CTJ Receiver Assembly – 10 mm x 10 mm Solar Cell Receiver for Terrestrial Concentrator Photovoltaics (CPV) Cell Optimized for 1000X Concentration SOLAR POWER DATASHEET | OCTOBER 2011 The Concentrator Triple-Junction (CTJ) receiver assembly takes the world-class efficiency of EMCORE’s multi-junction space solar cells and combines it with state-of-the-art packaging technology to create the most efficient CPV assembly today. Utilizing advanced, high-speed manufacturing and test equipment, EMCORE produces high-quality receivers to meet the rigorous demands of CPV applications. Features Supports EMCORE’s multi-junction CPV solar cell Cell Optimized for highest performance at 1000 suns. Includes bypass diode, box connectors for wire insertion High-quality Direct-Bond-Copper substrate Void-free solder die attach Low thermal resistance Low electrical resistance Qualification Tests for Standard Receivers Additional Information Solar cell receiver assembly includes EMCORE’s 10 mm x 10 mm triple-junction solar cell, bypass diode and box connectors. Position control of all components and integrated fiducials facilitates integration into higher level assemblies. High-quality Direct-Bond-Copper substrate provides anode and cathode separation. Aluminum oxide ceramic interlayer provides electrical insulation between top and bottom metallization. Title Standard Thermal Aging MIL-PRF-38534, Appendix C, Section C.126.96.36.199.2 Wire Bond Strength Testing Low electrical resistance and void-free solder die attach allow for high current operation. Powered Thermal Cycling IEC 62108, Section 10.6, Option 2 for thermal cycling parameters Bare cell format allows for secondary optical element attachment and encapsulation. Damp Freeze IEC 62108, Section 10.8 Stud Pull MIL-STD-883, Method 2027, stud pull test Light Biased Damp Heat IEC 62108, Section 10.7 with light bias Mechanical Shock JESD22-B104C Vibration JESD22-B103B Thermal Shock MIL-STD-883 Method 1011 ESD Damage Threshold JESD22-A114 (HBM) Custom receiver designs are available. Typical Efficiency 37%, 25°C, AM1.5, 100 W/cm2 Cell Active Area 1.012 cm2 Substrate Direct-bond-copper, A12O3 substrate with Au/ Ni surface plating (copper thickness 0.3 mm A12O3 thickness 0.38 mm) Bypass Diode 15A Schottky Operating Temperature -40°C to 100°C Max Temperature 180°C Part No. 615238 | REV 2011.10 Information contained herein is deemed reliable and accurate as of the issue date. EMCORE reserves the right to change the design or specification at any time without notice.