S16 SERIES SIP or SMT Version Application Notes Applications • Servers, Switches and Data Storage • Wireless Communications • Distributed Power Architecture • Semiconductor Test Equipment • Networking Gear • Data Communications • Telecommunications • Industrial / Medical NON-ISOLATED DC-DC Converter S16-12S5T, S16-12S5 9.0-14Vin, 0.75-5.0Vout, 16A APPLICATION NOTES Ver. 10 S16-12S5T S16-12S5 Page 1 S16 SERIES SIP or SMT Version Application Notes Applications • Servers, Switches and Data Storage • Wireless Communications • Distributed Power Architecture • Semiconductor Test Equipment • Networking Gear • Data Communications • Telecommunications • Industrial / Medical Content 1. INTRODUCTION 2. MODELS 3. 16A SIP/SMT CONVERTER FEATURES 4. GENERAL DESCRIPTION 3 3 3 4.1 Electrical Description 3 3 4.2 Thermal Packaging and Physical Design. 4 5. MAIN FEATURES AND FUNCTIONS 5.1 Operating Temperature Range 4 4 5.2 Over-Temperature Protection (OTP) 4 5.3 Output Voltage Adjustment 4 5.4 Safe Operating Area (SOA) 4 5.5 Over Current Protection 4 5.6 Remote ON/OFF 4 5.7 UVLO (Under-Voltage Lockout) 5 6. SAFETY 5 5 6.1 Input Fusing and Safety Considerations. 7. APPLICATIONS 7.1 Layout Design Challenges. 5 5 7.2 Convection Requirements for Cooling 5 7.3 Thermal Considerations 6 7.4 Power De-Rating Curves 7 7.5 Efficiency vs Load Curves 10 7.6 Input Capacitance at the Power Module 13 7.7 Test Set-Up 13 7.8 S16 Series Output Voltage Adustment. 14 7.9 Output Ripple and Noise Measurement 14 7.10 Output Capacitance 14 7.11 SMT Reflow Profile 14 8. MECHANICAL OUTLINE DIAGRAMS 8.1 SIP/SMT16 Mechanical Outline Diagrams 15 15 8.2 SMT Tape and Reel Dimensions 15 Page 2 S16 SERIES SIP or SMT Version Application Notes 1. Introduction Applications • Servers, Switches and Data Storage • Wireless Communications • Distributed Power Architecture • Semiconductor Test Equipment • Networking Gear • Data Communications • Telecommunications • Industrial / Medical 3. 16A SIP/SMT Converter Features This application note describes the features and functions of Intronics’ S16 Series of Non Isolated DC-DC Converters. These are highly efficient, reliable and compact, high power density, single output DC/DC converters. These “Point of Load” modules serve the needs specifically of the fixed and mobile telecommunications and computing market, employing economical distributed Power Architectures. The S16 Series provide precisely regulated output voltage range from 0.75V to 5.0Vdc over a wide range of input voltage (Vi=9.0 – 14Vdc) and can operate over an ambient temperature range of –40℃ to +85℃. Ultra-high efficiency operation is achieved through the use of synchronous rectification and drive control techniques. The modules are fully protected against short circuit and over-temperature conditions. Intronics’ world class automated manufacturing methods, together with an extensive testing and qualification program ensure that all S16 Series converters are extremely reliable. 2. Models • High efficiency topology, typically 94% at 5.0Vdc • Industry standard footprint • Wide ambient temperature range, -40C to +85C • Cost efficient open frame design • Programmable output voltage via external resistor from 0.75 to 5.0Vdc • No minimum load requirement (Stable at all loads) • Remote ON/OFF • Remote sense compensation • Fixed switching frequency • Continuous short-circuit protection and over current protection • Over-temperature protection (OTP) • Monotonic Startup with pre-bias at the output. • UL/IEC/EN60950 Certified. 