AN714 A Compact Controller for Brushless DC Motors

AN714
Vishay Siliconix
A Compact Controller for Brushless DC Motors
Wharton McDaniel
The drive electronics for 3-phase brushless dc motors often
occupy a surprising amount of space. Complex circuitry is
needed to drive the power MOSFETs, and this gets even more
complex in applications above 15 V. Above 15 V, level shifted
circuitry is required for proper drive of the high-side MOSFETs,
whether they are n-channel or p-channel. Add to this the
possible need for heat sinks. Even when the rDS(on) of the
MOSFETs is low enough to eliminate the requirement for
heatsinking, the MOSFETs’ package size will require a lot of
board area or headroom above the PC board surface. The
Si9979 brushless dc controller eliminates much of this
complexity for applications in the 20- to 40-V dc range. Housed
in a 7-mm SQFP package, the Si9979 reduces assembly cost
and simplifies both motor and electronics packaging.
been configured to work with either 60 or 120 commutation
sensor spacing. The internal voltage regulator allows the
Si9979 to operate over a wide input voltage range, 20 to 40 V
dc, and to power the commutation sensors over this same
range. Control inputs include direction, quadrature select,
PWM, and braking. A tachometer output is also featured.
Protection features include cross-conduction protection,
current limiting, and undervoltage lockout. The FAULT output
indicates when undervoltage, overcurrent, disable, or invalid
sensor shutdown has occurred.
The Si9979 is a monolithic controller with integral high-side
drive circuitry, allowing easy implementation of an
all-n-channel three-phase bridge. The commutation logic has
Functionally the Si9979 is made up of the commutation logic,
the gate drive outputs, VDD regulator and output, and
protection circuitry.
V+
Bootstrap Reg.
42
36
Charge Pump
Low-Voltage
Regulator
VDD
43
VDD
CAPA CAPB CAPC
34
High-side
U.V. Lockout
35
Bootstrap Reg.
VREF
Low-side
U.V. Lockout
INA
INB
INC
60/120
EN
F/R
QS
PWM
BRK
TACH
FAULT
30
31
1
VDD
2
VDD
Bootstrap Reg.
3
VDD
Charge Pump
4
VDD
5
VREF
6
VREF
7
VREF
8
VREF
9
VREF
32
Charge Pump
28
26
Input
Logic
VDD
27
33
29
10
25
RT/CT
GTA
SA
CAPB
GTB
SB
CAPC
GTC
SC
GBA
GBB
GBC
11
13-16, 21-24
37-41, 44-48
RT
CAPA
18
One Shot
17
Figure 1.
Document Number: 70585
08-Jun-00
–
+
20
19
GND
IS–
IS+
Si9979 Functional Block Diagram
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The commutation logic generates the basic commutation
signals from the commutation sensors and modifies those
signals according to the control inputs EN, F/R, PWM, QS, and
BRK.
whether bottom only or bottom and top MOSFETs are chopped
by the PWM signal, and BRK breaks the motor by turning on
all the bottom MOSFETs. The default conditions are EN enabled, F/R - forward rotation, PWM - no chopping on active
gate drives, QS - only bottom MOSFETs chopped by PWM,
and BRK - braking function on.
The basic commutation signals are generated from the code
provided by the commutation sensors connected to INA, INB,
and INC. These inputs are designed to be driven from open
collector Hall Effect switches and have active pull ups to VDD.
The 60/120 input must be set to be compatible with the sensor
spacing used. It also has an active pull-up to VDD, with the
default condition being 60-degree spacing. Figure 1 gives the
basic timing for both 60-degree and 120-degree commutation.
This output is an extension of the commutation logic. When
one of the commutation sensors changes state, a negative
going pulse is emitted (500 ns typical). This gives six pulses
per electrical revolution. The output is configured as an open
drain for easy interfacing.
The control inputs EN, F/R, PWM, QS, and BRK are TTL
compatible inputs with internal pull-ups. TTL compatibility
allows easy interface with microcontrollers and other common
logic devices. Functions are divided as follows: EN input
enables the outputs, F/R determines the direction of the
motor’s rotation, PWM accepts a digital pulse width modulation
signal for controlling the motor’s speed, QS determines
Each phase or half-bridge output is driven by a pair of
n-channel MOSFETs. These are controlled by a low- and a
high-side gate driver. They have been designed to drive a
600-pF load with a 110-ns rise time and a 50-ns fall time.
The low-side gate is driven directly from the commutation logic
and is powered by VDD. This means that VDD must be
decoupled with a 1-F capacitor; otherwise the turn-on surge
current can cause VDD to drop to the level of an undervoltage
condition.
