AOS Semiconductor Product Reliability Report

AOS Semiconductor
Product Reliability Report
AOTF409/L,
rev B
Plastic Encapsulated Device
ALPHA & OMEGA Semiconductor, Inc
www.aosmd.com
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This AOS product reliability report summarizes the qualification result for AOTF409/L.
Accelerated environmental tests are performed on a specific sample size, and then followed by
electrical test at end point. Review of final electrical test result confirms that AOTF409/L passes
AOS quality and reliability requirements. The released product will be categorized by the process
family and be monitored on a quarterly basis for continuously improving the product quality.
Table of Contents:
I.
II.
III.
IV.
Product Description
Package and Die information
Environmental Stress Test Summary and Result
Reliability Evaluation
I. Product Description:
The AOTF409/L uses advanced trench technology to provide excellent RDS(ON), low gate charge
and low gate resistance. With the excellent thermal resistance of the TO220FL package, this
device is well suited for high current load applications.
-RoHS Compliant
-AOTF409L is Halogen Free
Details refer to the datasheet.
II. Die / Package Information:
AOTF409/L
Standard sub-micron
Low voltage P channel process
Package Type
TO220FL
Lead Frame
Bare Cu
Die Attach
Soft solder
Bonding
Al wire
Mold Material
Epoxy resin with silica filler
Moisture Level
Up to Level 1 *
Note * based on info provided by assembler and mold compound supplier
Process
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III. Result of Reliability Stress for AOTF409/L
Test Item
Test Condition
Time
Point
MSL
Precondition
168hr 85°
c
/85%RH +3 cycle
[email protected]°
c
Temp = 150°
c,
Vgs=100% of
Vgsmax
-
11 lots
168hrs
500 hrs
1000 hrs
2 lots
1 lot
Temp = 150°
c,
Vds=80% of
Vdsmax
168hrs
500 hrs
1000 hrs
2 lots
1 lot
130 +/- 2°
c,
85%RH,
33.3 psi, Vgs =
100% of Vgs max
121°
c , 29.7psi,
RH=100%
100 hrs
96 hrs
HTGB
Lot
Attribution
HAST
Pressure Pot
Temperature
Cycle
-65°
c to 150°
c,
air to air,
250 / 500
cycles
Number
of
Failures
Reference
Standard
1815pcs
0
JESD22A113
231pcs
0
JESD22A108
77 pcs / lot
231pcs
0
JESD22A108
(Note A*)
5 lots
77 pcs / lot
275pcs
0
JESD22A110
(Note A*)
11 lots
55 pcs / lot
847pcs
0
JESD22A102
(Note A*)
77 pcs / lot
0
JESD22A104
(Note A*)
HTRB
Total
Sample size
9 lots
(Note A*)
693pcs
77 pcs / lot
Note A: The reliability data presents total of available generic data up to the published date.
IV. Reliability Evaluation
FIT rate (per billion): 12
MTTF = 9914 years
The presentation of FIT rate for the individual product reliability is restricted by the actual burn-in
sample size of the selected product (AOTF409/L). Failure Rate Determination is based on
JEDEC Standard JESD 85. FIT means one failure per billion hours.
2
9
Failure Rate = Chi x 10 / [2 (N) (H) (Af)]
9
= 1.83 x 10 / [2x (2x2x77x500+2x77x1000) x258] = 12
9
7
MTTF = 10 / FIT = 8.68 x 10 hrs = 9914 years
Chi² = Chi Squared Distribution, determined by the number of failures and confidence interval
N = Total Number of units from HTRB and HTGB tests
H = Duration of HTRB/HTGB testing
Af = Acceleration Factor from Test to Use Conditions (Ea = 0.7eV and Tuse = 55°C)
Acceleration Factor [Af] = Exp [Ea / k (1/Tj u – 1/Tj s)]
Acceleration Factor ratio list:
Af
55 deg C
70 deg C
85 deg C
100 deg C
115 deg C
130 deg C
150 deg C
258
87
32
13
5.64
2.59
1
Tj s = Stressed junction temperature in degree (Kelvin), K = C+273.16
Tj u =The use junction temperature in degree (Kelvin), K = C+273.16
k = Boltzmann’s constant, 8.617164 X 10-5eV / K
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