72Mb Pipelined and Flow Through Synchronous

GS8642Z18/36/72(B/C)-xxxV
119- & 209-Bump BGA
Commercial Temp
Industrial Temp
72Mb Pipelined and Flow Through
Synchronous NBT SRAM
Features
• NBT (No Bus Turn Around) functionality allows zero wait
Read-Write-Read bus utilization; fully pin-compatible with
both pipelined and flow through NtRAM™, NoBL™ and
ZBT™ SRAMs
• 1.8 V 2.5 V core power supply
• 1.8 V or 2.5 V I/O supply
• User-configurable Pipeline and Flow Through mode
• ZQ mode pin for user-selectable high/low output drive
• IEEE 1149.1 JTAG-compatible Boundary Scan
• LBO pin for Linear or Interleave Burst mode
• Pin-compatible with 2Mb, 4Mb, 8Mb, and 16Mb devices
• Byte write operation (9-bit Bytes)
• 3 chip enable signals for easy depth expansion
• ZZ Pin for automatic power-down
• JEDEC-standard 119- or 209-bump BGA package
• RoHS-compliant 119- and 209-bump BGA packages
available
Functional Description
250 MHz–167 MHz
1.8 V or 2.5 V VDD
1.8 V or 2.5 V I/O
Because it is a synchronous device, address, data inputs, and
read/write control inputs are captured on the rising edge of the
input clock. Burst order control (LBO) must be tied to a power
rail for proper operation. Asynchronous inputs include the
Sleep mode enable (ZZ) and Output Enable. Output Enable can
be used to override the synchronous control of the output
drivers and turn the RAM's output drivers off at any time.
Write cycles are internally self-timed and initiated by the rising
edge of the clock input. This feature eliminates complex offchip write pulse generation required by asynchronous SRAMs
and simplifies input signal timing.
The GS8642Z18/36/72(B/C)-xxxV may be configured by the
user to operate in Pipeline or Flow Through mode. Operating
as a pipelined synchronous device, in addition to the risingedge-triggered registers that capture input signals, the device
incorporates a rising edge triggered output register. For read
cycles, pipelined SRAM output data is temporarily stored by
the edge-triggered output register during the access cycle and
then released to the output drivers at the next rising edge of
clock.
The GS8642Z18/36/72(B/C)-xxxV is a 72Mbit Synchronous
Static SRAM. GSI's NBT SRAMs, like ZBT, NtRAM, NoBL
The GS8642Z18/36/72(B/C)-xxxV is implemented with GSI's
or other pipelined read/double late write or flow through read/
high performance CMOS technology and is available in a
single late write SRAMs, allow utilization of all available bus
JEDEC-standard 119-bump or 209-bump BGA package.
bandwidth by eliminating the need to insert deselect cycles
when the device is switched from read to write cycles.
Parameter Synopsis
Pipeline
3-1-1-1
Flow Through
2-1-1-1
Rev: 1.04a 2/2009
-250
-200
-167
Unit
tKQ
tCycle
3.0
4.0
3.0
5.0
3.4
6.0
ns
ns
Curr (x18)
Curr (x36)
Curr (x72)
340
410
520
290
350
435
260
305
380
mA
mA
mA
tKQ
tCycle
6.5
6.5
7.5
7.5
8.0
8.0
ns
ns
Curr (x18)
Curr (x36)
Curr (x72)
245
280
370
220
250
315
210
240
300
mA
mA
mA
1/33
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2004, GSI Technology
GS8642Z18/36/72(B/C)-xxxV
GS8642Z72C-xxxV Pad Out–209-Bump BGA—Top View (Package C)
1
2
3
4
5
6
7
8
9
10
11
A
DQG
DQG
A
E2
A
ADV
A
E3
A
DQB
DQB
A
B
DQG
DQG
BC
BG
NC
W
A
BB
BF
DQB
DQB
B
C
DQG
DQG
BH
BD
NC
E1
NC
BE
BA
DQB
DQB
C
D
DQG
DQG
VSS
NC
NC
G
NC
NC
VSS
DQB
DQB
D
E
DQPG
DQPC
VDDQ
VDDQ
VDD
VDD
VDD
VDDQ
VDDQ
DQPF
DQPB
E
F
DQC
DQC
VSS
VSS
VSS
ZQ
VSS
VSS
VSS
DQF
DQF
F
G
DQC
DQC
VDDQ
VDDQ
VDD
MCH
VDD
VDDQ
VDDQ
DQF
DQF
G
H
DQC
DQC
VSS
VSS
VSS
MCL
VSS
VSS
VSS
DQF
DQF
H
J
DQC
DQC
VDDQ
VDDQ
VDD
MCH
VDD
VDDQ
VDDQ
DQF
DQF
J
K
NC
NC
CK
NC
VSS
CKE
VSS
NC
NC
NC
NC
K
L
DQH
DQH
VDDQ
VDDQ
VDD
FT
VDD
VDDQ
VDDQ
DQA
DQA
L
M
DQH
DQH
VSS
VSS
VSS
MCL
VSS
VSS
VSS
DQA
DQA
M
N
DQH
DQH
VDDQ
VDDQ
VDD
MCH
VDD
VDDQ
VDDQ
DQA
DQA
N
P
DQH
DQH
VSS
VSS
VSS
ZZ
VSS
VSS
VSS
DQA
DQA
P
R
DQPD
DQPH
VDDQ
VDDQ
VDD
VDD
VDD
VDDQ
VDDQ
DQPA
DQPE
R
T
DQD
DQD
VSS
NC
NC
LBO
NC
NC
VSS
DQE
DQE
T
U
DQD
DQD
NC
A
A
A
A
A
NC
DQE
DQE
U
V
DQD
DQD
A
A
A
A1
A
A
A
DQE
DQE
V
W
DQD
DQD
TMS
TDI
A
A0
A
TDO
TCK
DQE
DQE
W
11 x 19 Bump BGA—14 x 22 mm2 Body—1 mm Bump Pitch
Rev: 1.04a 2/2009
2/33
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2004, GSI Technology
GS8642Z18/36/72(B/C)-xxxV
GS8642Z72C-xxxV 209-Bump BGA Pin Description
Symbol
Type
Description
A 0, A 1
I
Address field LSBs and Address Counter Preset Inputs
An
I
Address Inputs
DQA
DQB
DQC
DQD
DQE
DQF
DQG
DQH
I/O
Data Input and Output pins
BA, BB
I
Byte Write Enable for DQA, DQB I/Os; active low
BC,BD
I
Byte Write Enable for DQC, DQD I/Os; active low
BE, BF, BG,BH
I
Byte Write Enable for DQE, DQF, DQG, DQH I/Os; active low
NC
—
No Connect
CK
I
Clock Input Signal; active high
E1
I
Chip Enable; active low
E3
I
Chip Enable; active low
E2
I
Chip Enable; active high
G
I
Output Enable; active low
ADV
I
Burst address counter advance enable
ZZ
I
Sleep Mode control; active high
FT
I
Flow Through or Pipeline mode; active low
LBO
I
Linear Burst Order mode; active low
MCH
I
Must Connect High
MCH
I
Must Connect High
Must Connect Low
MCL
W
I
Write Enable; active low
ZQ
I
FLXDrive Output Impedance Control
Low = Low Impedance [High Drive],
High = High Impedance [Low Drive]
CKE
I
Clock Enable; active low
Rev: 1.04a 2/2009
3/33
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2004, GSI Technology
GS8642Z18/36/72(B/C)-xxxV
GS8642Z72C-xxxV 209-Bump BGA Pin Description
Symbol
Type
Description
TMS
I
Scan Test Mode Select
TDI
I
Scan Test Data In
TDO
O
Scan Test Data Out
TCK
I
Scan Test Clock
VDD
I
Core power supply
VSS
