Pulsed IV/RF Measurements for Compact Model Extraction

Pulsed IV/RF Measurements for
Compact Model Extraction
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System Design from Compact Models
Component level
Pulsed IV and RF
measurements
Angelov GaN
FET model
extraction
VNA Load
Pull model
validation
Circuit level
IC Design - ADS
IC X-Parameter
model - ADS
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System level
Simulation at
system level
Compact FET model extraction flow
1.18
1.6
y = 0.0049x + 0.6889
1.2
Rs
1
0.6
1.04
0.4
1.02
0
Rg
Lg
Cpg
Ls
Cpd
Ld
Rs
Rd
Ri
Cds
τ
Gm
Gd
Cgs
Cgd
Rgd
Non-linear
capacitances
IV Model
1.1
1.08
1.06
y = 0.0029x + 0.6375
0.8
Small-Signal
y = -0.0008x + 1.1543
1.12
Idss
Rs, Rd
1.16
1.14
Rd
1.4
50
100
T°C
150
200
0
50
100
T°C
150
200
Thermal
model
Trapping
effects
Dgs=f(Vgs)
Dgs=f(Vgs,T)
Dgd=f(Vgd)
Dgd=f(Vgd,T)
Ids=f(Vgs,Vds)
Ids=f(Vgs,Vds,T)
Ids=f(Vgs_trap,Vds,T)
Cgs=f(Vgs)
Cgd=f(Vgd)
Rs=f(T)
Rd=f(T)
Various effects are successively added
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Pulsed IV measurements – Why?
Self-Heating
Trapping Effects
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Pulsed IV measurements – How?
Short pulse : Quasi-isothermal conditions
Low duty cycle : Constant mean temperature
Quiescent bias point : Thermal conditions fixed
Several quiescent bias point
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Pulsed IV – Block Diagram
How to get accurate pulsed IV measurements ?
 PIV system
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Pulsed IV – Accuracy Considerations
How to get accurate pulsed IV measurements ?
Gate
+20V
15 bits + sign
250V
Drain
16 bits
15 bits + sign
25V
-20V
Pulse shape monitoring
20ns time resolution
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16 bits
Pulsed IV – Accuracy Considerations
How to get accurate pulsed IV measurements ?
1A
AM212
100mA
Gate access
33µA
4mA
1A
3,3µA
400µA
100mA
10mA
330nA
40µA
10mA
1mA
33nA
4µA
1mA
0mA
-2V
-20V
650µV
20mV
20V
65µV
2mV
2V
0V
Measurement Resolution
Voltage Absolute Accuracy
Voltage Range
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Pulsed IV – Accuracy Considerations
How to get accurate pulsed IV measurements ?
10A
AM221
200µA
20mA
Drain access
1A
0A
22µA
2mA
Measurement Resolution
Voltage Absolute Accuracy
Voltage Range
0,53mV
50mV
0V
4,9mV
500mV
25V
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250V
Pulsed S-parameter measurements
Pulsed S parameter measurements
Bias
Bias
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Pulsed S-parameter measurements
The first & most important point :
•
Pulsed S parameter measurements must not
be noisy
•
Small S2P measurement variation = strong
influence over the linear model extraction :
optimization algorithm
Requirements :
Dynamic range in pulsed mode > 90dB for Duty Cycle ~ 5%
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Pulsed S-parameter measurements
Pulsed S-parameter measurements must not be noisy at low duty cycle with
narrow pulse width
Pulse detection methods
Narrowband detection
Wideband detection
Receiver samples
Receiver samples
IF filter
IF filter
•
No pulse desensitization
•
•
Increased noise with narrow pulse width due
to wider IF bandwidth
Narrower minimum pulse width than
wideband pulse
•
Reduced dynamic range with low duty cycle
due to pulse desensitization by 20*log(duty
cycle)
•
Limited pulse width by maximum available IF
bandwidth
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PNA/PNA-X Noise reduction
techniques and performances
Peak-to-peak noise with wideband detection at 10% duty cycle
