NTCC200E4, NTCC300E4 www.vishay.com Vishay BCcomponents Leadless NTC Thermistor Die Suitable for Wire Bonding FEATURES QUICK REFERENCE DATA PARAMETER Resistance value at 25 °C Tolerance on R25-value B25/85-value Tolerance on B25/85-value Operating temperature range Response time (63.2 %) 25 °C to 85 °C still air (for info) Dissipation factor in still air (for info, non-mounted die) Maximum power dissipation Weight VALUE 4.7K to 20K ± 1 to ± 5 3435 to 3865 ±1 -55 to +175 UNIT % K % °C 3 s 3 mW 50 3 mW mg APPLICATIONS • High temperature sensing, control and compensation. E.g. IGBT modules (inverters in EV and HEV vehicles) • IC and semiconductor protecting • DC/AC power inverters and HIC overheat protecting MOUNTING The thermistors are primarily intended for wire bonding. The parameters of the assembly process should be chosen in accordance with the lead-wire material. The mounting process should be in compliance with the following guidelines and recommendations: Die bonding: • Gold electrode: silver epoxy gluing. • Silver electrode: (vacuum) reflow soldering - silver epoxy gluing - nano silver sintering. DIMENSIONS in millimeters W • Flat chip contacted top and bottom (gold: NTCC300E4 series or silver: NTCC200E4 series) • Wide temperature range from -55 °C to +175 °C • Highly resistant to thermal shocks • Ideal for wire bonding (aluminum or gold depending on metallization type) • Resistance to leaching • Delivered on blister tape • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 T Cleaning: • Detergent spraying. • Ultrasonic or formic acid recommended. is not Wire bonding: • The gold electrode has been tested for gold wire bonding with a wire diameter of max. 32 μm. • The silver electrode has been tested for aluminium wire bonding with a wire diameter of max. 300 μm. Wire bondable surface PARAMETER W T vapor cleaning VALUE 2 ± 0.1 0.7 max. Note • Non-dimensioned details do not affect the performance of the thermistors. Encapsulation: • In order to preserve the characteristics of the bonded die at long term an encapsulation is mandatory. • The encapsulation is defined by the user. Silicon and epoxy encapsulations have been tested. For recommendations on compatible encapsulants contact Vishay. ELECTRICAL DATA AND ORDERING INFORMATION VISHAY SAP ORDERING NUMBER (1) NTCC200E4472*T NTCC200E4123*T NTCC200E4203*T NTCC300E4472*T NTCC300E4123*T NTCC300E4203*T R25-VALUE (k) 4.7 12 20 4.7 12 20 R25-VALUE (%) 1, 2, 3, 5 1, 2, 3, 5 1, 2, 3, 5 1, 2, 3, 5 1, 2, 3, 5 1, 2, 3, 5 B25/85-VALUE (K) 3435 3740 3865 3435 3740 3865 B25/85-TOL. (%) 1 1 1 1 1 1 DESCRIPTION Bare die with top /bottom silver terminations Bare die with top /bottom silver terminations Bare die with top /bottom silver terminations Bare die with top /bottom gold terminations Bare die with top /bottom gold terminations Bare die with top /bottom gold terminations Note (1) In order to define R -tolerance, replace * in SAP part number by F (± 1 %) , G (± 2 %) , H (± 3 %) of J (± 5 %). 25 Revision: 13-Mar-15 Document Number: 29153 1 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 NTCC200E4, NTCC300E4 www.vishay.com Vishay BCcomponents PACKAGING INFORMATION The components are delivered on 8mm embossed blister tape (conductive PS) conforming to EIA-481 and IEC 60286-3, with 2000 parts per reel. Revision: 13-Mar-15 Document Number: 29153 2 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Legal Disclaimer Notice www.vishay.com Vishay Disclaimer ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product. Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or the continuing production of any product. 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Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as Halogen-Free follow Halogen-Free requirements as per JEDEC JS709A standards. Please note that some Vishay documentation may still make reference to the IEC 61249-2-21 definition. We confirm that all the products identified as being compliant to IEC 61249-2-21 conform to JEDEC JS709A standards. Revision: 02-Oct-12 1 Document Number: 91000