLASH bit= “1” to “0”. MS1637-E-00 - 12 - 2014/04 [AP2063AEC] 5) OFF → Torch → Flash → Torch → OFF (EDGE control) Power Supply (1) LED1,LED2 Setting Resister Setting (2) Setting (3) TORCH bit STROBE pin or FLASH bit Setting timer Setting timer Internal Timer LED Current (8) Reset (5) (6) (7) (8) Reset (5) (6) (7) (4) Figure 7. Torching to flashing sequence (EDGE control) (1) After power supplied(VIN>=2.7V), for resetting AP2063 internal circuits, please wait 5ms, then set LED1, LED2 bits= “01” or “10” or “11”. (2) After LED1, LED2 bits is set, VOUT pin voltage change to VIN*95% within 5ms, and inrush current< 500mA. (3) After register setting finished, Please set TORCH bit= “1”. After LED1, LED2 bits is set, please wait 5ms, then set TORCH bit= “1”. (4) After TORCH bit= “0” to “1”, LED current will reach to setting current within 300s. (5) After STROBE pin= “L” to “H” or FLASH bit= “0” to “1”, internal timer will start. (6) After STROBE pin= “L” to “H” or FLASH bit= “0” to “1”, LED current will reach setting current within 500s. (7) After timer finished, LED current will change to 0mA, even STROBE pin= “H” or FLASH bit= “1”. (8) When timer finished, it will be reset automatically. MS1637-E-00 - 13 - 2014/04 [AP2063AEC] ■ Typical Performance Characteristics (VIN=3.7V,Ta=25 C, Recommend Parts, use MAMK2520TR47M(0.47uH) inductor, GRM188B31A106ME69(10uF), unless otherwise specified) Figure 8. Efficiency and Input current characteristics (flash mode) Figure 9. Efficiency and Input current characteristics (torch mode) Figure 10. Device temperature increase characteristics MS1637-E-00 - 14 - 2014/04 [AP2063AEC] VIN=3.8V, [email protected] TXON LED_VF Input Current LED Current Figure 11. TXON function characteristics Bypass DC-DC VIN pin SW pin Input Current LED Current Figure 12. Bypass and DC-DC switching characteristics VIN VOUT Input Current LED Current Figure 13. Start-up characteristics MS1637-E-00 - 15 - 2014/04 [AP2063AEC] ■ Serial Control Interface The AP2063 supports a fast-mode I2C-bus system (max: 400kHz). Pull-up resistors at the SCL and SDA pins should be connected to VIN pin or less. 1. WRITE Operations Figure 14 shows the data transfer sequence for the I2C-bus mode. All commands are preceded by START condition. A HIGH to LOW transition on the SDA line while SCL is HIGH indicates START condition (Figure 19). After the START condition, a slave address is sent. This address is 7 bits long followed by the eighth bit that is a data direction bit (R/W). The most significant seven bits of the slave address are fixed as “0110111” (Figure 15). If the slave address matches that of the AP2063, the AP2063 generates an acknowledge and the operation is executed. The master must generate the acknowledge-related clock pulse and release the SDA line (HIGH) during the acknowledge clock pulse (Figure 20). An R/W bit value of “1” indicates that the read operation is to be executed. “0” indicates that the write operation is to be executed. The second byte consists of the control register address of the AP2063. The format is MSB first, and those most significant 3-bits are fixed to zero (Figure 16). The data after the second byte contains control data. The format is MSB first, 8-bits (Figure 