4. General Description 4.1 Electrical Description The adjustable S16 Series models are shown in table1. A block diagram of the S16 Series converter is shown in Figure 1. Extremely high Model Input Voltage Output Voltage Output Current efficiency power conversion is achieved through the use of synchronous rectification and S16-12S5T 9.0 – 14VDC 0.75 – 5.0VDC 16A synchronous buck converter. The control loop is optimized for unconditional stability, fast S16-12S5 9.0 – 14VDC 0.75 – 5.0VDC 16A drive techniques. Essentially, the powerful S16 Series topology is based on a non-isolated transient response and a very tight line and load regulation. In a typical pre-bias application the S16 Series converters do not draw any reverse current at start-up. The output voltage can be adjusted from 0.75 to 5.0vdc, using the TRIM pin with a external Table 1 – S16 Series Models resistor. The converter can be shut down via a remote ON/OFF input that is referenced to The S16 efficiency and input current at 12Vin are shown in table2. Output Voltage Output Current 0.75V 1.2V 1.5V 1.8V 2.0V 2.5V 3.3V 5.0V 16A Input Current (mA) No Load Full Load 1299mA 40 ground. This input is compatible with popular logic devices; a 'positive' logic input is Efficiency typ. supplied as standard. Positive logic implies that the converter is enabled if the remote ON/OFF input is high (or floating), and disabled if it is low. The converter is also protected 77% against over-temperature conditions. If the converter is overloaded or the ambient temperature gets too high, the converter will shut down to protect the unit. 16A 50 1928mA 83% 16A 50 2326mA 86% 16A 60 2727mA 88% 16A 60 2996mA 89% 16A 65 3704mA 90% 16A 75 4783mA 92% 16A 75 7092mA 94% L1 Q1 +VIN +VO C1 Q2 D1 C2 R sense +SENSE COM COM Table 2 – S16 Efficiency and Input Current R1 PWM IC ON/OFF R trim ERR AMP TRIM R2 Figure 1. Electrical Block Diagram Page 3 S16 SERIES SIP or SMT Version Application Notes Applications • Servers, Switches and Data Storage • Wireless Communications • Distributed Power Architecture • Semiconductor Test Equipment • Networking Gear • Data Communications • Telecommunications • Industrial / Medical Vo 4.2 Thermal Packaging and Physical Design. The S16 Series uses a multi-layer FR4 PCB construction. All surface mount power components are placed on one side of the PCB, and all low-power control components are optimized, ensuring that control components are not thermally stressed. The converter is an open-frame product and has no case or case pin. The open-frame design has several advantages over encapsulated closed devices. Among these advantages are: • Efficient Thermal Management: the heat is removed from the heat generating Vo,nom VOLTAGE (V) placed on the other side. Thus, the Heat dissipation of the power components is Safe Operating Area components without heating more sensitive, small signal control components. • Environmental: Lead free open-frame converters are more easily re-cycled. • Cost Efficient: No encapsulation. Cost efficient open-frame construction. • Reliable: Efficient cooling provided by open frame construction offers high reliability Io,max Io,CL Io CURRENT (A) and easy diagnostics. 5. Main Features and Functions 5.1 Operating Temperature Range Intronics’ S16 Series converters highly efficient converter design has resulted in its ability to operate over a wide ambient temperature environment ( -40℃ to 85℃). Due consideration must be given to the de-rating curves when ascertaining maximum power that can be drawn from the converter. The maximum power drawn is influenced by a number of factors, such as: Figure 2. Maximum Output Current Safe Operating Area 5.5 Over Current Protection All different voltage models have a full continuous short-circuit protection. The unit will auto recover once the short circuit is removed. To provide protection in a fault condition, the unit is equipped with internal over-current protection. The unit operates normally once the fault condition is removed. The power module will supply up to 150% of rated current. In the event of an over current converter will go into a hiccup mode protection. • Input voltage range. 