Averaging 20 times in calibration and measurements
No averaging in calibration and measurements
Pulse
width
(IFBW)
0.03 dB
10 us
(150 kHz)
0.04 dB
5 us
(280 kHz)
0.06 dB
0.09 dB
1 us
(1.5 MHz)
500 ns
(3 MHz)
0.005 dB
0.006 dB
0.012 dB
0.013 dB
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PNA/PNA-X Noise reduction
techniques and performances
Dynamic range with wideband detection at 10% duty cycle with 10 us, 5 us, 1 us,
500 ns pulse width
No averaging in calibration and measurements, 1%
smoothing on
Averaging 20 times in calibration and measurements,
1% smoothing on
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PNA/PNA-X Noise reduction
techniques and performances
Peak-to-peak noise at 10% duty cycle
Wideband detection with 20 times averaging in
calibration and measurements
Narrowband detection with no averaging in calibration
and measurements
Pulse
width
0.005 dB
10 us
0.009 dB
0.006 dB
5 us
0.009 dB
0.012 dB
0.013 dB
1 us
500 ns
0.012 dB
0.011 dB
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PNA/PNA-X Noise reduction
techniques and performances
Dynamic range with narrowband detection at 500 ns pulse width
Hardware
gating
Crystal
filter
No Averaging, 1% smoothing on, 500 Hz IF bandwidth
>100 dB at 10%
>100 dB at 5%
90 dB at 1%
85 dB at 0.5%
Software
gating
Spectral
nulling
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VNA performance comparisons
E836x Legacy PNA
N524xA PNA-X
N522xA New PNA
Pulse generator
External
Internal/External
Internal/External
Pulse modulator
External
Internal/External
Internal/External
Max BW/Min PW
35 kHz / 50 us
15 MHz / 100 ns
15 MHz / 100 ns
High level noise*
0.006 dBrms
0.002 dBrms
0.002 to 0.003 dBrms
Dynamic range**
114 to 123 dB
124 to 129 dB
127 dB
Min IF gate width
20 ns
<20 ns
<20 ns
Dynamic range***
85 dB
<105 dB
<105 dB
Wideband detection
Narrowband detection
* Specified as trace noise magnitude, at 20 GHz, at 1 kHz IF bandwidth
** Specified performance at 20 GHz, at 10 Hz IF bandwidth
*** Measured performance at 10 GHz at 10 Hz IF bandwidth, 1% duty cycle
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PNA/PNA-X internal pulse access
• Internal or external master pulse (PULSE SYNC IN)
• Synchronized data acquisition (P0)
• Synchronized internal pulse generators (P1 – P4) with independent
delay and width
• Internal or external drive for modulators or receiver gates
N1966A Pulse I/O adapter
Search “1408-21” on
www.agilent.com
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Pulsed IV/RF parameter measurements
How to get accurate pulsed IV measurements ?
Synchronisation between Pulse IV and pulse S parameters
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Pulsed S-parameter measurements
How to get accurate pulsed IV measurements ?
Synchronisation between Pulse IV and pulse S parameters
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Compact FET model extraction flow
1.18
1.6
y = 0.0049x + 0.6889
1.2
Rs
1
0.6
1.04
0.4
1.02
0
Rg
Lg
Cpg
Ls
Cpd
Ld
Rs
Rd
Ri
Cds
τ
Gm
Gd
Cgs
Cgd
Rgd
Non-linear
capacitances
IV Model
1.1
1.08
1.06
y = 0.0029x + 0.6375
0.8
Small-Signal
y = -0.0008x + 1.1543
1.12
Idss
Rs, Rd
1.16
1.14
Rd
1.4
50
100
T°C
150
200
0
50
100
T°C
150
200
Thermal
model
Trapping
effects
Dgs=f(Vgs)
Dgs=f(Vgs,T)
Dgd=f(Vgd)
Dgd=f(Vgd,T)
Ids=f(Vgs,Vds)
Ids=f(Vgs,Vds,T)
Ids=f(Vgs_trap,Vds,T)
Cgs=f(Vgs)
Cgd=f(Vgd)
Rs=f(T)
Rd=f(T)
Various effects are successively added
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Thermal effects
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Thermal effects
• Temperature dependence with ambient or chuck temperature
0.9
0.5
1.0
0.8
-40°C
0.7
0.3
0.3
0.2
0.1
Ids (A)
