LCC Series - Large Size Multilayer Ceramic Chip Capacitors Holy Stone Multilayer Ceramic Chip Capacitors [ Large Size Ceramic Chip Capacitors ] LCC Series Features Applications Voltage Multipliers Power Supplies DC-DC Converters Surge protection Industrial control circuits Isolation Ballast Snubber Custom applications Optimized internal designs offers the highest voltage rating (up to 8KVdc) Capacitance range from 100pF to 47uF and sizes from 1515 to 3640 Available with proprietary surface coating for arc prevention Available with flexible termination (Super Term) to minimize the effects of mechanical stress RoHS compliant Summary of Specifications ℃ ~ +125 ℃ Operation Temperature -55 Rated Voltage 50Vdc to 8KVdc Temperature Coefficient NP0 : ≤ Capacitance Range NP0 : 100pF to 220nF , X7R : 1000pF to 47uF Dissipation Factor NP0 : Q 1000 , X7R : D.F. Insulation Resistance 10G Aging NP0 : 0% , X7R : 2.5 % per decade of time Dielectric Strength V ≤ 500V : 200% Rated Voltage 500V ≤ V < 1000V : 150% Rated Voltage V ≥1000V : 120% Rated Voltage ± 30ppm/ ℃ X7R : ≤ ± 15% ℃ (EIA Class Ι) -55~+125 ℃ (EIA Class Ⅱ ) , -55~+125 , ≧ ≦2.5% Ω or 500/CΩ whichever is smaller (C in Farad ) How To Order CC Product Code C: MLCC (Multilayer Ceramic Chip of Capacitor) 2520 2520 XX Chip Size Dielectric EX.: 1515 2520 3530 3640 Ex.: N : NP0 X : X7R 103 103 Capacitance Unit : pF Ex.: 100 : 10×100 471 : 47×101 102 : 10×102 KK 102 102 Tolerance Ex.: J : +/- 5% K : +/-10% M : +/-20% Rated Voltage Ex.: 050:50Vdc 251:250Vdc 631:630Vdc 102:1000Vdc TT Packaging Ex.: T : T&R W : Waffle B : Bulk NN SS XX Termination Testing Special Requirement Requirement EX: Ex.: Ex.: N: S: O: Arc Ni Barrier/Sn Standard Prevention Plate Electrical Coating P: Pd/Ag H: X: Cushion Hi-Reliability Termination (Super Term) - 21 - LCC Series - Large Size Multilayer Ceramic Chip Capacitors Holy Stone Dimensions BW TYPE B L ± 6.35±0.50 [.25±.020] 8.90±0.50 [.35±.020] 9.20±0.50 [.36±.020] 3.80 0.50 1515 T [.15±.020] 2520 3530 W 3640 L W T (max) 3.80 0.50 [.15 ±.020] [.126] ± 5.00±0.50 [.20±.020] 7.60±0.50 [.30±.020] 10.2±0.50 [.40±.020] Unit : mm [inches] B (min) BW (min) 3.20 1.60 [.059] 0.30 [.012] 3.20 4.00 0.30 [.126] [.157] [.012] 5.00 5.50 0.30 [.200] [.217] [.012] 5.00 6.00 [.200] [.236] 0.30 [.012] Capacitance Range size 1515 2520 3530 3640 Dieletric 50V 100V 250V NP0 473 393 333 X7R 395 275 225 X7R 475 335 475 NP0 823 683 563 X7R 226 106 475 X7R 396 276 685 NP0 224 184 104 X7R 336 226 685 X7R 476 396 106 NP0 224 184 104 X7R 336 396 725 X7R 476 526 156 Capacitance (pF) maximum 500V 1KV 2KV 3KV 103 474 222 104 473 103 125 274 823 473 225 474 823 473 275 524 821 471 333 103 473 223 392 222 823 183 224 393 103 472 154 333 334 104 123 562 184 393 394 154 4KV 5KV 8KV 221 680 一 472 222 102 102 471 101 123 562 182 332 102 251 223 103 392 392 122 561 273 183 472 Under development, please contact Holy Stone All values are capacitance EIA codes. Other dimensions, capacitance values and voltages rating are available. Please contact Holy Stone. Soldering And Handling Precautions: Large ceramic capacitors are more prone to thermal and mechanical cracks. To minimize mechanical cracks, capacitors have to be handled carefully in the original waffle pack container, carrier tape or other suitable container. Care must be taken that these capacitors do not come into contact with each other which can cause chip outs, cracks or other mechanical damage. The recommended method for soldering large chips is reflow soldering. Wave soldering and manual soldering with Iron is not recommended. Ceramic capacitors must be preheated with less than 2ºC/second rate to about 50ºC below the reflow temperature. Any sudden increase or decrease in temperature more than the recommended rate, during soldering, may cause internal thermal cracks. Options: • HEC offers polymer termination (Super Term) for very large chips to minimize mechanical cracks due to board flexing. • To minimize the potential for surface arcing in higher voltage applications, HEC offers the option of a proprietary surface coating. • Pd/Ag termination is also offered as a standard option for Hybrid circuits and other applications. - 22 -