5.6 Remote ON/OFF • Output load current. The remote ON/OFF input feature of the converter allows external circuitry to turn the • Air velocity (forced or natural convection). converter ON or OFF. Active-high remote ON/OFF is available as standard. The S16 are • Mounting orientation of converter PCB with respect to the Airflow. turned on if the remote ON/OFF pin is high(=Vin), or left open. Setting the pin • Motherboard PCB design, especially ground and power planes. These can be low(<0.4Vdc) will turn the converter ‘Off’. The signal level of the remote on/off input is effective heat sinks for the converter. defined with respect to ground. If not using the remote on/off pin, leave the pin open 5.2 Over-Temperature Protection (OTP) The S16 Series converters are equipped with non-latching over-temperature protection. A temperature sensor monitors the temperature of the hot spot (typically, top switch). If the temperature exceeds a threshold of 130°C (typical) the converter will shut down, disabling (module will be on). The part number suffix “N” is Negative remote ON/OFF version. The unit is guaranteed OFF over the full temperature range if this voltage level exceeds 2.8Vdc. The converters are turned on If the on/off pin input is low (<0.4Vdc) or left open. The recommended SIP/SMT remote on/off drive circuit as shown as figure 3, 4. the output. When the temperature has decreased the converter will automatically restart. +Vin The over-temperature condition can be induced by a variety of reasons such as external overload condition or a system fan failure. 5.3 Output Voltage Adjustment Remote ON/OFF ON/OFF Control Q1 SIP/SMT Series Section 7.8 describes in detail as to how to trim the output voltage with respect to its set point. The output voltage on all models is trimmable in the range 0.75 – 5.0Vdc. 5.4 Safe Operating Area (SOA) Figure 2 provides a graphical representation of the Safe Operating Area (SOA) of the +Vo Common Common Figure 3. Positive Remote ON/OFF Input Drive Circuit converter. This representation assumes ambient operating conditions such as airflow are +Vin met as per thermal guidelines provided in Sections 7.2 and 7.3. +Vo Q1 SIP/SMT Series ON/OFF Control Remote ON/OFF Common Common Figure 4. Negative Remote ON/OFF Input Drive Circuit Page 4 S16 SERIES SIP or SMT Version Application Notes Applications • Servers, Switches and Data Storage • Wireless Communications • Distributed Power Architecture • Semiconductor Test Equipment 5.7 UVLO (Under-Voltage Lockout) Recommended Pad Layout The voltage on the Vcc pin determines the start of the operation of the Converter. When Dimensions are in millimetes and(inches) • Networking Gear • Data Communications • Telecommunications • Industrial / Medical the input Vcc rises and exceeds about 8.0V the converter initiates a soft start. The UVLO 7.54 function in the converter has a hysteresis (about 300mV) built in to provide noise immunity at start-up. (0.297) 4.83 4.83 (0.190) (0.190) (0.190) +SENSE TRIM 6. Safety 10.29 (0.405) 6.1 Input Fusing and Safety Considerations. +VO 7.87 (0.310) COM 10.92 (0.430) Top View of Board ON/OFF Agency Approvals: The power Supply shall be submitted to and receive formal approval from the following test agencies. 