0.4
150°C
0.4
0.6
0.5
Ids (A)
Ids (A)
25°C
0.8
0.6
0.4
0.2
0.2
0.1
-0.0
0.0
0.0
-0.2
-0.1
0
5
10
15
20
25
30
35
40
-0.1
0
45
5
10
15
20
25
30
35
40
45
Vds (V)
Vds (V)
1
0
5
10
15
20
25
Vds (V)
• Static and Dynamic self-heating effects
1.0
Static
0.8
2
Ids (A)
0.6
0.4
0.2
-0.0
-0.2
0
20
40
60
80
100
Vds (V)
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Dynamic
30
35
40
45
Thermal effects
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Thermal effects
Thermal resistance extraction → coincidence method
Ids
DC, Tchuck1 = 25°C
same Vgs
Pulsed from (0,0), Tchuck2 = 100°C
DC curve
Tj1 = Tchuck1 + Rth*Pdiss1
Pulsed curve
Tj2 = Tchuck2 + Rth*Pdiss2
Vds
=0
At intersection point
Tj1 =Tj2
=>
Rth = (Tchuch2 – Tchuck1)/ Pdiss1
Tchuck1 + Rth*Pdiss1 = Tchuck2
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Thermal effects
Thermal impedance extraction – by measurements
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Trapping effects
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Trapping effects
• Charge of the capacitance = Ionized traps
Charge through Rcapture, Emission through Rémission
C
R
Rcapture
Port
Vin
Diode
C8
signal reshaping
circuit
diode
Port
Vout
R
Remission
Diode = dissymmetry of the
capture and emission process
Tuning of the magnitude of the
trapping effects
Fundamental assumption : dissymetry of the capture and emission process
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Trapping effects
Id (A)
Id (A)
Measurements to extract Gate-lag at very low dissipated power
Vds(V)
Response to an ideal square
shaped pulsed voltage
Id (A)
Time (ms)
Emission
Time (ms)
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Trapping effects
Id (A)
Id (A)
Measurements to extract Drain-lag at very low dissipated power
Time (ms)
Vds(V)
Id (A)
Capture
Emission
Time (ms)
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Trapping effects
• Bias dependant gate lag -> current reduction over the entire characteristic
Bias dependent drain lag -> current reduction and shifts the knee-voltage to a higher Vds
Model covers knee walkout to avoid
errors in calculation of output power.
0.7
H
0.6
gate-lag : Id
↘ => Pout ↘
0.5
drain-lag :
Id ↘
Vknee↗
=> Pout ↘
Ids (A) (H)
0.4
0.3
0.2
0.1
0.0
-0.1
0
5
10
15
20
25
30
35
40
Vds (V)
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45
50
55
60
Trapping effects
• Decreasing form of the mean output current only reproduced with traps accurately modeled
4
H
Ids ↘
0.30
meas
0.25
model without traps model
model with traps model
0.20
0.15
-5
0
(H)
(H) (W)
Pout W
Pout
Pout W (H)
5
10
15
20
25
30
2
1
0.00
0.05
0.10
0.15
0.20
0.25
0.30
0.35
Pin (W)
Pin( dBm)
4
3
3
0
-10
H
H
Pout W (H) (H)
Pout W (H)
Ids (A) (H) (H)
(A) (H)
IdsIds(A)
0.35
H
Pout ↘
2
meas
model without traps model
model with traps model
1
0
25
30
0.00
0.05
0.10
0.15
0.20
0.25
0.30
0.35
Pin (W)
A Drain-Lag Model for AlGaN/GaN Power HEMTs, Jardel, O. ; Charbonniaud,
Microwave Symposium, 2007. IEEE/MTT-S International 2007
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Compact FET model extraction flow
1.18
1.6
y = 0.0049x + 0.6889
1.2
Rs
1
0.6
1.04
0.4
1.02
0
Rg
Lg
Cpg
Ls
Cpd
Ld
Rs
Rd
Ri
Cds
τ
Gm
Gd
Cgs
Cgd
Rgd
Non-linear
capacitances
IV Model
1.1
1.08
1.06
y = 0.0029x + 0.6375
0.8
Small-Signal
y = -0.0008x + 1.1543
1.12
Idss
Rs, Rd
1.16
1.14
Rd
1.4
50
100
T°C
150
200
0
50
100
T°C
150
200
Thermal
model
Trapping
effects
Dgs=f(Vgs)
Dgs=f(Vgs,T)
Dgd=f(Vgd)
Dgd=f(Vgd,T)
Ids=f(Vgs,Vds)
Ids=f(Vgs,Vds,T)
Ids=f(Vgs_trap,Vds,T)
Cgs=f(Vgs)
Cgd=f(Vgd)
Rs=f(T)
Rd=f(T)
Various effects are successively added
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