www.ironwoodelectronics.com Products, Services & Capabilities Toll Free: (800) 404-0204 U.S. Only Tel: (952) 229-8200 Fax: (952) 229-8201 email: [email protected] Overview Company Overview – – – – – – – – – Founded 1986 Over 5,000 products High Performance Adapters and Sockets Many Custom Designs & Turn-Key Solutions Engineering – Electrical and Mechanical ISO9001:2008 Registration World wide distribution Customers – Engineering and OEM 40 Employees Capabilities Overview – Simulation QFIN for heat sink design Microwave Studio for electrical – 3D Solid Modeling CAD & CAM ProEngineer, Solid Works Gibbs cam – www.ironwoodelectronics.com Product Overview GHz Elastomer Sockets Stamped Pin Sockets Silver Matrix Sockets Thermal Control System Giga-snaP BGA Socket Adapters SMT Package Emulation Package Convertors Prototype, Probing & Analysis Adapters Electronic Modules PCB Technology PADS Layout, PADS Router Controlled Impedance, Embedded Resistors, Laser Micro Vias, Filled Via in Pad, 3/3 traces, Rigid-flex PCBs – State of the art CNC machines - Tight Tolerance 3D Machining (e.g. ±0.0127mm), Swiss screw machine, Print, Pick, Place & Reflow assembly line, High speed PCB drilling, Automated Optical Inspection IP, 7/29/2015 Development Proven Capability 18 Years Continuous improvement Engineering Sockets www.ironwoodelectronics.com Heat sink lid BGA compressed on Elastomer Double latch lid Surface mount adapter Clamshell lid IP, 7/29/2015 Silver particle Elastomer Capabilities • 0.3mm to 1.27mm pitch • 1x1mm to 60x60mm device • BGA, LGA, QFN, QFP, SOIC, WLP • 4000 pin count • 75GHz •Heat sink options • Easy chip replacement • Custom support plate options •Custom mounting options •Industry’s smallest footprint Gold RF socket Swivel lid socket with decaps accommodated back plate Torque indicator Back-to-back socket PoP socket with two elastomers Open top lid No mounting hole socket Custom insulation plate 11 Years Stamped LGA pogo pin Short 3piece Pogo pin Stamped BGA pogo pin Capabilities • 0.2mm to 1.27mm pitch • 1x1mm to 60x60mm device • BGA, LGA, QFN, QFP, SOIC, WLP • 4000 pin count • 45 GHz, 500K cycles • Consistent contact resistance throughout life • Low cleaning frequency • High current & extreme temperature www.ironwoodelectronics.com Self cleaning Pogo pin crown Ceramic QFP socket with center E-pad SMP SM Offset plunger Kelvin pogo pin Development Proven Capability Continuous improvement Production & Burn-in Sockets SOIC production socket IP, 7/29/2015 BGA production socket with heat sink lid Multi Level SBT socket Flat lead Ceramic QFP production socket Contact Technology Summary Characteristics Bandwidth, GHz Embedded Wire Elastomer (SG) Stamped spring pins (SBT) www.ironwoodelectronics.com Embedded Silver Ball Elastomer Matrix (SM/SMP) Silver Button Elastomer (GT) 27 to >40 7 to 31.7 >40 75 Endurance, Cycles 2K 500K 5K/500K 1K Resistance, mΩ 20 15 15 20 0.11 to 0.28 0.88 to 0.98 0.21 0.04 2 8 4 5 Temp Range, ⁰C -35 to +100 -55 to +180 -55 to +155 -55 to +160 Pitch, mm 0.3 to 1.27 0.4 to 1.27 0.25 to 1.27 0.3 to 1.27 BGA, QFN, QFP, SOIC BGA, LGA, QFN, QFP, SOIC BGA, LGA, QFN BGA, LGA, QFN √ √ √ √ √ √ Self Inductance, nH Max Current, Amp Package Types Lab test Production test Field upgrade √ √ Temperature test √ √ √ √ Kelvin test √ √ √ √ Burn-in test IP, 7/29/2015 √ Pin Datasheet IP, 7/29/2015 www.ironwoodelectronics.com 25 Years www.ironwoodelectronics.com SOIC, PLCC adapter Power PC BGA device interfaced to Logic analyzer and mother board for functional analysis 0.5mm pitch 21x21 array 289 position BGA solder balls to AMP 104068 connectors using rigid flex PCB with socket fixture J-leaded PLCC Emulator foot Gull-wing QFP Emulator foot Capabilities • 0.4mm to 1.27mm pitch • 2x2mm to 50x50mm device • BGA, LGA, QFN, SOIC, PLCC, QFP, DIP, PGA, etc • 2000 pin count • RoHS compatible • Agilent, Tektronix compatible • Rigid & flex options 60 pin, 0.8mm pitch BGA rigid-flex probing adapter with AMP mictor and BGA surface mount foot BGA proto adapter with Clamshell pogo pin socket Development Proven Capability Continuous improvement Engineering Adapters Leadless QFN emulator IP, 7/29/2015 Allows QFN device to be socketed to mother board with signals brought out to test pins Flex emulator – 125 position AMP Z pack connector to 80 position female interface 25 Years Daughter card module Interfaced to QFP footprint SoC module with high density connector www.ironwoodelectronics.com QFP device mounted to PLCC Footprint on target board with shortest trace length 0.5mm pitch BGA Pluggable adapter system BGA to BGA conversion with complex signal swap due to device enhancement without additional real estate Capabilities • 0.4mm to 2.54mm pitch • 2x2mm to 50x50mm device • BGA, LGA, QFN, SOIC, PLCC, QFP, DIP, PGA, etc • 3 mil trace/space • Laser micro vias • Embedded caps & resistors • Lead free options • Tray, Tape & Reel options • Turnkey solutions Development Proven Capability Continuous improvement Production Adapters 2000 pin count BGA adapter system plugged together IP, 7/29/2015 SOIC to DIP convertor using blind hole technology PLCC plug connects Daughter card to socket SOIC device mounted to PLCC footprint using solder column technology for high volume production SOIC pitch convertor Thermal Control System • • • • • • • • • • • FlexTC, -55°C to +155°C, Temperature accuracy of ±0.2°C MaxTC, -60°C to +300°C, Temperature accuracy of ±0.2°C FlexTC device plunger, 21W @-40C MaxTC device plunger, 52W @-40C Adaptor plate – specific to socket Universal adaptor plate – mounting hole in PCB Condensation control – dry air purge Accommodate device in socket as well as soldered device Portable, fluid free operation, Ultra-quiet operation Maintenance-free system Self contained system - No external chiller and no compressed air required IP, 7/29/2015 www.ironwoodelectronics.com Facility Overview 24000 Sq. Ft Building Machining area IP, 7/29/2015 www.ironwoodelectronics.com Production area ESD Automated Assembly area Typical Custom Product Process Flow www.ironwoodelectronics.com 0 day Customer Sends Drawings, Specs 1 day Concept Designed With Customer Documentation generated 2 days 1 day Quotes & Drawings rev A Components manufactured 10 days 1 day Customer Approves / Orders Part Assembled and Tested 3 days 3 days Engineer designed product Part Inspected and Shipped 1 day IP, 7/29/2015 Design Approved by Customer 1 day Custom Capabilities Custom designs in 2 days Match customer’s PCB footprint Custom manufacturing in 10 days Multiple contactor technologies Heat sink simulation and design Contactor signal integrity simulation In-house automated optical inspection In-house machining Quick turn production IP, 7/29/2015 www.ironwoodelectronics.com Global Presence www.ironwoodelectronics.com Headquarter Distributor IP, 7/29/2015