I
I/O and Core Ground
VDDQ
I
Output driver power supply
Rev: 1.04a 2/2009
4/33
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2004, GSI Technology
GS8642Z18/36/72(B/C)-xxxV
GS8642Z36B-xxxV Pad Out–119-Bump BGA—Top View
1
2
3
4
5
6
7
A
VDDQ
A
A
A
A
A
VDDQ
A
B
NC
E2
A
ADV
A
E3
NC
B
C
NC
A
A
VDD
A
A
NC
C
D
DQC
DQPC
VSS
ZQ
VSS
DQPB
DQB
D
E
DQC
DQC
VSS
E1
VSS
DQB
DQB
E
F
VDDQ
DQC
VSS
G
VSS
DQB
VDDQ
F
G
DQC
DQC
BC
A
BB
DQB
DQB
G
H
DQC
DQC
VSS
W
VSS
DQB
DQB
H
J
VDDQ
VDD
NC
VDD
NC
VDD
VDDQ
J
K
DQD
DQD
VSS
CK
VSS
DQA
DQA
K
L
DQD
DQD
BD
NC
BA
DQA
DQA
L
M
VDDQ
DQD
VSS
CKE
VSS
DQA
VDDQ
M
N
DQD
DQD
VSS
A1
VSS
DQA
DQA
N
P
DQD
DQPD
VSS
A0
VSS
DQPA
DQA
P
R
NC
A
LBO
VDD
FT
A
NC
R
T
NC
A
A
A
A
A
ZZ
T
U
VDDQ
TMS
TDI
TCK
TDO
NC
VDDQ
U
7 x 17 Bump BGA—14 x 22 mm2 Body—1.27 mm Bump Pitch
Rev: 1.04a 2/2009
5/33
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2004, GSI Technology
GS8642Z18/36/72(B/C)-xxxV
GS8642Z18B-xxxV Pad Out–119-Bump BGA—Top View
1
2
3
4
5
6
7
A
VDDQ
A
A
A
A
A
VDDQ
A
B
NC
E2
A
ADV
A
E3
NC
B
C
NC
A
A
VDD
A
A
NC
C
D
DQB
NC
VSS
ZQ
VSS
DQPA
NC
D
E
NC
DQB
VSS
E1
VSS
NC
DQA
E
F
VDDQ
NC
VSS
G
VSS
DQA
VDDQ
F
G
NC
DQB
BB
A
NC
NC
DQA
G
H
DQB
NC
VSS
W
VSS
DQA
NC
H
J
VDDQ
VDD
NC
VDD
NC
VDD
VDDQ
J
K
NC
DQB
VSS
CK
VSS
NC
DQA
K
L
DQB
NC
NC
NC
BA
DQA
NC
L
M
VDDQ
DQB
VSS
CKE
VSS
NC
VDDQ
M
N
DQB
NC
VSS
A1
VSS
DQA
NC
N
P
NC
DQPB
VSS
A0
VSS
NC
DQA
P
R
NC
A
LBO
VDD
FT
A
NC
R
T
A
A
A
A
A
A
ZZ
T
U
VDDQ
TMS
TDI
TCK
TDO
NC
VDDQ
U
7 x 17 Bump BGA—14 x 22 mm2 Body—1.27 mm Bump Pitch
Rev: 1.04a 2/2009
6/33
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2004, GSI Technology
GS8642Z18/36/72(B/C)-xxxV
GS8642Z18/36B-xxxV 119-Bump BGA Pin Description
Symbol
Type
Description
A 0, A 1
I
Address field LSBs and Address Counter Preset Inputs
An
I
Address Inputs
DQA
DQB
DQC
DQD
I/O
Data Input and Output pins
BA , BB , BC , BD
I
Byte Write Enable for DQA, DQB, DQC, DQD I/Os; active low
NC
—
No Connect
CK
I
Clock Input Signal; active high
CKE
I
Clock Enable; active low
W
I
Write Enable; active low
E1
I
Chip Enable; active low
E3
I
Chip Enable; active low
E2
I
Chip Enable; active high
G
I
Output Enable; active low
ADV
I
Burst address counter advance enable
ZZ
I
Sleep mode control; active high
FT
I
Flow Through or Pipeline mode; active low
LBO
I
Linear Burst Order mode; active low
ZQ
I
FLXDrive Output Impedance Control
Low = Low Impedance [High Drive], High = High Impedance [Low Drive])
TMS
I
Scan Test Mode Select
TDI
I
Scan Test Data In
TDO
O
Scan Test Data Out
TCK
I
Scan Test Clock
VDD
I
Core power supply
VSS
I
I/O and Core Ground
VDDQ
I
Output driver power supply
BPR1999.05.18
Rev: 1.04a 2/2009
7/33
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2004, GSI Technology
GS8642Z18/36/72(B/C)-xxxV
Functional Details
Clocking
Deassertion of the Clock Enable (CKE) input blocks the Clock input from reaching the RAM's internal circuits. It may be used to
suspend RAM operations. Failure to observe Clock Enable set-up or hold requirements will result in erratic operation.
Pipeline Mode Read and Write Operations
All inputs (with the exception of Output Enable, Linear Burst Order and Sleep) are synchronized to rising clock edges. Single cycle
read and write operations must be initiated with the Advance/Load pin (ADV) held low, in order to load the new address. Device
activation is accomplished by asserting all three of the Chip Enable inputs (E1, E2, and E3). Deassertion of any one of the Enable
inputs will deactivate the device.
Function
W
BA
BB
BC
BD
Read
H
X
X
X
X
Write Byte “a”
L
L
H
H
H
Write Byte “b”
L
H
L
H
H
Write Byte “c”
L
H
H
L
H
Write Byte “d”
L
H
H
H
L
Write all Bytes
L
L
L
L
L
Write Abort/NOP
L
H
H
H
H
Read operation is initiated when the following conditions are satisfied at the rising edge of clock: CKE is asserted low, all three
chip enables (E1, E2, and E3) are active, the write enable input signals W is deasserted high, and ADV is asserted low. The address
presented to the address inputs is latched into the address register and presented to the memory core and control logic. The control
logic determines that a read access is in progress and allows the requested data to propagate to the input of the output register. At
the next rising edge of clock the read data is allowed to propagate through the output register and onto the output pins.
Write operation occurs when the RAM is selected, CKE is active, and the Write input is sampled low at the rising edge of clock.
The Byte Write Enable inputs (BA, BB, BC, and BD) determine which bytes will be written. All or none may be activated. A write
cycle with no Byte Write inputs active is a no-op cycle. The pipelined NBT SRAM provides double late write functionality,
matching the write command versus data pipeline length (2 cycles) to the read command versus data pipeline length (2 cycles). At
the first rising edge of clock, Enable, Write, Byte Write(s), and Address are registered. The Data In associated with that address is
required at the third rising edge of clock.
Flow Through Mode Read and Write Operations
Operation of the RAM in Flow Through mode is very similar to operations in Pipeline mode. Activation of a Read Cycle and the
use of the Burst Address Counter is identical. In Flow Through mode the device may begin driving out new data immediately after
new address are clocked into the RAM, rather than holding new data until the following (second) clock edge. Therefore, in Flow
Through mode the read pipeline is one cycle shorter than in Pipeline mode.
