TSOP753..W, TSOP755..W Datasheet

TSOP753..W, TSOP755..W
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Vishay Semiconductors
IR Receiver Modules for Remote Control Systems
FEATURES
• Very low supply current
• Photo detector and preamplifier in one package
• Compatible also with short burst dataformats
• Supply voltage: 2.5 V to 5.5 V
• Improved immunity against ambient light
• Capable of side or top view
• Low profile 2.35 mm
• Insensitive to supply voltage ripple and noise
• Narrow optical filter to reduce interference from
plasma TV emissions
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
MECHANICAL DATA
DESCRIPTION
Pinning:
The TSOP753..W, TSOP755..W series are a miniaturized
receiver module for infrared remote control systems. Two
PIN diodes and a preamplifier are assembled on a
leadframe, the epoxy package is designed as an IR filter.
1, 4 = GND, 2 = VS, 3 = OUT
ORDERING CODE
Taping:
The demodulated output signal can be directly connected to
a microprocessor for decoding. The TSOP753..W is
optimized to better suppress spurious pulses from energy
saving lamps. The TSOP755..W has an excellent noise
suppression. It is immune to dimmed LCD backlighting and
any fluorescent lamps. AGC3 and AGC5 may also suppress
some data signals in case of continuous transmission.
TSOP75...WTT - top view taped
TSOP75...WTR - side view taped
This component has not been qualified according to
automotive specifications.
PARTS TABLE
AGC
30 kHz
Carrier
frequency
NOISY ENVIRONMENTS
AND SHORT BURSTS (AGC3)
VERY NOISY ENVIRONMENTS
AND SHORT BURSTS (AGC5)
TSOP75330W
TSOP75530W
33 kHz
TSOP75333W
TSOP75533W
36 kHz
TSOP75336W (1)
TSOP75536W
38 kHz
TSOP75338W (2)(3)(4)(5)
TSOP75538W
40 kHz
TSOP75340W
TSOP75540W
56 kHz
TSOP75356W
TSOP75556W
Package
Heimdall no lens
Pinning
1, 4 = GND, 2 = VS, 3 = OUT
Dimensions (mm)
6.8 W x 3.0 H x 2.35 D
Mounting
SMD
Application
Best remote control code
Rev. 1.2, 17-Apr-15
Remote control
(1)
MCIR
(2)
Mitsubishi
1
(3)
RECS-80 Code
(4)
r-map
(5)
XMP-1, XMP-2
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BLOCK DIAGRAM
APPLICATION CIRCUIT
17170_5
2
IR receiver
VS
3
Input
Band
pass
AGC
OUT
Demodulator
VO
GND
GND
Control circuit
µC
OUT
1, 4
PIN
+ VS
C1
Circuit
VS
30 k Ω
R1
Transmitter
with
TSALxxxx
GND
R1 and C1 are recommended for protection against EOS.
Components should be in the range of 33 Ω < R1 < 1 kΩ,
C1 > 0.1 µF.
20445-1
ABSOLUTE MAXIMUM RATINGS
PARAMETER
Supply voltage
Supply current
Output voltage
Output current
Junction temperature
Storage temperature range
Operating temperature range
Power consumption
TEST CONDITION
SYMBOL
VS
IS
VO
IO
Tj
Tstg
Tamb
Ptot
Tamb ≤ 85 °C
VALUE
-0.3 to +6
3
-0.3 to (VS + 0.3)
5
100
-25 to +85
-25 to +85
10
UNIT
V
mA
V
mA
°C
°C
°C
mW
Note
• Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only
and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification
is not implied. Exposure to absolute maximum rating conditions for extended periods may affect the device reliability.