17). The AP2063 generates an acknowledge after each byte is received. A data transfer is always terminated by STOP condition generated by the master. A LOW to HIGH transition on the SDA line while SCL is HIGH defines STOP condition (Figure 19). The AP2063 can perform more than one byte write operation per sequence. After receipt of the third byte the AP2063 generates an acknowledge and awaits the next data. The master can transmit more than one byte instead of terminating the write cycle after the first data byte is transferred. After receiving each data packet the internal 5-bit address counter is incremented by one, and the next data is automatically taken into the next address. If the address exceeds 0BH prior to generating the stop condition, the address counter will “roll over” to 00H and the previous data will be overwritten. The data on the SDA line must remain stable during the HIGH period of the clock. The HIGH or LOW state of the data line can only change when the clock signal on the SCL line is LOW (Figure 21) except for the START and STOP conditions. S T A R T SDA S T O P R/W="0" Slave S Address Sub Address(n) Data(n) A C K A C K Data(n+1) A C K Data(n+x) A C K A C K P A C K Figure 14. Data transfer sequence 0 1 1 0 1 1 1 R/W A2 A1 A0 D2 D1 D0 Figure 15. The first byte 0 0 0 0 0 Figure 16. The second byte D7 D6 D5 D4 D3 Figure 17. Byte structure after the second byte MS1637-E-00 - 16 - 2014/04 [AP2063AEC] 2. READ Operations Set the R/W bit = “1” for the READ operation of the AP2063. The master can read the next address’s data by generating an acknowledge instead of terminating the write cycle after the receipt of the first data word. After receiving each data packet the internal 5-bit address counter is incremented, and the next data is automatically taken into the next address. If the address exceeds 04H prior to generating stop condition, the address counter will “roll over” to 00H and the previous data will be overwritten. The AP2063 supports two basic read operations: RANDOM ADDRESS READ. 2-1. RANDOM ADDRESS READ The random read operation allows the master to access any memory location at random. Prior to issuing the slave address with the R/W bit “1”, the master must first perform a “dummy” write operation. The master issues start request, a slave address (R/W bit = “0”) and then the register address to read. After the register address is acknowledged, the master immediately reissues the start request and the slave address with the R/W bit “1”. The AP2063 then generates an acknowledge, 1 byte of data and increments the internal address counter by 1. If the master does not generate an acknowledge to the data but generates a stop condition, the AP2063 ceases transmission. S T A R T SDA S T A R T R/W="0" Slave S Address Sub Address(n) A C K Slave S Address A C K S T O P R/W="1" Data(n) A C K Data(n+1) MA AC S K T E R Data(n+x) MA AC S T K E R MA AC S T K E R P MN A A S T C E K R Figure 18. Random address read SDA SCL S P start condition stop condition Figure 19. START and STOP conditions MS1637-E-00 - 17 - 2014/04 [AP2063AEC] DATA OUTPUT BY TRANSMITTER not acknowledge DATA OUTPUT BY RECEIVER acknowledge SCL FROM MASTER 2 1 8 9 S clock pulse for acknowledgement