VSMY7850X01 www.vishay.com Vishay Semiconductors High Power Infrared Emitting Diode, 850 nm, Surface Emitter Technology FEATURES • • • • • • • • • • 21783 • • • • • DESCRIPTION As part of the SurfLightTM portfolio, the VSMY7850X01 is an infrared, 850 nm emitting diode based on surface emitter technology with high radiant power and high speed, molded in low thermal resistance Little Star package. A 42 mil chip provides outstanding low forward voltage and allows DC operation of the device up to 1 A. Package type: surface mount Package form: Little Star® Dimensions (L x W x H in mm): 6.0 x 7.0 x 1.5 Peak wavelength: λp = 850 nm High reliability High radiant power High radiant intensity Angle of half intensity: ϕ = ± 60° Low forward voltage Designed for high drive currents: up to 1 ADC and up to 5 A pulses Low thermal resistance: RthJP = 10 K/W Floor life: 1 year, MSL 2, acc. J-STD-020 Lead (Pb)-free reflow soldering AEC-Q101 qualified Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 APPLICATIONS • • • • Infrared illumination for CMOS cameras (CCTV) Driver assistance systems Machine vision IR data transmission 3D TV PRODUCT SUMMARY COMPONENT Ie (mW/sr) ϕ (deg) λp (nm) tr (ns) VSMY7850X01 170 ± 60 850 15 Note • Test conditions see table “Basic Characteristics” ORDERING INFORMATION ORDERING CODE PACKAGING REMARKS PACKAGE FORM VSMY7850X01-GS08 Tape and reel MOQ: 2000 pcs, 2000 pcs/reel Little Star Note • MOQ: minimum order quantity ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified) SYMBOL VALUE Reverse voltage PARAMETER TEST CONDITION VR 5 UNIT V Forward current IF 1 A 2 A Peak forward current tp/T = 0.5, tp = 100 μs IFM Surge forward current tp = 100 μs IFSM 5 A PV 2.5 W Power dissipation Junction temperature Operating temperature range Storage temperature range Soldering temperature Thermal resistance junction/pin Rev. 1.5, 07-Nov-14 Tj 125 °C Tamb -40 to +100 °C °C Tstg -40 to +100 Acc. figure 7, J-STD-20 Tsd 260 °C Acc. J-STD-051, soldered on PCB RthJP 10 K/W Document Number: 81145 1 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VSMY7850X01 Vishay Semiconductors 3 1.2 2.5 1.0 IF - Forward Current (A) PV - Power Dissipation (W) www.vishay.com 2 1.5 1 RthJP = 10 K/W 0.5 0.8 0.6 0.4 RthJP = 10 K/W 0.2 0 0 0 20 40 60 80 100 0 120 20 Tamb - Ambient Temperature (°C) 40 60 80 100 120 Tamb - Ambient Temperature (°C) Fig. 1 - Power Dissipation Limit vs. Ambient Temperature Fig. 2 - Forward Current Limit vs. Ambient Temperature BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) PARAMETER Forward voltage TEST CONDITION SYMBOL IF = 1 A, tp = 20 ms VF MIN. TYP. MAX. UNIT 2.0 2.5 V IF = 5 A, tp = 100 μs VF 3.5 V Temperature coefficient of VF IF = 1 A TKVF -0.2 mV/K Reverse current VR = 5 V IR not designed for reverse operation μA Radiant intensity Radiant power Temperature coefficient of φe IF = 1 A, tp = 20 ms Ie IF = 5 A, tp = 100 μs Ie 130 170 780 390 mW/sr mW/sr IF = 1 A, tp = 20 ms φe 520 mW IF = 1 A TKφe -0.5 %/K ϕ ± 60 deg Angle of half intensity Peak wavelength IF = 1 A λp 850 nm Spectral bandwidth IF = 1 A Δλ 30 nm Temperature coefficient of λp IF = 1 A TKλp 0.2 nm/K Rise time IF = 1 A tr 15 ns Fall time IF = 1 A tf 18 ns Rev. 1.5, 07-Nov-14 Document Number: 81145 2 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VSMY7850X01 www.vishay.com Vishay Semiconductors BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) 10 Φe, rel - Relative Radiant Power 1 1 0.1 0.01 0.75 0.5 0.25 0.001 0 1 2 3 0 650 4 VF - Forward Voltage (V) 750 Fig. 3 - Forward Current vs. Forward Voltage 850 Fig. 5 - Relative Radiant Power vs. Wavelength 0° 10° 20° 30° tp = 100 µs Ie, rel - Relative Radiant Intensity Ie - Radiant Intensity (mW/sr) 1000 100 10 1 0.01 950 λ- Wavelength (nm) 21776 0.1 1 40° 1.0 0.9 50° 0.8 60° 70° 0.7 80° 0.6 10 ϕ - Angular Displacement IF - Forward Current (A) tp = 100 µs 0.4 0.2 0 948013-1 IF - Forward Current (A) Fig. 4 - Radiant Intensity vs. Forward Current Rev. 1.5, 07-Nov-14 Fig. 6 - Relative Radiant Intensity vs. Angular Displacement Document Number: 