GSDC165ADE 165-Bump BGA (15 mm x 17 mm) DummyDie™ Daisy Chain Package Description This mechanical daisy chain test vehicle is designed to represent the 165-Bump BGA package. It is used for second level interconnect assembly test and continuity verification. The DummyDie™ incorporates a 10 mm x 15 mm die, which is not electrically connected. Package Dimensions—165-Bump FPBGA (Package E) A1 CORNER TOP VIEW BOTTOM VIEW Ø0.10 M C Ø0.25 M C A B Ø0.40~0.60 (165x) 1 2 3 4 5 6 7 8 9 10 11 A1 CORNER 11 10 9 8 7 6 5 4 3 2 1 A B C D E F G H J K L M N P R 1.0 14.0 17±0.05 1.0 A B C D E F G H J K L M N P R A 1.0 1.0 10.0 0.20 C B C Rev: 1.01 12/2009 0.20(4x) 0.36~0.46 1.50 MAX. SEATING PLANE 15±0.05 1/3 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 2004, GSI Technology GSDC165ADE Package Dimensions—165-Bump FPBGA 1 2 3 4 5 6 7 8 9 10 11 A B C D E F G H J K L M N P R Rev: 1.01 12/2009 2/3 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 2004, GSI Technology GSDC165ADE Ordering Information 165-Bump BGA (15 mm x 17 mm) Daisy Chain Package GSDC165ADE Package Designator DummyDie™ Designator Revision Ball Count Daisy Chain GSI Technology 165-Bump BGA (15 mm x 17 mm) Daisy Chain Package RoHS-compliant Option GSDC165ADGE Package Designator RoHS-compliance designator DummyDie™ Designator Revision Ball Count Daisy Chain GSI Technology Rev: 1.01 12/2009 3/3 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 2004, GSI Technology