Write operations are initiated in the same way, but differ in that the write pipeline is one cycle shorter as well, preserving the ability
to turn the bus from reads to writes without inserting any dead cycles. While the pipelined NBT RAMs implement a double late
write protocol in Flow Through mode a single late write protocol mode is observed. Therefore, in Flow Through mode, address
and control are registered on the first rising edge of clock and data in is required at the data input pins at the second rising edge of
clock.
Rev: 1.04a 2/2009
8/33
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2004, GSI Technology
GS8642Z18/36/72(B/C)-xxxV
Synchronous Truth Table
Operation
Type Address CK CKE ADV W Bx E1 E2 E3 G ZZ
DQ
Notes
Read Cycle, Begin Burst
R
External
L-H
L
L
H
X
L
H
L
L
L
Q
Read Cycle, Continue Burst
B
Next
L-H
L
H
X
X
X
X
X
L
L
Q
1,10
NOP/Read, Begin Burst
R
External
L-H
L
L
H
X
L
H
L
H
L
High-Z
2
Dummy Read, Continue Burst
B
Next
L-H
L
H
X
X
X
X
X
H
L
High-Z
1,2,10
Write Cycle, Begin Burst
W
External
L-H
L
L
L
L
L
H
L
X
L
D
3
Write Abort, Begin Burst
D
None
L-H
L
L
L
H
L
H
L
X
L
High-Z
1
Write Cycle, Continue Burst
B
Next
L-H
L
H
X
L
X
X
X
X
L
D
1,3,10
Write Abort, Continue Burst
B
Next
L-H
L
H
X
H
X
X
X
X
L
High-Z 1,2,3,10
Deselect Cycle, Power Down
D
None
L-H
L
L
X
X
H
X
X
X
L
High-Z
Deselect Cycle, Power Down
D
None
L-H
L
L
X
X
X
X
H
X
L
High-Z
Deselect Cycle, Power Down
D
None
L-H
L
L
X
X
X
L
X
X
L
High-Z
Deselect Cycle, Continue
D
None
L-H
L
H
X
X
X
X
X
X
L
High-Z
None
X
X
X
X
X
X
X
X
X
H
High-Z
Current
L-H
H
X
X
X
X
X
X
X
L
-
Sleep Mode
Clock Edge Ignore, Stall
1
4
Notes:
1. Continue Burst cycles, whether read or write, use the same control inputs. A Deselect continue cycle can only be entered into if a Deselect cycle is executed first.
2. Dummy Read and Write abort can be considered NOPs because the SRAM performs no operation. A Write abort occurs when the W
pin is sampled low but no Byte Write pins are active so no write operation is performed.
3. G can be wired low to minimize the number of control signals provided to the SRAM. Output drivers will automatically turn off during
write cycles.
4. If CKE High occurs during a pipelined read cycle, the DQ bus will remain active (Low Z). If CKE High occurs during a write cycle, the bus
will remain in High Z.
5. X = Don’t Care; H = Logic High; L = Logic Low; Bx = High = All Byte Write signals are high; Bx = Low = One or more Byte/Write
signals are Low
6. All inputs, except G and ZZ must meet setup and hold times of rising clock edge.
7. Wait states can be inserted by setting CKE high.
8. This device contains circuitry that ensures all outputs are in High Z during power-up.
9. A 2-bit burst counter is incorporated.
10. The address counter is incriminated for all Burst continue cycles.
Rev: 1.04a 2/2009
9/33
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2004, GSI Technology
GS8642Z18/36/72(B/C)-xxxV
Pipelined and Flow Through Read Write Control State Diagram
D
B
Deselect
W
R
D
R
D
W
New Read
New Write
R
W
B
B
R
B
W
R
Burst Read
W
Burst Write
D
Key
B
D
Notes
Input Command Code
1. The Hold command (CKE Low) is not
shown because it prevents any state change.
ƒ Transition
Current State (n)
2. W, R, B, and D represent input command
codes as indicated in the Synchronous Truth Table.
Next State (n+1)
n
n+1
n+2
n+3
Clock (CK)
Command
ƒ
Current State
ƒ
ƒ
ƒ
Next State
Current State and Next State Definition for Pipelined and Flow through Read/Write Control State Diagram
Rev: 1.04a 2/2009
10/33
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2004, GSI Technology
GS8642Z18/36/72(B/C)-xxxV
Pipeline Mode Data I/O State Diagram
Intermediate
B W
R B
Intermediate
R
High Z
(Data In)
D
Data Out
(Q Valid)
W
D
Intermediate
Intermediate
W
Intermediate
R
High Z
B
D
Intermediate
Key
Notes
Input Command Code
1. The Hold command (CKE Low) is not
shown because it prevents any state change.
ƒ Transition
Current State (n)
Transition
Intermediate State (N+1)
n
Next State (n+2)
n+1
2. W, R, B, and D represent input command
codes as indicated in the Truth Tables.
n+2
n+3
Clock (CK)
Command
ƒ
ƒ
ƒ
Current State
Intermediate
State
Next State
ƒ
Current State and Next State Definition for Pipeline Mode Data I/O State Diagram
Rev: 1.04a 2/2009
11/33
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2004, GSI Technology
GS8642Z18/36/72(B/C)-xxxV
Flow Through Mode Data I/O State Diagram
B W
R B
R
High Z
(Data In)
Data Out
(Q Valid)
W
D
D
W
R
High Z
B
D
Key
Notes
Input Command Code
1. The Hold command (CKE Low) is not
shown because it prevents any state change.
ƒ Transition
Current State (n)
2. W, R, B, and D represent input command
codes as indicated in the Truth Tables.
Next State (n+1)
n
n+1
n+2
n+3
Clock (CK)
Command
ƒ
Current State
ƒ
ƒ
ƒ
Next State
Current State and Next State Definition for: Pipeline and Flow Through Read Write Control State Diagram
Rev: 1.04a 2/2009
12/33
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2004, GSI Technology
GS8642Z18/36/72(B/C)-xxxV
Burst Cycles
Although NBT RAMs are designed to sustain 100% bus bandwidth by eliminating turnaround cycle when there is transition from
read to write, multiple back-to-back reads or writes may also be performed. NBT SRAMs provide an on-chip burst address
generator that can be utilized, if desired, to further simplify burst read or write implementations. The ADV control pin, when
driven high, commands the SRAM to advance the internal address counter and use the counter generated address to read or write
the SRAM. The starting address for the first cycle in a burst cycle series is loaded into the SRAM by driving the ADV pin low, into
Load mode.
Burst Order
The burst address counter wraps around to its initial state after four addresses (the loaded address and three more) have been
accessed. The burst sequence is determined by the state of the Linear Burst Order pin (LBO). When this pin is Low, a linear burst
sequence is selected. When the RAM is installed with the LBO pin tied high, Interleaved burst sequence is selected. See the tables
below for details.
Mode Pin Functions
Mode Name
Pin Name
Burst Order Control
LBO
Output Register Control
FT
Power Down Control
ZZ
FLXDrive Output Impedance Control
ZQ
State
Function
L
Linear Burst
H
Interleaved Burst
L
Flow Through
H or NC
Pipeline
L or NC
Active
H
Standby, IDD = ISB
L
High Drive (Low Impedance)
H or NC
Low Drive (High Impedance)
Note:
There are pull-up devices on the ZQ and FT pins and a pull-down device on the ZZ and PE pins, so those input pins can be unconnected and
the chip will operate in the default states as specified in the above tables.
