IGBR Datasheet

IGBR
www.vishay.com
Vishay Electro-Films
Thin Film, High Power Back-Contact Resistor
FEATURES
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•
•
•
•
•
•
Wire bondable
Small size
High power rating
Single wire bond assembly
Moisture resistant
Case size 0202 to 0808
Material categorization:
for definitions of compliance please see
www.vishay.com/doc?99912
APPLICATIONS
•
•
•
•
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The high power back-contact resistor (IGBR) series thin film
chip resistor utilizes the excellent thermal properties of
silicon to allow ultra high power rating with miniature case
size for hybrid (chip and wire) assemblies.
Gate resistor for IGBT based power converters
Current limiting for LED lighting applications
High power applications
Alternative energy
Hybrid assemblies
TEMPERATURE COEFFICIENT OF RESISTANCE, VALUES, AND TOLERANCES
PARAMETER
Total Resistance Range
Standard Tolerances
TCR
VALUE
3 to 25
5, 10, 25
± 500
UNIT

%
ppm/°C
TCR (ppm/°C) BY CASE SIZE AND VALUE
Case Size (mil)
20 x 20
n/a
40 x 40
n/a
60 x 60
500
400
300
80 x 80
450
350
300
3
500
5
400
8
10
400
300
300
250
250
200
250
15
200
20
22
25
Value (Ω)
STANDARD ELECTRICAL SPECIFICATIONS
PARAMETER
Operating Film Temperature Range
Operating Temperature Range
Working Voltage
Breakdown Voltage
Thermal Resistivity (1)
DC Power Rating (1)(2)
Load Life Stability, 1000 h, Film Temperature 200 °C
Short Time Overload, 5 x Rated Power, 25 °C, 5 s
Thermal Shock, MIL-STD-202, Method 107 F
Moisture Resistance, MIL-STD-202, Method 106 (3)
High Temperature Exposure, 100 h, +250 °C
Low Temperature Operation, -65 °C, 45 min, 200 VDC
VALUE
200 max.
-55 to +125
75 max.
400
Down to 2
Up to 4
± 1 R/R
± 0.25 R/R
± 1 R/R
± 0.25 R/R
± 0.5 R/R
± 0.5 R/R
UNIT
°C
°C
V
V
K/W
W
%
%
%
%
%
%
Notes
(1) See table “Power Rating by Case Size”.
(2) Power rating determined by application specific heat sink properties. Film temperature should not exceed 200 °C. See table “Power Rating
by Case Size” for more details.
(3) Aluminum pads and aluminum wire bonds are sensitive to high moisture environments. Adequate application level packaging is required to
protect the components and wire bonds from moisture related damage.
Revision: 03-Aug-15
Document Number: 61107
1
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
IGBR
www.vishay.com
Vishay Electro-Films
POWER RATING BY CASE SIZE
CHIP SIZE
mil (mm) (2)
BOND PAD SIZE
mil (mm)
DIE THICKNESS
mm (mil) (2)
TYPICAL R
THERMAL (1)
K/W
R MIN.

R MAX.

0202
20 x 20 (0.5 x 0.5)
10 x 16 (0.25 x 0.41)
10 (0.25)
10
15
25
0404
40 x 40 (1 x 1)
15 x 36 (0.38 x 0.91)
10 (0.25)
7
5
25
0606
60 x 60 (1.5 x 1.5)
20 x 56 (0.51 x 1.42)
10 (0.25)
5
3
25
0808
80 x 80 (2 x 2)
27 x 76 (0.69 x 1.93)
10 (0.25)
2
3
25
CASE SIZE
Notes
(1) Typical R thermal between film and back contact. Does not include die attach joint (epoxy or solder).
(2) Dimension tolerances are ± 0.05 mm (± 2 mil).
SCHEMATIC
MATERIAL SPECIFICATIONS
PARAMETER
Chip Substrate Material
Film Material
Case Size
Passivation
Number of Pads
Top Terminations Suitable for Heavy Gage Aluminum Wire-Bonding
Back Termination (for epoxy, lead (Pb)-free solder or silver compression assembly)
Oxidized silicon, 10 kÅ minimum SiO2
Tantalum Nitride
See table “Power Rating by Case Size”
None
1
Al (2.5 μm min.)
TiW/Pd/Au or TiW/Ni/Au
GLOBAL PART NUMBER INFORMATION
Global Part Number: IGBRB3000CJOPCST
Global Part Number Description: IGBR 1 mm 3  5 % 300 ppm/°C PD Commercial Tape
I
G
B
R
B
MODEL
SIZE
RESISTANCE
()
IGBR
A = 20 x 20
B = 40 x 40
C = 60 x 60
D = 80 x 80
First 4 digits
are significant
figures of
capacitance
High
power
backcontact
resistor
Revision: 03-Aug-15
3
0
0
RESISTANCE
MULTILPLIER
CODE
TOL.
CODE
(%)
C = 0.001
B = 0.01
A = 0.1
F=1
J=5
K = 10
M = 20
L = 25
0
C
J
O
P
C
S
T
TCR
(ppm/°C)
BACKSIDE
TERMINATION
VISUAL
CLASS
PACKAGING
CODE
J = ± 500
W = ± 350
O = ± 300
M = ± 250
P = TiW/Pd/Au
N = TiW/Ni/Au
C = commercial
H = class H
K = class K
WS =
waffle pack
100 min., 1 mult
FW = full
wafer (3")
ST = diced
on tape
Document Number: 61107
2
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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Revision: 02-Oct-12
1
Document Number: 91000