High Efficiency, 6A Output, Synchronous Step Down

G5196
Global Mixed-mode Technology
High Efficiency, 6A Output, Synchronous Step Down
Features
General Description
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The G5196 device is a full featured 5.5V, 6A synchronous step down current mode converter with two integrated MOSFETs.
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Two 20mΩ (typical) MOSFETs for high efficiency at 6A loads
200kHz to 2MHz Switching Frequency
0.8V ± 1% Voltage Reference Over Temperature
Synchronizes to External Clock
Adjustable Soft Start
UV and OV Power Good Output
Low Operating and Shutdown Quiescent Current
Safe Start-up into Pre-Biased Output
Cycle by Cycle Current Limit, Thermal and
Frequency Fold Back Protection
Thermally Enhanced 3mm × 3mm 16-pin TQFN
and 4mm × 4mm 16-pin TQFN
The G5196 enables small designs by integrating the
MOSFETs, implementing current mode control to reduce external component count, reducing inductor size
by enabling up to 2MHz switching frequency, and
minimizing the IC footprint with a small 3mm x 3mm
(4mm x 4mm) thermally enhanced TQFN package.
The G5196 provides accurate regulation for a variety
of loads with an accurate ±1% Voltage Reference
(VREF) over temperature.
Efficiency is maximized through the integrated 20mΩ
MOSFETs and 350µA typical supply current. Using the
enable pin, shutdown supply current is reduced to 2µA
by entering a shutdown mode.
Applications
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Low-Voltage, High-Density Power Systems
Point of Load Regulation for High Performance
DSPs, FPGAs, ASICs and Microprocessors
„ Broadband, Networking and Optical Communication Infrastructure
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Under voltage lockout is internally set at 2.6V, but can
be increased by programming the threshold with a
resistor network on the enable pin. The output voltage
startup ramp is controlled by the soft start pin. An open
drain power good signal indicates the output is within
93% to 107% of its nominal voltage.
Ordering Information
ORDER
NUMBER
Marking
TEMP.
RANGE
PACKAGE
(Green)
G5196R41U
5196
-40°C to +85°C TQFN3X3-16
G5196R41D
G5196R81U
5196
5196
-40°C to +85°C TQFN3X3-16
-40°C to +85°C TQFN4X4-16
Frequency fold back and thermal shutdown protects
the device during an over-current condition.
Note: R4: TQFN3X3-16 R8:TQFN4X4-16
1: Bonding Code
U & D: Tape & Reel
Pin Configuration
Typical Application Circuit
VINA
1
VIN
2
VIN
EN
PG
BS
15
14
13
3
VIN
3.3V to 5.5V
12
LX
11
LX
10
4
CI
10µF
VINA
R5
100KΩ
VIN
R3
48.7KΩ
R4
32.4KΩ
EN
PG
LX
SS
RT
COMP
8
SS
RT
7
COMP
AGND
6
9
5
GND
Thermal
Pad
FB
GND
16
G5196
CSS
0.01µF
RT
182KΩ
CZ*
TQFN3X3-16/TQFN4X4-16
Note: Recommend connecting the Thermal Pad to
the Ground for excellent power dissipation.
G5196
BS
LX
FB
(0.803V)
CBS
0.1µF
LO
1.0µH
CO
22*2µF
VOUT
1.8V
CD*
R1
100KΩ
R2
80KΩ
GND
AGND
EP
RC
20KΩ
CC
470PF
* Option
* VINA must connect to VIN
TEL: 886-3-5788833
http://www.gmt.com.tw
Ver: 0.1
Nov 15, 2011
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