4 Pad Ceramic Package Quartz Crystal, 3.2 mm x 5 mm Product Features: Applications: Low Cost SMD Package Low ESR Compatible with Leadfree Processing Frequency Fibre Channel Server & Storage Sonet /SDH 802.11 / Wifi T1/E1, T3/E3 24.000000 MHz Total Frequency Tolerance (including tolerance @ 25 C, frequency stability over temp range, aging for 10 years and tuning capacitor tolerance) ILCX07-24.000000M-2389 5.0 4 3 1 2 3.2 1.3 Max. 1 2 4 3 40 ppm Max. 0.9 Frequency Stability Included Above. Operation Mode Fundamental Equivalent Series Resistance (ESR) 60 Ohms Max. Shunt Capacitance (C0) 7.0 pF Max. Load Capacitance 18.0 pF Drive Level 100 µW Max. Operating Temperature -40 C to +85 C 1.2 Connection Diagram 4 3 1 2 Recommended pad layout 2.0 4 3 1 2 1.2 2.2 Storage Temperature -55 C to +125 C 3.7 Dimension Units: mm ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: [email protected] • www.ilsiamerica.com 02/11 Specifications subject to change without notice Page 1 4 Pad Ceramic Package Quartz Crystal, 3.2 mm x 5 mm ILCX07-24.000000M-2389 Pb Free Solder Reflow Profile: Typical Circuit: *Units are backward compatible with 240C reflow processes Package Information: MSL = 1 Termination = e4 (Au over Ni over W base metal). Tape and Reel Information: Quantity per Reel A B C D E F 1000 12 +/-.3 8 +/-.2 5.5 +/-.2 13.5 +/-1 or 12 +/-3 60 / 80 180 / 250 Environmental Specifications Thermal Shock Moisture Resistance Mechanical Shock Mechanical Vibration Resistance to Soldering Heat Hazardous Substance Solderability Terminal Strength Gross Leak Fine Leak Solvent Resistance MIL-STD-883, Method 1011, Condition A MIL-STD-883, Method 1004 MIL-STD-883, Method 2002, Condition B MIL-STD-883, Method 2007, Condition A J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max) Pb-Free / RoHS / Green Compliant JESD22-B102-D Method 2 (Preconditioning E) MIL-STD-883, Method 2004, Test Condition D MIL-STD-883, Method 1014, Condition C MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s MIL-STD-202, Method 215 Marking Line 1: ILSI, Date Code (yww) Line 2: 2389 ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: [email protected] • www.ilsiamerica.com 02/11 Specifications subject to change without notice Page 2 4 Pad Ceramic Package Quartz Crystal, 3.2 mm x 5 mm Product Features: Applications: Low Cost SMD Package Low ESR Compatible with Leadfree Processing Frequency Fibre Channel Server & Storage Sonet /SDH 802.11 / Wifi T1/E1, T3/E3 24.000000 MHz Total Frequency Tolerance (including tolerance @ 25 C, frequency stability over operating temp range, aging for 10 years and tuning capacitor tolerance) ILCX07-24.000000M-2390 5.0 4 3 1 2 3.2 1.3 Max. 1 2 4 3 40 ppm Max. 0.9 Frequency Stability Included Above. Operation Mode Fundamental Equivalent Series Resistance (ESR) 60 Ohms Max. Shunt Capacitance (C0) 7.0 pF Max. Load Capacitance 18.0 pF Drive Level 100 µW Max. Operating Temperature -40 C to +105 C 1.2 Connection Diagram 4 3 1 2 Recommended pad layout 2.0 4 3 1 2 1.2 2.2 Storage Temperature -55 C to +125 C 3.7 Dimension Units: mm ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: [email protected] • www.ilsiamerica.com 02/11 Specifications subject to change without notice Page 1 4 Pad Ceramic Package Quartz Crystal, 3.2 mm x 5 mm ILCX07-24.000000M-2390 Pb Free Solder Reflow Profile: Typical Circuit: *Units are backward compatible with 240C reflow processes Package Information: MSL = 1 Termination = e4 (Au over Ni over W base metal). Tape and Reel Information: Quantity per Reel A B C D E F 1000 12 +/-.3 8 +/-.2 5.5 +/-.2 13.5 +/-1 or 12 +/-3 60 / 80 180 / 250 Environmental Specifications Thermal Shock Moisture Resistance Mechanical Shock Mechanical Vibration Resistance to Soldering Heat Hazardous Substance Solderability Terminal Strength Gross Leak Fine Leak Solvent Resistance MIL-STD-883, Method 1011, Condition A MIL-STD-883, Method 1004 MIL-STD-883, Method 2002, Condition B MIL-STD-883, Method 2007, Condition A J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max) Pb-Free / RoHS / Green Compliant JESD22-B102-D Method 2 (Preconditioning E) MIL-STD-883, Method 2004, Test Condition D MIL-STD-883, Method 1014, Condition C MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s MIL-STD-202, Method 215 Marking Line 1: ILSI, Date Code (yww) Line 2: 2390 ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: [email protected] • www.ilsiamerica.com 02/11 Specifications subject to change without notice Page 2 4 Pad Ceramic Package, 2.5 mm x 3.2 mm Product Features: ILCX13-24.000000M-2391 Applications: SMD Package Small package Foot Print Supplied in Tape and Reel Compatible with Leadfree Processing 3.2 PCMCIA Cards Storage PC’s Wireless Lan 3 4 2.5 1 2 0.9 Frequency 24.000000 MHz Total Frequency Tolerance (including tolerance @ 25C, frequency stability over operating temp range, aging for 10 years and tuning capacitor tolerance) 1 2 4 3 40 ppm Max. Frequency Stability Included Above. Operation Mode Fundamental Equivalent Series Resistance (ESR) 60 Ohms Max. Shunt Capacitance (C0) 7.0 pF Max. Load Capacitance 18.0 pF Drive Level 100 µW Max. Operating Temperature -40 C to +85 C Connection Diagram 3 4 2 1 Recommended Pad Layout 1.4 1.1 2.0 3.0 Storage Temperature Dimension Units: mm -55 C to +125 C ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: [email protected] • www.ilsiamerica.com 02/11 Specifications subject to change without notice Page 1 4 Pad Ceramic Package, 2.5 mm x 3.2 mm ILCX13-24.000000M-2391 Pb Free Solder Reflow Profile: Typical Circuit: *Units are backward compatible with 240C reflow processes Package Information: MSL = 1 Termination = e4 (Au over Ni over W base metal). Tape and Reel Information: Quantity per Reel A B C D E F 1000 8.0+/-.2 4.0 +/-.2 3.5 +/-.2 16.5 +/-2 50 / 60 / 80 180 Environmental Specifications Thermal Shock Moisture Resistance Mechanical Shock Mechanical Vibration Resistance to Soldering Heat Hazardous Substance Solderability Terminal Strength Gross Leak Fine Leak Solvent Resistance MIL-STD-883, Method 1011, Condition A MIL-STD-883, Method 1004 MIL-STD-883, Method 2002, Condition B MIL-STD-883, Method 2007, Condition A J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max) Pb-Free / RoHS / Green Compliant JESD22-B102-D Method 2 (Preconditioning E) MIL-STD-883, Method 2004, Test Condition D MIL-STD-883, Method 1014, Condition C MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s MIL-STD-202, Method 215 Marking Line 1: I-Date Code (YWW) Line 2: 2391 ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: [email protected] • www.ilsiamerica.com 02/11 Specifications subject to change without notice