Rev: 1.04a 2/2009
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GS8642Z18/36/72(B/C)-xxxV
Burst Counter Sequences
Linear Burst Sequence
Interleaved Burst Sequence
A[1:0] A[1:0] A[1:0] A[1:0]
A[1:0] A[1:0] A[1:0] A[1:0]
1st address
00
01
10
11
1st address
00
01
10
11
2nd address
01
10
11
00
2nd address
01
00
11
10
3rd address
10
11
00
01
3rd address
10
11
00
01
4th address
11
00
01
10
4th address
11
10
01
00
Note:
The burst counter wraps to initial state on the 5th clock.
Note:
The burst counter wraps to initial state on the 5th clock.
BPR 1999.05.18
Sleep Mode
During normal operation, ZZ must be pulled low, either by the user or by its internal pull down resistor. When ZZ is pulled high,
the SRAM will enter a Power Sleep mode after 2 cycles. At this time, internal state of the SRAM is preserved. When ZZ returns to
low, the SRAM operates normally after 2 cycles of wake up time.
Sleep mode is a low current, power-down mode in which the device is deselected and current is reduced to ISB2. The duration of
Sleep mode is dictated by the length of time the ZZ is in a High state. After entering Sleep mode, all inputs except ZZ become
disabled and all outputs go to High-Z The ZZ pin is an asynchronous, active high input that causes the device to enter Sleep mode.
When the ZZ pin is driven high, ISB2 is guaranteed after the time tZZI is met. Because ZZ is an asynchronous input, pending
operations or operations in progress may not be properly completed if ZZ is asserted. Therefore, Sleep mode must not be initiated
until valid pending operations are completed. Similarly, when exiting Sleep mode during tZZR, only a Deselect or Read commands
may be applied while the SRAM is recovering from Sleep mode.
Sleep Mode Timing Diagram
tKH
tKC
tKL
CK
tZZR
tZZS
tZZH
ZZ
Designing for Compatibility
The GSI NBT SRAMs offer users a configurable selection between Flow Through mode and Pipeline mode via the FT signal. Not
all vendors offer this option, however most mark the pin VDD or VDDQ on pipelined parts and VSS on flow through parts. GSI NBT
SRAMs are fully compatible with these sockets. Other vendors mark the pin as a No Connect (NC). GSI RAMs have an internal
pull-up device on the FT pin so a floating FT pin will result in pipelined operation. If the part being replaced is a pipelined mode
part, the GSI RAM is fully compatible with these sockets. In the unlikely event the part being replaced is a Flow Through device,
the pin will need to be pulled low for correct operation.
Rev: 1.04a 2/2009
14/33
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
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GS8642Z18/36/72(B/C)-xxxV
Absolute Maximum Ratings
(All voltages reference to VSS)
Symbol
Description
Value
Unit
VDD
Voltage on VDD Pins
–0.5 to 4.6
V
VDDQ
Voltage on VDDQ Pins
–0.5 to VDD
V
VI/O
Voltage on I/O Pins
–0.5 to VDDQ +0.5 ( 4.6 V max.)
V
VIN
Voltage on Other Input Pins
–0.5 to VDD +0.5 ( 4.6 V max.)
V
IIN
Input Current on Any Pin
+/–20
mA
IOUT
Output Current on Any I/O Pin
+/–20
mA
PD
Package Power Dissipation
1.5
W
TSTG
Storage Temperature
–55 to 125
o
TBIAS
Temperature Under Bias
–55 to 125
o
C
C
Note:
Permanent damage to the device may occur if the Absolute Maximum Ratings are exceeded. Operation should be restricted to Recommended
Operating Conditions. Exposure to conditions exceeding the Absolute Maximum Ratings, for an extended period of time, may affect reliability of
this component.
Power Supply Voltage Ranges (1.8 V/2.5 V Version)
Parameter
Symbol
Min.
Typ.
Max.
Unit
1.8 V Supply Voltage
VDD1
1.7
1.8
2.0
V
2.5 V Supply Voltage
VDD2
2.3
2.5
2.7
V
1.8 V VDDQ I/O Supply Voltage
VDDQ1
1.7
1.8
VDD
V
2.5 V VDDQ I/O Supply Voltage
VDDQ2
2.3
2.5
VDD
V
Notes
Notes:
1. The part numbers of Industrial Temperature Range versions end the character “I”. Unless otherwise noted, all performance specifications quoted are evaluated for worst case in the temperature range marked on the device.
2. Input Under/overshoot voltage must be –2 V > Vi < VDDn+2 V not to exceed 4.6 V maximum, with a pulse width not to exceed 20% tKC.
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GS8642Z18/36/72(B/C)-xxxV
VDDQ2 & VDDQ1 Range Logic Levels
Parameter
Symbol
Min.
Typ.
Max.
Unit
Notes
VDD Input High Voltage
VIH
0.6*VDD
—
VDD + 0.3
V
1
VDD Input Low Voltage
VIL
–0.3
—
0.3*VDD
V
1
Notes:
1. The part numbers of Industrial Temperature Range versions end the character “I”. Unless otherwise noted, all performance specifications quoted are evaluated for worst case in the temperature range marked on the device.
2. Input Under/overshoot voltage must be –2 V > Vi < VDDn+2 V not to exceed 4.6 V maximum, with a pulse width not to exceed 20% tKC.
Recommended Operating Temperatures
Parameter
Symbol
Min.
Typ.
Max.
Unit
Notes
Ambient Temperature (Commercial Range Versions)
TA
0
25
70
C
2
Ambient Temperature (Industrial Range Versions)
TA
–40
25
85
C
2
Notes:
1. The part numbers of Industrial Temperature Range versions end the character “I”. Unless otherwise noted, all performance specifications quoted are evaluated for worst case in the temperature range marked on the device.
2. Input Under/overshoot voltage must be –2 V > Vi < VDDn+2 V not to exceed 4.6 V maximum, with a pulse width not to exceed 20% tKC.
Undershoot Measurement and Timing
Overshoot Measurement and Timing
VIH
20% tKC
VDD + 2.0 V
VSS
50%
50%
VDD
VSS – 2.0 V
20% tKC
VIL
Capacitance
(TA = 25oC, f = 1 MHZ, VDD = 2.5 V)
Parameter
Symbol
Test conditions
Typ.
Max.
Unit
Input Capacitance
CIN
VIN = 0 V
8
10
pF
Input/Output Capacitance
CI/O
VOUT = 0 V
12
14
pF
Note:
These parameters are sample tested.
Rev: 1.04a 2/2009
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© 2004, GSI Technology
GS8642Z18/36/72(B/C)-xxxV
AC Test Conditions
Parameter
Conditions
Input high level
VDD – 0.2 V
Input low level
0.2 V
Input slew rate
1 V/ns
Input reference level
VDD/2
Output reference level
VDDQ/2
Output load
Fig. 1
Figure 1
Output Load 1
DQ
30pF*
50
Notes:
1. Include scope and jig capacitance.
2. Test conditions as specified with output loading as shown in Fig. 1
unless otherwise noted.
