VSB3200S-M3/54

VSB3200S
www.vishay.com
Vishay General Semiconductor
High Voltage Trench MOS Barrier Schottky Rectifier
FEATURES
• Trench MOS Schottky technology
• Low forward voltage drop, low power losses
TMBS
®
• High efficiency operation
• Solder dip 275 °C max. 10 s, per JESD 22-B106
• Material categorization: For definitions of compliance
please see www.vishay.com/doc?99912
DO-204AC (DO-15)
TYPICAL APPLICATIONS
For use in high frequency rectifier of switching mode power
supplies, freewheeling diodes, DC/DC converters or polarity
protection application.
PRIMARY CHARACTERISTICS
IF(AV)
3.0 A
MECHNICAL DATA
VRRM
200 V
IFSM
50 A
Case: DO-204AC (DO-15)
Molding compound meets UL 94 V-0 flammability rating
Base P/N-M3 - halogen-free, RoHS compliant, and
commercial grade
VF at IF = 3.0 A
0.64 V
TJ max.
150 °C
Package
DO-204AC (DO-15)
Diode variation
Single
Terminals: Matte tin plated leads, solderable
J-STD-002 and JESD 22-B102
M3 suffix meets JESD 201 class 1A whisker test
per
Polarity: Color band denotes the cathode end
MAXIMUM RATINGS (TA = 25 °C unless otherwise noted)
PARAMETER
SYMBOL
VSB3200S
Max. repetitive peak reverse voltage
VRRM
200
V
Max. average forward rectified current (fig. 1) (1)
IF(AV)
3.0
A
Peak forward surge current 8.3 ms single half
sine-wave superimposed on rated load
IFSM
50
A
dV/dt
10 000
V/μs
TJ, TSTG
- 40 to + 150
°C
Voltage rate of change (rated VR)
Operating junction and storage temperature range
UNIT
Note
(1) Units mounted on PCB with 14 mm x 14 mm copper pad areas 0.375" (9.5 mm) lead length
ELECTRICAL CHARACTERISTICS (TA = 25 °C unless otherwise noted)
PARAMETER
TEST CONDITIONS
Breakdown voltage
IR = 1.0 mA
Instantaneous forward voltage (1)
IF = 3.0 A
Reverse current per diode (2)
VR = 200 V
Typical juntion capacitance
4.0 V, 1 MHz
TA = 25 °C
TA = 25 °C
TA = 125 °C
TA = 25 °C
TA = 125 °C
SYMBOL
TYP.
MAX.
VBR
200 (min.)
-
VF
IR
CJ
0.98
1.40
0.64
0.72
UNIT
V
1.3
50
μA
0.98
7
mA
170
-
pF
Notes
(1) Pulse test: 300 μs pulse width, 1 % duty cycle
(2) Pulse test: Pulse width  40 ms
Revision: 14-Aug-13
Document Number: 89143
1
For technical questions within your region: [email protected], [email protected], [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VSB3200S
www.vishay.com
Vishay General Semiconductor
THERMAL CHARACTERSTICS (TA = 25 °C unless otherwise noted)
PARAMETER
SYMBOL
VSB3200S
RJA
64
RJL
18
Typical thermal resistance (1)
UNIT
°C/W
Note
(1) Units mounted on PCB with 14 mm x 14 mm copper pad areas 0.375" (9.5 mm) lead length
ODERING INFORMATION (Example)
PREFERRED P/N
UNIT WEIGHT (g)
PREFERRED PACKAGE CODE
BASE QUANTITY
DELIVERY MODE
VSB3200S-M3/54
0.399
54
4000
13" diameter paper tape and reel
VSB3200S-M3/73
0.399
73
2000
Ammo pack packaging


RATINGS AND CHARACTERISTICS CURVES 
(TA = 25 °C unless otherwise noted)
10
Resistive or Inductive Load
Instantaneous Forward Current (A)
Average Forward Rectified Current (A)
3.5
3.0
2.5
2.0
1.5
1.0
14 mm x 14 mm
Copper Pads
0.5
0.375" (9.5 mm) Lead Length
TA = 125 °C
1
TA = 25 °C
0.1
0
0
25
50
75
100
125
150
175
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
Ambient Temperature (°C)
Instantaneous Forward Voltage (V)
Fig. 1 - Maximum Forward Current Derating Curve
Fig. 3 - Typical Instantaneous Forward Characteristics
2.4
10
D = 0.3
Instantaneous Reverse Current (mA)
D = 0.8
2.0
Average Power Loss (W)
TA = 150 °C
D = 0.5
D = 0.2
1.6
D = 0.1
D = 1.0
1.2
T
0.8
0.4
D = tp/T
tp
TA = 150 °C
1
TA = 125 °C
0.1
0.01
0.001
TA = 25 °C
0.0001
0
0
0.4
0.8
1.2
1.6
2.0
2.4
2.8
3.2
3.6
10
20
30
40
50
60
70
80
90
Average Forward Current (A)
Percent of Rated Peak Reverse Voltage (%)
Fig. 2 - Forward Power Loss Characteristics
Fig. 4 - Typical Reverse Characteristics
Revision: 14-Aug-13
100
Document Number: 89143
2
For technical questions within your region: [email protected], [email protected], [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VSB3200S
www.vishay.com
Vishay General Semiconductor
100
Transient Thermal Impedance (°C/W)
Junction Capacitance (pF)
1000
TJ = 25 °C
f = 1.0 MHz
Vsig = 50 mVp-p
100
10
0.1
1
10
10
Junction to Ambient
1
0.01
100
0.1
1
10
100
Reverse Voltage (V)
t - Pulse Duration (s)
Fig. 5 - Typical Junction Capacitance
Fig. 6 - Typical Transient Thermal Impedance


PACKAGE OUTLINE DIMENSIONS in inches (millimeters)
DO-204AC (DO-15)
0.034 (0.86)
0.028 (0.71)
DIA.
1.0 (25.4)
MIN.
0.300 (7.6)
0.230 (5.8)
0.140 (3.6)
0.104 (2.6)
DIA.
1.0 (25.4)
MIN.
Revision: 14-Aug-13
Document Number: 89143
3
For technical questions within your region: [email protected], [email protected], [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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www.vishay.com
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Disclaimer
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definitions and restrictions defined under Directive 2011/65/EU of The European Parliament and of the Council
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Please note that some Vishay documentation may still make reference to RoHS Directive 2002/95/EC. We confirm that
all the products identified as being compliant to Directive 2002/95/EC conform to Directive 2011/65/EU.
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requirements as per JEDEC JS709A standards. Please note that some Vishay documentation may still make reference
to the IEC 61249-2-21 definition. We confirm that all the products identified as being compliant to IEC 61249-2-21
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Revision: 02-Oct-12
1
Document Number: 91000