INA
60 Spacing
INB
INC
INA
120 Spacing
INB
INC
GT-
Top Gate
Drive
A
GTB
GTC
GBA
Bottom Gate
Drive
GBB
GBC
PHASE
A
Drive
Outputs
PHASE
B
PHASE
C
Figure 2.
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Basic Timing for Both 60 and 120 Commutation
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The high side is a floating circuit powered from a combination
bootstrap/charge pump supply. The bootstrap capacitor is
charged to VDD when ever the low-side MOSFET is turned on.
For the rest of the time, the charge pump keeps the bootstrap
capacitor charged, replacing the charge used in powering the
high-side circuitry and in turning on the MOSFET. The value of
the bootstrap capacitor is a function of the MOSFET being
driven. The bootstrap voltage should not drop more than 1 V
as the result of a MOSFET turn-on. For a 60-V dual n-channel
MOSFET like the Si4946EY, 30 nC (Qg) is required for turn-on
at a VGS of 10 V. Using the equation C = Qg/VGS, 3 nF is
required to provide sufficient charge for turn-on. To meet the
criteria of dropping only 1 V at turn-on, the capacitor needs to
be 10 times as large, making the equation CBOOT =
10(Qg/VGS). This makes the minimum value of CBOOT equal
to 0.03 F. Table 1 gives minimum recommended values for
several MOSFETs that might be used with the Si9979. This
minimum recommended value is one standard value above
the minimum calculated value.
TABLE 1.
BOOTSTRAP CAPACITOR
SELECTION
rDS(on)
Qg @
VGS = 10 V
(nC)
Minimum
Recommended
CBOOT (F)
Si4946
0.055
30
0.039
Si9956
0.10
7
0.001
Part
Number
VDD REGULATOR AND OUTPUT
The regulation circuitry of the Si9979 has been sized to source
20 mA to power the commutation sensors. When the operating
ambient temperature rises to 70C, the input voltage (V+) must
be limited to 32 V dc.
V+
PROTECTION CIRCUITRY
The protection circuitry provides current limit, crossconduction protection, undervoltage lockout, and the FAULT
output.
CURRENT LIMIT
The current limit circuitry consists of a comparator driving a
one-shot multivibrator (Figure 4). The comparator has an
internal 100-mV reference voltage on the inverting input and
an external sensing resistor connected to the noninverting
input. These inputs should be connected directly to the
sensing resistor. This will eliminate the effects of any noise in
the ground traces. The motor current must generate 100 mV
across a sensing resistor for the comparator to trip. This in turn
triggers the one-shot, turning off the active MOSFETs for a
period defined by the product of RT and CT.
If the current has dropped below the threshold by the time the
off period has expired, the MOSFETs will be turned on again.
If the overcurrent condition remains after the off period has
expired, the MOSFETs will be held off until the current drops
below the threshold.
With the current limit off period in the 100-s range,
cycle-by-cycle current limiting is achieved. If the current limit off
period is reduced to the 10-s range, a constant current mode
current limit is achieved. In this mode, the RMS current (and
therefore the torque) is maximized for the current limit setting.
This is particularly useful when a maximum acceleration rate
is required at power on. Figure 5 shows typical current
waveforms for durations of the off period.
CROSS CONDUCTION PROTECTION
When driven in the anti-phase mode, the high-side and
low-side MOSFETs of each active phase are toggled. To
prevent shoot-through, each half-bridge has break-beforemake circuitry. This delays the MOSFET turn for 250 ns from
the turn off of the opposite MOSFET.
UNDERVOLTAGE LOCKOUT
VDD
OUT
VDD
1 F
Figure 3.
Si9979
External VDD Regulator
Otherwise the Si9979 may overheat. In cases where this
condition cannot be met, or where more current is required, an
external series pass NPN can be added as shown in Figure 3.
Document Number: 70585
08-Jun-00
Internal circuitry monitors the voltage level on VDD and the
high-side supplies. This ensures that there is sufficient voltage
to turn on the MOSFETs. Should the voltage level on VDD drop
below a nominal 12.2 V, all gate drives will be turned off until
the undervoltage condition is gone. Each of the high-side
supplies is monitored only when it is referenced to ground. If
the high-side voltage is under a nominal 12.7 V, the high-side
will not be allowed to turn on.
FAULT OUTPUT
A negative going transition indicates that an undervoltage,
current limit, or invalid sensor code condition exists. This
output is configured as an open drain.
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To
Commutation
Logic
Current
From 3-Phase
MOSFET Bridge
One
Shot
RSENSE
RT
100 mV
CT
Figure 4.