3. Device is deselected as defined by the Truth Table.
VDDQ/2
* Distributed Test Jig Capacitance
DC Electrical Characteristics
Parameter
Symbol
Test Conditions
Min
Max
Input Leakage Current
(except mode pins)
IIL
VIN = 0 to VDD
–1 uA
1 uA
FT, ZQ, ZZ Input Current
IIN
VDD  VIN  0 V
–100 uA
100 uA
Output Leakage Current
IOL
Output Disable, VOUT = 0 to VDD
–1 uA
1 uA
DC Output Characteristics (1.8 V/2.5 V Version)
Parameter
Symbol
Test Conditions
Min
Max
1.8 V Output High Voltage
VOH1
IOH = –4 mA, VDDQ = 1.7 V
VDDQ – 0.4 V
—
2.5 V Output High Voltage
VOH2
IOH = –8 mA, VDDQ = 2.375 V
1.7 V
—
1.8 V Output Low Voltage
VOL1
IOL = 4 mA
—
0.4 V
2.5 V Output Low Voltage
VOL2
IOL = 8 mA
—
0.4 V
Rev: 1.04a 2/2009
17/33
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2004, GSI Technology
GS8642Z18/36/72(B/C)-xxxV
Operating Currents
-250
Parameter
Test Conditions
Operating
Current
Device Selected;
All other inputs
VIH or VIL
Output open
(x32/
x36)
(x18)
Standby
Current
ZZ VDD – 0.2 V
Deselect
Current
Device Deselected;
All other inputs
VIH or  VIL
—
—
-167
Symbol
0
to
70°C
–40
to
85°C
0
to
70°C
–40
to
85°C
0
to
70°C
–40
to
85°C
Pipeline
IDD
IDDQ
460
60
480
60
385
50
405
50
340
40
360
40
mA
Flow
Through
IDD
IDDQ
330
40
340
40
285
30
295
30
270
30
280
30
mA
Pipeline
IDD
IDDQ
360
50
380
50
310
40
330
40
270
35
290
35
mA
Flow
Through
IDD
IDDQ
255
25
275
25
230
20
250
20
220
20
240
20
mA
Pipeline
IDD
IDDQ
315
25
335
25
270
20
290
20
240
20
260
20
mA
Flow
Through
IDD
IDDQ
230
15
250
15
205
15
225
15
195
15
215
15
mA
Pipeline
ISB
100
120
100
120
100
120
mA
Flow
Through
ISB
100
120
100
120
100
120
mA
Pipeline
IDD
140
155
130
146
125
140
mA
Flow
Through
IDD
125
140
120
135
120
135
mA
Mode
(x72)
-200
Unit
Notes:
1. IDD and IDDQ apply to any combination of VDD and VDDQ operation.
2. All parameters listed are worst case scenario.
Rev: 1.04a 2/2009
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© 2004, GSI Technology
GS8642Z18/36/72(B/C)-xxxV
AC Electrical Characteristics
Pipeline
Flow Through
Parameter
Symbol
Clock Cycle Time
-250
-200
-167
Unit
Min
Max
Min
Max
Min
Max
tKC
4.0
—
5.0
—
6.0
—
ns
Clock to Output Valid
tKQ
—
3.0
—
3.0
—
3.4
ns
Clock to Output Invalid
tKQX
1.5
—
1.5
—
1.5
—
ns
Clock to Output in Low-Z
tLZ1
1.5
—
1.5
—
1.5
—
ns
Setup time
tS
1.5
—
1.5
—
1.5
—
ns
Hold time
tH
0.2
—
0.4
—
0.5
—
ns
Clock Cycle Time
tKC
6.5
—
7.5
—
8.0
—
ns
Clock to Output Valid
tKQ
—
6.5
—
7.5
—
8.0
ns
Clock to Output Invalid
tKQX
3.0
—
3.0
—
3.0
—
ns
Clock to Output in Low-Z
tLZ1
3.0
—
3.0
—
3.0
—
ns
Setup time
tS
1.5
—
1.5
—
1.5
—
ns
Hold time
tH
0.5
—
0.5
—
0.5
—
ns
Clock HIGH Time
tKH
1.3
—
1.3
—
1.3
—
ns
Clock LOW Time
tKL
1.7
—
1.7
—
1.7
—
ns
Clock to Output in
High-Z (x18/x36)
tHZ1
1.5
2.5
1.5
3.0
1.5
3.0
ns
Clock to Output in
High-Z (x72)
tHZ1
1.5
3.0
1.5
3.0
1.5
3.0
ns
G to Output Valid
(x18/x36)
tOE
—
2.5
—
3.0
—
3.5
ns
G to Output Valid
(x72)
tOE
—
3.0
—
3.0
—
3.5
ns
G to output in Low-Z
tOLZ1
0
—
0
—
0
—
ns
G to output in High-Z
(x18/36)
tOHZ1
—
2.5
—
3.0
—
3.0
ns
G to output in High-Z
(x72)
tOHZ1
—
3.0
—
3.0
—
3.0
ns
ZZ setup time
tZZS2
5
—
5
—
5
—
ns
ZZ hold time
tZZH2
1
—
1
—
1
—
ns
ZZ recovery
tZZR
20
—
20
—
20
—
ns
Notes:
1. These parameters are sampled and are not 100% tested.
2. ZZ is an asynchronous signal. However, in order to be recognized on any given clock cycle, ZZ must meet the specified setup and hold
times as specified above.
Rev: 1.04a 2/2009
19/33
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© 2004, GSI Technology
GS8642Z18/36/72(B/C)-xxxV
Pipeline Mode Timing (NBT)
Write A
Read B
Suspend
Read C
tKH
Write D
Write No-op
Read E
Deselect
tKC
tKL
CK
tH
tS
A
A
B
C
D
E
tH
tS
CKE
tH
tS
E*
tH
tS
ADV
tH
tS
W
tH
tH
tS
tS
Bn
tH
tLZ
tKQ
tS
DQ
Rev: 1.04a 2/2009
D(A)
Q(B)
Q(C)
D(D)
20/33
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
tHZ
tKQX
Q(E)
© 2004, GSI Technology
GS8642Z18/36/72(B/C)-xxxV
Flow Through Mode Timing (NBT)
Write A
Write B
Write B+1
Read C
Cont
Read D
Write E
Read F
Write G
tKL
tKH
tKC
CK
tH
tS
CKE
tH
tS
E
tH
tS
ADV
tH
tS
W
tH
tS
Bn
tH
tS
A0–An
A
B
C
D
E
F
G
tKQ
tH
tKQ
tLZ
tS
D(A)
DQ
D(B)
D(B+1)
tKQX
tHZ
Q(C)
Q(D)
tLZ
D(E)
tKQX
Q(F)
D(G)
tOLZ
tOE
tOHZ
G
*Note: E = High(False) if E1 = 1 or E2 = 0 or E3 = 1
JTAG Port Operation
Overview
The JTAG Port on this RAM operates in a manner that is compliant with IEEE Standard 1149.1-1990, a serial boundary scan
interface standard (commonly referred to as JTAG). The JTAG Port input interface levels scale with VDD. The JTAG output
drivers are powered by VDDQ.
Disabling the JTAG Port
It is possible to use this device without utilizing the JTAG port. The port is reset at power-up and will remain inactive unless
clocked. TCK, TDI, and TMS are designed with internal pull-up circuits.To assure normal operation of the RAM with the JTAG
Port unused, TCK, TDI, and TMS may be left floating or tied to either VDD or VSS. TDO should be left unconnected.
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GS8642Z18/36/72(B/C)-xxxV
JTAG Pin Descriptions
Pin
Pin Name
I/O
Description
TCK
Test Clock
In
Clocks all TAP events. All inputs are captured on the rising edge of TCK and all outputs propagate
from the falling edge of TCK.
