GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB (needs tooling holes) with hardware. Top View High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 22.225mm Ball guide prevents over compression of elastomer Easily removable swivel socket lid A A 1 Socket Lid: Black anodized Aluminum. Thickness = 2.5mm. 2 Socket base: Black anodized Aluminum. Thickness = 5mm. 3 Compression Plate: Black anodized Aluminum. Thickness = 2.5mm. 4 Compression screw: Black anodized Aluminum. Thickness = 5mm, Hex socket = 5mm. 5 Elastomer: 40 micron dia gold plated brass filaments arranged symmetrically in a silicone rubber (63.5 degree angle). Thickness = 0.75mm. 6 Elastomer Guide: Non-clad FR4. Thickness = 0.75mm. 7 Ball Guide: Kapton polyimide. 8 Socket base screw: Socket head cap, alloy steel with black oxide finish, 0-80 fine thread , 9.525mm long. 9 Socket lid screw: Shoulder screw, 18-8 SS, 0-80 fine thread. 10 Socket base nut: 18-8 Stainless steel, 0-80 fine thread. 22.225mm Side View (Section AA) Recommended torque = 3 in lb. 1 4 3 Assembled 8.25mm + IC thickness 9 2 8 7 6 10 5 Customer's BGA IC SG-BGA-6136 Drawing © 2009 IRONWOOD ELECTRONICS, INC. Tele: (952) 229-8200 www.ironwoodelectronics.com 11 11 Nylon washer: 1.73mm ID; 4.78mm OD 0.64mm thickness. Customer's Target PCB Status: Released Scale: - Rev: C Drawing: B. Roux Date: 11/23/04 File: SG-BGA-6136 Dwg.mcd Modified: 7/6/09, AE All tolerances: ±0.125mm (unless stated otherwise). Materials and specifications are subject to change without notice. PAGE 1 of 3 Recommended PCB Layout Top View *Note: BGA pattern is not symmetrical with respect to the mounting holes. Orientation Mark 1.25mm±0.13mm(x4) 0.8mm typ. 1.25mm±0.13mm(x4) Socket Body Size 2.64mm* 2.26mm 2.54mm Ø 0.85mm±0.03mm (x2) Non plated alignment hole Ø 0.43mm pad (x400) Note: Full BGA pattern shown. Please adjust pattern according to individual requirements. 5.08mm 19.725mm (x4) Ø 1.61mm±0.05mm (x4) Non plated mounting hole 22.225mm±0.125mm (x4) Target PCB Recommendations Total thickness: 1.6mm min. Plating: Gold or Solder finish PCB Pad height: Same or higher than solder mask NOTE: Steel backing plate may be required based on end user's application SG-BGA-6136 Drawing © 2009 IRONWOOD ELECTRONICS, INC. Tele: (952) 229-8200 www.ironwoodelectronics.com Recommended PCB Layout Tolerances: ±0.025mm [±0.001”] unless stated otherwise. Status: Released Scale: 3:1 Rev: C Drawing: B. Roux Date: 11/23/04 File: SG-BGA-6136 Dwg.mcd Modified: 7/6/09, AE PAGE 2 of 3 Compatible BGA Spec SIDE VIEW (reference only) TOP VIEW (reference only) X D DETAIL Y 5 DETAIL 0.20 Z A E Z A1 0.12 Z 4 0.15 BOTTOM VIEW (reference only) Dimensions are in millimeters. 2. Interpret dimensions and tolerances per ASME Y14.5M-1994. 3 Dimension b is measured at the maximum solder ball diameter, parallel to datum plane Z. 4 Datum Z (seating plane) is defined by the spherical crowns of the solder balls. 5 Parallelism measurement shall exclude any effect of mark on top surface of package. e 3 DIM 1. MIN MAX 1.7 A A1 0.25 0.35 b 0.35 0.45 D 17.00 BSC E 17.00 BSC e 0.8 BSC Øb Array 20x20 Ø0.15 Z X Y Ø0.08 SG-BGA-6136 Drawing © 2009 IRONWOOD ELECTRONICS, INC. Tele: (952) 229-8200 www.ironwoodelectronics.com Status: Released Scale: - Rev: C Drawing: B. Roux Date: 11/23/04 File: SG-BGA-6136 Dwg.mcd Modified: 7/6/09, AE PAGE 3 of 3