4 Pad Ceramic Package, 2 mm x 2.5 mm Product Features: ILCX18 Series Applications: SMD Package Small package Foot Print Supplied in Tape and Reel Compatible with Leadfree Processing Fundamental Mode up to 80.0 MHz PCMCIA Cards Storage PC’s GSM Cell Phone Wireless Lan USB GSM Cell Phone 4 2.5 +/-0.1 3 2.0 +/-0.1 12.0 MHz to 80.0 MHz Frequency 0.55 +/-0.1 ESR (Equivalent Series Resistance) 100 Max. 80 Max. 60 Max. 40 Max. 40 Max 12 MHz – 19.9 MHz 20 MHz – 29.9 MHz 30 MHz – 39.9 MHz 40 MHz – 60.0 MHz 60 MHz – 80.0 MHz 2 1 0.75 1 2 0.575 0.7 4 3 0.9 Shunt Capacitance (C0) 3.5 pF Max. Frequency Tolerance @ 25 C 30 ppm Standard (see Part Number Guide for more options) Frequency Stability over Temperature 50 ppm Standard (see Part Number Guide for more options) Crystal Cut AT Cut Load Capacitance 18 pF Standard (see Part Number Guide for more options) Drive Level 100 µW Max. Aging 5 ppm Max. / Year Standard Connection diagram 4 3 1 2 Recommended pad layout 1.2 1.0 1.3 Temperature Operating 0 C to +70 C Standard (see Part Number Guide for more options) Storage -40 C to +85 C Standard 1.7 Dimension Units: mm Part Number Guide Package ILCX18 - Sample Part Number: ILCX18 - FB1F18 - 20.000 Tolerance (ppm) at Room Temperature Stability (ppm) over Operating Temperature Operating Temperature Range B = ±50 ppm B = ±50 ppm 0 = 0°C to +50°C F = ±30 ppm F = ±30 ppm 1 = 0°C to +70°C G = ±25 ppm G = ±25 ppm 2 = -10°C to +60°C H = ±20 ppm H = ±20 ppm 3 = -20°C to +70°C I = ±15 ppm I = ±15 ppm** 5 = -40°C to +85°C J = ±10 ppm* J = ±10 ppm** Mode (overtone) F = Fundamental Load Capacitance (pF) 18 pF Standard Or Specify Frequency - 20.000 MHz 9 = -10°C to +50°C D = -10°C to +105°C* E = -40°C to +105°C* ** Not available for all temperature ranges. ILSI America Phone 775-851-8880 ● Fax 775-851-8882 ●email: [email protected] ● www.ilsiamerica.com Specifications subject to change without notice Rev: 08/12/15_F Page 1 of 2 4 Pad Ceramic Package, 2 mm x 2.5 mm ILCX18 Series Pb Free Solder Reflow Profile: Typical Circuit: *Units are backward compatible with 240C reflow processes Package Information: MSL = 1 Termination = e4 (Au over Ni over W base metal). Tape and Reel Information: Quantity per Reel A B C D E F 3000 8 +/-.3 4 +/-.2 3.5 +/-.2 9 +/-1 or 12 +/-3 60 / 80 180 Environmental Specifications Thermal Shock Moisture Resistance Mechanical Shock Mechanical Vibration Resistance to Soldering Heat Hazardous Substance Solderability Terminal Strength Gross Leak Fine Leak Solvent Resistance MIL-STD-883, Method 1011, Condition A MIL-STD-883, Method 1004 MIL-STD-883, Method 2002, Condition B MIL-STD-883, Method 2007, Condition A J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max) Pb-Free / RoHS / Green Compliant JESD22-B102-D Method 2 (Preconditioning E) MIL-STD-883, Method 2004, Test Condition D MIL-STD-883, Method 1014, Condition C MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s MIL-STD-202, Method 215 Marking Line 1: I-Date Code(yww) Line 2: Frequency PROPRIETARY AND CONFIDENTIAL THIS DOCUMENT CONTAINS PROPRIETARY INFORMATION, AND SUCH INFORMATION MAY NOT BE DISCLOSED TO OTHERS FOR ANY PURPOSE NOR USED FOR MANUFACTURING PURPOSES WITHOUT WRITTEN PERMISSION FROM ILSI America. ILSI America Phone 775-851-8880 ● Fax 775-851-8882 ●email: [email protected] ● www.ilsiamerica.com Specifications subject to change without notice Rev: 08/12/15_F Page 2 of 2