Current Limit Circuitry
100 ms
10 ms
Figure 5.
Current Waveforms
Q
D1 – Square
b
L
e
L1
Pin 1 Indicator
A1
1 2 3
C
D – Square
A
L2
Dim
Min
Max
Min
Max
A
1.35
1.60
0.053
0.063
A1
b
C
D
D1
e
L
L1
L2
0.04
0.16
0.002
0.006
0.14
0.26
0.006
0.010
0.117
0.177
0.005
0.007
6.90
7.10
0.272
0.280
8.70
9.30
0.343
0.366
0.40
0.60
0.016
0.024
Q
–
7.80
–
0.307
7.80
8.20
0.307
0.323
0.30
0.70
0.012
0.028
0
7
0
7
*For Reference Only
Figure 6.
48-Pin SQFP Package
The Si9979 was packaged in a 48-pin SQFP to make drive
circuits as compact as possible. The package has a 7-mm
body with a total footprint of 9.3 mm on a side, occupying
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86.5 mm2. The package dimensions are given in Figure 6.
Beyond the basic footprint, the ground pins of the package
should be connected to copper. This will help transfer heat out
of the package and in to the PC board (Figure 7). Heat
dissipation is especially important when the internal regulator
is used to supply the current to the commutation sensors.
Document Number: 70585
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peak because of a system power supply limitation. It will take
five seconds for the motor to accelerate the load to speed.
THE COMMUTATION SENSOR INTERFACE
Figure 7.
Most brushless dc motors use Hall effect switches with open
collector outputs. These can be connected directly to INA, INB,
and INC. However, there are some motors which use Hall effect
sensors with differential outputs. These are not compatible
with the commutation inputs on the Si9979. The circuit in
Figure 9 is an example of how differential output Hall sensors
can be interfaced to the single ended inputs of the Si9979.
Pad Pattern with Heat Sinking Copper (2 )
A 3 PHASE BRUSHLESS DC DRIVE
THE CURRENT SENSE RESISTOR
Figure 8 shows a typical 3-phase brushless dc drive circuit.
Designers should consider both the motor being driven and
any conditions imposed by the system when selecting the
values of the current sense resistor, the R/C for the current limit
one-shot, and the bootstrap capacitor, as well as the actual
MOSFETs.
The current limit level is determined by the motor starting
requirements, such as acceleration time, the power capability
of the power MOSFETs, and the capability of the system power
supply to supply current to the motor. For this design, the
current limit level will be set at 5 A peak. There is a simple way
to set this level. Select a sensing resistor which will give
100 mV when 5 A flows through it. Using Ohm’s law, RS =
100 mV/IPK. Therefore a 20-mW resistor is required. A 0.5-W
resistor will handle the starting condition, since it is a transient
condition. At the load current of 2 A, power dissipation is less
than 0.10 W.
MOTOR DEFINITION
The motor being driven will be operated at 24 V dc. The typical
load current is 2 A. The starting current must be limited to 5-A
V+
C1
47 mF
C8
1 mF
C3
0.1 mF
Q1
VDD
C9
1 mF
Q2
C10
1 mF
Q3
Si9979CS
C2
1 mF
HA
HB
HC
42 V+
43
VDD
1
INA
2
INB
3 IN
GTA
SA
CAPA
GTB
C
4
GND
60/120
5
EN
EN
6
F/R
PWM
11
FAULT
18
D. GND
17
R1
10 kW
30
31
CAPB
32
26
CAPC
PWM
10
TACH
A
36
C5
B
C6
SC 27
28
QS
9
BRK
35
SB
GTC
F/R
7
8
QS
34
BRK
GBC 25
29
GB
TACH
FAULT
GBA 33
C
C7
B
IS+
RT
19
IS– 20
RT/CT
Q4
Q5
Q6
GND
12-16, 21-24
37-41, 44-48
(18-22,
27-30)
C4
0.1 mF
R2
GND
Figure 8.
Document Number: 70585
08-Jun-00
Three-Phase Brushless DC Motor Controller
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V+
R8, 1.3
k
1
VDD
C4, 0.1
V–
R7, 1.3 k
2
C5, 0.1
C4, 0.1
C1, 0.01
R1, 1 k
3
HA–
HA+
To
Differential
Halls
INA
R2, 1 k
4
To Si9979
C2, 0.01
R3, 1 k
5
HB–
INB
R4, 1 k
6
C3, 0.01
AB+
R5, 1 k
7
HC–
HC+
INC
R6, 1 k
8
GND
Figure 9.