ELECTRICAL AND OPTICAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
PARAMETER
Supply voltage
TEST CONDITION
Ev = 0, VS = 3.3 V
Ev = 40 klx, sunlight
Ev = 0, test signal see fig. 1, IR diode TSAL6200,
IF = 200 mA
IOSL = 0.5 mA, Ee = 0.7 mW/m2, test signal see fig. 1
Pulse width tolerance:
tpi - 5/fo < tpo < tpi + 6/fo, test signal see fig. 1
tpi - 5/fo < tpo < tpi + 6/fo, test signal see fig. 1
Angle of half transmission distance
Supply current
Transmission distance
Output voltage low
Minimum irradiance
Maximum irradiance
Directivity
SYMBOL
VS
ISD
ISH
MIN.
2.5
0.27
TYP.
0.35
0.45
d
MAX.
5.5
0.45
UNIT
V
mA
mA
100
mV
0.5
mW/m2
30
m
VOSL
Ee min.
0.25
Ee max.
ϕ1/2
W/m2
deg
30
± 75
TYPICAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
0.4
Optical Test Signal
(IR diode TSAL6200, IF = 0.4 A, N = 6 pulses, f = f0, t = 10 ms)
tpo - Output Pulse Width (ms)
Ee
t
tpi *)
T
*) tpi ≥ 6/f0 is recommended for optimal function
Output Signal
VO
1)
2)
VOH
VOL
14337
3/f0 < td < 9/f0
tpi - 4/f0 < tpo < tpi + 6/f0
0.35
0.3
0.25
0.2
0.15
Input Burst Length
0.1
0.05
0
0.1
td
1)
tpo
2)
t
20760
Fig. 1 - Output Active Low
Rev. 1.2, 17-Apr-15
Output Pulse Width
λ = 950 nm,
optical test signal, fig. 1
1
10
100
1000
10 000
Ee - Irradiance (mW/m²)
Fig. 2 - Pulse Length and Sensitivity in Dark Ambient
2
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Optical Test Signal
600 µs
Ee min. - Threshold Irradiance (mW/m²)
Ee
Vishay Semiconductors
t
600 µs
t = 60 ms
94 8134
Output Signal, (see fig. 4)
VO
VOH
VOL
Ee min. - Threshold Irradiance (mW/m2)
Ton, Toff - Output Pulse Width (ms)
0.6
Toff
0.4
0.3
λ = 950 nm,
Optical Test Signal, Fig. 3
0.1
0
0.1
21584
1
10
102
103
2
Wavelength of Ambient
Illumination: λ = 950 nm
1.5
1
0.5
0.1
1
10
100
Ee - Ambient DC Irradiance (W/m²)
Fig. 6 - Sensitivity in Bright Ambient
Ton
0.2
2.5
21585
0.8
0.5
10 W/m² = 8.2 kLx (Daylight, T = 5900 K)
3
0
0.01
Fig. 3 - Output Function
0.7
Correlation with Ambient Light Sources:
3.5 10 W/m² = 1.4 kLx (Std. illum. A, T = 2855 K)
t
t off
t on
4
104
105
Ee - Irradiance (mW/m²)
3.0
2.5
f = f0
f = 30 kHz
f = 10 kHz
f = 100 Hz
2.0
1.5
1.0
0.5
0
1
10
100
1000
ΔVS RMS - AC Voltage on DC Supply Voltage (mV)
Fig. 4 - Output Pulse Diagram
Fig. 7 - Sensitivity vs. Supply Voltage Disturbances
1.2
1
Max. Envelope Duty Cycle
E e min./Ee - Rel. Responsivity
0.9
1.0
0.8
0.6
0.4
f = f0 ± 5 %
Δ f(3 dB) = f0/10
0.2
f = 38 kHz, Ee = 2 mW/m²
0.8
0.7
0.6
0.5
0.4
0.3
TSOP753..W
0.2
0.1
0.0
TSOP755..W
0
0.7
16925
0.9
1.1
0
1.3
22183-1
f/f0 - Relative Frequency
Fig. 5 - Frequency Dependence of Responsivity
Rev. 1.2, 17-Apr-15
20
40
60
80
100
120
Burst Length (number of cycles/burst)
Fig. 8 - Max. Envelope Duty Cycle vs. Burst Length
