VSMY385010 Datasheet

VSMY385010
www.vishay.com
Vishay Semiconductors
High Speed Infrared Emitting Diode, 850 nm,
Surface Emitter Technology
FEATURES
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948553
DESCRIPTION
Package type: surface mount
Package form: PLCC-2
Dimensions (L x W x H in mm): 3.5 x 2.8 x 1.75
Peak wavelength: p = 850 nm
High reliability
High radiant power
High radiant intensity
Angle of half intensity:  = ± 60°
Floor life: 168 h, MSL 3, acc. J-STD-020
Lead (Pb)-free reflow soldering
Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
RELEASED FOR APPLICATIONS
As part of the SurfLightTM portfolio, the VSMY385010 is an
infrared, 850 nm emitting diode based on surface emitter
technology with high radiant intensity, high optical power
and high speed, molded in a PLCC-2 package for surface
mounting (SMD).
Infrared radiation source for operation with CMOS cameras
(illumination)
• High speed IR data transmission
• IR touch panels
• 3D gaming
• Light curtain
PRODUCT SUMMARY
COMPONENT
Ie (mW/sr)
 (deg)
p (nm)
tr (ns)
VSMY385010
9
± 60
850
10
Note
• Test conditions see table “Basic Characteristics”
ORDERING INFORMATION
ORDERING CODE
PACKAGING
REMARKS
PACKAGE FORM
VSMY385010-GS08
Tape and reel
MOQ: 7500 pcs, 1500 pcs/reel
PLCC-2
VSMY385010-GS18
Tape and reel
MOQ: 8000 pcs, 8000 pcs/reel
PLCC-2
Note
• MOQ: minimum order quantity
ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified)
PARAMETER
TEST CONDITION
Reverse voltage
Forward current
Pulse peak forward current
Surge forward current
V
IF
70
mA
140
mA
tp = 100 μs
IFSM
1
A
PV
140
mW
Operating temperature range
Storage temperature range
Rev. 1.0, 27-May-15
UNIT
5
IFM
Junction temperature
Thermal resistance junction/ambient
VALUE
VR
tp/T = 0.5, tp  100 μs
Power dissipation
Soldering temperature
SYMBOL
Tj
100
°C
Tamb
-40 to +85
°C
Tstg
-40 to +85
°C
acc. figure 7, J-STD-020
Tsd
260
°C
J-STD-051, soldered on PCB
RthJA
250
K/W
Document Number: 84294
1
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VSMY385010
www.vishay.com
Vishay Semiconductors
80
IF - Forward Current (mA)
PV - Power Dissipation (mW)
140
120
100
80
60
RthJA = 250 K/W
40
20
0
70
60
50
40
30
RthJA = 250 K/W
20
10
0
0
20
40
60
80
100
0
Tamb - Ambient Temperature (°C)
20
40
60
80
100
Tamb - Ambient Temperature (°C)
Fig. 1 - Power Dissipation Limit vs. Ambient Temperature
Fig. 2 - Forward Current Limit vs. Ambient Temperature
BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
PARAMETER
Forward voltage
TEST CONDITION
SYMBOL
TYP.
MAX.
UNIT
IF = 70 mA, tp = 20 ms
VF
1.6
2.0
V
IF = 1 A, tp = 100 μs
VF
2.9
V
IF = 70 mA
TKVF
-1.5
mV/K
IR
not designed for reverse operation
μA
VR = 0 V, f = 1 MHz, E = 0
Cj
125
IF = 70 mA, tp = 20 ms
Ie
Temperature coefficient of VF
Reverse current
Junction capacitance
Radiant intensity
Radiant power
MIN.
5.5
pF
9
16
mW/sr
IF = 1 A, tp = 100 μs
Ie
130
IF = 70 mA, tp = 20 ms
e
40
mW
IF = 70 mA
TKe
-0.25
%/K

± 60
deg
Temperature coefficient of e
Angle of half intensity
mW/sr
Peak wavelength
IF = 50 mA
p
Spectral bandwidth
IF = 50 mA

