0.4mm SBT (etched) AC data

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Test Report
RF Characterization IE SBT - 0.4mm Pitch array - Vespel SP-1 Body
Material
Report description:
Objective
The objective of this report is to evaluate the RF characteristics of IE SBT pins used for devices with
0.4mm pitch configured in different array patterns. Shunt capacitance and loop inductance are measured.
Mutual capacitance and mutual inductance are extrapolated from simulation. Time domain reflection
coefficient and frequency domain group delay characteristics quantify the signal delay. Fixture parasitics are
minimized by direct measurement using 50Ω air coplanar probes. Test setup, conditions, and
methodologies are described in the Appendix.
Results
Equivalent Circuit SPICE Compatible Model
Rs
Cs
2
IN
(DUT)
Cs
2
Cc
Lm
Ls
Rs
Loop Inductance
0.95nH
Cs
Shunt Capacitance
0.20pF
OUT
(BOARD)
Cc
Mutual Capacitance**
0.06pF
Cs
2
Lm
Mutual Inductance**
0.11nH
Cs
2
Ls
Cc
2
Ls
2
Rs
Rskin (High-Frequency
Loss)
1000Ω
The crosstalk model is valid through 6GHz. 1GHz measured data is used to calculate derived values.
**These values are determined through curve-fit approximation, as these values cannot be directly measured
1|Page
SBT0.4mm Pitch
RF.doc, Rev.A
VP, 11/9/10
www.ironwoodelectronics.com Tel: (800) 404-0204
Bandwidth (One-way Through):
The bandwidth of the contactor is the insertion loss (S21) from a direct one-way through measurement.
INSERTION
LOSS (dB)
FREQUENCY
(GHz)
1
34.6 GHz
3
40+ GHz
INSERTION LOSS (dB)
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0.0
MARKERS
S-21
dB
GHz
-0.11
1.0
-0.15
2.0
-0.18
3.0
0.5
1.0
-0.21
4.0
35.12 -1.0
40.00 -3.0
Insertion Loss (dB)
1.5
2.0
S21
S12
2.5
3.0
MARKERS
S-12
dB
GHz
1.0
-0.11
-0.14
2.0
-0.18
3.0
4.0
-0.21
34.64 -1.0
40.00 -3.0
3.5
4.0
4.5
5.0
0.0
5.0
10.0
15.0
20.0
25.0
30.0
35.0
40.0
Frequency (GHz)
8/13/2009
Group Delay:
Group delay is a measure of the time it takes a signal to transmit through the device under test. Group
delay indicates electrical length. Group delay is derived by differentiating the phase with respect to
frequency.
GROUP DELAY (ps)
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100
90
MARKERS
S-21
GHz
ps
11.6
1.0
2.0
12.9
11.3
3.0
80
Group Delay (ps)
70
4.0
60
11.7
S21
50
S12
40
MARKERS
S-12
GHz
ps
1.0
11.8
30
2.0
3.0
4.0
20
10
11.5
10.8
10.9
0
0.0
1.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
9.0
10.0
Frequency (GHz)
8/13/2009
2|Page
SBT0.4mm Pitch
RF.doc, Rev.A
VP, 11/9/10
www.ironwoodelectronics.com Tel: (800) 404-0204
Return Loss:
Return loss is the ratio of the reflected wave to the incident wave, expressed in dB. The -20dB return
loss limit (10% reflection) is reached at 4.2 GHz.
RETURN LOSS (dB)
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0.0
MARKERS
S-11
dB
GHz
1.0
-30.0
2.0
-25.5
Return Loss (dB)
5.0
10.0
3.0
-22.9
4.0
-20.4
31.60 -10.0
15.0
4.24
-20.0
S11
20.0
S22
MARKERS
S-22
GHz
dB
1.0
-30.2
25.0
30.0
-25.6
-22.9
-20.5
33.76 -10.0
2.0
3.0
4.0
35.0
4.24
-20.0
40.0
0.0
1.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
9.0
10.0
Frequency (GHz)
8/13/2009
Time Domain Response and Electrical Delay:
Below is shown comparative Time Domain Responses from the open, short, and one-way through
configurations. The electrical delay measured between the open port trace and the open contact trace is
10.2 picoseconds (open circuit), 14.4 picoseconds (short circuit).
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TIME DOMAIN ( S11 REAL )
1.2
1.0
SHORTED PROBE
OPEN PROBE
OPEN GSG
SHORT GSG
LOOP-THRU GSG
0.8
Reflection Coefficient (Real)
0.6
0.4
SHORT DELAY
OPEN DELAY
0.2
0.0
-0.2
ELECTRICAL
DELAY
-0.4
OPEN
-0.6
10.2
-0.8
ps
SHORT
14.4
-1.0
ps
-1.2
-50
-25
0
25
50
75
Time (ps)
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100
8/13/2009
SBT0.4mm Pitch
RF.doc, Rev.A
VP, 11/9/10
www.ironwoodelectronics.com Tel: (800) 404-0204
Loop Inductance:
Loop inductance is derived from the short measurement, by measuring the imaginary component of S11
with respect to the frequency.