TMS
Test Mode Select
In
The TMS input is sampled on the rising edge of TCK. This is the command input for the TAP
controller state machine. An undriven TMS input will produce the same result as a logic one input
level.
In
The TDI input is sampled on the rising edge of TCK. This is the input side of the serial registers
placed between TDI and TDO. The register placed between TDI and TDO is determined by the
state of the TAP Controller state machine and the instruction that is currently loaded in the TAP
Instruction Register (refer to the TAP Controller State Diagram). An undriven TDI pin will produce
the same result as a logic one input level.
TDI
Test Data In
TDO
Test Data Out
Output that is active depending on the state of the TAP state machine. Output changes in
Out response to the falling edge of TCK. This is the output side of the serial registers placed between
TDI and TDO.
Note:
This device does not have a TRST (TAP Reset) pin. TRST is optional in IEEE 1149.1. The Test-Logic-Reset state is entered while TMS is
held high for five rising edges of TCK. The TAP Controller is also reset automaticly at power-up.
JTAG Port Registers
Overview
The various JTAG registers, refered to as Test Access Port orTAP Registers, are selected (one at a time) via the sequences of 1s
and 0s applied to TMS as TCK is strobed. Each of the TAP Registers is a serial shift register that captures serial input data on the
rising edge of TCK and pushes serial data out on the next falling edge of TCK. When a register is selected, it is placed between the
TDI and TDO pins.
Instruction Register
The Instruction Register holds the instructions that are executed by the TAP controller when it is moved into the Run, Test/Idle, or
the various data register states. Instructions are 3 bits long. The Instruction Register can be loaded when it is placed between the
TDI and TDO pins. The Instruction Register is automatically preloaded with the IDCODE instruction at power-up or whenever the
controller is placed in Test-Logic-Reset state.
Bypass Register
The Bypass Register is a single bit register that can be placed between TDI and TDO. It allows serial test data to be passed through
the RAM’s JTAG Port to another device in the scan chain with as little delay as possible.
Boundary Scan Register
The Boundary Scan Register is a collection of flip flops that can be preset by the logic level found on the RAM’s input or I/O pins.
The flip flops are then daisy chained together so the levels found can be shifted serially out of the JTAG Port’s TDO pin. The
Boundary Scan Register also includes a number of place holder flip flops (always set to a logic 1). The relationship between the
device pins and the bits in the Boundary Scan Register is described in the Scan Order Table following. The Boundary Scan
Register, under the control of the TAP Controller, is loaded with the contents of the RAMs I/O ring when the controller is in
Capture-DR state and then is placed between the TDI and TDO pins when the controller is moved to Shift-DR state. SAMPLE-Z,
SAMPLE/PRELOAD and EXTEST instructions can be used to activate the Boundary Scan Register.
Rev: 1.04a 2/2009
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© 2004, GSI Technology
GS8642Z18/36/72(B/C)-xxxV
JTAG TAP Block Diagram
·
·
·
·
·
·
·
·
Boundary Scan Register
·
·
1
·
M*
0
0
Bypass Register
2 1 0
Instruction Register
TDI
TDO
ID Code Register
31 30 29
·
· ··
2 1 0
Control Signals
TMS
Test Access Port (TAP) Controller
TCK
* For the value of M, see the BSDL file, which is available at by contacting us at [email protected]
Identification (ID) Register
The ID Register is a 32-bit register that is loaded with a device and vendor specific 32-bit code when the controller is put in
Capture-DR state with the IDCODE command loaded in the Instruction Register. The code is loaded from a 32-bit on-chip ROM.
It describes various attributes of the RAM as indicated below. The register is then placed between the TDI and TDO pins when the
controller is moved into Shift-DR state. Bit 0 in the register is the LSB and the first to reach TDO when shifting begins.
GSI Technology
JEDEC Vendor
ID Code
Not Used
Bit #
Presence Register
ID Register Contents
31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
0
X
1
X
Rev: 1.04a 2/2009
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
0
23/33
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
0 0 1 1 0 1 1 0 0 1
© 2004, GSI Technology
GS8642Z18/36/72(B/C)-xxxV
Tap Controller Instruction Set
Overview
There are two classes of instructions defined in the Standard 1149.1-1990; the standard (Public) instructions, and device specific
(Private) instructions. Some Public instructions are mandatory for 1149.1 compliance. Optional Public instructions must be
implemented in prescribed ways. The TAP on this device may be used to monitor all input and I/O pads, and can be used to load
address, data or control signals into the RAM or to preload the I/O buffers.
When the TAP controller is placed in Capture-IR state the two least significant bits of the instruction register are loaded with 01.
When the controller is moved to the Shift-IR state the Instruction Register is placed between TDI and TDO. In this state the desired
instruction is serially loaded through the TDI input (while the previous contents are shifted out at TDO). For all instructions, the
TAP executes newly loaded instructions only when the controller is moved to Update-IR state. The TAP instruction set for this
device is listed in the following table.
JTAG Tap Controller State Diagram
1
0
Test Logic Reset
0
Run Test Idle
1
Select DR
1
Select IR
0
0
1
1
Capture DR
Capture IR
0
0
Shift DR
1
1
Shift IR
0
1
1
Exit1 DR
0
Exit1 IR
0
0
Pause DR
1
Exit2 DR
1
Update DR
1
1
0
0
Pause IR
1
Exit2 IR
0
1
0
0
Update IR
1
0
Instruction Descriptions
BYPASS
When the BYPASS instruction is loaded in the Instruction Register the Bypass Register is placed between TDI and TDO. This
occurs when the TAP controller is moved to the Shift-DR state. This allows the board level scan path to be shortened to facilitate testing of other devices in the scan path.
Rev: 1.04a 2/2009
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© 2004, GSI Technology
GS8642Z18/36/72(B/C)-xxxV
SAMPLE/PRELOAD
SAMPLE/PRELOAD is a Standard 1149.1 mandatory public instruction. When the SAMPLE / PRELOAD instruction is
loaded in the Instruction Register, moving the TAP controller into the Capture-DR state loads the data in the RAMs input and
I/O buffers into the Boundary Scan Register. Boundary Scan Register locations are not associated with an input or I/O pin, and
are loaded with the default state identified in the Boundary Scan Chain table at the end of this section of the datasheet. Because
the RAM clock is independent from the TAP Clock (TCK) it is possible for the TAP to attempt to capture the I/O ring contents
while the input buffers are in transition (i.e. in a metastable state). Although allowing the TAP to sample metastable inputs will
not harm the device, repeatable results cannot be expected. RAM input signals must be stabilized for long enough to meet the
TAPs input data capture set-up plus hold time (tTS plus tTH). The RAMs clock inputs need not be paused for any other TAP
operation except capturing the I/O ring contents into the Boundary Scan Register. Moving the controller to Shift-DR state then
places the boundary scan register between the TDI and TDO pins.
EXTEST
EXTEST is an IEEE 1149.1 mandatory public instruction. It is to be executed whenever the instruction register is loaded with
all logic 0s. The EXTEST command does not block or override the RAM’s input pins; therefore, the RAM’s internal state is
still determined by its input pins.

Typically, the Boundary Scan Register is loaded with the desired pattern of data with the SAMPLE/PRELOAD command.
Then the EXTEST command is used to output the Boundary Scan Register’s contents, in parallel, on the RAM’s data output
drivers on the falling edge of TCK when the controller is in the Update-IR state.

