PCAN series

PCAN
www.vishay.com
Vishay Dale Thin Film
High Power Aluminum Nitride, Wraparound Surface Mount,
Precision Thin Film Chip Resistor (up to 6 W)
FEATURES
•
•
•
•
•
•
High thermal conductivity aluminum nitride substrate
Power rating up to 6.0 W
Resistance range 30  to 175 
Resistor tolerance to ± 0.1 %
TCR to ± 25 ppm/°C
Flame resistant UL 94 V-0
APPLICATIONS
• Power supplies
PCAN series chip resistors are designed on aluminum
nitride ceramic substrates with enlarged backside
terminations to reduce the thermal resistance between the
topside resistor layer and the solder joint on the end users
circuit assembly.
Actual power handling capability is limited by the end user
mounting process. As with any high power chip resistor the
ability to remove the heat is critical to the overall
performance of the device.
• Power switching
• Braking system
TYPICAL PERFORMANCE
ABSOLUTE
TCR
25
TOL.
0.1
STANDARD ELECTRICAL SPECIFICATIONS
TEST
SPECIFICATIONS
CONDITIONS
Nichrome
-
30  to 175 
-
Material
Resistance Range
TCR: Absolute
25 ppm/°C (standard) and 100 ppm/°C
-
Tolerance: Absolute
0.1 %, 0.25 %, 0.5 %, 1.0 % and 5.0 %
-55 °C to +150 °C
2.0 W to 6.0 W (1)
Maximum at +70 °C
Stability: Absolute
R 1.0 %
1000 h at +70 °C
Voltage Coefficient
< 0.1 ppm/V
-
Working Voltage
75 V to 200 V
-
Operating Temperature Range
-55 °C to +155 °C
-
Storage Temperature Range
-55 °C to +155 °C
-
Power Rating: Resistor
Noise
< -30 dB
-
Shelf Life Stability: Absolute
± 0.01 %
1 year at +25 °C
Note
(1) Dependant on component mounting by user.
COMPONENT RATINGS
POWER RATING (mW)
WORKING VOLTAGE (V)
RESISTANCE RANGE ()
1206
CASE SIZE
2000 (2)
200
30 to 175
2512
6000 (2)
200
30 to 175
Notes
• 0603 and 0805 case size under engineering qualification.
(2) Dependant on component mounting by user.
Revision: 07-Aug-14
Document Number: 60125
1
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
PCAN
www.vishay.com
Vishay Dale Thin Film
ENVIRONMENTAL TESTS
ENVIRONMENTAL TEST
LIMITS MIL-PRF-55342
CHARACTERISTIC “H”
TYPICAL VISHAY
PERFORMANCE
± 50 ppm/°C
± 25 ppm/°C
Resistance temperature characteristic
Maximum ambient temperature at rated wattage
+70 °C
+70 °C
Maximum ambient temperature at power derating
+150 °C
+150 °C
Thermal shock
± 0.25 %
± 0.10 %
Low temperature operation
± 0.25 %
± 0.10 %
Short time overload
± 0.1 %
± 0.10 %
High temperature exposure
± 0.2 %
± 0.10 %
Resistance to soldering heat
± 0.25 %
± 0.10 %
Moisture resistance
± 0.4 %
± 0.50 %
Life at +70 °C for 1000 h
± 0.5 %
± 1.00 %
DIMENSIONS in inches
D
T
D
W
T
E
L
L
LENGTH
L
WIDTH
W
THICKNESS
T
MIN./MAX.
TOP PAD
D
1206
0.126 ± 0.008
0.063 ± 0.005
0.015 ± 0.003
0.020 + 0.005/- 0.010
0.040 ± 0.005
2512
0.259 + 0.009/- 0.015
0.124 ± 0.005
0.015 ± 0.003
0.020 ± 0.005
0.050 ± 0.005
CASE SIZE
BOTTOM PAD
E
LAND PATTERN DIMENSIONS in inches
1206 Land Pattern
0.1730
2512 Land Pattern
0.2910
0.0710
0.1260
0.0220
0.0755
0.1090
0.0910
STANDARD MATERIAL SPECIFICATIONS
Resistive element
Nichrome
Substrate material
Aluminum nitride
Terminations (Tin/lead)
Terminations (Lead (Pb)-free)
Revision: 07-Aug-14
Tin/lead solder over nickel barrier
Tin/silver/copper (Sn96.5/Ag3.0/Cu0.5) solder over nickel barrier
Document Number: 60125
2
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
PCAN
www.vishay.com
Vishay Dale Thin Film
PCAN1206 CHIP TEMP VS. APPLIED POWER
PCAN2512 CHIP TEMP VS. APPLIED POWER
12.0
12.0
10.0
30 Ω
8.0
Applied Power (W)
Applied Power (W)
10.0
175 Ω
6.0
4.0
2.0
0.0
30 Ω
150 Ω
8.0
6.0
4.0
2.0
70
150
Chip Surface Temperature Temperature (°C)
0.0
200
Note
• Chip surface temperature measured using FLIR SC645 thermal
imaging system with an approximate test card surface
temperature of 85 °C.