3
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0.6
0°
d rel - Relative Transmission Distance
Ee min. - Threshold Irradiance (mW/m2)
www.vishay.com
0.5
0.4
0.3
0.2
0.1
0
-30
-10
10
30
50
70
40°
0.9
50°
0.8
60°
70°
0.7
80°
0.6
21580
0.4
0.2
0
Fig. 12 - Vertical Directivity
0.60
1.0
0.9
Ee min. - Sensitivity (mW/m2)
S (λ) rel - Relative Spectral Sensitivity
30°
1.0
Fig. 9 - Sensitivity vs. Ambient Temperature
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
750
0.50
0.40
0.30
0.20
0.10
0.00
800
850
900
950 1000 1050 1100 1150
1
λ- Wavelength (nm)
21425
0°
10°
2
3
4
5
VS - Supply Voltage (V)
Fig. 10 - Relative Spectral Sensitivity vs. Wavelength
d rel - Relative Transmission Distance
20°
90
Tamb - Ambient Temperature (°C)
21581
10°
20°
Fig. 13 - Sensitivity vs. Supply Voltage
30°
40°
1.0
50°
0.9
60°
0.8
70°
80°
0.7
0.6
0.4
0.2
0
Fig. 11 - Horizontal Directivity
Rev. 1.2, 17-Apr-15
4
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SUITABLE DATA FORMAT
IR Signal
The TSOP753..W, TSOP755..W series are designed to
suppress spurious output pulses due to noise or
disturbance signals. Data and disturbance signals can be
distinguished by the devices according to carrier frequency,
burst length and envelope duty cycle. The data signal should
be close to the band-pass center frequency (e.g. 38 kHz)
and fulfill the conditions in the table below.
When a data signal is applied to the TSOP753..W,
TSOP755..W in the presence of a disturbance signal, the
sensitivity of the receiver is reduced to insure that no
spurious pulses are present at the output. Some examples
of disturbance signals which are suppressed are:
0
5
• DC light (e.g. from tungsten bulb or sunlight)
10
15
20
Time (ms)
16920
Fig. 14 - IR Distrubance from Fluorescent Lamp
with Low Modulation
• Continuous signals at any frequency
IR Signal
• Strongly or weakly modulated pattern from fluorescent
lamps with electronic ballasts (see fig. 14 or fig. 15)
0
16921
5
10
15
20
Time (ms)
Fig. 15 - IR Distrubance from Fluorescent Lamp
with High Modulation
TSOP753..W
TSOP755..W
Minimum burst length
6 cycles/burst
6 cycles/burst
After each burst of length
a minimum gap time is required of
6 to 35 cycles
≥ 10 cycles
6 to 24 cycles
≥ 10 cycles
35 cycles
24 cycles
> 4 x burst length
> 25 ms
2000
2000
For bursts greater than
a minimum gap time in the data stream is
needed of
Maximum number of continuous short
bursts/second
MCIR code
preferred
yes
XMP-1, XMP-2, code
preferred
yes
Most common disturbance
patterns are suppressed
Most common disturbance
patterns are suppressed
Suppression of interference from fluorescent
lamps
Notes
• For data formats with long bursts please see the datasheet for TSOP752..W, TSOP754..W.