Alternately, the Boundary Scan Register may be loaded in parallel using the EXTEST command. When the EXTEST instruction is selected, the sate of all the RAM’s input and I/O pins, as well as the default values at Scan Register locations not associated with a pin, are transferred in parallel into the Boundary Scan Register on the rising edge of TCK in the Capture-DR
state, the RAM’s output pins drive out the value of the Boundary Scan Register location with which each output pin is associated.
IDCODE
The IDCODE instruction causes the ID ROM to be loaded into the ID register when the controller is in Capture-DR mode and
places the ID register between the TDI and TDO pins in Shift-DR mode. The IDCODE instruction is the default instruction
loaded in at power up and any time the controller is placed in the Test-Logic-Reset state.
SAMPLE-Z
If the SAMPLE-Z instruction is loaded in the instruction register, all RAM outputs are forced to an inactive drive state (highZ) and the Boundary Scan Register is connected between TDI and TDO when the TAP controller is moved to the Shift-DR
state.
RFU
These instructions are Reserved for Future Use. In this device they replicate the BYPASS instruction.
Rev: 1.04a 2/2009
25/33
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2004, GSI Technology
GS8642Z18/36/72(B/C)-xxxV
JTAG TAP Instruction Set Summary
Instruction
Code
Description
Notes
EXTEST
000
Places the Boundary Scan Register between TDI and TDO.
1
IDCODE
001
Preloads ID Register and places it between TDI and TDO.
1, 2
SAMPLE-Z
010
Captures I/O ring contents. Places the Boundary Scan Register between TDI and
TDO.
Forces all RAM output drivers to High-Z.
1
RFU
011
Do not use this instruction; Reserved for Future Use.
Replicates BYPASS instruction. Places Bypass Register between TDI and TDO.
1
SAMPLE/
PRELOAD
100
Captures I/O ring contents. Places the Boundary Scan Register between TDI and
TDO.
1
GSI
101
GSI private instruction.
1
RFU
110
Do not use this instruction; Reserved for Future Use.
Replicates BYPASS instruction. Places Bypass Register between TDI and TDO.
1
BYPASS
111
Places Bypass Register between TDI and TDO.
1
Notes:
1. Instruction codes expressed in binary, MSB on left, LSB on right.
2. Default instruction automatically loaded at power-up and in test-logic-reset state.
Rev: 1.04a 2/2009
26/33
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2004, GSI Technology
GS8642Z18/36/72(B/C)-xxxV
JTAG Port Recommended Operating Conditions and DC Characteristics (1.8/2.5 V Version)
Parameter
Symbol
Min.
Max.
Unit Notes
1.8 V Test Port Input Low Voltage
VILJ1
–0.3
0.3 * VDD1
V
1
2.5 V Test Port Input Low Voltage
VILJ2
–0.3
0.3 * VDD2
V
1
1.8 V Test Port Input High Voltage
VIHJ1
0.6 * VDD1
VDD1 +0.3
V
1
2.5 V Test Port Input High Voltage
VIHJ2
0.6 * VDD2
VDD2 +0.3
V
1
TMS, TCK and TDI Input Leakage Current
IINHJ
–300
1
uA
2
TMS, TCK and TDI Input Leakage Current
IINLJ
–1
100
uA
3
TDO Output Leakage Current
IOLJ
–1
1
uA
4
Test Port Output High Voltage
VOHJ
1.7
—
V
5, 6
Test Port Output Low Voltage
VOLJ
—
0.4
V
5, 7
Test Port Output CMOS High
VOHJC
VDDQ – 100 mV
—
V
5, 8
Test Port Output CMOS Low
VOLJC
—
100 mV
V
5, 9
Notes:
1. Input Under/overshoot voltage must be –2 V < Vi < VDDn +2 V not to exceed 4.6 V maximum, with a pulse width not to exceed 20% tTKC.
2. VILJ  VIN VDDn
3. 0 V VIN VILJn
4. Output Disable, VOUT = 0 to VDDn
5. The TDO output driver is served by the VDDQ supply.
6. IOHJ = –4 mA
7. IOLJ = + 4 mA
8. IOHJC = –100 uA
9. IOLJC = +100 uA
JTAG Port AC Test Conditions
Parameter
Conditions
Input high level
VDD – 0.2 V
Input low level
0.2 V
Input slew rate
1 V/ns
Input reference level
VDDQ/2
Output reference level
VDDQ/2
JTAG Port AC Test Load
DQ
50
30pF*
VDDQ/2
* Distributed Test Jig Capacitance
Notes:
1. Include scope and jig capacitance.
2. Test conditions as shown unless otherwise noted.
Rev: 1.04a 2/2009
27/33
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2004, GSI Technology
GS8642Z18/36/72(B/C)-xxxV
JTAG Port Timing Diagram
tTKC
tTKH
tTKL
TCK
tTH
tTS
TDI
tTH
tTS
TMS
tTKQ
TDO
tTH
tTS
Parallel SRAM input
JTAG Port AC Electrical Characteristics
Parameter
Symbol
Min
Max
Unit
TCK Cycle Time
tTKC
50
—
ns
TCK Low to TDO Valid
tTKQ
—
20
ns
TCK High Pulse Width
tTKH
20
—
ns
TCK Low Pulse Width
tTKL
20
—
ns
TDI & TMS Set Up Time
tTS
10
—
ns
TDI & TMS Hold Time
tTH
10
—
ns
Boundary Scan (BSDL Files)
For information regarding the Boundary Scan Chain, or to obtain BSDL files for this part, please contact our Applications
Engineering Department at: [email protected]
Rev: 1.04a 2/2009
28/33
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2004, GSI Technology
GS8642Z18/36/72(B/C)-xxxV
Package Dimensions—119-Bump FPBGA (Package B, Variation 2)
TOP VIEW
A1
1
2
3
4
5
6
BOTTOM VIEW
A1
Ø0.10S C
Ø0.30S C AS B S
Ø0.60~0.90 (119x)
7
7 6 5 4 3 2 1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
20.32
22±0.10
1.27
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
B
1.27
0.15 C
7.62
Rev: 1.04a 2/2009
14±0.10
0.50~0.70
1.86.±0.13
SEATING PLANE
C
A
0.20(4x)
29/33
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2004, GSI Technology
GS8642Z18/36/72(B/C)-xxxV
Package Dimensions—209-Bump BGA (Package C)
14 mm x 22 mm Body, 1.0 mm Bump Pitch, 11 x 19 Bump Array
Ø0.10 M C
Ø0.30 M C A B
A1 CORNER
2
3
4
5
6
7
11
8
10
Ø0.50~0.70 (209x)
9
8
7
6
5
9 10 11
22.0
1.0
1.0
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
1.0
B
4
3
2
1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
18.0
1
TOP VIEW
BOTTOM VIEW
1.0
10.0
A
14.0
0.15 C
0.20(4x)
