CDHV Datasheet

CDHV
www.vishay.com
Vishay Techno
Thick Film Chip Dividers, High Voltage
FEATURES
• High voltage up to 3000 V
• Typical resistance ratios of 250:1, 500:1, etc;
maximum resistance ratio of 800:1
Available
• Flow solderable
• Tape and reel packaging available
Available
• Termination
style:
3-sided
wraparound
termination or single termination flip chip
available
• Suitable for solderable, epoxy bondable, or
wire bondable applications
• Termination material: solder-coated nickel barrier or
solder coated non-magnetic terminations standard; gold,
palladium silver, platinum gold, platinum silver or platinum
palladium gold terminations available
• Multiple styles, termination materials and configurations,
allow wide design flexibility
• Epoxy bondable or wire bondable non-magnetic
terminations available
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
Note
* This datasheet provides information about parts that are RoHS-compliant and / or parts that are non-RoHS-compliant. For example, parts
with lead (Pb) terminations are not RoHS-compliant. Please see the information / tables in this datasheet for details.
STANDARD ELECTRICAL SPECIFICATIONS
GLOBAL
MODEL
CASE
SIZE
MAXIMUM
WORKING
VOLTAGE (1)
V
3000
POWER RATING
P70 °C
W
RESISTANCE
RANGE (2)

TOLERANCE (3)
±%
TEMPERATURE
COEFFICIENT (4)
(-55 °C to +155 °C)
± ppm/°C
100
TCR TRACKING
± ppm/°C
CDHV 2512
2512
Contact factory
20M to 20G
1, 2, 5, 10, 20
50 (typical)
Notes
(1) Continuous working voltage shall be P x R or maximum working voltage, whichever is less.
(2) Resistance values below 1 G are calibrated at 100 V , and values of 1 G and above are calibrated at 1000 V . Calibration at other
DC
DC
voltages available upon request.
(3) Contact factory for tighter tolerances.
(4) Reference only: Not for all values specified. Consult factory for your value.
VOLTAGE AND TEMPERATURE COEFFICIENTS OF RESISTANCE CHART TYPICAL
RESISTANCE ()
20M
150M
800M
Note
• Contact factory for other ratios.
RATIO (TYPICAL)
250:1
300:1
500:1
VCR (ppm/V)
10
10
10
TCR (ppm/°C) -55 °C to +155 °C
100
150
200
GLOBAL PART NUMBER INFORMATION
New Global Part Numbering: CDHVAF20M0J2500GFB (preferred part number format)
C
GLOBAL
MODEL
D
H
TERM
STYLE
CDHV =
A = 3-sided
CDHV2512 B = Top only
V
A
F
TERM MATERIAL
2
0
RESISTANCE
VALUE (R1)
F = Nickel barrier
M = M
G = Non-magnetic
G = G
A = Palladium silver 20M0 = 20 M
B = Platinum gold 800M = 800 M
C = Gold
1G00 = 1 G
D = Platinum silver
E = Platinum
palladium gold
M
0
TOLERANCE
F=±1%
G=±2%
J=±5%
K = ± 10 %
M = ± 20 %
J
2
5
0
0
G
F
RATIO
R1/R2
RATIO
TOLERANCE
SOLDER
TERMINATION
3 digit
significant
figure, followed
by a multiplier
0500 = 50:1
2500 = 250:1
3000 = 300:1
5000 = 500:1
G=±2%
H=±3%
J=±5%
E = Sn100
F = Sn95/Ag5,
HSD
N = No solder
S=
Sn62/Pb36/Ag2,
HSD
T = Sn90/Pb10
Historical Part Numbering: CDHV2512AF2005J2500Ge2 (will continue to be accepted)
CDHV2512
A
F
2005
J
2500
G
B
PACKAGING
B = Bulk
F = T/R
(full reel)
1 = T/R
(1000 pcs)
5 = T/R
(500 pcs)
T = T/R
(250 pcs min.)
W = Waffle
tray
e2
HISTORICAL
TERM
TERM
RESISTANCE
RATIO
RATIO
SOLDER
TOLERANCE
MODEL
STYLE
MATERIAL
VALUE (R1)
R1/R2
TOLERANCE
TERMINATION
Note
• For additional information on packaging, refer to the Surface Mount Resistor Packaging document (www.vishay.com/doc?31543).