Page 2 4 Pad Ceramic Package, 2.5 mm x 3.2 mm Product Features: ILCX13-24.000000M-2392 Applications: SMD Package Small package Foot Print Supplied in Tape and Reel Compatible with Leadfree Processing 3.2 PCMCIA Cards Storage PC’s Wireless Lan 3 4 2.5 1 2 0.9 Frequency 24.000000 MHz Total Frequency Tolerance (including tolerance @ 25 C, frequency stability over operating temp range, aging for 10 years and tuning capacitor tolerance) 1 2 4 3 40 ppm Max. Frequency Stability Included Above. Operation Mode Fundamental Equivalent Series Resistance (ESR) 60 Ohms Max. Shunt Capacitance (C0) 7.0 pF Max. Load Capacitance 18.0 pF Drive Level 100 µW Max. Operating Temperature -40 C to +105 C Connection Diagram 3 4 2 1 Recommended Pad Layout 1.4 1.1 2.0 3.0 Storage Temperature Dimension Units: mm -55 C to +125 C ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: [email protected] • www.ilsiamerica.com 02/11 Specifications subject to change without notice Page 1 4 Pad Ceramic Package, 2.5 mm x 3.2 mm ILCX13-24.000000M-2392 Pb Free Solder Reflow Profile: Typical Circuit: *Units are backward compatible with 240C reflow processes Package Information: MSL = 1 Termination = e4 (Au over Ni over W base metal). Tape and Reel Information: Quantity per Reel A B C D E F 1000 8.0+/-.2 4.0 +/-.2 3.5 +/-.2 16.5 +/-2 50 / 60 / 80 180 Environmental Specifications Thermal Shock Moisture Resistance Mechanical Shock Mechanical Vibration Resistance to Soldering Heat Hazardous Substance Solderability Terminal Strength Gross Leak Fine Leak Solvent Resistance MIL-STD-883, Method 1011, Condition A MIL-STD-883, Method 1004 MIL-STD-883, Method 2002, Condition B MIL-STD-883, Method 2007, Condition A J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max) Pb-Free / RoHS / Green Compliant JESD22-B102-D Method 2 (Preconditioning E) MIL-STD-883, Method 2004, Test Condition D MIL-STD-883, Method 1014, Condition C MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s MIL-STD-202, Method 215 Marking Line 1: I-Date Code (YWW) Line 2: 2392 ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: [email protected] • www.ilsiamerica.com 02/11 Specifications subject to change without notice Page 2 2 Pad Metal Package, 4.7 mm x 13.3 mm Product Features: HC49USM-24.000000M-2435 Applications: Low Cost SMD Package Low ESR Compatible with Leadfree Processing Fibre Channel Server & Storage Sonet /SDH 802.11 / Wifi T1/E1, T3/E3 13.3 Max. 11.4 0.2 System Clock 4.73 Frequency H Max. See Part Number Guide 24.000000 MHz Total Frequency Tolerance (including tolerance @ 25 C, frequency stability over temp range, aging for 10 years and tuning capacitor tolerance) 0.1 40 ppm Max. Frequency Stability Included Above. Operation Mode Fundamental Equivalent Series Resistance (ESR) 30 Ohms Max. 3.9 Nom. 0.5 Min. Insulator 0.8 Shunt Capacitance (C0) 7.0 pF Max. Load Capacitance 18.0 pF Drive Level 100 µW Max. 5.5 1.6 Operating Temperature -40 C to +85 C Recommended Pad Layout Dimension Units: mm Storage Temperature 06/13/11 -55 C to +125 C ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: [email protected] • www.ilsiamerica.com Specifications subject to change without notice Page 1 0.2 2 Pad Metal Package, 4.7 mm x 13.3 mm HC49USM-24.000000M-2435 Pb Free Solder Reflow Profile: Typical Circuit: *Units are backward compatible