0.40~0.60
1.70 MAX.
SEATING PLANE
C
Rev: 1.04a 2/2009
30/33
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2004, GSI Technology
GS8642Z18/36/72(B/C)-xxxV
Ordering Information for GSI NBT SRAMs
Org
Part Number1
NBT
Voltage
Option
Package
Speed2
(MHz/ns)
TA3
4M x 18
GS8642Z18B-250V
NBT
1.8 V or 2.5 V
119 BGA (var.2)
250/6.5
C
4M x 18
GS8642Z18B-200V
NBT
1.8 V or 2.5 V
119 BGA (var.2)
200/7.5
C
4M x 18
GS8642Z18B-167V
NBT
1.8 V or 2.5 V
119 BGA (var.2)
167/8
C
2M x 36
GS8642Z36B-250V
NBT
1.8 V or 2.5 V
119 BGA (var.2)
250/6.5
C
2M x 36
GS8642Z36B-200V
NBT
1.8 V or 2.5 V
119 BGA (var.2)
200/7.5
C
2M x 36
GS8642Z36B-167V
NBT
1.8 V or 2.5 V
119 BGA (var.2)
167/8
C
1M x 72
GS8642Z72C-250V
NBT
1.8 V or 2.5 V
209 BGA
250/6.5
C
1M x 72
GS8642Z72C-200V
NBT
1.8 V or 2.5 V
209 BGA
200/7.5
C
1M x 72
GS8642Z72C-167V
NBT
1.8 V or 2.5 V
209 BGA
167/8
C
4M x 18
GS8642Z18B-250IV
NBT
1.8 V or 2.5 V
119 BGA (var.2)
250/6.5
I
4M x 18
GS8642Z18B-200IV
NBT
1.8 V or 2.5 V
119 BGA (var.2)
200/7.5
I
4M x 18
GS8642Z18B-167IV
NBT
1.8 V or 2.5 V
119 BGA (var.2)
167/8
I
2M x 36
GS8642Z36B-250IV
NBT
1.8 V or 2.5 V
119 BGA (var.2)
250/6.5
I
2M x 36
GS8642Z36B-200IV
NBT
1.8 V or 2.5 V
119 BGA (var.2)
200/7.5
I
2M x 36
GS8642Z36B-167IV
NBT
1.8 V or 2.5 V
119 BGA (var.2)
167/8
I
1M x 72
GS8642Z72C-250IV
NBT
1.8 V or 2.5 V
209 BGA
250/6.5
I
1M x 72
GS8642Z72C-200IV
NBT
1.8 V or 2.5 V
209 BGA
200/7.5
I
1M x 72
GS8642Z72C-167IV
NBT
1.8 V or 2.5 V
209 BGA
167/8
I
4M x 18
GS8642Z18GB-250V
NBT
1.8 V or 2.5 V
RoHS-compliant 119 BGA (var.2)
250/6.5
C
4M x 18
GS8642Z18GB-200V
NBT
1.8 V or 2.5 V
RoHS-compliant 119 BGA (var.2)
200/7.5
C
4M x 18
GS8642Z18GB-167V
NBT
1.8 V or 2.5 V
RoHS-compliant 119 BGA (var.2)
167/8
C
2M x 36
GS8642Z36GB-250V
NBT
1.8 V or 2.5 V
RoHS-compliant 119 BGA (var.2)
250/6.5
C
2M x 36
GS8642Z36GB-200V
NBT
1.8 V or 2.5 V
RoHS-compliant 119 BGA (var.2)
200/7.5
C
2M x 36
GS8642Z36GB-167V
NBT
1.8 V or 2.5 V
RoHS-compliant 119 BGA (var.2)
167/8
C
Notes:
1. Customers requiring delivery in Tape and Reel should add the character “T” to the end of the part number. Example: GS8642Z18B-167IVB.
2. The speed column indicates the cycle frequency (MHz) of the device in Pipeline mode and the latency (ns) in Flow Through mode. Each
device is Pipeline/Flow Through mode-selectable by the user.
3. TA = C = Commercial Temperature Range. TA = I = Industrial Temperature Range.
4. GSI offers other versions this type of device in many different configurations and with a variety of different features, only some of which are
covered in this data sheet. See the GSI Technology web site (www.gsitechnology.com) for a complete listing of current offerings.
Rev: 1.04a 2/2009
31/33
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2004, GSI Technology
GS8642Z18/36/72(B/C)-xxxV
Ordering Information for GSI NBT SRAMs (Cont.)
Org
Part Number1
NBT
Voltage
Option
Package
Speed2
(MHz/ns)
TA3
1M x 72
GS8642Z72GC-250V
NBT
1.8 V or 2.5 V
RoHS-compliant 209 BGA
250/6.5
C
1M x 72
GS8642Z72GC-200V
NBT
1.8 V or 2.5 V
RoHS-compliant 209 BGA
200/7.5
C
1M x 72
GS8642Z72GC-167V
NBT
1.8 V or 2.5 V
RoHS-compliant 209 BGA
167/8
C
4M x 18
GS8642Z18GB-250IV
NBT
1.8 V or 2.5 V
RoHS-compliant 119 BGA (var.2)
250/6.5
I
4M x 18
GS8642Z18GB-200IV
NBT
1.8 V or 2.5 V
RoHS-compliant 119 BGA (var.2)
200/7.5
I
4M x 18
GS8642Z18GB-167IV
NBT
1.8 V or 2.5 V
RoHS-compliant 119 BGA (var.2)
167/8
I
2M x 36
GS8642Z36GB-250IV
NBT
1.8 V or 2.5 V
RoHS-compliant 119 BGA (var.2)
250/6.5
I
2M x 36
GS8642Z36GB-200IV
NBT
1.8 V or 2.5 V
RoHS-compliant 119 BGA (var.2)
200/7.5
I
2M x 36
GS8642Z36GB-167IV
NBT
1.8 V or 2.5 V
RoHS-compliant 119 BGA (var.2)
167/8
I
1M x 72
GS8642Z72GC-250IV
NBT
1.8 V or 2.5 V
RoHS-compliant 209 BGA
250/6.5
I
1M x 72
GS8642Z72GC-200IV
NBT
1.8 V or 2.5 V
RoHS-compliant 209 BGA
200/7.5
I
1M x 72
GS8642Z72GC-167IV
NBT
1.8 V or 2.5 V
RoHS-compliant 209 BGA
167/8
I
Notes:
1. Customers requiring delivery in Tape and Reel should add the character “T” to the end of the part number. Example: GS8642Z18B-167IVB.
2. The speed column indicates the cycle frequency (MHz) of the device in Pipeline mode and the latency (ns) in Flow Through mode. Each
device is Pipeline/Flow Through mode-selectable by the user.
3. TA = C = Commercial Temperature Range. TA = I = Industrial Temperature Range.
4. GSI offers other versions this type of device in many different configurations and with a variety of different features, only some of which are
covered in this data sheet. See the GSI Technology web site (www.gsitechnology.com) for a complete listing of current offerings.
Rev: 1.04a 2/2009
32/33
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2004, GSI Technology
GS8642Z18/36/72(B/C)-xxxV
72Mb Sync SRAM Datasheet Revision History
DS/DateRev. Code: Old;
New
Types of Changes
Page;Revisions;Reason
Format or Content
• Creation of new datasheet
8642ZVxx_r1
• Changed “E” package to “F”
• Added Pb-Free information
8642ZVxx_r1;
8642ZVxx_r1_01
Content
8642ZVxx_r1_01;
8642ZVxx_r1_02
Content
8642ZVxx_r1_02;
8642Zxx_V_r_03
Content
• Updated entire document to reflect new part nomenclature
• Removed 300 MHz speed bin
Content
• Changed 167 MHz tKQ to 3.4 ns (pg. 1, 19)
• Rev1.04a: updated coplanarity for 119, 209 BGA mechanical,
removed Status column from Ordering Information table,
Updated Synchronous Truth Table (pg. 9), removed
“Preliminary” Banner due to MP status.
8642ZVxx_r1_03;
8642Zxx_V_r_04
Rev: 1.04a 2/2009
• Removed F package entirely
33/33
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2004, GSI Technology