GHz MLF Socket - Direct mount, solderless Top View Features Directly mounts to target PCB (needs tooling holes) with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly IC guide prevents over compression of elastomer 12.225mm Easily removable swivel socket lid A A Side View (Section AA) 1 Socket Lid: Black anodized Aluminum. Thickness = 2.5mm. 2 Socket base: Black anodized Aluminum. Thickness = 3mm. 3 Compression Plate: Black anodized Aluminum. Thickness = 1.5mm. 4 Compression screw: Clear anodized Aluminum. Thickness = 5mm, Hex socket = 3mm. 5 Elastomer: 20 micron dia gold plated brass filaments arranged symmetrically in a silicone rubber (63.5 degree angle). Thickness = 0.5mm. 6 Elastomer Guide: Cirlex Thickness = 0.475mm. 7 IC (MLF) Guide: Torlon 8 Socket base screw: Socket head cap, Alloy steel with black oxide finish, 0-80 fine thread , 9.525mm long. 9 Socket lid screw: Shoulder screw, 18-8 SS, 0-80 fine thread. 10 Socket base nut: 18-8 Stainless steel, 0-80 fine thread. 11 Nylon washer: 1.73mm ID; 4.78mm OD 0.64mm thickness. 12.225mm Recommended torque = 1.0 in. lb. (16 in. oz.) 4 1 9 3 Assembled 6.95mm + IC thickness 2 8 7 6 10 5 Customer's MLF SG-MLF-7004 Drawing © 2009 IRONWOOD ELECTRONICS, INC. Tele: (800) 404-0204 www.ironwoodelectronics.com 11 Customer's Target PCB Status: Released Scale: - Rev: K Drawing: H. Hansen Date: 10/22/02 File: SG-MLF-7004 Dwg.mcd Modified: 05/07/14, DH All tolerances: ±0.125mm (unless stated otherwise). Materials and specifications are subject to change without notice. PAGE 1 of 3 Recommended PCB Layout Top View *Note: MLF pattern is not symmetrical with respect to the mounting holes. It is offset 0.25mm to the right of center. Orientation Mark C* 1.25mm±0.125mm (x4) 1.25mm±0.125mm (x4) e typ. +0.025mm (x2) - 0.025mm Non plated alignment hole Ø 0.85mm 2mm B Z2 max Socket Body Size YxX pad (x N) 3mm A2 max +0.05mm (x4) - 0.05mm Non plated mounting hole Ø 1.61mm A1 max Z1 max 9.725mm (x4) 12.225mm±0.125mm (x4) **** To effectively conduct heat away from the package a thermal pad is recommended with vias spaced 1.0 to 1.2 mm pitch and a diameter of 0.3 to 0.33 mm. Ideally 1 via for every 3 leads has been shown to work well. Target PCB Recommendations Total thickness: 1.6mm min. Plating: Gold or Solder finish PCB Pad height: Same or higher than solder mask NOTE: Steel backing plate may be required based on end user's application SG-MLF-7004 Drawing © 2009 IRONWOOD ELECTRONICS, INC. Tele: (800) 404-0204 www.ironwoodelectronics.com Status: Released Scale: - Rev: K Drawing: H. Hansen Date: 10/22/02 File: SG-MLF-7004 Dwg.mcd Modified: 05/07/14, DH PAGE 2 of 3 Package Code MLF28A MLF32A MLF20B MLF16C MLF24E MLF40C C 3.47 3.22 3.63 3.7 3.338 3.19 B 2.18 2.18 2.18 2.18 2.263 1.88 Z1max 5.36 5.36 5.36 5.36 5.2 5.96 A1max 3.28 3.78 2.97 2.82 3.55 3.85 Z2max 5.36 5.36 5.36 5.36 5.2 5.96 A2 max 3.28 3.78 2.97 2.82 3.55 3.85 e 0.5 0.5 0.65 0.8 0.65 0.4 X 0.28 0.28 0.37 0.42 0.6 0.24 Y 0.94 0.69 1.06 1.06 0.3 1.06 N 28 32 20 16 24 16 Thermal Pad Recommendations 3.08 x 3.08 3.58 x 3.58 2.08 x 2.08 2.84 x 2.84 3.3 x 3.3 3.4 x 3.4 Recommended PCB Layout Tolerances: ±0.025mm unless stated otherwise. All dimensions are in mm. D Package Code MLF28A MLF32A MLF20B MLF16C MLF24E MLF40C D2 L D2 e 0.5 0.5 0.65 0.8 0.65 0.4 D min 4.85 4.85 4.85 4.85 4.85 4.9 D max 5.15 5.15 5.15 5.15 5.15 5.1 E min 4.85 4.85 4.85 4.85 4.85 4.9 E max 5.15 5.15 5.15 5.15 5.15 5.1 b min 0.18 0.18 0.23 0.28 0.25 0.15 b max 0.3 0.3 0.35 0.4 0.35 0.25 L min 0.5 0.3 0.5 0.5 0.35 0.35 L max 0.75 0.5 0.75 0.75 0.45 0.45 D2 3.18 3.68 2.94 2.94 3.25 3.4 N 28 32 20 16 24 40 b E e L D SG-MLF-7004 Drawing © 2009 IRONWOOD ELECTRONICS, INC. Tele: (800) 404-0204 www.ironwoodelectronics.com Status: Released Scale: - Rev: K Drawing: H. Hansen Date: 10/22/02 File: SG-MLF-7004 Dwg.mcd Modified: 05/07/14, DH PAGE 3 of 3