CADDOCK Applications Engineering Note: AEN-0104 Revision Date: 6/20/12, Rev. E Page 1 of 1 Terminal Finish and Soldering Process Information for Caddock Resistor Products Group 1: Caddock Resistor Products that are compatible with “Lead(Pb)-Free” wave soldering, utilizing a “through hole” circuit board wave soldering process. Caddock Resistor Products Terminal Finish and underplate "Lead Free" Soldering Process utilizing Sn/Ag or Sn/Ag/Cu solder alloys Type HVD Sn/Ag Solder Coated See “Solder Processing Note 1” Type MG Ultra-thin Gold (Au) over Nickel layer (Ni) See “Solder Processing Note 1” Type ML Type MM Ultra-thin Gold (Au) over Nickel layer (Ni) Ultra-thin Gold (Au) over Nickel layer (Ni) MP Models MP2060 MP915 Matte Tin (Sn) MP808 MP916 MP816 MP925 over Nickel flash (Ni) MP825 MP930 MP850 MP9100 MP820 MP821 Type MS Type MV Matte Tin (Sn) See “Solder Processing Note 1” See “Solder Processing Note 1” Caddock Resistor Products Type MK TK Models TK121 TK133V TK621 TK633V TK133 TK139 TK633 TK639 TK134 See “Solder Processing Note 1” See “Solder Processing Note 1” Solder Processing Note 3: This part is not normally compatible with the high temperature soldering process used in common “Lead(Pb)-Free” wave soldering. This part may only be used in “Lead(Pb)-Free” wave soldering when the temperature of the resistor terminal adjacent to the resistor body is maintained below 219°C during soldering. This can be accomplished: 1) By shielding the resistor body from top side heating to help accomplish this terminal temperature requirement; 2) When using Sn/Ag or Sn/Ag/Cu soldering alloys, managing the temperature of the resistor terminal, by spacing the resistor a distance above the circuit board or by using heat sink clips on the terminals adjacent to the resistor body to avoid exceeding the maximum lead temperature. Group 4: Caddock SMD Resistor Products that are NOT recommended for common “Lead-Free” SMD reflow soldering. See “Solder Processing Note 1” Type USF Matte Tin (Sn) See “Solder Processing Note 1” Type CD Type USG Ultra-thin Gold (Au) over Nickel layer (Ni) See “Solder Processing Note 1” Model MP725 Matte Tin (Sn) See “Solder Processing Note 1” Type USVD See “Solder Processing Note 1” Type T912 / T914 Sn/Ag Solder Coated See “Solder Processing Note 1” 1776-XXX Matte Tin (Sn) or Matte Tin (Sn) over Nickel flash (Ni) See “Solder Processing Note 1” 1776-CXXX Sn/Ag Solder Coated See “Solder Processing Note 1” Type 1787 Matte Tin (Sn) or Matte Tin (Sn) over Nickel flash (Ni) See “Solder Processing Note 1” Type 1789 Sn/Ag Solder Coated See “Solder Processing Note 1” Type T1794 Sn/Ag Solder Coated See “Solder Processing Note 1” 1776 Models Solder Processing Note 1: Wave soldering with 260°C peak temperature (maximum) with a maximum time at peak temperature of 10 seconds. Group 2: Caddock SMD Resistor Products that are compatible with “Lead-Free” SMD reflow soldering. Caddock Resistor Terminal Finish Products and underplate Type CC Type CHR Metallization or Sn/Ag/Cu coating Metallization "Lead Free" Soldering Process ultilizing Sn/Ag or Sn/Ag/Cu solder alloys See “Solder Processing Note 2” See “Solder Processing Note 2” Solder Processing Note 2: SMD reflow soldering with 260°C peak temperature (maximum) with a maximum time at peak temperature of 10 seconds. CADDOCK © Caddock Electronics Inc., 2012 See “Solder Processing Note 3” See “Solder Processing Note 3” See “Solder Processing Note 1” Type THV Matte Tin (Sn) over Nickel flash (Ni) See “Solder Processing Note 3” Matte Tin (Sn) over Nickel flash (Ni) Matte Tin (Sn) Type TG Matte Tin (Sn) over Nickel flash (Ni) "Lead Free" Soldering Process utilizing Sn/Ag or Sn/Ag/Cu solder alloys See “Solder Processing Note 3” Ultra-thin Gold (Au) over Nickel layer (Ni) Ultra-thin Gold (Au) over Nickel layer (Ni) Type TF Terminal Finish and underplate Ultra-thin Gold (Au) TK634 over Nickel layer (Ni) Type TN See “Solder Processing Note 1” See “Solder Processing Note 1” Ultra-thin Gold (Au) over Nickel layer (Ni) Ultra-thin Gold (Au) over Nickel layer (Ni) Group 3: Caddock Resistor Products that are compatible with “Lead(Pb)-Free” wave soldering but only with special conditions that control the maximum terminal temperature adjacent to the resistor body. Caddock Resistor Products Terminal Finish and underplate Sn/Ag or Aluminum (Al) Matte Tin (Sn) over Nickel flash (Ni) Comments See “Solder Processing Note 4” See “Solder Processing Note 4” Solder Processing Note 4: This part is not compatible with the high temperature soldering process used in common “Lead-Free” SMD reflow soldering. The soldering profile must not cause the body of these resistors to exceed 219°C. See Caddock Applications Engineering Note AEN-0108 Group 5: Caddock Resistor Products that are NOT recommended for common “Lead-Free” wave soldering. Caddock Resistor Products Terminal Finish and underplate Comments Type LC Sn/Ag Solder coated See Solder Processing Note 5 Type SR Sn/Ag or Matte Tin (Sn) See Solder Processing Note 5 Solder Processing Note 5: This part is not compatible with the high temperature soldering process used in common “Lead-Free” wave soldering. The soldering profile must not cause the body of these resistors to exceed 219°C. Group 6: Caddock Resistor Products with Lead (Pb) in terminal finish that are NOT recommended for “Lead-Free” wave soldering. Caddock Resistor Products Type MX Terminal Finish and underplate Comments Sn/Pb See “Solder Processing Note 6” Solder Processing Note 6: Due to the Lead (Pb) in the terminal finish, this part is not compatible with “Lead-Free” Soldering processes. Obtain pdf copies of AEN documents at www.caddock.com