35
nm
Temperature coefficient of p
IF = 70 mA
TKp
0.26
nm/K
Rise time
IF = 70 mA
tr
10
ns
Fall time
IF = 70 mA
tf
10
ns
840
850
870
nm
BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
VF, rel - Relative Forward Voltage (%)
IF - Forward Current (mA)
1000
tp = 20 ms
100
10
1.2
1.4
1.6
1.8
2.0
VF - Forward Voltage (V)
Fig. 3 - Forward Current vs. Forward Voltage
Rev. 1.0, 27-May-15
115
IF = 70 mA
tp = 20 ms
110
105
100
95
90
-50
-25
0
25
50
75
100
125
Tamb - Ambient Temperature (°C)
Fig. 4 - Relative Forward Voltage vs. Ambient Temperature
Document Number: 84294
2
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VSMY385010
www.vishay.com
Vishay Semiconductors
Ie, rel - Relative Radiant Intensity (%)
tp = 20 ms
10
1
10
100
100
90
IF = 70 mA
80
70
60
50
40
30
20
10
0
1000
750
800
850
900
Fig. 5 - Radiant Intensity vs. Forward Current
1050
Fig. 7 - Relative Radiant Intensity vs. Wavelength
0°
10°
Ie, rel - Relative Radiant Intensity
150
140
IF = 70 mA
tp = 20 ms
130
1000
λ - Wavelength (nm)
IF - Forward Current (mA)
Ie, rel - Relative Radiant Intensity (%)
950
120
110
100
90
80
70
60
20°
30°
40°
1.0
0.9
50°
0.8
60°
70°
0.7
80°
ϕ - Angular Displacement
Ie - Radiant Intensity (mW/sr)
100
50
-50
-25
0
25
50
75
100
125
Tamb - Ambient Temperature (°C)
Fig. 6 - Relative Radiant Intensity vs. Ambient Temperature
Rev. 1.0, 27-May-15
0.6
0.4
0.2
0
λ - Wavelength (nm)
Fig. 8 - Relative Radiant Intensity vs. Angular Displacement
Document Number: 84294
3
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VSMY385010
www.vishay.com
Vishay Semiconductors
PACKAGE DIMENSIONS in millimeters
0.9
1.75±0.1
3.5±0.2
0.8
A
C
Technical drawings
according to DIN
specifications
2.2
2.8±0.15
Pin identification
Dimensions in mm
Ø2.4
Drawing-No.: 6.541-5067.02-4
Issue: 5; 23.09.13
+0.15
3
Mounting Pad Layout
Area covered
with solderresist
4
2.6 (2.8)
1.2
1.6 (1.9)
4
Dimensions: Reflow and vapor phase (wave soldering)
SOLDER PROFILE
Fig. 9 - Lead (Pb)-free Reflow Solder Profile acc. J-STD-020
300
Temperature (°C)
max. 260 °C
245 °C
255 °C
240 °C
217 °C
250
200
max. 30 s
150
max. 100 s
max. 120 s
100
max. ramp down 6 °C/s
50
max. ramp up 3 °C/s
0
0
19841
Rev. 1.0, 27-May-15
50
100
150
200
250
300
Time (s)
Document Number: 84294
4
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VSMY385010
www.vishay.com
Vishay Semiconductors
DRYPACK
is followed by six consecutive components.
Devices are packed in moisture barrier bags (MBB) to
prevent the products from moisture absorption during
transportation and storage. Each bag contains a desiccant.
De-reeling direction
94 8158
FLOOR LIFE
Floor life (time between soldering and removing from MBB)
must not exceed the time indicated on MBB label:
Floor life: 168 h
> 160 mm
Conditions: Tamb < 30 °C, RH < 60 %
Moisture sensitivity level 3, according to J-STD-020.
Tape leader
DRYING
40 empty
compartments
min. 75 empty
compartments
Carrier leader
Carrier trailer
Fig. 12 - Beginning and End of Reel
In case of moisture absorption devices should be baked
before soldering. Conditions see J-STD-020 or label.
Devices taped on reel dry using recommended conditions
192 h at 40 °C (+ 5 °C), RH < 5 %.
TAPE AND REEL
PLCC-2 components are packed in antistatic blister tape
(DIN IEC (CO) 564) for automatic component insertion.
Cavities of blister tape are covered with adhesive tape.
The tape leader is at least 160 mm and is followed by a
carrier tape leader with at least 40 empty compartments.
The tape leader may include the carrier tape as long as the
cover tape is not connected to the carrier tape. The least
component is followed by a carrier tape trailer with a least
75 empty compartments and sealed with cover tape.
10.0
9.0
120°
4.5
3.5
Adhesive tape
2.5
1.5
Blister tape
Component cavity
94 8670
Identification
Label:
Vishay
type
group
tape code
production
code
quantity
Fig. 10 - Blister Tape
3.5
3.1
4.1
3.9
4.5
3.5
4.0
3.6
2.5
1.5
8.3
7.7
0.25
2.05
1.95
94 8668
Fig. 11 - Tape Dimensions in mm for PLCC-2
MISSING DEVICES
A maximum of 0.5 % of the total number of components per
reel may be missing, exclusively missing components at the
beginning and at the end of the reel. A maximum of three
consecutive components may be missing, provided this gap
Rev. 1.0, 27-May-15
94 8665
10.4
8.4
120°
1.85
1.65
4.1
3.9
14.4 max.
180
178
Fig. 13 - Dimensions of Reel-GS08
5.75
5.25
1.6
1.4
63.5
60.5
2.2
2.0
3.6
3.4
13.00
12.75
Identification
Label:
Vishay
type
group
tape code
production
code
quantity
13.00
12.75
62.5
60.0
321
329
14.4 max.
18857
Fig. 14 - Dimensions of Reel-GS18
COVER TAPE REMOVAL FORCE
The removal force lies between 0.1 N and 1.0 N at a removal
Document Number: 84294
5
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VSMY385010
www.vishay.com
Vishay Semiconductors
speed of 5 mm/s. In order to prevent components from
popping out of the blisters, the cover tape must be pulled off
at an angle of 180° with regard to the feed direction.
Rev. 1.0, 27-May-15
Document Number: 84294
6
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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Revision: 02-Oct-12
1
Document Number: 91000