Revision: 21-Apr-15
Document Number: 68020
1
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
CDHV
www.vishay.com
Vishay Techno
MECHANICAL SPECIFICATIONS
ENVIRONMENTAL SPECIFICATIONS
Resistive element
Operating
temperature
Ruthenium oxide
Encapsulation
Glass
Substrate
-55 °C to +155 °C
Less than 0.5 % change when tested at
full rated power
Life
96 % alumina
Termination
Solder-coated nickel barrier or solder
coated non-magnetic terminations
standard. Gold, palladium silver, platinum
gold, platinum silver, platinum palladium
gold terminations available.
Solder finish
Pure tin or tin/lead solder alloys standard.
Tin/silver or tin/lead/silver solder
alloys available.
Note
• Reference only: Not for all values specified. Consult factory for
your size and value.
DIMENSIONS in inches (millimeters)
B
B
L
A
A
C
C
T
T
W
B
Style A
A
B
W
A
Style B
B
C
A
E
W
Style A Bottom
(3-sided wraparound)
LENGTH (L)
± 0.006 (0.152)
WIDTH (W)
± 0.006 (0.152)
THICKNESS (T)
± 0.005 (0.127)
A ± 0.005
B ± 0.005
C ± 0.005
E ± 0.005
STYLE A 
(3-sided wraparound)
0.250
0.126
0.025
0.025
0.025
0.040
0.046
STYLE B
(top only)
0.240
0.126
0.025
0.025
0.025
0.040
-
TERMINATION
Revision: 21-Apr-15
Document Number: 68020
2
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
CDHV
www.vishay.com
Vishay Techno
Rated Power in %
DERATING CURVE
120
100
80
60
40
20
0
- 55
- 25
0
25
50
75 100 125 155 175
70
Ambient Temperature in °C
Note
• (Reference only: Not for all values specified. Consult factory for your specific value.)
TYPE
TERMINATION
MATERIAL
Solderable
Nickel barrier
Solderable
Non-magnetic
Epoxy bondable/
solderable
Wire bondable/
epoxy bondable
TERMINATION
STYLE
TERMINATION STYLE/
MATERIAL CODE
SOLDER TERMINATION
CODE
3-sided (wraparound)
AF
Top only (flip chip)
BF
E or T (standard);
F or S (optional) (1)
3-sided (wraparound)
AG
Top only (flip chip)
BG
Platinum palladium gold
Top only (flip chip)
BE
N (standard);
F or S (optional) (2)
Gold
Top only (flip chip)
BC
N
Top only (flip chip)
BB
Palladium silver (3)
Epoxy bondable
Platinum gold
Platinum silver
E or T (standard);
F or S (optional) (1)
BA
N
BD
Notes
(1) Standard solder plating for the nickel barrier and non-magnetic parts is solder terminations E or T. Hot solder dipped terminations F or S are
also available.
(2) Use solder termination N for applications requiring epoxy bondable mounting, and solder terminations F or S for applications requiring
solderable mounting.
(3) While not recommended, palladium silver terminations could be used for solderable applications when using a solder alloy containing silver.
If the solder paste being used to solder the palladium silver terminated parts to the boards does not have a silver-based composition, then
the silver in the terminations could begin to leach when it is exposed to liquidus non-silver-based solders, causing the potential for
solderability and/or solder joint issues.
Revision: 21-Apr-15
Document Number: 68020
3
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Legal Disclaimer Notice
www.vishay.com
Vishay
Disclaimer
ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE
RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively,
“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
disclosure relating to any product.
Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or
the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all
liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special,
consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular
purpose, non-infringement and merchantability.
Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of typical
requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements
about the suitability of products for a particular application. It is the customer’s responsibility to validate that a particular
product with the properties described in the product specification is suitable for use in a particular application. Parameters
provided in datasheets and/or specifications may vary in different applications and performance may vary over time. All
operating parameters, including typical parameters, must be validated for each customer application by the customer’s
technical experts. Product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase,
including but not limited to the warranty expressed therein.
Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining
applications or for any other application in which the failure of the Vishay product could result in personal injury or death.
Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk. Please
contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by
any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners.
Material Category Policy
Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as RoHS-Compliant fulfill the
definitions and restrictions defined under Directive 2011/65/EU of The European Parliament and of the Council
of June 8, 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment
(EEE) - recast, unless otherwise specified as non-compliant.
Please note that some Vishay documentation may still make reference to RoHS Directive 2002/95/EC. We confirm that
all the products identified as being compliant to Directive 2002/95/EC conform to Directive 2011/65/EU.
Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as Halogen-Free follow Halogen-Free
requirements as per JEDEC JS709A standards. Please note that some Vishay documentation may still make reference
to the IEC 61249-2-21 definition. We confirm that all the products identified as being compliant to IEC 61249-2-21
conform to JEDEC JS709A standards.
Revision: 02-Oct-12
1
Document Number: 91000