2 Pad Ceramic Package, 1.5 mm x 3.2 mm IL3X

2 Pad Ceramic Package, 1.5 mm x 3.2 mm
IL3X Series
Product Features:
Applications:
20 ppm Stability
SMD Package
Low Profile
RoHS Compliant
Compatible with Leadfree Processing
Real Time Clocks
Metering
Industrial Control
Time Reference
3.2
1.5
Frequency
32.768 kHz
ESR (Equivalent Series Resistance)
65 k Max.
Shunt Capacitance (C0)
1.7 pF Typical
Frequency Tolerance @ 25 C
20 ppm Standard
Frequency Stability over
Temperature
Parabolic -0.034 ppm /  C Typical. Inflection point approx.
27 C
See Graph Below.
Crystal Cut
X-Cut
Load Capacitance
12.5 pF Standard
Drive Level
1 uW Max.
Aging
3 ppm Max. / Year
0.9 Max.
2
1.0
1.35
Connection Diagram
Temperature
Operating
-40 C to +85 C Standard
Storage
-40 C to +85 C Standard
Recommended Pad Layout
1.0
ppm
Typical X Cut Tem perature Coefficient
0
-30
-60
-90
-120
-150
-180
1.8
2.5
Dimension Units: mm
-40
-30
-20
-10
0
10
20
30
40
50
60
70
80
Tem perature
Part Number Guide
Package
IL3X –
IL3X2-(Metal Lid)
Sample Part Number:
IL3X - HX5F12.5 - 32.768 kHz
Stability
(ppm) at Room
Temperature
Stability
(ppm) over Operating
Temperature
Operating
Temperature Range
H = ±20 ppm
X = X Cut
5 = -40°C to +85°C
Mode
(overtone)
F = Fundamental
Load Capacitance
(pF)
12.5 pF
6pF, 9pF available
ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: e-mail@ilsiamerica.com • www.ilsiamerica.com
06/10/13_F
Specifications subject to change without notice
Page 1
Frequency
- 32.768 kHz
2 Pad Ceramic Package, 1.5 mm x 3.2 mm
IL3X Series
Pb Free Solder Reflow Profile:
Typical Circuit:
*Units are backward compatible with 240C reflow processes
Package Information:
MSL = N/A
Termination = e4 (Au over Ni over W base metal)
Tape and Reel Information:
Quantity per
Reel
A
B
C
D
E
F
3000
12 +/-.3
8 +/-.2
5.5 +/-.2
13.5 +/-1 or
12 +/- 3
60 / 80
180 / 250
Environmental Specifications
Thermal Shock
Moisture Resistance
Mechanical Shock
Mechanical Vibration
Resistance to Soldering Heat
Hazardous Substance
Solderability
Terminal Strength
Gross Leak
Fine Leak
Solvent Resistance
MIL-STD-883, Method 1011, Condition A
MIL-STD-883, Method 1004
MIL-STD-883, Method 2002, Condition B
MIL-STD-883, Method 2007, Condition A
J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max)
Pb-Free / RoHS / Green Compliant
JESD22-B102-D Method 2 (Preconditioning E)
MIL-STD-883, Method 2004, Test Condition D
MIL-STD-883, Method 1014, Condition C
MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s
MIL-STD-202, Method 215
Marking
Line 1: Factory Designator, Date Code (yww)
ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: e-mail@ilsiamerica.com • www.ilsiamerica.com
06/10/13_F
Specifications subject to change without notice
Page 2