12 06L WC T 1

Hebei I.T. (Shanghai) Co., Ltd.
SMD SPECIFICATION
Part No./型号
12 06L WC T
1、Features/特 征:
z Emitting Color/发光颜色:White/白色
z Device Outline/外形特征:3.2×1.6×1.1mm
z Dice material/晶片材质:InGaN / GaN
2、Applications/应 用:
z Backlight for Mobile,Machine Vision, LCD Display/手机、电话、显示屏背光源
z Backlight in Dashboard and switch of Automove/汽车仪表盘、记程器背光源
z 特殊场合的装饰、照明
3、Outline Dimensions/产品外形尺寸:
被推荐的回焊焊盘尺寸:
SPATIAL DISTRIBUTION
°
1.0
0.9
0.8
0.7
0.5
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0.3
0.1 0
0.2
0.4
0.6
Page 1 of 10
Hebei I.T. (Shanghai) Co., Ltd.
SMD SPECIFICATION
Part No./型号
12 06L WC T
4、Absolute maximum ratings/极限参数(Ta = 25℃)
Parameter
参数
Symbol
符号
Test Condition
测试条件
Pd
Power Dissipation
损耗功率
Reverse Voltage
反 向 电 压
Pulse Current
正向峰值电流
Forward Current
正向工作电流
Operating Temperature
工作温度范围
Storage Temperature
储存温度范围
Value 参数
Unit
单位
Min.
Max.
——
——
65
mW
VR
IR = 30μA
5
——
V
IFp
Duty=0.1,1kHz
——
100
mA
IFm
——
——
20
mA
Topr
——
-40
+85
℃
Tstr
——
-40
+85
℃
5、Electrical and optical characteristics/光电参数(Ta = 25℃)
Parameter
参数
Forward Voltage
正向电压
Reverse Current
反向电流
Luminous Intensity
发光强度
Viewing Angle
发光指向角
Value 参数
Symbol
符号
Test
Condition
测试条件
Min.
Typ.
Max.
VF
IF = 20mA
——
3.2
3.4
V
IR
VR =5V
——
——
30
μA
IV
IF = 20mA
——
200
——
mcd
2θ1/2
IF = 20mA
——
120
——
Deg.
单位
6、Chromaticity coordinates/色度坐标:
等级
WC
WD
X
0.310
0.310
0.330
0.330
0.330
0.330
0.361
0.356
Y
0.290
0.340
0.360
0.318
0.318
0.360
0.385
0.351
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Page 2 of 10
Hebei I.T. (Shanghai) Co., Ltd.
SMD SPECIFICATION
Part No./型号
12 06L WC T
7、Typical electrical/optical characteristic curves/光电特性曲线:
2.5
Luminous Intensity
Relative Value at IF=20mA
Forward Current(mA)
50
40
30
20
10
0
2.8
3.0 3.2 3.4 3.6
Forward Voltage(V)
0.5
0
10
100
80
20
40
60
Ambient Temperature TA (℃)
50
2.0
1.5
1.0
0.5
0
-40
-20
0
20
40
60
80
Ambient Temperature T A (℃)
100
1.2
Ta=25℃
1.0
0.8
0.6
0.4
0.2
0
400
450
500
550
Wavelength
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10
20
30
40
IF-Forward Current (mA)
2.5
20
Relative Luminous Intensity
1.0
LUMINOUS INTENSITY Vs.
AMBIENT TEMPERATURE
30
0
1.5
0
FORWARD CURRENT
DERATING CURVE
40
0
2.0
3.8
Relative Luminous Intensity
50
Forward Current(mA)
LUMINOUS INTENSITY Vs.
FORWARD CURRENT
FORWARD CURRENT Vs
FORWARD VOLTAGE
600
650
700
(nm)
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Page 3 of 10
Hebei I.T. (Shanghai) Co., Ltd.
SMD SPECIFICATION
Part No./型号
12 06L WC T
8、Relibility Analysis/可靠性分析
The reliability of products shall be satisfied with items listed below.