4.83 0.64 (0.025) +VIN 29.90 (1.177) 1.The power supply shall be approved by a nationally recognized testing laboratory to PAD SIZE MIN:3.556x2.413(0.140x0.095) MAX:4.19x2.79(0.165x0.110) UL/CSA 60950 3rd Edition (North America) and EN60950 (International) 2. CB Certificate from an internationally recognized test house in accordance with EN Figure 6. Recommended SMT Footprint 60950. The S16 Series converters do not have an internal fuse. However, to achieve maximum 7.2 Convection Requirements for Cooling safety and system protection, always To predict the approximate cooling needed for the module, refer to the Power De-rating use an input line fuse. The safety agencies require a time-delay fuse curves in Figures 10 to 13 . These de-rating curves are approximations of the ambient with a maximum rating of 20A. temperatures and airflows required to keep the power module temperature below its maximum rating. Once the module is assembled in the actual system, the module’s temperature should be checked as shown in Figure 7 to ensure it does not exceed 120°C. 7. Applications Proper cooling can be verified by measuring the power module’s temperature at Q1-pin 6 as shown in Figure 8,9. 7.1 Layout Design Challenges. In optimizing thermal design the PCB is utilized as a heat sink. Also some heat is transferred from the SIP/SMT module to the main board through connecting pins. The system designer or the end user must ensure that other components and metal in the vicinity of the W ind Tunnel 25.4(1.0) Bakelite S16 Series meet the spacing requirements to which the system is approved. Power Module Low resistance and low inductance PCB layout traces are the norm and should be used where possible. Due consideration must also be given to proper low impedance tracks between power module, input and output grounds. The recommended SIP/SMT footprint as shown as figure 5, 6. 76.2(3.0) 0.29(7.4) LAYOUT PATTERN TOP VIEW All Dimmension In Inches(mm) Tolerance : .XX=¡ Ó0.04 .XXX=¡ Ó0.010 0.33(8.4) Thermocuple Location for measuring ambient temperature and airflow 1.1mm PLATED THROUGH HOLE 1.6mm PAD SIZE Figure 5. Recommended SIP Footprint 12.7(0.5) Air flow Note : Dimensions are in millimeters and (inches) Figure 7. Thermal Test Setup Page 5 S16 SERIES SIP or SMT Version Application Notes Applications • Servers, Switches and Data Storage • Wireless Communications • Distributed Power Architecture • Semiconductor Test Equipment • Networking Gear • Data Communications • Telecommunications • Industrial / Medical Figure 8. Temperature Measurement Location for SIP Figure 9. Temperature Measurement Location for SMT 7.3 Thermal Considerations The power module operates in a variety of thermal environments; however, sufficient cooling should be provided to help ensure reliable operation of the unit. Heat is removed by conduction, convection, and radiation to the surrounding environment. The thermal data presented is based on measurements taken in a set-up as shown in Figure7. Figures 10 to 13 represent the test data. Note that the airflow is parallel to the long axis of the module as shown in Figure7 for the SIP/SMT. The temperature at either location should not exceed 120 °C. The output power of the module should not exceed the rated power for the module (VO, set x IO, max). The SMT05 thermal data presented is based on measurements taken in a wind tunnel. The test setup shown in Figure 7 and EUT need to solder on 33mm x 40.38mm(1.300'' x 1.59'') test pcb. Note that airflow is parallel to the long axis of the module as shown in Fig7. Page 6 S16 SERIES SIP or SMT Version Application