SM-BGA DIRECT MOUNT, SOLDERLESS SOCKET FOR BURN-IN AND TEST APPLICATION Features A • • • • • • A 60.0000 Wide temperature range (-55C to +150C). Current capability is 4A per pin at 14C temperature rise. Over 40GHz bandwidth @-1dB for edge pins Low and stable contact resistance for reliable production yield. Self inductance under 0.21nH. Easily removable swivel socket lid 60.00 Silver ball matrix elastomer Recommended torque = 35-40in lbs 57.2500 TOP VIEW 59.41 54.76 39.76 22.76 16.50 6.35 6.35 SECTION A-A Note: Depend on the structure of the fan, may only need 3 screws on the top of torque bar. Description: Custom SM-BGA1136 Socket 1mm pitch 35mm 34x34 array IC with heat sink and fan Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams. Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. SM-BGA-9061 Drawing Ironwood Electronics, Inc. Tele: (800) 404-0204 www.ironwoodelectronics.com Material: N/A Finish: N/A Weight: 323.97 STATUS: Released SHEET: 1 OF 4 REV. B ENG: S. Huang DRAWN BY: M. Raske SCALE: 1:1 FILE: SM-BGA-9061 Dwg DATE: 03/20/2015 Dot shaded area denote cutout area in the socket base, 1.5mm High Orientation Mark 1.00 typ. 1.630±0.025 (x2) Non plated alignment hole 29.00 53.000±0.125 Socket size 46.50 0.54 pad (x1136) 3.40±0.10 (x4) Non-plated mounting hole 19.25 33.00±0.05 (x4) Target PCB Recommendations Total thickness: 2.4 mm min. Plating: Gold or Solder finish. PCB Pad height: Same or higher than solder mask. R4.00 (x4) 38.50±0.05 (x4) 45.00±0.05 (x4) NOTE: Steel backing plate may be required based on end user's application. Description: Recommended PCB Layout Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams. Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. SM-BGA-9061 Drawing Ironwood Electronics, Inc. Tele: (800) 404-0204 www.ironwoodelectronics.com Material: N/A Finish: N/A Weight: 323.97 STATUS: Released SHEET: 2 OF 4 REV. B ENG: S. Huang DRAWN BY: M. Raske SCALE: 2.5:1 FILE: SM-BGA-9061 Dwg DATE: 03/20/2015 IRONWOOD PACKAGE CODE: BGA1136C D AA AB e E b 0.25 Z X Y 0.10 Z 7.00 Bottom View Top View 3 5 0.25 Z D A Side View A1 1. Dimensions are in millimeters. 2. Interpret dimensions and tolerances per ASME Y14.5-1994. 3. Dimension b is measured at the maximum solder bll diameter, parallel to datum plane Z. 4. Datum Z (seating plane) is defined by the spherical crowns of the solder balls. 5. Parallelisml measurement shall exclude any effect of mark on top surface of package. 4 Description: Compatible BGA Spec Ironwood Electronics, Inc. Tele: (800) 404-0204 www.ironwoodelectronics.com Material: N/A Finish: N/A Weight: 323.97 DIM MIN MAX A A1 b D E e 3.29 0.4 0.5 34.85 34.85 3.89 0.6 0.7 35.15 35.15 1.00 Array: 34x34 Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams. Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. SM-BGA-9061 Drawing DETAIL D SCALE 4 : 1 STATUS: Released SHEET: 3 OF 4 REV. B ENG: S. Huang DRAWN BY: M. Raske SCALE: 2:1 FILE: SM-BGA-9061 Dwg DATE: 03/20/2015 ITEM NO. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 13 12 14 2 DESCRIPTION Material SM Socket Base for 35x35mm IC w/ custom footpirnt Heat sink screw M30 Custom Socket Lid Compression Plate, 35x35mm IC Ball Guide, SM, 35mm, 34x34 array SM Contactor 1136 pin BGA 35mm , 1mm Pitch Test PCB BGA1136, 1mm pitch 34x34 array Custom backing plate Dowel Pin, 1/16" x 3/16", SS Screw, M3 x 0.5mm, 25mm lg, Low Head Cap, SS Fan 50mmx50mmx15mm, 12V, 0.573 m3/min, 4 wires Torquing bracket Flat HD phillips, 6-32x7/8in long 100deg. M3 Stand off 4.5mm OD 3.2mm ID 8mm long Torlon 5530 7075-T6 Aluminum Alloy 7075-T6 Aluminum Alloy 7075-T6 Aluminum Alloy Kapton Polyimide/Cirlex Silmat Material <not specified> FR4 7075-T6 Alumium Alloy Chrome Stainless Steel Stainless Steel (18-8) Plastic (UL 94V-0) 7075-T6 Alumium Alloy Stainless Steel Stainless Steel (18-8) 53.00 3 6.35 11 4 15 7 45.00 (x4) 1 10 5 6 8 2.50 Top View Side View R4.00 9 Note: SM interposer (item 6) will be made as a full 34x34 array BGA1156. Description: Socket Assem and Detail Rev A Date - Initials - B 5/30/15 MR Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams. Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. SM-BGA-9061 Drawing Ironwood Electronics, Inc. Tele: (800) 404-0204 www.ironwoodelectronics.com Material: N/A Finish: N/A Weight: 323.97 STATUS: Released Description Original Changes to heatsink per Production Redline SHEET: 4 OF 4 REV. B ENG: S. Huang DRAWN BY: M. Raske SCALE: 1.5:1 FILE: SM-BGA-9061 Dwg DATE: 03/20/2015