2 Pad Ceramic Base SMD Crystal, 1.6 mm x 1.0 mm Product Features: IL3W Series Applications: Low Cost SMD Package RoHS Compliant Compatible with Leadfree Processing Ultra Low Profile Real Time Clocks Metering Industrial Control Time Reference Frequency 32.768 KHz ESR (Equivalent Series Resistance) 90 kΩ Max Shunt Capacitance (C0) 2.0 pF Max. Motional Capacitance (Cl) 6.5pF Typ. 1.60±.10 Marking Frequency Tolerance @ 25 C ±5ºC 20 ppm Standard Frequency Stability over Temperature Parabolic -0.045 ppm / C Typ. Turnover point +25º ±5ºC See Graph Below Crystal Cut X-Cut Load Capacitance 12.5 pF Standard (see table below) Drive Level 0.1 µW typ, 0.5 µW max Aging 3 ppm Max. / Year Standard 2 0.50 max 0.86 Temperature 0.40 Operating -40 C to +85 C Standard Storage -55 C to +125 C Standard 0.40 0.50 0.50 Typical X Cut Tem perature Coefficient ppm 1.00±.10 1.00 0 -30 -60 -90 -120 -150 -180 0.60 Suggested Land Patterns -40 -30 -20 -10 0 10 20 30 40 50 60 70 Dimensions: mm 80 Tem perature Part Number Guide Package IL3W - Sample Part Number: IL3W - HX5F12.5 - 32.768 KHz Stability (ppm) at Room Temperature Stability (ppm) over Operating Temperature Operating Temperature Range H = ±20 ppm X = X Cut 5 = -40°C to +85°C Mode (overtone) F = Fundamental Load Capacitance (pF) 12.5 pF (Standard) 9.0 pF or 7.0 pF ILSI America Phone 775-851-8880 ● Fax 775-851-8882 ●email: [email protected] ● www.ilsiamerica.com Specifications subject to change without notice Frequency - 32.768 KHz Rev: 03/25/15_A Page 1 of 2 2 Pad Ceramic Base SMD Crystal, 1.6 mm x 1.0 mm IL3W Series Pb Free Solder Reflow Profile: Typical Circuit: *Units are backward compatible with 240C reflow processes Package Information: MSL = 2a Termination = e4 (Au over Ni over W base metal) Tape and Reel Information: Quantity per Reel A B C D E F 3000 8.0 ±0.2 4.0 ±0.1 3.5 ±0.05 9.0 ±0.3 60 / 80 180 / 250 Environmental Specifications Thermal Shock Moisture Resistance Mechanical Shock Mechanical Vibration Resistance to Soldering Heat Hazardous Substance Solderability Terminal Strength Gross Leak Fine Leak Solvent Resistance MIL-STD-883, Method 1011, Condition A MIL-STD-883, Method 1004 MIL-STD-883, Method 2002, Condition B MIL-STD-883, Method 2007, Condition A J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max) Pb-Free / RoHS / Green Compliant JESD22-B102-D Method 2 (Preconditioning E) MIL-STD-883, Method 2004, Test Condition D MIL-STD-883, Method 1014, Condition C MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s MIL-STD-202, Method 215 Marking Line 1: Frequency, Date Code PROPRIETARY AND CONFIDENTIAL THIS DOCUMENT CONTAINS PROPRIETARY INFORMATION, AND SUCH INFORMATION MAY NOT BE DISCLOSED TO OTHERS FOR ANY PURPOSE NOR USED FOR MANUFACTURING PURPOSES WITHOUT WRITTEN PERMISSION FROM ILSI America. ILSI America Phone 775-851-8880 ● Fax 775-851-8882 ●email: [email protected] ● www.ilsiamerica.com Specifications subject to change without notice Rev: 03/25/15_A Page 2 of 2