Notes Applications • Servers, Switches and Data Storage • Wireless Communications • Distributed Power Architecture • Semiconductor Test Equipment • Networking Gear • Data Communications • Telecommunications • Industrial / Medical 7.4 Power De-Rating Curves SIP16-12S05A (Vo=5.0V) Derating Curve S16-12S5T 16 14 12 10 8 0LFM 6 100LFM 4 2 0 200LFM 300LFM 20 30 40 50 60 70 80 Ambient Temperature(oC) 90 SIP16-12S05A (Vo=3.3V) Derating Curve S16-12S5T 18 Output Current(A) Output Current(A) 18 16 14 12 10 8 0LFM 6 100LFM 4 2 0 200LFM 100 300LFM 20 30 40 50 60 70 80 Ambient Temperature(oC) 90 100 Figure10a.Typical Power De-rating for 12V IN 5.0Vout Figure 10b.Typical Power De-rating for 12V IN 3.3Vout SIP16-12S05A S16-12S5T (Vo=2.0V) Derating Curve Output Current(A) Output Current(A) SIP16-12S05A (Vo=2.5V) Derating Curve S16-12S5T 18 16 14 12 10 8 0LFM 100LFM 6 4 2 0 200LFM 300LFM 20 30 40 50 60 70 80 Ambient Temperature(oC) 90 18 16 14 12 10 8 0LFM 100LFM 6 4 2 0 100 200LFM 300LFM 20 30 40 50 60 70 80 Ambient Temperature(oC) 90 100 Figure10c.Typical Power De-rating for 12V IN 2.5Vout Figure 10d.Typical Power De-rating for 12V IN 2.0Vout SIP16-12S05A (Vo=1.5V) Derating Curve S16-12S5T Output Current(A) Output Current(A) SIP16-12S05A S16-12S5T (Vo=1.8V) Derating Curve 18 16 14 12 10 8 6 4 2 0 0LFM 100LFM 200LFM 300LFM 20 30 40 50 60 70 80 Ambient Temperature(oC) 90 100 18 16 14 12 10 8 6 4 2 0 0LFM 100LFM 200LFM 300LFM 20 30 40 50 60 70 80 Ambient Temperature(oC) 90 100 Figure10e.Typical Power De-rating for 12V IN 1.8Vout Figure 10f.Typical Power De-rating for 12V IN 1.5Vout Page 7 S16 SERIES SIP or SMT Version Application Notes 18 16 14 16 14 12 10 8 0LFM 6 100LFM 4 2 200LFM • Networking Gear • Data Communications • Telecommunications • Industrial / Medical SIP16-12S05A S16-12S5T (Vo=0.75V) Derating Curve 18 Output Current(A) Output Current(A) SIP16-12S05A (Vo=1.2V) Derating Curve S16-12S5T Applications • Servers, Switches and Data Storage • Wireless Communications • Distributed Power Architecture • Semiconductor Test Equipment 300LFM 0 12 10 8 0LFM 6 100LFM 4 2 200LFM 300LFM 0 20 30 40 50 60 70 80 Ambient Temperature(oC) 90 100 20 30 40 50 60 70 80 Ambient Temperature(oC) 90 100 18 16 14 12 10 8 6 4 2 0 SMT16-12S05A (Vo=5.0V) Derating Curve S16-12S5 Output Current(A) Output Current(A) Figure10g.Typical Power De-rating for 12V IN 1.2Vout Figure 10h.Typical Power De-rating for 12V IN 0.75Vout 0LFM 100LFM 200LFM 300LFM 20 30 40 50 60 70 80 Ambient Temperature(oC) 90 18 16 14 12 10 8 6 4 2 0 100 SMT16-12S05A (Vo=3.3V) Derating Curve S16-12S5 0LFM 100LFM 200LFM 300LFM 20 30 40 50 60 70 80 Ambient Temperature(oC) 90 100 18 16 14 12 10 8 6 4 2 0 SMT16-12S05A (Vo=2.5V) Derating Curve S16-12S5 SMT16-12S05A (Vo=2.0V) Derating Curve S16-12S5 Output Current(A) Output Current(A) Figure11a.Typical Power De-rating for 12V IN 5.0Vout Figure 11b.Typical Power De-rating for 12V IN 3.3Vout 0LFM 100LFM 200LFM 300LFM 20 30 40 50 60 70 80 Ambient Temperature(oC) 90 100 18 16 14 12 10 8 6 4 2 0 0LFM 100LFM 200LFM 300LFM 20 30 40 50 60 70 80 Ambient Temperature(oC) 90 100 Figure11c.Typical Power De-rating for 12V IN 2.5Vout Figure 11d.Typical Power De-rating for 12V IN 2.0Vout Page 8 S16 SERIES SIP or SMT Version Application Notes 16 14 16 14 Output Current(A) Output Current(A) 18 12 0LFM 6 100LFM 4 2 0 200LFM 300LFM 20 30 40 50 60 70 80 Ambient Temperature(oC) 90 • Networking Gear • Data Communications • Telecommunications • Industrial / Medical SMT16-12S05A (Vo=1.5V) Derating Curve S16-12S5 SMT16-12S05A (Vo=1.8V) Derating Curve S16-12S5 18 10 8 Applications • Servers, Switches and Data Storage • Wireless