Interface for Differential Hall Sensors
There are alternative ways of setting current limits which use
standard resistors to adjust the level. The first method is to use
a resistive divider (Figure 10). This forces the voltage drop
across the sensing resistor to be greater than 100 mV, so 100
mV can be achieved at Is+. If this method is used to get the 5-A
level, RSENSE should be selected at 50 mW. A current of 5 A
will generate a 250-mV drop across RS. Then select values for
R1 and R2 to divide this by 2.5, applying 100 mV to IS+. Setting
R1 to 4.2 kW and R2 to 6.2 kW provides this division. This
adjustability is gained at the cost of increasing the power rating
of the sensing resistor to 1.5 W.
If the current limit off time is kept short, acceleration can take
place as quickly as possible while respecting the peak starting
current of 5 A. The recommended setting is 10 ms. Since this
off time is defined by the product of RT and CT, RT is set to
10 kW, making CT equal to 0.001 mF.
Dc motors demand more current during startup than they do
under normal running conditions. As a result, the most
important specification for the power MOSFETs is their ability
to withstand the starting current. This is especially true when
surface-mount devices are involved.
Another way to get an adjustable current limit level is to bias the
IS- pin up from ground (Figure 11). This raises the threshold
from 100 mV to 100 mV + VBias. With the 50-mW sense
resistor, 150 mV of bias needs to be applied to IS- to raise the
threshold to the 250-mV level required for a 5-A current limit.
The bias voltage must be kept under 0.8 V to ensure the input
is not damaged. As in the resistive divider method, this method
forces the increase in the sense resistor’s power rating. Also,
the stability of the threshold voltage is affected by the stability
of the bias voltage.
To
Commutation
Logic
Current
From 3-Phase
MOSFET Bridge
If the current starting level is 5 A, and the current limit circuitry
is set for constant current operation, then power dissipation will
determine the device chosen.
The Si4946EY LITTLE FOOT power MOSFET is a good
choice for this application. Its worst case on resistance is
110 mW. This puts the power dissipation at approximately
1.7 W. With the Rja of 68.5C/W, the junction temperature will
stay below 150C in ambient temperatures as high as 45C.
To
Commutation
Logic
Current
From 3-Phase
MOSFET Bridge
R1
One
Shot
One
Shot
R2
RT
RSENSE
100 mV
RT
100 mV
RSENSE
0.8 V max
R1
CT
CT
Figure 10. Resistive Divider Adjustment
of Current Limit Level
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Figure 11. Reference Voltage Offset Adjustment
of Current Limit Level
Document Number: 70585
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THE BOOTSTRAP CAPACITOR
The value of the bootstrap capacitor is determined by the gate
charge required for the MOSFET selected. The Si4946EY
requires 30 nC (Qg) at a VGS of 10 V (Figure 12). Using the
equation CBOOT = 10 (Qg/VGS), the typical value is 0.03 F.
Table 1 shows a recommended minimum value of 0.039 F,
which provides some headroom.
V GS – Gate-to-Source Voltage (V)
10
VDS = 25 V
ID = 2 A
8
power MOSFETs. There are several decoupling capacitors in
the design. The capacitors that are decoupling IC pins should
be placed as close as possible to the pin itself, with the ground
side of the capacitor going directly to an IC ground pin.
Decoupling of the power bus should occur at the MOSFETs to
minimize the surge current in the traces. Separate power and
ground traces should be run to eliminate noise generated by
fast MOSFET transitions. These traces should be terminated
as close as possible to the V+ and GND inputs on the PC
board. Wherever separate traces are not feasible, the
common trace should be as wide as possible. Wide traces
should be connected to the drain pins of the power MOSFETs
to draw heat away from their packages. These traces should
be at least 0.1” wide.
6
Figure 13 shows a sample PC board layout using the Si9979
with Si9940 MOSFETs. The overall dimensions of this board
are 2.1” 1.85”. This size board can be mounted directly on
a motor.
4
Si9940
2
CONCLUSION
0
0
10
5
15
20
25
30
Qg – Total Gate Charge (nC)
Figure 12.
PC BOARD LAYOUT
Careful attention should be paid to decoupling, to routing of
traces that carry the motor current, and to placement of the
a) Component Placement
Drive circuitry can be made more compact when high levels of
integration are combined with surface-mount packaging. The
PC board layout shown below is small enough to be mounted
directly on a motor. This keeps the motor leads short and
minimizes the switching noise associated with long motor
leads. LITTLE FOOT MOSFETs help minimize the board area
while allowing the designer to tailor the design to the motor
being driven. Combined with the Si9979, the result is a
compact, all-surface-mount solution allowing fully automated
assembly.
b) PC Board Layout
Figure 13.
Document Number: 70585
08-Jun-00
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