with 240C reflow processes Package Information: MSL = N/A Termination = e1 (Sn / Cu / Ag over Ni over Kovar base metal). Tape and Reel Information: Quantity per Reel A B C D E F 1000 24 +/-.3 12 +/-.2 11.5 +/-.2 25 +/-1.5 80/100 330 Environmental Specifications Thermal Shock Moisture Resistance Mechanical Shock Mechanical Vibration Resistance to Soldering Heat Hazardous Substance Solderability Terminal Strength Gross Leak Fine Leak Solvent Resistance MIL-STD-883, Method 1011, Condition A MIL-STD-883, Method 1004 MIL-STD-883, Method 2002, Condition B MIL-STD-883, Method 2007, Condition A J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max) Pb-Free / RoHS / Green Compliant JESD22-B102-D Method 2 (Preconditioning E) MIL-STD-883, Method 2004, Test Condition D MIL-STD-883, Method 1014, Condition C MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s MIL-STD-202, Method 215 Marking Line 1: ILSI, Frequency, Date Code 06/13/11 ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: [email protected] • www.ilsiamerica.com Specifications subject to change without notice Page 2 2 Pad Metal Package, 4.7 mm x 13.3 mm Product Features: HC49USM-24.000000M-2436 Applications: Low Cost SMD Package Low ESR Compatible with Leadfree Processing Fibre Channel Server & Storage Sonet /SDH 802.11 / Wifi T1/E1, T3/E3 13.3 Max. 11.4 0.2 System Clock 4.73 Frequency H Max. See Part Number Guide 24.000000 MHz Total Frequency Tolerance (including tolerance @ 25 C, frequency stability over temp range, aging for 10 years and tuning capacitor tolerance) 0.1 40 ppm Max. Frequency Stability Included Above. Operation Mode Fundamental Equivalent Series Resistance (ESR) 30 Ohms Max. 3.9 Nom. 0.5 Min. Insulator 0.8 Shunt Capacitance (C0) 7.0 pF Max. Load Capacitance 18.0 pF Drive Level 100 µW Max. 5.5 1.6 Operating Temperature -40 C to +105 C Recommended Pad Layout Dimension Units: mm Storage Temperature 06/13/11 -55 C to +125 C ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: [email protected] • www.ilsiamerica.com Specifications subject to change without notice Page 1 0.2 2 Pad Metal Package, 4.7 mm x 13.3 mm HC49USM-24.000000M-2436 Pb Free Solder Reflow Profile: Typical Circuit: *Units are backward compatible with 240C reflow processes Package Information: MSL = N/A Termination = e1 (Sn / Cu / Ag over Ni over Kovar base metal). Tape and Reel Information: Quantity per Reel A B C D E F 1000 24 +/-.3 12 +/-.2 11.5 +/-.2 25 +/-1.5 80/100 330 Environmental Specifications Thermal Shock Moisture Resistance Mechanical Shock Mechanical Vibration Resistance to Soldering Heat Hazardous Substance Solderability Terminal Strength Gross Leak Fine Leak Solvent Resistance MIL-STD-883, Method 1011, Condition A MIL-STD-883, Method 1004 MIL-STD-883, Method 2002, Condition B MIL-STD-883, Method 2007, Condition A J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max) Pb-Free / RoHS / Green Compliant JESD22-B102-D Method 2 (Preconditioning E) MIL-STD-883, Method 2004, Test Condition D MIL-STD-883, Method 1014, Condition C MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s MIL-STD-202, Method 215 Marking Line 1: ILSI, Frequency, Date Code 06/13/11 ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: [email protected] • www.ilsiamerica.com Specifications subject to change without notice Page 2 