• Thermal imaging was conducted under ambient conditions
resulting in a steady state test card surface temperature of 85 °C
over the full range of power levels.
• Thermal imaging and load life testing was conducted mounting
one device to a 1.6" x 3.7" test card with 3.5 mil copper plating
on both surfaces. Thermal vias on 50 mil centers were utilized for
heat transfer between surfaces of the test card.
70
150
Chip Surface Temperature Temperature (°C)
200
Note
• Chip surface temperature measured using FLIR SC645 thermal
imaging system with an approximate test card surface
temperature of 85 °C.
DERATING CURVE
Percent of Rated Power
100
80
60
40
20
0
0
70
125
155
Ambient Temperature °C
Revision: 07-Aug-14
Document Number: 60125
3
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
PCAN
www.vishay.com
Vishay Dale Thin Film
GLOBAL PART NUMBER INFORMATION
New Global Part Numbering: PCAN1206H1000BBT1
P
C
A
N
1
GLOBAL
MODEL
CASE
SIZE
TCR
CHARACTERISTIC
PCAN
1206
2512
E = ± 25 ppm/°C
H = ± 50 ppm/°C
K = ± 100 ppm/°C
2
0
6
1
0
0
0
RESISTANCE
TOLERANCE
TERMINATION
The first 3 digits are
significant figures and
the last digit specifies
the number of zeros
to follow.
“R” designates the
decimal point.
B = ± 0.1 %
C = ± 0.25 %
D = ± 0.5 %
F = ± 1.0 %
G = ± 2.0 %
B = Wraparound 
Sn/Pb solder
w/ nickel barrier
S = Wraparound
lead (Pb)-free
solder (e1)
RoHS compliant 
G = Wraparound Au,
over Ni (gold)
termination
epoxy bondable
RoHS compliant
(e4)
Example:
10R0 = 10 
1000 = 100 
Revision: 07-Aug-14
H
B
B
T
1
PACKAGING
BS = BULK
100 min., 1 mult
WS = WAFFLE
100 min., 1 mult
W0 = 100 pc min. waffle,
1 mult
WI = 100 min., 1 mult
(package unit single lot
date code)

TAPE AND REEL
T0 = 100 min., 100 mult
T1 = 1000 min., 1000 mult
T3 = 300 min., 300 mult
T5 = 500 min., 500 mult
TF = Full reel
TS = 100 min., 1 mult
TI = 100 min., 1 mult
(item single lot date code)
TP = 100 min., 1 mult
(package unit single lot
date code)
Document Number: 60125
4
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Legal Disclaimer Notice
www.vishay.com
Vishay
Disclaimer
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RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.
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“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
disclosure relating to any product.
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the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all
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Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of typical
requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements
about the suitability of products for a particular application. It is the customer’s responsibility to validate that a particular
product with the properties described in the product specification is suitable for use in a particular application. Parameters
provided in datasheets and/or specifications may vary in different applications and performance may vary over time. All
operating parameters, including typical parameters, must be validated for each customer application by the customer’s
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including but not limited to the warranty expressed therein.
Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining
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Material Category Policy
Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as RoHS-Compliant fulfill the
definitions and restrictions defined under Directive 2011/65/EU of The European Parliament and of the Council
of June 8, 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment
(EEE) - recast, unless otherwise specified as non-compliant.
Please note that some Vishay documentation may still make reference to RoHS Directive 2002/95/EC. We confirm that
all the products identified as being compliant to Directive 2002/95/EC conform to Directive 2011/65/EU.
Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as Halogen-Free follow Halogen-Free
requirements as per JEDEC JS709A standards. Please note that some Vishay documentation may still make reference
to the IEC 61249-2-21 definition. We confirm that all the products identified as being compliant to IEC 61249-2-21
conform to JEDEC JS709A standards.
Revision: 02-Oct-12
1
Document Number: 91000