81145 3 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VSMY7850X01 www.vishay.com Vishay Semiconductors TAPING DIMENSIONS in millimeters 20846 Rev. 1.5, 07-Nov-14 Document Number: 81145 4 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VSMY7850X01 www.vishay.com Vishay Semiconductors PACKAGE DIMENSIONS in millimeters 6 0.7 0.5 5.2 0.7 3 Ø 3.3 1.6 0.6 2.6 7 6 2.6 0.1 0.3 Anode marking Recommended solder pad Recommended area for heat sink connected with anode pad technical drawings according to DIN specifications 8.2 6.2 Not indicated tolerances ± 0.1 8.65 3 17.5 1.2 2 solder pad cathode solder pad anode contour of device Drawing-No.: 6.541-5076.01-4 Issue: 3; 22.10.14 Rev. 1.5, 07-Nov-14 19 Document Number: 81145 5 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VSMY7850X01 www.vishay.com Vishay Semiconductors SOLDER PROFILE DRYPACK 300 Temperature (°C) max. 260 °C 245 °C 255 °C 240 °C 217 °C 250 200 FLOOR LIFE max. 30 s Floor life (time between soldering and removing from MBB) must not exceed the time indicated on MBB label: max. 100 s Floor life: 1 year 150 max. 120 s Devices are packed in moisture barrier bags (MBB) to prevent the products from moisture absorption during transportation and storage. Each bag contains a desiccant. 100 Conditions: Tamb < 30 °C, RH < 60 % max. ramp up 3 °C/s max. ramp down 6 °C/s 50 0 0 19841 50 100 150 200 250 300 Time (s) Fig. 7 - Lead (Pb)-free Reflow Solder Profile acc. J-STD-020 for Preconditioning acc. to JEDEC®, Level 2 Rev. 1.5, 07-Nov-14 Moisture sensitivity level 2, acc. to J-STD-020B DRYING In case of moisture absorption devices should be baked before soldering. Conditions see J-STD-020 or label. Devices taped on reel dry using recommended conditions 192 h at 40 °C (+ 5 °C), RH < 5 %. Document Number: 81145 6 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Legal Disclaimer Notice www.vishay.com Vishay Disclaimer ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product. Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special, consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular purpose, non-infringement and merchantability. Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of typical requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements about the suitability of products for a particular application. It is the customer’s responsibility to validate that a particular product with the properties described in the product specification is suitable for use in a particular application. Parameters provided in datasheets and/or specifications may vary in different applications and performance may vary over time. All operating parameters, including typical parameters, must be validated for each customer application by the customer’s technical experts. Product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed therein. Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining applications or for any other application in which the failure of the Vishay product could result in personal injury or death. Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners. Material Category Policy Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as RoHS-Compliant fulfill the definitions and restrictions defined under Directive 2011/65/EU of The European Parliament and of the Council of June 8, 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment (EEE) - recast, unless otherwise specified as non-compliant. Please note that some Vishay documentation may still make reference to RoHS Directive 2002/95/EC. We confirm that all the products identified as being compliant to Directive 2002/95/EC conform to Directive 2011/65/EU. Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as Halogen-Free follow Halogen-Free requirements as per JEDEC JS709A standards. Please note that some Vishay documentation may still make reference to the IEC 61249-2-21 definition. We confirm that all the products identified as being compliant to IEC 61249-2-21 conform to JEDEC JS709A standards. Revision: 02-Oct-12 1 Document Number: 91000