Communications • Distributed Power Architecture • Semiconductor Test Equipment 12 10 8 0LFM 6 100LFM 4 2 0 200LFM 100 300LFM 20 30 40 50 60 70 80 Ambient Temperature(oC) 90 100 18 16 14 12 10 8 6 4 2 0 SMT16-12S05A (Vo=1.2V) Derating Curve S16-12S5 SMT16-12S05A (Vo=0.75V) Derating Curve S16-12S5 Output Current(A) Output Current(A) Figure11e.Typical Power De-rating for 12V IN 1.8Vout Figure11d.Typical Power De-rating for 12V IN 1.5Vout 0LFM 100LFM 200LFM 300LFM 20 30 40 50 60 70 80 Ambient Temperature(oC) 90 100 18 16 14 12 10 8 6 4 2 0 0LFM 100LFM 200LFM 300LFM 20 30 40 50 60 70 80 Ambient Temperature(oC) 90 100 Figure11f.Typical Power De-rating for 12V IN 1.2Vout Figure 11g.Typical Power De-rating for 12V IN 0.75Vout Page 9 S16 SERIES SIP or SMT Applications • Servers, Switches and Data Storage • Wireless Communications • Distributed Power Architecture • Semiconductor Test Equipment Version Application Notes • Networking Gear • Data Communications • Telecommunications • Industrial / Medical 7.5 Efficiency vs Load Curves SIP16-12S05A S16-12S5T Vo=5.0V (Eff Vs Io) SIP16-12S05A Vo=3.3V (Eff Vs Io) S16-12S5T 95% 95% 90% 85% 9.0V 12V 14V 80% 75% Efficincy (%) 100% Efficincy (%) 100% 90% 85% 9.0V 12V 14V 80% 75% 70% 70% 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 0 1 2 3 4 Current Load (A) 5 6 7 8 9 10 11 12 13 14 15 16 Current Load (A) SIP16-12S05A S16-12S5T Vo=2.5V (Eff Vs Io) SIP16-12S05A S16-12S5T Vo=2.0V (Eff Vs Io) 100% 100% 95% 95% 85% 9.0V 12V 14V 80% 75% Efficincy (%) Efficincy (%) 90% 90% 85% 80% 75% 9.0V 12V 14V 70% 65% 70% 60% 0 1 2 3 4 5 6 7 8 0 9 10 11 12 13 14 15 16 1 2 3 4 Current Load (A) SIP16-12S05A S16-12S5T Vo=1.8V (Eff Vs Io) 90% 90% 85% 80% 9.0V 12V 14V 60% Efficincy (%) 95% Efficincy (%) 95% 65% 7 8 9 10 11 12 13 14 15 16 SIP16-12S05A Vo=1.5V (Eff Vs Io) S16-12S5T 100% 70% 6 Current Load (A) 100% 75% 5 85% 80% 75% 9.0V 12V 14V 70% 65% 60% 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 Current Load (A) 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 Current Load (A) Page 10 S16 SERIES SIP or SMT Applications • Servers, Switches and Data Storage • Wireless Communications • Distributed Power Architecture • Semiconductor Test Equipment Version Application Notes SIP16-12S05A S16-12S5T Vo=1.2V (Eff Vs Io) SIP16-12S05A Vo=0.75V (Eff Vs Io) S16-12S5T 100% 100% 95% 95% 90% 85% 80% 75% 9.0V 12V 14V 70% 65% Efficincy (%) Efficincy (%) 90% 85% 80% 75% 70% 9.0V 12V 14V 65% 60% 55% 60% 50% 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 0 1 2 3 4 Current Load (A) SMT16-12S05A Vo=5.0V (Eff Vs Io) S16-12S5 90% 85% 9.0V 12V 14V Efficincy (%) 95% Efficincy (%) 95% 75% 6 7 8 9 10 11 12 13 14 15 16 SMT16-12S05A Vo=3.3V (Eff Vs Io) S16-12S5 100% 80% 5 Current Load (A) 100% 90% 85% 9.0V 12V 14V 80% 75% 70% 70% 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 0 1 2 3 4 Current Load (A) SMT16-12S05A Vo=2.5V (Eff Vs Io) S16-12S5 95% 90% 85% 9.0V 12V 14V 70% Efficincy (%) 95% 75% 6 7 8 9 10 11 12 13 14 15 16 SMT16-12S05A Vo=2.0V (Eff Vs Io) S16-12S5 100% 80% 5 Current Load (A) 100% Efficincy (%) • Networking Gear • Data Communications • Telecommunications • Industrial / Medical 90% 85% 9.0V 12V 14V 80% 75% 70% 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 Current Load (A) 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 Current Load (A) Page 11 S16 SERIES SIP or SMT Applications • Servers, Switches and Data Storage • Wireless Communications • Distributed Power Architecture • Semiconductor Test Equipment Version Application Notes SMT16-12S05A Vo=1.8V (Eff Vs Io) S16-12S5 SMT16-12S05A Vo=1.5V (Eff Vs Io) S16-12S5 95% 95% 90% 90% 80% 75% 