START CONDITION Figure 20. Acknowledge on the I2C-Bus SDA SCL data line stable; data valid change of data allowed Figure 21. Bit transfer on the I2C-Bus MS1637-E-00 - 18 - 2014/04 [AP2063AEC] 10. REGISTER MAP ■ Register Map (GND=0V; (Note 1),VIN=3.7V, Ta=25℃, Recommend Parts, unless otherwise specified) Addr 00H 01H 02H 03H Register Name Instruction LED Control 1 LED Control 2 LED Control 3 04H Others 05H Light Control 06H D7 INST7 LIGHT_ NG Fault/Status D6 INST6 D5 INST5 D4 INST4 D3 INST3 D2 INST2 TSDSEL DIM CB LEDT2 TIME3 LEDT0 TIME2 LEDF2 VIN1 VIN0 EDGE LEDT1 TXON_ MODE EN_NG TSD D1 INST1 LED2 TIME1 LEDF1 D0 INST0 LED1 TIME0 LEDF0 LIMIT1 LIMIT0 FLASH TORCH LO UVLO VOS LS D3 INST3 R/W 0 D2 INST2 R/W 0 D1 INST1 R/W 0 D0 INST0 R/W 0 D1 LED2 R/W 0 D0 LED1 R/W 0 Note 7. The writing of Addr >= “07H” is prohibited. ■ Register Map Details Addr 00H Register Name Instruction Read/Write Default D7 INST7 R/W 0 D6 INST6 R/W 0 D5 INST5 R/W 0 D4 INST4 R/W 0 INST[7:0]: The instruction for error protection. IF INST[7:0] = 01101001 is not written, the access for other register is not effective. At first, please set INST[7:0] = 01101001. Addr 01H Register Name LED Control Read/Write Default D7 D6 D5 D4 D3 D2 RD 0 RD 0 RD 0 RD 0 RD 0 RD 0 LED1, LED2: The power ON/OFF for AP2063 and the ON/OFF control for LED that connect to LED pin. Table 1. AP2063&LED status setting LED2 LED1 0 0 0 1 1 0 1 1 MS1637-E-00 - 19 - AP2063 Status Power-down Prohibit Prohibit LED=on 2014/04 [AP2063AEC] Addr 02H Register Name LED Control 2 R/W Default D7 RD 0 D6 TSDSEL R/W 0 D5 CB R/W 0 D4 EDGE R/W 0 D3 TIME3 R/W 0 D2 TIME2 R/W 1 D1 TIME1 R/W 1 D0 TIME0 R/W 1 TIME0, TIME1, TIME2, TIME3: The on-time setting for LEDs that connect to LED1, LED2 in flash mode. Table 2. LED on-time setting in the case of flash mode TIME3 TIME2 TIME1 TIME0 Time 0 0 0 0 5ms 0 0 0 1 10ms 0 0 1 0 20ms 0 0 1 1 30ms 0 1 0 0 40ms 0 1 0 1 50ms 0 1 1 0 70ms 0 1 1 1 90ms TIME3 1 1 1 1 1 1 1 1 TIME2 0 0 0 0 1 1 1 1 TIME1 0 0 1 1 0 0 1 1 TIME0 0 1 0 1 0 1 0 1 Time 120ms 150ms 200ms 250ms 300ms 400ms 600ms 800ms EDGE: Change flashing time control method 0: Level control 1: Edge control (flashing time is controlled by internal timer) CB: Change current source dropping voltage (VOUT-LED) 0: 0.35V 1: 0.43V Use this register can set current source dropped voltage (VOUT-LED pins). If use the LED which VF is very low, please set CB= “1”. (Example: LED current= 2A, LED VF≦2.8V @2A) TSDSEL: Thermal Shut Down return mode 0: not return, should set LED1 bit= LED2 bit= “0” again. 1: Return automatically MS1637-E-00 - 20 - 2014/04 [AP2063AEC] Addr 03H Register Name LED Control 3 R/W Default D7 RD 0 D6 DIM R/W 0 D5 LEDT2 R/W 0 D4 LEDT1 R/W 0 D3 LEDT0 R/W 1 D2 LEDF2 R/W 1 D1 LEDF1 R/W 0 D0 LEDF0 R/W 0 LEDF0, LEDF1, LEDF2: The current setting for LEDs that connect to LED pin. Table 3. LED current setting in the case of flash mode FLASH (mA) LEDF2 LEDF1 LEDF0 LED1=LED2= “1” 0 0 0 274 0 0 1 472 0 1 0 674 0 1 1 878 1 0 0 1082 1 0 1 1290 1 1 0 1600 1 1 1 2000 LEDT0, LEDT1, LEDT2: The current setting for LEDs that connect to LED pin. DIM: Small torching current setting 0: normal setting 1: torching current= torching setting current / 5 Table 4. LED current setting in the case