ILCX08 - ILSI America, Inc.

4 Pad Ceramic Package Quartz Crystal, 3.5 mm x 6 mm
Product Features:
Applications:
Low Cost SMD Package
Low Profile Package
Compatible with Leadfree Processing
Frequency
ILCX08 Series
Fibre Channel
Server & Storage
Sonet /SDH
802.11 / Wifi
T1/E1, T3/E3
System Clock
6.0
+/-0.2
4
3
1
2
3.5
+/-0.2
1.1 Max.
8 MHz to 100 MHz
1
2
4
3
ESR (Equivalent Series
Resistance)
8 MHz – 48 MHz
rd
36 MHz – 100.0 MHz (3 O.T.)
60 : Max.
60 : Max.
Connection Diagram
Shunt Capacitance (C0)
7 pF Max.
Frequency Tolerance @ 25q C
r30 ppm Standard (see Part Number Guide for more options)
Frequency Stability over
Temperature
r50 ppm Standard (see Part Number Guide for more options)
Crystal Cut
AT Cut
Load Capacitance
18 pF Standard (see Part Number Guide for more options)
Drive Level
500 uW Max.
Aging
r5 ppm Max. / Year Standard
4
3
1
2
Recommended pad layout
2.0
4
3
1
2
1.4
2.40
Temperature
Operating
0q C to +70q C Standard (see Part Number Guide for more
options)
Storage
-40q C to +85q C Standard
4.4
Dimension Units: mm
Part Number Guide
Package
ILCX08 -
Sample Part Number:
ILCX08 - FB1F18 - 20.000
Tolerance
(ppm) at Room
Temperature
Stability
(ppm) over Operating
Temperature
Operating
Temperature Range
Mode
(overtone)
B = ±50 ppm
B = ±50 ppm
0 = 0°C to +50°C
F = Fundamental
F = ±30 ppm
F = ±30 ppm
1 = 0°C to +70°C
3 = 3rd overtone
G = ±25 ppm
G = ±25 ppm
2 = -10°C to +60°C
H = ±20 ppm
H = ±20 ppm
3 = -20°C to +70°C
I = ±15 ppm
I = ±15 ppm**
5 = -40°C to +85°C
J = ±10 ppm*
J = ±10 ppm**
9 = -10°C to +50°C
Load Capacitance
(pF)
18 pF Standard.
Or Specify
Frequency
- 20.000 MHz
* Not available at all frequencies. ** Not available for all temperature ranges.
[email protected]• www.ilsiamerica.com
• www.ilsiamerica.com
ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: [email protected]
06/09_A
Specifications subject to change without notice
Page 1
4 Pad Ceramic Package Quartz Crystal, 3.5 mm x 6 mm
Pb Free Solder Reflow Profile:
ILCX08 Series
Typical Circuit:
*Units are backward compatible with 240C reflow processes
Package Information:
MSL = 1
Termination = e4 (Au over Ni over W base metal).
Tape and Reel Information:
Quantity per
Reel
A
B
C
D
E
F
1000
16 +/-.3
8 +/-.2
7.5 +/-.2
17.5 +/-1
50 / 60 / 80
180 / 250
Environmental Specifications
Thermal Shock
Moisture Resistance
Mechanical Shock
Mechanical Vibration
Resistance to Soldering Heat
Hazardous Substance
Solderability
Terminal Strength
Gross Leak
Fine Leak
Solvent Resistance
MIL-STD-883, Method 1011, Condition A
MIL-STD-883, Method 1004
MIL-STD-883, Method 2002, Condition B
MIL-STD-883, Method 2007, Condition A
J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max)
Pb-Free / RoHS / Green Compliant
JESD22-B102-D Method 2 (Preconditioning E)
MIL-STD-883, Method 2004, Test Condition D
MIL-STD-883, Method 1014, Condition C
MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s
MIL-STD-202, Method 215
Marking
Line 1: ILSI, Date Code (yww)
Line 2: Frequency
[email protected]• www.ilsiamerica.com
• www.ilsiamerica.com
ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: [email protected]
06/09_A
Specifications subject to change without notice
Page 2