Confidence level :90%;LTPD :10%
8.1 Test Items And Results/测试项目和结果
Spec. /
引用标准
Q’ty/
数量
Time/时
间
20
2times
ALL PASS
1times
Over 95%
ALL PASS
20
50cycles
ALL PASS
GB/T 4937,
Ⅲ,4
20
6cycles
ALL PASS
Ta=100℃
GB/T 4937,
Ⅲ,2
20
1000hrs
ALL PASS
Ta=-40℃
GB/T 4937,
Ⅲ,2
20
1000hrs
ALL PASS
GB/T
18904.3
Part A
20
1000hrs
Iv decay <30%
No.
Item/项目
Test Condition/测试条件
1
IR Reflow (Reflow
Soldering) /回流焊接
Tsld=260℃,10sec
2
Solder ability/可焊性
Tsld=235±5℃,3sec
3
Temperature Cycle/高
低温循环
-40℃—— 100℃
30min ~ 30min
The cut is not more than 1 min
GB/T 4937,
Ⅲ,1
4
Moisture Resistance
Cyclic /湿热循环
25℃/12hr~ 55℃/12hr
95%RH
5
High Temperature
Storage /高温储存
6
Low Temperature
Storage /低温储存
7
Steady State perating
Life /电耐久性
GB/T 4937,
Ⅱ,2.2
IF=20mA Ta=25℃
Standard/判定
8.2 Criteria For Judging Damage/判断标准
Symbol/
符号
Test conditions
/测试条件
Luminous Intensity/亮度
Iv
Forward Voltage/正向电压
Reverse current/反向电流
Item/项目
Criteria for Judgement
/判断标准
Min./最小值
Max./最大值
IF=20mA
Iv*0.7
/
VF
IF=20mA
/
U.S.L*1.1
IR
VR=5v
/
U.S.L*2
*U.S.L.:Upper Standard Level / 上限
*L.S.L.:Lower Standard Level / 下限
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Page 4 of 10
Hebei I.T. (Shanghai) Co., Ltd.
SMD SPECIFICATION
Part No./型号
12 06L WC T
9、Specification of Packing /包装规格
9.1 Taping and Orientation/编带和方向
Quantity/数量:3000 units/reel
60+0.5/-0
178±1.0
13.0±0.2
Diameter/直径:178 mm
9.0±0.5
Label sticking position
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12±0.15
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Page 5 of 10
Hebei I.T. (Shanghai) Co., Ltd.
SMD SPECIFICATION
Part No./型号
12 06L WC T
9.2 Specification of Packing/包装规格
Diameter/直径 : 178 mm
Width/宽度 : 12 mm
=>3000 pcs / Reel
(Anti-Static Shielding/抗静电保护袋)
Thickness/厚度: T=0.1 mm
=> 1 Reel / Bag
5 Bags / Box
195mm
=> 15,000 pcs / Box
85mm
195mm
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Page 6 of 10
Hebei I.T. (Shanghai) Co., Ltd.
SMD SPECIFICATION
Part No./型号
12 06L WC T
9、Notes/注意
9.1 Moisture Proof Packaging/防潮包装
9.1.1 LEDs need to package in moisture proof bag. When moisture is absorbed into the SMT
package it may vaporize and expand during soldering. There is a possibility that this can cause
exfoliation of the contacts and damage to the optical characteristics of the LEDs. For this reason,
the moisture proof bag is used to keep moisture to a minimum in the bag.
产品必须包封装在防潮包装袋中。当湿气进入防潮包装袋的时候,在焊接时,湿气会
受热汽化膨胀,从而可能影响产品的光学特性,甚至造成封装胶体的开裂剥离。因此,防
潮袋要求放置在保持低湿度的盒中。
9.1.2 Moisture proof function is inactive. The moisture proof bag is made of an aluminum
moisture proof bag. A package of a moisture absorbent material (silica gel) is inserted into the
aluminum moisture proof bag. The silica gel turns the smashing from the transparent circular
spherical pellet.