of torch mode TORCH (mA) LED1=LED2= “1” LEDT2 LEDT1 LEDT0 DIM= “0” DIM= “1” 0 0 0 50 10 0 0 1 86 17.2 0 1 0 124 24.8 0 1 1 162 32.4 1 0 0 200 40 1 0 1 240 48 1 1 0 300 60 1 1 1 380 76 MS1637-E-00 - 21 - 2014/04 [AP2063AEC] Addr Register Name 04H Others R/W Default D7 D6 D5 VIN1 VIN0 R/W 0 R/W 0 RD 0 D4 TXON_ MODE R/W 0 D3 RD 0 D2 RD 0 D1 D0 LIMIT1 LIMIT0 R/W 1 R/W 0 LIMIT1, LIMIT0: Inductor limit current setting Table 5. Inductor current limit setting LIMIT1 LIMIT0 Limit Current 0 0 4.4A 0 1 3.5A 1 0 2.5A 1 1 1.5A TXON_MODE: TXON function select mode 0: TXON function available (Change LED current from flashing mode to torching mode when TXON pin= “high”) 1: TORCH mode (Drive LED with torching current when TXON pin= “high”) VIN1, VIN0: Input voltage detection When input voltage is detected, LED current will be changed to torching current in case of flashing. If do not use this function, please set VIN [1:0]= “00”. Table 6. Input voltage detection VIN1 VIN0 Detection voltage 0 0 off 0 1 3.3V 1 0 3.1V 1 1 2.9V Addr 05H Register Name Light Control R/W Default D7 D6 D5 D4 D3 D2 RD 0 RD 0 RD 0 RD 0 RD 0 RD 0 D1 FLASH R/W 0 D0 TORCH R/W 0 FLASH: Drive LED with flashing current TORCH: Drive LED with torching current Table 7. LED Control Status (LED1=LED2 bits= “11”) TXON pin STROBE pin FLASH bit TROCH bit Low Low 0 0 Low Low 0 1 Low Low 1 0 Low Low 1 1 Low High * * High Low 0 0 High STROBE pin= High or FLASH bit=1 MS1637-E-00 - 22 - Status Standby TORCH FLASH FLASH FLASH Standby TORCH 2014/04 [AP2063AEC] Addr Register Name 06H Fault/Status R/W Default D7 LIGHT_ NG RD 0 D6 D5 EN_NG TSD RD 0 RD 0 D4 RD 0 D3 D2 D1 D0 LO UVLO VOS LS RD 0 RD 0 RD 0 RD 0 LS: Show LED1 pin short to GND or LED2 pin short to GND. 0: not short 1: short VOS: Show VOUT1 pin short to GND or VOUT2 short to GND. 0: not short 1: short UVLO: Show UVLO is detected or not. 0: not in the status of UVLO 1: UVLO LO: show LED is open or not. 0: not open 1: open TSD: Thermal shut down is detected or not. 0: not in the status of TSD 1: TSD EN_NG：for Start-up Stand-by 0：VOUT≧VIN-0.1V（Stand-by） 1：VOUT＜VIN-0.1V（not Stand-by） LIGHT_NG：for Second Start-up Stand-by 0：VOUT≒VIN（Stand-by） 1：VOUT≠VIN（not Stand-by） MS1637-E-00 - 23 - 2014/04 [AP2063AEC] 11. RECOMMEND EXTERNAL CIRCUITS 4.0mm Inductor (2520) Cout Please connect TXON pin, VIN STROBE pin to GND, if these pins are not used. 4.0mm OUT SW GND Top View LED2 TXON LED STROB VIN TXON E SDA SCL SDA STROBE Cin SCL Recommended external components (LED=1.6A, VIN=3.3~4.2V, LED_VF<4.2V) Table 8. Recommend external parts example Item Symble Value Type (example) Size 0.47uH MAMK2520TR47M 2.5 x 2.0 x 1.2mm 1uH DFE252010C 2.5x2.0x1.2 mm Inductor L 1uH LQH44PN1R0NP0 3.7x4.0x1.8mm 1uH VLF4014ST-1R0N2R3 3.8x3.6x1.4mm 1uH TFM252010 (DCR<65mohm) 2.5x2.0x1.0 mm GRM188B30J475KE18 (6.3V) 1.6 x 0.8 x 0.8mm GRM188B31C475MAAJ (16V) 1.6 x 0.8 x 0.8mm 4.7uF C1608JB0J475K, C1608JB0J475M 1.6 x 0.8 x 0.8mm C1608X5R0J475K, C1608X5R0J475M GRM219B31C106KA73 (16V) 2.0 x 1.3 x 0.85mm Cin GRM219R61C106KA73 (16V) 2.0 x 1.3 x 0.85mm 10uF GRM188B31A106ME6 (10V) 1.6 x 0.8 x 0.8mm C2012JB1A106K085AC (10V) 2.0 x 1.3 x 0.85mm Capacitor C2012JB0J106K085AB (6.3V) 2.0 x 1.3 x 0.85mm 4.7uF C1608JB0J475K, C1608JB0J475M 1.6 