9.0V 12V 14V 70% 65% Efficincy (%) 100% Efficincy (%) 100% 85% 85% 80% 75% 9.0V 12V 14V 70% 65% 60% 60% 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 0 1 2 3 4 Current Load (A) 5 6 7 8 9 10 11 12 13 14 15 16 Current Load (A) SMT16-12S05A Vo=1.2V (Eff Vs Io) S16-12S5 SMT16-12S05A Vo=0.75V (Eff Vs Io) S16-12S5 100% 100% 95% 95% 90% 85% 80% 75% 9.0V 12V 14V 70% 65% 60% Efficincy (%) 90% Efficincy (%) • Networking Gear • Data Communications • Telecommunications • Industrial / Medical 85% 80% 75% 70% 9.0V 12V 14V 65% 60% 55% 50% 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 Current Load (A) 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 Current Load (A) Page 12 S16 SERIES SIP or SMT Version Application Notes 7.6 Input Capacitance at the Power Module Applications • Servers, Switches and Data Storage • Wireless Communications • Distributed Power Architecture • Semiconductor Test Equipment • Networking Gear • Data Communications • Telecommunications • Industrial / Medical The value of line regulation is defined as: The SIP/SMT converters must be connected to a low AC source impedance. To avoid problems with loop stability source inductance should be low. Also, the input capacitors Line.reg = should be placed close to the converter input pins to de-couple distribution inductance. However, the external input capacitors are chosen for suitable ripple handling capability. Low ESR polymers are a good choice. They have high capacitance, high Where: Current Meter avoided. Circuit as shown in Figure 14 represents typical measurement methods for A ripple current. Input reflected-ripple current is measured with a simulated source Power Supply To Oscilloscope VHL is the output voltage of maximum input voltage at full load. VLL is the output voltage of minimum input voltage at full load. ripple rating and low ESR (typical <100mohm). Electrolytic capacitors should be Inductance of 1uH. Current is measured at the input of the module. VHL − VLL ×100% VLL +Vin A +Vo +Sense + V 100uF Voltage Meter SIP/SMT Series Common V Load Common L1 +Vin 1uH Power + 2*100uF Tantalum Supply Figure 15. SIP/SMT16 Series Test Setup SIP/SMT16 220uF ESR<0.1ohm Common Figure 14. Input Reflected-Ripple Test Setup 7.7 Test Set-Up The basic test set-up to measure parameters such as efficiency and load regulation is shown in Figure 15. Things to note are that this converter is non-isolated, as such the input and output share a common ground. These grounds should be connected together via low impedance ground plane in the application circuit. When testing a converter on a bench set-up, ensure that -Vin and -Vo are connected together via a low impedance short to ensure proper efficiency and load regulation measurements are being made. When testing the Intronics’ S16 Series under any transient conditions please ensure that the transient response of the source is sufficient to power the equipment under test. We can calculate the • • Efficiency Load regulation and line regulation. The value of efficiency is defined as: η = Where: Vo × Io × 100% Vin × Iin Vo is output voltage, Io is output current, Vin is input voltage, Iin is input current. The value of load regulation is defined as: Load .reg = Where: VFL − VNL × 100% VNL VFL is the output voltage at full load VNL is the output voltage at no load Page 13 S16 SERIES SIP or SMT Version Application Notes Applications • Servers, Switches and Data Storage • Wireless Communications • Distributed Power Architecture • Semiconductor Test Equipment • Networking Gear • Data Communications • Telecommunications • Industrial / Medical 7.8 S16 Series Output Voltage Adustment. 