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INDUCTANCE (nH)
5.0
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RESONANCE#DIVGHz
SMITH CHART - REFLECTION
SHORT
4.5
4.0
MARKERS
S-11
MARKERS
S-11
GHz
GHz
L1.0H) 1.04
3.5
Inductance (nH)
3.0
2.0
0.95
3.0
0.93
4.0
0.93
2.5
Z (R+jX)Ω
L (nH)
1.0
1.4+j6.3
1.04
2.0
3.0
4.0
1.9+j12.0
2.2+j17.3
2.5+j23.4
0.95
0.93
0.93
MARKERS
S-22
S11
S22
Z (R+jX)Ω
GHz
L (nH)
2.0
MARKERS
1.0
1.30+j6.17
1.02
1.5
S-22
GHz
2.0
3.0
1.62+j11.93
1.90+j17.37
0.95
0.93
L1.0H) 1.02
4.0
2.28+j23.56
0.94
1.0
2.03.0
0.950.93
0.5
4.0
0.94
S-11S-22
8/13/2009
0.0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
8/13/2009
Frequency (GHz)
Shunt Capacitance:
Shunt Capacitance is derived from the open measurement, by measuring the imaginary component of
S11 with respect to the frequency.
CAPACITANCE (pF)
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OPEN
4.5
MARKERS
S-11
GHz Z (R+jX)Ω
MARKERS
S-11
4.0
3.5
73.8-j739.1
19.4-j390.8
11.7-j269.6
0.22
0.20
0.20
-122.53
-31.10
-14.50
0.20
4.0
6.2-j194.3
0.20
-7.73
MARKERS
S-22
GHz Z (R+jX)Ω
(open)
C (pF)
0.20
S11
2.5
S22
2.0
MARKERS
S-22
GHz
1.5
C1(.0F)
1.0
0.5
(short)
L (nH)
1.0
2.0
3.0
4.0
3.0
(open)
C (pF)
GHz
C1 F)
.0 0.22
0.20
2.0
3.0
Capacitance (pF)
SMITH CHART - REFLECTION
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RESONANCE`#DIVGHz
5.0
2.0
0.220.21
3.0
0.20
4.0
0.21
(short)
L (nH)
1.0
2.0
3.0
81.70-j739.44 0.22
21.90-j383.94 0.21
12.28-j268.42 0.20
-122.59
-30.55
-14.43
4.0
7.35-j192.45
-7.66
S-11
S-22
0.21
8/13/2009
0.00.0
0.5
1.0
1.5
2.0
2.5
Frequency (GHz)
4|Page
Test Report
3.0
3.5
4.0
4.5
5.0
8/13/2009
SBT0.4mm Pitch
RF.doc, Rev.A
VP, 11/9/10
www.ironwoodelectronics.com Tel: (800) 404-0204
Contactor Crosstalk:
Contactor crosstalk is measured as the insertion loss (S21 and S12) of a signal that is transmitted between
2 adjacent signal pins. Each signal pin has an adjacent ground on each side (GSG). The Appendix
shows the configuration of source and victim pins. The -20dB crosstalk limit (10% voltage crosstalk) is
reached at 5.6 GHz (open circuit) and 4.3 GHz (short circuit).
SPICE models for both measurements, which are used to extract coupling parameters, are shown in the
Appendix.
Open Circuit Crosstalk:
OPEN CROSSTALK (dB)
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0.0
MARKERS
S-21
dB
GHz
10.0
-30.3
2.0
-27.3
3.0 -25.5
4.0 -22.1
5.60 -20.0
20.0
Open Crosstalk (dB)
1.0
S21
30.0
S12
MARKERS
S-12
dB
GHz
40.0
50.0
1.0
-30.3
2.0
-27.3
3.0
4.0
-25.5
-22.1
5.76 -20.0
60.0
0.0
1.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
9.0
10.0
Frequency (GHz)
8/13/2009
Short Circuit Crosstalk:
SHORT CROSSTALK (dB)
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0.0
MARKERS
S-21
GHz
dB
10.0
Short Crosstalk (dB)
20.0
1.0
-30.1
2.0
-24.8
3.0
-22.0
4.0
-20.3
4.32
-20.0
S21
S12
30.0
MARKERS
S-12
dB
GHz
40.0
50.0
1.0
-30.2
2.0
-24.8
3.0
-22.0
4.0
-20.4
4.32
-20.0
60.0
0.0
1.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
9.0
Frequency (GHz)
5|Page
Test Report
10.0
8/13/2009
SBT0.4mm Pitch
RF.doc, Rev.A
VP, 11/9/10
www.ironwoodelectronics.com Tel: (800) 404-0204
Appendix 1 - Equipment List
Contactor:
Contactor Material
Custom IE SBT pin with gold plated pogo pins. The contactor housing is
designed so that all probes are preloaded to the specified test height.