x 0.8 x 0.8mm GRM219B31C106KA73 (16V) 2.0 x 1.3 x 0.85mm GRM219R61C106KA73 (16V) 2.0 x 1.3 x 0.85mm Cout (Note 8) 10uF GRM188B31A106ME6 (10V) 1.6 x 0.8 x 0.8mm C2012JB1A106K085AC (10V) 2.0 x 1.3 x 0.85mm C2012JB0J106K085AB (6.3V) 2.0 x 1.3 x 0.85mm Note 8. Recommend to use the capacitor which the value is more than 2.2uF @5.0V DC bias. Note 9. GND shall be connected to the same ground plane. Inductor shall be placed as close as possible to the chip. Capacitors shall be placed as close as possible to the chip. Low ESR (Equivalent Series Resistance) capacitors are recommended. MS1637-E-00 - 24 - Marker TAIYO-YUDEN TOKO MURATA TDK TDK MURATA TDK MURATA TDK TDK MURATA 2014/04 [AP2063AEC] 12. PACKAGE CSP (Unit: mm) 13. MARKING 2063 Market No.（Product No.） YWWA Pin #1 indication YWWA : date code (4 digit) A: manage number WW: the week of manufacture Y: the year of manufacture (Ex: 2013-> “3”) MS1637-E-00 - 25 - 2014/04 [AP2063AEC] 14. REVISE HISTORY Date (YY/MM/DD) 14/04/03 MS1637-E-00 Revision Page 00 Contents First edition - 26 - 2014/04 [AP2063AEC] IMPORTANT NOTICE 0. Asahi Kasei Microdevices Corporation (“AKM”) reserves the right to make changes to the information contained in this document without notice. When you consider any use or application of AKM product stipulated in this document (“Product”), please make inquiries the sales office of AKM or authorized distributors as to current status of the Products. 1. All information included in this document are provided only to illustrate the operation and application examples of AKM Products. AKM neither makes warranties or representations with respect to the accuracy or completeness of the information contained in this document nor grants any license to any intellectual property rights or any other rights of AKM or any third party with respect to the information in this document. You are fully responsible for use of such information contained in this document in your product design or applications. AKM ASSUMES NO LIABILITY FOR ANY LOSSES INCURRED BY YOU OR THIRD PARTIES ARISING FROM THE USE OF SUCH INFORMATION IN YOUR PRODUCT DESIGN OR APPLICATIONS. 2. The Product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious public impact, including but not limited to, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. Do not use Product for the above use unless specifically agreed by AKM in writing. 3. 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The Products and related technology may not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable domestic or foreign laws or regulations. 5. Please contact AKM sales representative for details as to environmental matters such as the RoHS compatibility of the Product. Please use the Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. AKM assumes no liability for damages or losses occurring as a result of noncompliance with applicable laws and regulations. 6. Resale of the Product with provisions different from the statement and/or technical features set forth in this document shall immediately void any warranty granted by AKM for the Product and shall not create or extend in any manner whatsoever, any liability of AKM. 7. 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