I587/I787 Series 2.0 mm x 2.5 mm Ceramic Package SMD TCXO Applications: Product Features: Low Current Consumption Ultra Miniature Package RoHS Compliant Compatible with Leadfree Processing GPS, GPS Module CDMA/WCDMA 802.11 / Wifi T1/E1, T3/E3 Frequency (Contact Sales Channel for available frequencies) Output Level Clipped Sinewave 0.8 V p-p Min. Output Load Clipped Sinewave Frequency Stability Vs Temperature Vs Voltage Vs Load(5%) 2.50+/- 0.2 4 3 1 2 2.0+/-0.2 1.1 Max. 0.6 0.10 10K Ohms / 10 pF 0.5 ppm Max 0.2 ppm Max. .0.2 ppm Max. 1 2 4 3 0.5 0.10 Frequency Tolerance @ 25 C 2 .0 ppm (After 2 Reflow) Aging 1 ppm / Year Max. nd Recommended Pad Layout 2.80 See Supply Voltage Table , tolerance 5% Supply Voltage 2.0 mA Max. Current 4 3 1 2 0.6 2.3 Voltage Control (I787) 1.5 VDC 1.0 VDC, 5.0 ppm Min. Operating See Operating Temperature Table Storage -40 C to +85 C Harmonics -8.0 dBc Max. 1.4 No pattern area Pin 1 2 3 4 Connection Vcontrol / N.C. GND Output Vcc Dimension Units: mm -130 dBc/Hz @ 1KHz Phase Noise Package I587 (Clipped Sinewave TCXO) I787 (Clipped Sinewave TCVCXO) Part Number Guide Operating Temperature 5 = -30 C to +85 C Sample Part Number: I587-5Y8-26.000 Mhz FrequencyStability vs Temperature Supply Voltage Y = 0.5 ppm 7 = 3.0 V 8 = 2.8 V 2 = 2.7 V 1 = 1.8 V NOTE: A 0.01 µF bypass capacitor is recommended between Vcc (pin 4) and GND (pin 2) to minimize power supply noise. ** Not available for all temperature ranges. ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: [email protected] • www.ilsiamerica.com 02/26/14_H Frequency 3 = 3.3 V Specifications subject to change without notice Page 1 - 26.000 MHz I587/I787 Series 2.0 mm x 2.5 mm Ceramic Package SMD TCXO Pb Free Solder Reflow Profile: Typical Application: *Units are backward compatible with 240C reflow processes Package Information: MSL = N.A. (package does not contain plastic, storage life is unlimited under normal room conditions). Termination = e4 (Au over Ni over W base metalization). Tape and Reel Information: Quantity per Reel A B C D E F 3000 8 +/-.3 4 +/-.2 3.5 +/-.2 9 +/-1 or 12 +/-3 60 / 80 180 Environmental Specifications Thermal Shock Moisture Resistance Mechanical Shock Mechanical Vibration Resistance to Soldering Heat Hazardous Substance Solderability Terminal Strength Gross Leak Fine Leak Solvent Resistance MIL-STD-883, Method 1011, Condition A MIL-STD-883, Method 1004 MIL-STD-883, Method 2002, Condition B MIL-STD-883, Method 2007, Condition A J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max) Pb-Free / RoHS / Green Compliant JESD22-B102-D Method 2 (Preconditioning E) MIL-STD-883, Method 2004, Test Condition D MIL-STD-883, Method 1014, Condition C MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s MIL-STD-202, Method 215 Marking Line 1: XXXX(Freq.Code,Production Code,Year, Month, Date) Line 2: XXXXX (Crystal Code) ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: [email protected] • www.ilsiamerica.com 02/26/14_H Specifications subject to change without notice Page 2