V4PAL45 www.vishay.com Vishay General Semiconductor Surface Mount Trench MOS Barrier Schottky Rectifier FEATURES • Very low profile - typical height of 0.95 mm • Ideal for automated placement TMBS® SMPATM • Trench MOS Schottky technology • Low power losses, high efficiency • Low forward voltage drop • Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C Top View Bottom View DO-221BC (SMPA) • AEC-Q101 qualified available - Automotive ordering code; base P/NHM3 • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 TYPICAL APPLICATIONS For use in low voltage, high frequency inverters, freewheeling, DC/DC converters, and polarity protection applications. PRIMARY CHARACTERISTICS IF(AV) 4.0 A VRRM 45 V IFSM 80 A VF at IF = 4.0 A (TA = 125 °C) 0.41 V TJ max. 150 °C Package DO-221BC (SMPA) Diode variation Single die MECHANICAL DATA Case: DO-221BC (SMPA) Molding compound meets UL 94 V-0 flammability rating Base P/N-M3 - halogen-free, RoHS-compliant, and commercial grade Base P/NHM3 - halogen-free, RoHS-compliant, and AEC-Q101 qualified Base P/NHM3_X - halogen-free, RoHS-compliant, and AEC-Q101 qualified (“_X” denotes revision code e.g. A, B,.....) Terminals: matte tin plated leads, solderable per J-STD-002 and JESD22-B102 M3 suffix meets JESD 201 class 2 whisker test, HM3 suffix meets JESD 201 class 2 whisker test Polarity: color band denotes cathode end MAXIMUM RATINGS (TA = 25 °C unless otherwise noted) PARAMETER SYMBOL Device marking code Maximum repetitive peak reverse voltage Maximum DC forward current Peak forward surge current 10 ms single half sine-wave superimposed on rated load Operating junction and storage temperature range V4PAL45 UNIT 4L45 VRRM 45 IF (1) 4.0 IF (2) 3.0 IFSM 80 A TJ, TSTG - 40 to + 150 °C V A Notes (1) Units mounted on 15 mm x 15 mm pad areas, 2 oz. PCB (2) Free air, mounted on recommended copper pad area Revision: 06-May-15 Document Number: 87907 1 For technical questions within your region: [email protected], [email protected], [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 V4PAL45 www.vishay.com Vishay General Semiconductor ELECTRICAL CHARACTERISTICS (TA = 25 °C unless otherwise noted) PARAMETER TEST CONDITIONS IF = 2.0 A IF = 4.0 A Instantaneous forward voltage IF = 2.0 A IF = 4.0 A Reverse current VR = 45 V Typical junction capacitance 4.0 V, 1 MHz SYMBOL TA = 25 °C VF (1) TA = 125 °C TA = 25 °C TA = 125 °C IR (2) CJ TYP. MAX. 0.43 - UNIT 0.49 0.57 0.33 - 0.41 0.50 - 450 μA 5 15 mA 450 - pF V Notes (1) Pulse test: 300 μs pulse width, 1 % duty cycle (2) Pulse test: pulse width 5 ms THERMAL CHARACTERISTICS (TA = 25 °C unless otherwise specified) PARAMETER Typical thermal resistance SYMBOL V4PAL45 RJA (1) 100 RJM (1) 9 UNIT °C/W Note (1) Free air, mounted on recommended PCB, 2 oz. pad area; thermal resistance R JA - junction to ambient; RJM - junction to mount ORDERING INFORMATION (Example) UNIT WEIGHT (g) PREFERRED PACKAGE CODE BASE QUANTITY DELIVERY MODE V4PAL45-M3/I PREFERRED P/N 0.032 I 14 000 13" diameter plastic tape and reel V4PAL45HM3/I (1) 0.032 I 14 000 13" diameter plastic tape and reel V4PAL45HM3_A/I (1) 0.032 I 14 000 13" diameter plastic tape and reel Note (1) AEC-Q101 qualified RATINGS AND CHARACTERISTICS CURVES 2.4 4.5 TM = 135 °C, RthJM = 9 °C/W 4 2.2 D = 0.5 2 3.5 Average Power Loss (W) Average Forward Rectified Current (A) (TA = 25 °C unless otherwise noted) 3 2.5 2 TA = 25 °C RthJA = 100 °C/W 1.5 1 TM measured at cathode band terminal PCB mount 0.5 0 1.8 D = 0.8 D = 0.3 D = 0.2 1.6 1.4 D = 1.0 D = 0.1 1.2 1 T 0.8 0.6 0.4 0.2 D = tp/T tp 0 0 25 50 75 100 125 150 Mount Temperature (°C) Fig. 1 - Maximum Forward Current Derating Curve 0 0.4 0.8 1.2 1.6 2 2.4 2.8 3.2 3.6 4 4.4 4.8 Average Forward Current (A) Fig. 2 - Forward Power Loss Characteristics Revision: 06-May-15 Document Number: 87907 2 For technical questions within your region: [email protected], [email protected], [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 V4PAL45 www.vishay.com Vishay General Semiconductor Transient Thermal Impedance (°C/W) Instantaneous Forward Current (A) 50 TA = 150 °C 10 TA = 125 °C TA = 100 °C 1 TA = 25 °C 0.1 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1000 Junction to Ambient 100 10 1 0.01 0.1 Fig. 3 - Typical Instantaneous Forward Characteristics 10 100 Fig. 6 - Typical Transient Thermal Impedance 100 110 10 TA = 125 °C TA = 100 °C 1 0.1 TA = 25 °C 0.01 0.001 10 Epoxy printed circuit board FR4 copper thickness = 70 μm 100 TA = 150 °C Thermal Resistance (°C/W) Instantaneous Reverse Current (mA) 1 t -Pulse Duration (s) Instantaneous Forward Voltage (V) 90 80 70 60 50 40 30 S (cm2) 20 20 30 40 50 60 70 80 90 100 Percent of Rated Peak Reverse Voltage (%) Fig. 4 - Typical Reverse Leakage Characteristics 0 1 2 3 4 5 6 7 8 9 Copper Pad Areas (cm2) Fig. 7 - Thermal Resistance Junction to Ambient vs. Copper Pad Areas Junction Capacitance (pF) 1000 TJ = 25 °C f = 1.0 MHz Vsig= 50 mVp-p 100 10 0.1 1 10 100 Reverse Voltage (V) Fig. 5 - Typical Junction Capacitance Revision: 06-May-15 Document Number: 87907 3 For technical questions within your region: [email protected], [email protected], [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 V4PAL45 www.vishay.com Vishay General Semiconductor PACKAGE OUTLINE DIMENSIONS in inches (millimeters) DO-221BC (SMPA) 0.059 (1.50) 0.030 (0.75) 0.122 (3.10) 0.098 (2.50) Cathode Band 0.057 (1.45) 0.049 (1.25) 0.106 (2.70) 0.098 (2.50) 0.171 (4.35) 0.163 (4.15) 0.211 (5.35) 0.199 (5.05) 0.087 (2.20) 0.063 (0.75) 0.059 (1.50) 0.030 (0.75) Typ.: 0.019 (0.48) Mounting Pad Layout MAX. 0.037 (0.92) 0.039 (1.00) 0.035 (0.90) 0.012 (0.30) 0.006 (0.15) 0.087 (2.20) MIN. 0.060 (1.52) MIN. MIN. 0.122 (3.10) MIN. 0.059 (1.50) 0.217 (5.52) Revision: 06-May-15 Document Number: 87907 4 For technical questions within your region: [email protected], [email protected], [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. 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