防潮的作用是缓慢的。防潮袋使用铝防潮袋,并在铝防潮袋中放入潮气吸收材料(硅
胶干燥剂)。当硅胶干燥剂吸收潮气后,硅胶干燥剂从透明圆形球状颗粒变成粉碎物。
9.2 Storage Method/储存方式
9.2.1
Before opening the bag: The LEDs should be used within a year and kept at 30℃ or less and
70%RH or less. The moisture proof bag with absorbent material is needed when storing the
LEDs.
拆开包装袋之前:产品可以储存一年,但要求放置在温度低于30℃,湿度低于70%的环
境中;当存放产品时,必须放置在带有干燥剂的防潮容器中。
9.2.2 After opening the bag: The LEDs should be soldered within 72 hours after opening the
package. If unused LEDs remain, they should be stored in moisture proof bags with moisture
absorbent material. If the LEDs have exceeded the storage time or the moisture absorbent
material has faded away. Baking process should be performed by using more than 24hours
baking at 60±5℃ before using LEDs. It recommended that the user use the LEDs as soon as
possible.
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Page 7 of 10
Hebei I.T. (Shanghai) Co., Ltd.
SMD SPECIFICATION
Part No./型号
12 06L WC T
拆开包装袋之后:产品应该在拆封后的72小时内焊接完毕;如果没用完,产品应该储
存在带有干燥剂的防潮包装袋中;如果产品超出了使用期限或者干燥剂失效,那么产品在
使用前必须在60±5℃中烘烤至少24小时;建议客户尽快的使用完产品。
9.3 Heat Generation/产品热量的产生
Thermal design of the end applications are of paramount importance. Please consider the
heat generation of the LED when making the system design. It is necessary to avoid intense heat
generation and operate within the maximum ratings given in this specification.
应用产品的热学设计是至关重要的。在做系统设计时,请考虑LED的散热,避免热量
的积累,必须严格的在允许的温度范围内使用。
9.4 Soldering/焊接
9.4.1 Lead Solder/回流焊接
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Page 8 of 10
Hebei I.T. (Shanghai) Co., Ltd.
SMD SPECIFICATION
Part No./型号
12 06L WC T
9.4.2 Lead – Free Solder/无铅回流焊接
9.4.3 Hand Soldering(Not Recommended)/手工焊接(不推荐)
Soldering iron/烙铁焊接:300 degrees C max/不超过300℃;5 seconds max/不超过5s;
once/允许1次.
9.5 Cleaning/清洗
It is recommended that isopropyl alcohol be used as a solvent for cleaning the LEDs. It
should be confirmed beforehand whether the solvents will dissolve the package the resin or not
when using other solvents. Please do not clean the LEDs by the ultrasonic. If it is absolutely
necessary, the influence of ultrasonic cleaning on the LEDs depends on ultrasonic power and the
assembled condition. Before cleaning, a pre-test should be done to confirm whether any damage
to the LEDs will occur.
建议使用酒精作为溶剂清洗LEDs。若要使用其他溶剂,应该预先证实是否能溶化封装
料。请不要使用超声波清洗LEDS,如果一定要使用超声波清洗,则一定要注意超声波的
功率和超声条件。在清洗作业前,必须预先实验确认对LEDs无任何的伤害。
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Page 9 of 10
Hebei I.T. (Shanghai) Co., Ltd.
SMD SPECIFICATION
Part No./型号
12 06L WC T
9.6 Static Electricity/静电
It is recommended that a wrist band or an anti-electrostatic glove be used when handling the
LEDs. All devices, equipment and machinery must be properly grounded. It is recommended that
precautions be taken against surge voltage to the equipment that mounts the LEDs.
在接触LEDs时,建议使用防静电手腕带或防静电手套。所有的器件、设备和机器必须
有可靠的接地。对所有LEDs接触的设备,建议采取预防措施消除冲击电压。
9.7 Others/其他
The LED light output is strong enough to injure human eyes. Precautions must be taken to
prevent looking directly at the LEDs with unaided eyes for more than a few seconds.
LED的光辐射足够强时,会对人眼造成伤害。若眼睛要直接看LED,并且要一定的时
间,则必须采取相应防护措施。
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Page 10 of 10