4 Pad Ceramic Package, 2 mm x 2.5 mm ILCX18

4 Pad Ceramic Package, 2 mm x 2.5 mm
Product Features:
ILCX18 Series
Applications:
SMD Package
Small package Foot Print
Supplied in Tape and Reel
Compatible with Leadfree Processing
Fundamental Mode up to 80.0 MHz
PCMCIA Cards
Storage
PC’s
GSM Cell Phone
Wireless Lan
USB
GSM Cell Phone
4
2.5
+/-0.1
3
2.0
+/-0.1
12.0 MHz to 80.0 MHz
Frequency
0.55
+/-0.1
ESR (Equivalent Series Resistance)
100  Max.
80  Max.
60  Max.
40  Max.
40  Max
12 MHz – 19.9 MHz
20 MHz – 29.9 MHz
30 MHz – 39.9 MHz
40 MHz – 60.0 MHz
60 MHz – 80.0 MHz
2
1
0.75
1
2
0.575
0.7
4
3
0.9
Shunt Capacitance (C0)
3.5 pF Max.
Frequency Tolerance @ 25 C
30 ppm Standard (see Part Number Guide for more options)
Frequency Stability over
Temperature
50 ppm Standard (see Part Number Guide for more options)
Crystal Cut
AT Cut
Load Capacitance
18 pF Standard (see Part Number Guide for more options)
Drive Level
100 µW Max.
Aging
5 ppm Max. / Year Standard
Connection diagram
4
3
1
2
Recommended pad layout
1.2
1.0
1.3
Temperature
Operating
0 C to +70 C Standard (see Part Number Guide for more
options)
Storage
-40 C to +85 C Standard
1.7
Dimension Units: mm
Part Number Guide
Package
ILCX18 -
Sample Part Number:
ILCX18 - FB1F18 - 20.000
Tolerance
(ppm) at Room
Temperature
Stability
(ppm) over Operating
Temperature
Operating
Temperature Range
B = ±50 ppm
B = ±50 ppm
0 = 0°C to +50°C
F = ±30 ppm
F = ±30 ppm
1 = 0°C to +70°C
G = ±25 ppm
G = ±25 ppm
2 = -10°C to +60°C
H = ±20 ppm
H = ±20 ppm
3 = -20°C to +70°C
I = ±15 ppm
I = ±15 ppm**
5 = -40°C to +85°C
J = ±10 ppm*
J = ±10 ppm**
Mode
(overtone)
F = Fundamental
Load
Capacitance
(pF)
18 pF Standard
Or Specify
Frequency
- 20.000 MHz
9 = -10°C to +50°C
D = -10°C to +105°C*
E = -40°C to +105°C*
** Not available for all temperature ranges.
ILSI America Phone 775-851-8880 ● Fax 775-851-8882 ●email: e-mail@ilsiamerica.com ●
www.ilsiamerica.com
Specifications subject to change without notice
Rev: 08/12/15_F
Page 1 of 2
4 Pad Ceramic Package, 2 mm x 2.5 mm
ILCX18 Series
Pb Free Solder Reflow Profile:
Typical Circuit:
*Units are backward compatible with 240C reflow processes
Package Information:
MSL = 1
Termination = e4 (Au over Ni over W base metal).
Tape and Reel Information:
Quantity per
Reel
A
B
C
D
E
F
3000
8 +/-.3
4 +/-.2
3.5 +/-.2
9 +/-1 or 12 +/-3
60 / 80
180
Environmental Specifications
Thermal Shock
Moisture Resistance
Mechanical Shock
Mechanical Vibration
Resistance to Soldering Heat
Hazardous Substance
Solderability
Terminal Strength
Gross Leak
Fine Leak
Solvent Resistance
MIL-STD-883, Method 1011, Condition A
MIL-STD-883, Method 1004
MIL-STD-883, Method 2002, Condition B
MIL-STD-883, Method 2007, Condition A
J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max)
Pb-Free / RoHS / Green Compliant
JESD22-B102-D Method 2 (Preconditioning E)
MIL-STD-883, Method 2004, Test Condition D
MIL-STD-883, Method 1014, Condition C
MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s
MIL-STD-202, Method 215
Marking
Line 1: I-Date Code(yww)
Line 2: Frequency
PROPRIETARY AND CONFIDENTIAL
THIS DOCUMENT CONTAINS PROPRIETARY INFORMATION, AND SUCH INFORMATION MAY NOT BE DISCLOSED TO OTHERS FOR ANY
PURPOSE NOR USED FOR MANUFACTURING PURPOSES WITHOUT WRITTEN PERMISSION FROM ILSI America.
ILSI America Phone 775-851-8880 ● Fax 775-851-8882 ●email: e-mail@ilsiamerica.com ●
www.ilsiamerica.com
Specifications subject to change without notice
Rev: 08/12/15_F
Page 2 of 2