• Best choice of AGC for some popular IR-codes:
- TSOP75336W: MCIR
- TSOP75538W: Mitsubishi, RECS-80 Code
- TSOP75338W: XMP-1, XMP-2, r-map
• For SIRCS 15 and 20 bit, Sony 12 bit IR-codes, please see the datasheet for TSOP75S40FW
• For RCMM, TSOP75G36W provides the highest pulse accuracy with some loss of sensitivity
Rev. 1.2, 17-Apr-15
5
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PACKAGE DIMENSIONS in millimeters
6.8
6.6 ± 0.1
Center of
sensitive area
(3.25)
Mold residue
2.35
(1.8)
1.2 ± 0.2
3
0.8
Mold residue
(0.635)
(1)
1.27
(3 x)
0.5 ± 0.1
(4 x)
technical drawings
according to DIN
specifications
3 x 1.27 = 3.81
Marking area
2.05
Not indicated tolerances ± 0.15
(1.5)
Tool separation line
(2.2)
Proposed pad layout
from component side
(for reference only)
3 x 1.27 = 3.81
Pick and place area
1.8
1.27
Drawing-No.: 6.550-5300.01-4
Issue: 4; 13.09.11
0.8
22609
ASSEMBLY INSTRUCTIONS
Reflow Soldering
Manual Soldering
• Reflow soldering must be done within 72 h while stored
under a max. temperature of 30 °C, 60 % RH after
opening the dry pack envelope
• Use a soldering iron of 25 W or less. Adjust the
temperature of the soldering iron below 300 °C
• Set the furnace temperatures for pre-heating and heating
in accordance with the reflow temperature profile as
shown in the diagram. Exercise extreme care to keep the
maximum temperature below 260 °C. The temperature
shown in the profile means the temperature at the device
surface. Since there is a temperature difference between
the component and the circuit board, it should be verified
that the temperature of the device is accurately being
measured
• Handle products only after the temperature has cooled off
• Finish soldering within 3 s
• Handling after reflow should be done only after the work
surface has been cooled off
Rev. 1.2, 17-Apr-15
6
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VISHAY LEAD (Pb)-FREE REFLOW SOLDER PROFILE
300
max. 260 °C
245 °C
255 °C
240 °C
217 °C
250
T (°C)
200
max. 20 s
150
max. 100 s
max. 120 s
100
max. Ramp Up 3 °C/s
max. Ramp Down 6 °C/s
50
0
0
50
100
150
t (s)
19800
200
250
300
max. 2 cycles allowed
TAPING VERSION TSOP..TR DIMENSIONS in millimeters
3.3
0.3
4°
7.1
16
7.5
4°
2.7
1.75
Ø 1.5
4
Direction of feed
8
2
Ø 1.5 min
Drawing-No.: 9.700-5342.01-4
Issue: 1: 23.03.09
technical drawings
according to DIN
specifications
21785
Rev. 1.2, 17-Apr-15
7
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TAPING VERSION TSOP..TT DIMENSIONS in millimeters
0.3
2.7
4°
7.1
16
7.5
3.3
4°
1.75
Ø 1.5
4
8
2
Direction of feed
Ø 1.5 min.
technical drawings
according to DIN
specifications
Drawing-No.: 9.700-5341.01-4
Issue: 2: 23.03.09
21666
Rev. 1.2, 17-Apr-15
8
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REEL DIMENSIONS in millimeters
16734
LEADER AND TRAILER DIMENSIONS in millimeters
Trailer
no devices
Leader
devices
no devices
End
Start
min. 200
min. 400
96 11818
COVER TAPE PEEL STRENGTH
LABEL
According to DIN EN 60286-3
0.1 N to 1.3 N
300 ± 10 mm/min.
165° to 180° peel angle
Standard bar code labels for finished goods
Rev. 1.2, 17-Apr-15
The standard bar code labels are product labels and used
for identification of goods. The finished goods are packed in
final packing area. The standard packing units are labeled
with standard bar code labels before transported as finished
goods to warehouses. The labels are on each packing unit
and contain Vishay Semiconductor GmbH specific data.
9
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VISHAY SEMICONDUCTOR GmbH STANDARD BAR CODE PRODUCT LABEL (finished goods)
PLAIN WRITING
ABBREVIATION
LENGTH
Item-description
-
18
Item-number
INO
8
Selection-code
SEL
3
BATCH
10
Data-code
COD
3 (YWW)
Plant-code
PTC
2
Quantity
QTY
8
Accepted by
ACC
-
Packed by
PCK
-
LOT-/serial-number
Mixed code indicator
Origin
Long bar code top
MIXED CODE
-
xxxxxxx+
Company logo
Type
Length
Item-number
N
8
Plant-code
N
2
Sequence-number
X
3
Quantity
N
8
Total length
-
21
Short bar code bottom
Type
Length
Selection-code
X
3
Data-code
N
3
Batch-number
X
10
Filter
-
1
Total length
-
17
DRY PACKING
After more than 72 h under these conditions moisture
content will be too high for reflow soldering.