7.9 Output Ripple and Noise Measurement The output Voltage of the S16 can be adjusted in the range 0.75V to 5.0V by The test set-up for noise and ripple measurements is shown in Figure 17. a coaxial connecting a single resistor on the motherboard (shown as Rtrim) in Figure 16. When cable with a 50ohm termination was used to prevent impedance mismatch reflections Trim resistor is not connected the output voltage defaults to 0.75V +Vin +Vin +Vo +Vo 10uF Tant. SIP/SMT16-12S05A SIP or SMT S16 Trim 1uF Ceramic R-Load SIP/SMT16-12S05A SIP or SMT S16 R-Load Test Jack Common R trim-up Common disturbing the noise readings at higher frequencies. Common Common Figure 17. Output Voltage Ripple and Noise Measurement Set-Up Figure 16. Trim-up Voltage Setup The value of Rtrim-up defined as: Intronics’ S16 Series converters provide unconditional stability with or without external 10500 Rtrim = ( − 1000 ) Vo − 0.75 Where: 7.10 Output Capacitance capacitors. For good transient response low ESR output capacitors should be located close to the point of load. For high current applications point has already been made in layout considerations for low resistance and low inductance tracks. Rtrim-up is the external resistor in ohm, Output capacitors with its associated ESR values have an impact on loop stability and Vo is the desired output voltage To give an example of the above calculation, to set a voltage of 3.3Vdc, Rtrim is given by: bandwidth. Intronics’ converters are designed to work with load capacitance up-to 8,000uF. It is recommended that any additional capacitance, Maximum 8,000uF and low ESR, be connected close to the point of load and outside the remote compensation 10500 Rtrim = ( − 1000 ) 3.3 − 0.75 Rtrim = 3117 ohm point. 7.11 SMT Reflow Profile An example of the SMT reflow profile is given in Figure 18. Equipment used: SMD HOT AIR REFLOW HD-350SAR Alloy: AMQ-M293TA or NC-SMQ92 IND-82088 SN63 For various output values various resistors are calculated and provided in Table 3 for convenience. REFLOW PROFILE 240 Rtrim (Kohm) Open 22.33 13.0 9.0 7.4 5.0 3.12 1.47 Table 3 – Trim Resistor Values 200 TEMPERATURE (C) Vo,set (V) 0.75 1.20 1.50 1.80 2.00 2.50 3.30 5.0 160 120 80 40 0 0 30 60 90 120 150 180 210 240 TIME (SECONDS) Figure 18 SMT Reflow Profile Page 14 S16 SERIES SIP or SMT Version Application Notes Applications • Servers, Switches and Data Storage • Wireless Communications • Distributed Power Architecture • Semiconductor Test Equipment • Networking Gear • Data Communications • Telecommunications • Industrial / Medical 8.2 SMT Tape and Reel Dimensions 8. Mechanical Outline Diagrams The Tape Reel dimensions for the SMT module is shown in Figure 21. 8.1 SIP/SMT16 Mechanical Outline Diagrams Dimensions are in millimeters and inches Po P2 P D t E 0.327(8.30)max. 2.00(50.8) W SIZE SIP Bo F Tolerance: x.xx ±0.02 in. (0.5mm) , x.xxx ±0.010 in. (0.25 mm) unless otherwise noted 0.23(5.8) Ao Ko 6 7 8 9 10 11 1 2 3 4 5 0.14(3.6) 0.512(13.00) 0.010(0.25) min. 0.025(0.64) 0.100(2.54) 0.050(1.30) 1.000(25.40) 0.28(7.1) 0.025(0.64) 0.400(10.20) Figure 19 SIP16 Mechanical Outline Diagram W Ao BOTTOM VIEW OF BOARD Bo 9.30 (0.366) max. 33.0 (1.30) 7.87 (0.310) 4.83 4.83 4.83 (0.190) (0.190) (0.190) COM +VO 7.54 1.65 (0.065) (0.297) F E D TRIM +SENSE 10.29 13.46 (0.405) (0.530) 1.60 (0.063) D1 Po ON/OFF +VIN SURFACE MOUNT CONTACT P2 t 1.91 (0.075) 1.22 (0.048) 2.84 (0.112) Ko P L1 INDUCTOR Dimensions are in millimeters(Inches) Tolerances :X.X¡ Ó0.5mm(0.02in),X.XX¡ Ó0.25mm(0.010in),unless otherwise noted. Figure 21 – SMT Tape and Reel Dimensions Figure 20 SMT16 Mechanical Outline Diagram Page 15