AOS Semiconductor Product Reliability Report

AOS Semiconductor
Product Reliability Report
AOT424/AOT424L,
rev A
Plastic Encapsulated Device
ALPHA & OMEGA Semiconductor, Inc
495 Mercury Drive
Sunnyvale, CA 94085
U.S.
Tel: (408) 830-9742
www.aosmd.com
Jan 28, 2005
1
This AOS product reliability report summarizes the qualification result for AOT424. Accelerated
environmental tests are performed on a specific sample size, and then followed by electrical test
at end point. Review of final electrical test result confirms that AOT424 passes AOS quality and
reliability requirements. The released product will be categorized by the process family and be
monitored on a quarterly basis for continuously improving the product quality.
Table of Contents:
I.
II.
III.
IV.
V.
Product Description
Package and Die information
Environmental Stress Test Summary and Result
Reliability Evaluation
Quality Assurance Information
I. Product Description:
Absolute Maximum Ratings T A=25°C unless otherwise noted
Parameter
Symbol
Drain-Source Voltage
Gate-Source Voltage
TC =25°C
Continuous Drain
B,G
Current
TC =100°C
Repetitive avalanche energy L=0.1mH
C
TC =25°C
Power Dissipation
VDS
30
V
VGS
±20
V
110
B
C
B
Units
G
Pulsed Drain Current
Avalanche Current
Maximum
88
IDM
200
IAR
30
A
EAR
112
mJ
Junction and Storage Temperature Range
Maximum Junction-to-Ambient
Maximum Junction-to-Ambient
Maximum Junction-to-Case
C
A
W
50
TJ , TSTG
Thermal Characteristics
Parameter
A
100
PD
TC =100°C
A
ID
-55 to 175
°C
Symbol
Typ
Max
Units
t = 10s
Steady-State
RθJA
14.2
39
20
50
°C/W
°C/W
Steady-State
RθJC
0.8
1.5
°C/W
2
II. Die / Package Information:
Process
Package Type
Lead Frame
Die Attach
Bond wire
Mold Material
Filler % (Spherical/Flake)
Flammability Rating
Backside Metallization
Moisture Level
AOT424
AOT424L (Green Compound)
Standard sub-micron
Standard sub-micron
low voltage N channel process low voltage N channel process
3 leads TO220
3 leads TO220
Copper with Ni pad
Copper with Ni pad
Soft solder
Soft solder
Al wire, 5&15 mils
Al wire, 5&15 mils
Epoxy resin with silica filler
Epoxy resin with silica filler
50/50
100/0
UL-94 V-0
UL-94 V-0
Ti / Ni / Ag
Ti / Ni / Ag
Up to Level 1 *
Up to Level 1*
Note * based on info provided by assembler and mold compound supplier
III. Result of Reliability Stress for AOT424 (Standard) & AOT424L (Green)
Test Item
Test Condition
Time
Point
Lot Attribution
Total
Sample
size
Solder
Reflow
Precondition
HTGB
Normal: 1hr PCT+3
cycle IR [email protected] °c
(260° c for Green)
Temp = 150 C,
Vgs=100% of Vgsmax
0hr
Normal: 7 lots
715pcs
168 / 500
hrs
Normal: 3 lots
246pcs
(Note A*)
HTRB
Temp = 150 C, Vds=80%
of Vdsmax
168 / 500
hrs
Normal: 3 lots
(Note A*)
HAST
Pressure Pot
Temperature
Cycle
130 +/- 2 C, 85%, 33.3
psi, Vgs = 80% of Vgs
max
100 hrs
121 C, 15+/-1 PSIG,
RH=100%
96 hrs
-65 to 150 deg C, air to
air, 0.5hr per cycle
250 / 500
cycles
Number
of
Failures
0
0
77+5 pcs /
lot
246pcs
0
77+5 pcs /
lot
Normal: 7 lots
385pcs
0
Normal: 3 lots
50+5 pcs /
lot
165pcs
0
Normal: 3 lots
50+5 pcs /
lot
165pcs
0
50+5 pcs /
lot
3
III. Result of Reliability Stress for AOT424 (Standard) & AOT424L (Green)
Continues
DPA
Internal Vision
Cross-section
X-ray
CSAM
NA
5
5
5
5
5
5
0
NA
5
5
0
Bond Integrity
Room Temp
150° C bake
150° C bake
0hr
250hr
500hr
40
40
40
40 wires
40 wires
40 wires
0
Solderability
230° C
5 sec
15
15 leads
0
Die shear
150°C
0hr
10
10
0
Note A: The HTGB and HTRB reliability data presents total of available AOT424 and AOT424L
burn-in data up to the published date.
IV. Reliability Evaluation
FIT rate (per billion): 18.5
MTBF = 6171 years
AOS reliability group also routinely monitors the product reliability up to 1000 hr at and performs
the necessary failure analysis on the units failed for reliability test(s).
The presentation of FIT rate for the individual product reliability is restricted by the actual burn-in
sample size of the selected product (AOT424). Failure Rate Determination is based on JEDEC
Standard JESD 85. FIT means one failure per billion hours.
2
9
/ [2 (N) (H) (Af)]
= 1.83 x 10 / [2 (328) (500) (258.24)+ 2 (164) (168) (258.24)] = 18.5
7
Failure Rate = Chi x 10
9
9
MTBF = 10 / FIT =5.4x 10 hrs = 6171 years
Chi² = Chi Squared Distribution, determined by the number of failures and confidence interval
N = Total Number of units from HTRB and HTGB tests
H = Duration of HTRB/HTGB testing
Af = Acceleration Factor from Test to Use Conditions (Ea = 0.7eV and Tuse = 55C)
Acceleration Factor [Af] = Exp [Ea / k ( 1/Tj u – 1/Tj s )]
Acceleration Factor ratio list:
Af
55 deg C
70 deg C
85 deg C
100 deg C
115 deg C
130 deg C
150 deg C
258
87
32
13
5.64
2.59
1
Tj s = Stressed junction temperature in degree (Kelvin), K = C+273.16
Tj u =The use junction temperature in degree (Kelvin), K = C+273.16
k = Boltznan’s constant, 8.617164 X 10 E-5V / K
4
V. Quality Assurance Information
Acceptable Quality Level for outgoing inspection: 0.1% for electrical and visual.
Guaranteed Outgoing Defect Rate: < 25 ppm
Quality Sample Plan: conform to Mil-Std-105D
Contacts:
Wei Liu, Engineer of Failure Analysis and Reliability
[email protected]
Fred Chang, Manager of Failure Analysis and Reliability
[email protected]
Wilson Ma, Senior Director of Quality Assurance
[email protected]
5