2 Pad and 3 Pad Ceramic Package, 3.1 mm x 3.7 mm Product Features: ZTACV and ZTTCV Series Applications: Low Cost Compatible with Leadfree Processing ZTACV - MX Storage Media Home Appliance Microprocessors Office Automation 1.2 3.7 1 2 3.1 0.7 Frequency 7 MHz to 50 MHz ZTTCV - MX ESR (Equivalent Series Resistance) 0.7 See Table Below 1.2 3.7 Frequency Tolerance @ 25° C ±0.5% Frequency Stability over Temperature ±0.3% Aging ±0.3% Max. for 10 Years 1.4 1 3 2 0.9 Temperature 3.7 1 Operating -40° C to +85° C Storage -40° C to +85° C Standard 3 2 4.1 1.4 0.9 Part Frequency ESR C1 (MHz) (Ω Max.) (pF) ZTTCV-MX 13 to 19.9 40 30 30 ZTTCV-MX 20 to 25.9 40 15 15 ZTTCV-MX 26 to 50 40 5 5 Connection Diagrams C2 (pF) ZTACV-MX 7 to 12.9 60 30* 30* ZTACV-MX 13 to 19.9 40 30* 30* ZTACV-MX 20 to 25.9 40 15* 15* 26 to 50 40 5* 5* ZTACV 2 1 1 ZTTCV 2 3 ZTACV-MX Dimension Units: mm * Recommended external capacitance, not internal to the device. The terminations of the ZTACV and ZTTCV series ceramic resonator are Pb free. Pb may be contained in the ceramic resonator element of this device and is exempted via item 7 of the RoHS annex. This ceramic resonator series is considered RoHS compliant. Part Number Guide Sample Part Number: Part Series ZTTCV - MX - 20.000 Package Code Frequency MX - 20.000 MHz ZTTCV (internal capacitors) ZTACV (must supply externanl capacitance for proper circuit operation) ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: [email protected] • www.ilsiamerica.com 06/09 Specifications subject to change without notice Page 1 2 Pad and 3 Pad Ceramic Package, 3.1 mm x 3.7 mm Pb Free Solder Reflow Profile: ZTACV and ZTTCV Series Typical Circuit: *Units are backward compatible with 240C reflow processes Package Information: MSL = 1 Termination = e1 (Sn / Cu / Ag). Tape and Reel Information: Quantity per Reel A B C D E F 1000 12 +/-.3 8 +/-.2 5.5 +/-.2 13 +/-1 or 12 +/-3 60 / 80 180 / 250 Environmental Specifications Thermal Shock Moisture Resistance Mechanical Shock Mechanical Vibration Resistance to Soldering Heat Hazardous Substance Solderability Terminal Strength Gross Leak Fine Leak Solvent Resistance MIL-STD-883, Method 1011, Condition A MIL-STD-883, Method 1004 MIL-STD-883, Method 2002, Condition B MIL-STD-883, Method 2007, Condition A J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max) Pb-Free / RoHS / Green Compliant JESD22-B102-D Method 2 (Preconditioning E) MIL-STD-883, Method 2004, Test Condition D MIL-STD-883, Method 1014, Condition C MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s MIL-STD-202, Method 215 Marking Line 1: Frequency ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: [email protected] • www.ilsiamerica.com 06/09 Specifications subject to change without notice Page 2