2 Pad and 3 Pad Ceramic Package, 5.5 mm x 10 mm Product Features: ZTT and ZTA Series Applications: Low Cost Compatible with Leadfree Processing Storage Media Home Appliance Microprocessors Office Automation 5 .5 M a x 1 0 .0 M a x 7 .5 M a x Frequency 1.8 MHz to 50 MHz ESR (Equivalent Series Resistance) See Table Below 5 .0 + /-1 .0 1 3 2 Frequency Tolerance @ 25q C r0.5% Frequency Stability over Temperature r0.3% Aging r0.3% Max. for 10 Years 0 .3 M a x . 0 .6 + /-0 .1 2 .5 + /-0 .3 2 .5 + /-0 .3 5 .5 M a x 1 0 .0 M a x 1 0 .0 M a x Temperature Operating -40q C to +85q C Storage -40q C to +85q C Standard Part 5 .0 + /-1 .0 2 3 0 .6 + /-0 .1 2 .5 + /-0 .3 Frequency ESR C1 (KHz) (: Max.) (pF) ZTT-MG 1.8 to 4.9 80 30 30 ZTT-MT 5 to 12.9 50 22 22 C2 0 .3 M a x . 2 .5 + /-0 .3 1 0 .0 M a x 5 .0 M a x (pF) ZTT-MX 13 to 19.9 40 22 22 ZTT-MX 20 to 25.9 40 15 15 ZTT-MX 26 to 50 40 5 5 ZTA-MG 1.8 to 4.9 80 30* 30* ZTA-MT 5 to 12.9 50 22* 22* ZTA-MX 13 to 19.9 40 22* 22* ZTA-MX 20 to 25.9 40 15* 15* ZTA-MX 26 to 50 40 5* 5* * Recommended external capacitance, not internal to the device. 7 .5 M a x 5 .0 Sample Part Number: 0 .6 + /-0 .1 0 .3 M a x . 5 .0 + /-0 .3 5 .0 M a x 1 0 .0 M a x 1 0 .0 M a x 5 .0 The terminations of the ZTA and ZTT series ceramic resonator are Pb free. Pb may be contained in the ceramic resonator element of this device and is exempted via item 7 of the RoHS annex. This ceramic resonator series is considered RoHS compliant. Part Number Guide 1 0 .6 + /-0 .1 5 .0 + /-0 .3 0 .3 M a x . D im e n sio n U n its : m m ZTT - MX - 20.000 Part Series ZTT - (internal capacitors) ZTA -(must supply externanl capacitance for proper circuit operation) Package Code Frequency MG MT MX - 20.000 MHz [email protected]• www.ilsiamerica.com • www.ilsiamerica.com ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: [email protected] 06/09_A Specifications subject to change without notice Page 1 2 Pad and 3 Pad Ceramic Package, 5.5 mm x 10 mm Pb Free Solder Reflow Profile: ZTT and ZTA Series Typical Circuit: *Units are backward compatible with 240C reflow processes Package Information: MSL = 1 Termination = e1 (Sn / Cu / Ag). Environmental Specifications Thermal Shock Moisture Resistance Mechanical Shock Mechanical Vibration Resistance to Soldering Heat Hazardous Substance Solderability Terminal Strength Gross Leak Fine Leak Solvent Resistance MIL-STD-883, Method 1011, Condition A MIL-STD-883, Method 1004 MIL-STD-883, Method 2002, Condition B MIL-STD-883, Method 2007, Condition A J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max) Pb-Free / RoHS / Green Compliant JESD22-B102-D Method 2 (Preconditioning E) MIL-STD-883, Method 2004, Test Condition D MIL-STD-883, Method 1014, Condition C MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s MIL-STD-202, Method 215 Marking Line 1: Frequency, Date code (Packaging Only) [email protected]• www.ilsiamerica.com • www.ilsiamerica.com ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: [email protected] 06/09_A Specifications subject to change without notice Page 2