ILCX07 Aging (10year) 1 2 0.0 3 4 5 ‐1.0 6 7 ‐2.0 8 PPM 9 10 ‐3.0 11 12 13 ‐4.0 14 15 ‐5.0 16 17 18 ‐6.0 0 2 4 6 8 10 12 YEARS 19 20 1 HC49U Aging (10 Year) 2 1.5 3 4 5 1 6 7 0.5 8 9 0 PPM 10 11 ‐0.5 12 13 14 ‐1 15 16 ‐1.5 17 18 ‐2 19 0 2 4 6 YEARS 8 10 12 20 ILCX07‐Series 30 25 20 15 PPM 10 5 0 ‐5 ‐10 ‐15 ‐20 ‐45 ‐35 ‐25 ‐15 ‐5 5 15 25 35 45 55 65 75 85 95 105 Temperature (°C) HC49USM‐Series 20 15 10 5 PPM 0 ‐5 ‐10 ‐15 ‐20 ‐25 ‐30 ‐45 ‐35 ‐25 ‐15 ‐5 5 15 25 35 45 55 65 75 85 95 Temperature (° C) ESR HC49USM-Series 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 Temp ESR ESR ESR ESR ESR ESR ESR ESR ESR ESR ESR ESR ESR ESR ESR ESR ‐40.0 5.3 5.4 7.4 5.8 7.8 5.7 5.7 6.9 6.1 7.9 5.2 7.0 6.0 5.7 6.0 8.1 ‐30.0 5.4 5.5 6.8 6.0 7.9 5.7 6.0 6.2 5.8 7.3 5.2 6.9 5.8 5.7 5.8 7.9 ‐20.0 5.5 5.6 6.4 6.1 7.9 5.8 5.9 6.2 5.9 7.0 5.3 7.1 5.9 6.3 5.8 8.3 ‐10.0 5.7 5.8 6.4 6.2 7.9 5.9 5.8 6.3 5.9 7.0 5.5 7.3 6.0 6.1 5.7 9.1 0.0 5.8 6.0 6.3 6.3 7.9 6.6 5.8 6.3 6.1 7.0 5.6 7.3 6.2 6.0 5.9 8.5 10.0 6.0 6.8 6.5 6.5 8.0 6.1 6.0 6.5 6.1 7.0 5.6 7.2 6.4 6.0 6.1 8.1 20.0 5.8 6.2 6.5 6.5 7.8 6.2 6.6 6.5 6.3 7.0 5.7 7.1 6.4 6.2 6.3 7.8 25.0 5.9 6.1 6.6 6.6 8.1 6.2 6.0 6.6 6.6 7.1 5.8 7.1 6.2 6.1 6.3 9.9 30.0 6.0 6.0 6.6 6.5 7.9 6.2 6.1 6.6 6.4 7.0 5.8 7.0 6.4 6.2 6.4 7.5 40.0 7.1 6.1 6.8 6.5 8.0 6.7 6.5 6.8 6.6 7.1 5.9 7.1 6.5 6.2 6.6 7.5 50.0 6.3 6.2 6.7 6.6 8.1 7.0 6.2 6.8 6.6 7.2 6.0 7.3 6.6 6.3 6.8 7.5 60.0 6.2 6.3 7.0 6.7 8.1 6.6 6.7 6.9 6.7 7.6 6.1 7.3 6.8 6.4 7.0 7.6 70.0 6.2 6.6 6.9 6.7 8.2 6.6 6.6 7.0 6.8 8.1 6.5 7.5 7.2 6.6 6.8 7.8 80.0 6.3 6.5 7.1 7.2 8.5 6.8 6.8 7.2 7.0 8.0 6.4 7.5 7.3 6.9 6.9 7.9 85.0 6.7 6.7 6.9 7.8 8.6 6.8 6.8 7.2 7.1 7.9 6.4 7.5 7.2 6.7 7.1 8.3 17 18 19 20 21 Temp ESR ESR ESR ESR ESR ‐40.0 5.9 10.3 5.9 12.7 15.3 ‐30.0 5.8 10.4 5.9 12.8 15.4 ‐20.0 5.6 10.5 6.2 13.0 14.8 ‐10.0 5.7 10.8 6.3 13.2 15.0 0.0 5.7 10.5 6.5 13.4 14.7 10.0 5.8 10.5 6.5 13.5 14.3 20.0 5.8 10.5 6.5 13.7 13.7 25.0 6.0 10.9 6.5 13.6 13.9 30.0 5.8 10.8 6.5 13.6 13.6 40.0 6.0 10.8 6.6 14.2 13.6 50.0 6.2 10.9 6.9 13.5 13.5 60.0 6.1 11.0 6.9 13.6 13.3 70.0 6.3 11.4 7.1 13.7 14.1 80.0 6.4 11.5 6.8 14.0 85.0 6.4 11.6 6.9 15.3 13.5 ILCX07-Series 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 Temp ESR ESR ESR ESR ESR ESR ESR ESR ESR ESR ESR ESR ESR ESR ESR ESR ‐40.0 9.7 8.2 8.8 9.3 8.6 8.6 8.6 8.9 9.0 8.9 10.1 17.4 8.5 9.2 8.9 8.2 ‐30.0 8.7 8.7 8.8 9.4 8.7 8.9 9.4 9.1 8.4 8.9 9.2 15.8 8.6 13.1 8.2 8.2 ‐20.0 8.5 8.5 8.8 9.7 8.7 9.1 8.5 9.1 8.6 8.8 8.8 14.8 8.8 9.0 7.9 8.2 ‐10.0 8.7 8.6 8.9 9.8 8.8 8.6 8.5 9.3 9.0 8.9 9.0 13.8 8.8 8.9 8.0 8.2 0.0 8.9 8.7 9.1 10.0 8.6 8.8 8.5 9.2 8.9 8.9 9.1 13.1 8.7 9.2 8.0 8.3 10.0 8.8 8.8 9.1 10.1 8.9 8.9 8.6 9.5 8.9 9.1 8.8 12.1 8.7 9.7 7.9 8.5 25.0 9.2 8.9 9.2 10.4 9.7 9.2 8.6 9.6 9.5 9.7 9.0 11.5 9.0 10.3 7.9 8.5 40.0 9.4 9.5 9.4 10.6 9.7 9.9 9.8 9.9 9.6 10.0 9.9 11.7 9.3 10.5 8.0 8.6 50.0 9.7 9.2 9.5 10.9 10.9 9.7 8.6 10.2 9.6 9.8 8.8 12.0 9.2 10.8 8.1 8.6 60.0 10.1 10.0 9.8 11.1 10.6 10.0 9.9 9.9 10.1 10.3 9.6 11.8 9.7 12.2 8.2 8.8 70.0 10.8 9.6 10.4 11.7 10.7 11.3 8.8 10.5 10.5 10.6 9.2 12.5 10.1 11.1 8.2 9.4 85.0 11.5 10.0 10.5 12.1 10.6 11.2 9.5 10.3 10.6 10.4 9.7 12.3 9.6 10.7 8.4 8.8 95.0 11.9 11.1 10.6 13.1 12.0 12.0 9.0 11.1 11.1 11.0 10.3 13.1 9.7 11.3 8.7 8.5 105.0 12.1 10.9 10.9 13.3 11.4 13.2 8.8 11.2 11.7 11.1 9.8 13.7 9.8 12.2 8.9 8.3