DuPont Vespel® SP-1. Dielectric constant, εr = 3.5; Loss Tangent = 0.007
Vector Network 1. Wiltron 360A, with time domain option installed
Analyzer:
2. Wiltron 3611A S-Parameter Test Set, 66 MHz-40 GHz
3. Wiltron 360SS69 Synthesized Sweeper
Air Coplanar
Probes:
Calibration
Substrate:
Test Port
Extension Cables:
Probing Station:
6|Page
Test Report
GGB Industries PicoProbe®, model 40A-GSG, K connector interface
GGB Industries Model CS-10 Calibration Substrate with calibration coefficients for
the HP8510 VNA
Gore PHASEFLEX Test Cable Assembly. Male-Female 2.92mm 24in cables;
P/N EL0CQ0CP024.0.
IE custom with mounting test block
SBT0.4mm Pitch
RF.doc, Rev.A
VP, 11/9/10
www.ironwoodelectronics.com Tel: (800) 404-0204
Appendix 2 - Experimental Method
General Set-Up
1) The test contactor is cleaned per IE standard instructions.
2) The contactor is mounted to the test board such that contacts can be probed from above.
3)
The test port extension cables and air coplanar probes are connected and mounted to the VNA and
probing station per the manufacturers’ recommended procedures.
4)
The VNA is powered on per the manufacturers recommended procedures. The equipment is allowed
at least ½ hour of temperature stabilization warm-up time.
5) The VNA is set for frequency domain to the frequency limits of interest. A full 2-port SOLT (Short,
Open, Load, Thru) calibration is performed on the VNA using the Calibration substrate per the
manufacturers recommended procedures. Calibration verification is done.
One-way Through Measurement (Insertion Loss and Impedance)
6) THROUGH measurements are required for insertion loss, return loss, and impedance extraction. See
the Appendix for configuration details. The contactor is mounted vertically such that the probes are
horizontal. The microwave probes on port1 and port2 engage directly to the device under test. The
technique used is a direct through measurement. The contact probes are measured at proper test
height as the test fixture is designed to pre-compress the probes for all through measurements.
Open Circuit Measurement (Crosstalk and Capacitance)
7) OPEN measurements are required for shunt and coupling capacitance extraction. See the Appendix
for configuration details. The contactor is mounted to a bare PC board. No contact pins are shorted
together whatsoever. The contactor and board are mounted on the probing station so that the VNA
port 1 engages with the center left contact element and port 2 engages with the center right contact
under test. The contact probes are engaged to proper test height.
Short Circuit Measurement (Crosstalk and Inductance)
8) SHORT circuit measurements are required for self and mutual inductance extraction. See the
Appendix for configuration details. The contactor is mounted to a gold plated copper clad board. All
contact pins are completely together. The contactor and board are mounted on the probing station so
that the VNA port 1 engages with the center left contact element and port 2 engages with the center right
contact under test. The contact probes are engaged to proper test height
General Data Sweep and Storage Procedure
9) The VNA sweep is reset, and a full sweep is performed. Visual verification of the analysis is made on
the VNA graphical display.
10) When the data is found to be accurate, the internal VNA data arrays are saved to disk. The format
used is the “DATA-DATA’ format. Time domain data is then also saved along with raw probe and/or
raw PC board data for reference.
11) The raw VNA data is imported into IE proprietary analysis software for data extraction. 12)
Mutual capacitance and mutual inductance are derived using IE best known methods.
(A curve-fit technique that converges upon measured cross-talk values.)
7|Page
Test Report
SBT0.4mm Pitch
RF.doc, Rev.A
VP, 11/9/10
www.ironwoodelectronics.com Tel: (800) 404-0204
Appendix 3 - Probing Configuration
Open Circuit Crosstalk and Capacitance Measurement:
Short Circuit Crosstalk and Inductance Measurement:
One-way Through Measurement:
8|Page
Test Report
SBT0.4mm Pitch
RF.doc, Rev.A
VP, 11/9/10
www.ironwoodelectronics.com Tel: (800) 404-0204
Appendix 4 - SPICE Models
The models shown below are used to extract coupling parameters. Measured values for Shunt
Capacitance and Loop Inductance are used. RSKIN and RDC is a resistor models used to simulate high
frequency losses, and DC contact resistance respectively. Both values were derived empirically. Mutual
inductance and mutual capacitance are found using curve-fit methods to match measured crosstalk
values.
One-way Through:
Open Crosstalk:
Short Crosstalk:
9|Page
Test Report
SBT0.4mm Pitch
RF.doc, Rev.A
VP, 11/9/10
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