The reel is packed in an anti-humidity bag to protect the
devices from absorbing moisture during transportation and
storage.
In case of moisture absorption, the devices will recover to
the former condition by drying under the following condition:
192 h at 40 °C + 5 °C / - 0 °C and < 5 % RH (dry air/nitrogen)
or
96 h at 60 °C + 5 °C and < 5 % RH for all device containers
or
24 h at 125 °C + 5 °C not suitable for reel or tubes.
Aluminum bag
Label
An EIA JEDEC® standard J-STD-020 level 4 label is included
on all dry bags.
Reel
LEVEL
CAUTION
This bag contains
MOISTURE-SENSITIVE DEVICES
15973
4
FINAL PACKING
1. Shelf life in sealed bag: 12 months at < 40 °C and < 90 % relative
humidity (RH)
The sealed reel is packed into a cardboard box. A secondary
cardboard box is used for shipping purposes.
2. After this bag is opened, devices that will be subjected to soldering
reflow or equivalent processing (peak package body temp. 260 °C)
must be
2a. Mounted within 72 hours at factory condition of < 30 °C/60 % RH or
2b. Stored at < 5 % RH
3. Devices require baking befor mounting if:
Humidity Indicator Card is > 10 % when read at 23 °C ± 5 °C or
2a. or 2b. are not met.
RECOMMENDED METHOD OF STORAGE
4. If baking is required, devices may be baked for:
192 hours at 40 °C + 5 °C/- 0 °C and < 5 % RH (dry air/nitrogen) or
96 hours at 60 °C ± 5 °C and < 5 % RH for all device containers or
24 hours at 125 °C ± 5 °C not suitable for reels or tubes
Dry box storage is recommended as soon as the aluminum
bag has been opened to prevent moisture absorption. The
following conditions should be observed, if dry boxes are
not available:
Bag Seal Date:
(If blank, see barcode label)
Note: Level and body temperature defined by EIA JEDEC Standard J-STD-020
• Storage temperature 10 °C to 30 °C
22522
• Storage humidity ≤ 60 % RH max.
Rev. 1.2, 17-Apr-15
EIA JEDEC standard J-STD-020 level 4 is included
on all dry bags
10
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VISHAY SEMICONDUCTORS STANDARD
BAR CODE LABELS
ESD PRECAUTION
Proper storage and handling procedures should be followed
to prevent ESD damage to the devices especially when they
are removed from the antistatic shielding bag. Electrostatic
sensitive devices warning labels are on the packaging.
The Vishay Semiconductors standard bar code labels are
printed at final packing areas. The labels are on each
packing unit and contain Vishay Semiconductors specific
data.
BAR CODE PRODUCT LABEL (example)
22178
Rev. 1.2, 17-Apr-15
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Disclaimer
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RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.
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“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
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Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of typical
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about the suitability of products for a particular application. It is the customer’s responsibility to validate that a particular
product with the properties described in the product specification is suitable for use in a particular application. Parameters
provided in datasheets and/or specifications may vary in different applications and performance may vary over time. All
operating parameters, including typical parameters, must be validated for each customer application by the customer’s
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including but not limited to the warranty expressed therein.
Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining
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Please note that some Vishay documentation may still make reference to RoHS Directive 2002/95/EC. We confirm that
all the products identified as being compliant to Directive 2002/95/EC conform to Directive 2011/65/EU.
Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as Halogen-Free follow Halogen-Free
requirements as per JEDEC JS709A standards. Please note that some Vishay documentation may still make reference
to the IEC 61249-2-21 definition. We confirm that all the products identified as being compliant to IEC 61249-2-21
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Revision: 02-Oct-12
1
Document Number: 91000