GHz MLF Socket - Direct mount, solderless Features Top View Directly mounts to target PCB (needs tooling holes) with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 15.225mm IC guide prevents over compression of elastomer Easily removable swivel socket lid A A 1 Socket Lid: Black anodized Aluminum. Thickness = 2.5mm. 2 Socket base: Black anodized Aluminum. Thickness = 3mm. 3 Compression Plate: Black anodized Aluminum. Thickness = 1.5mm. 15.225mm 4 Side View (Section AA) Recommended torque = 1.5 in. lbs. (24 in. oz.) 4 1 5 9 3 Assembled 6.95mm + IC thickness Compression screw: Clear anodized Aluminum. Thickness = 5mm, Hex socket = 3mm. Elastomer: 20 micron dia gold plated brass filaments arranged symmetrically in a silicone rubber (63.5 degree angle). Thickness = 0.5mm. 6 Elastomer Guide: Cirlex Thickness = 0.475mm. 7 IC (MLF) Guide: Torlon 8 Socket base screw: Socket head cap, Alloy steel with black oxide finish, 0-80 fine thread , 9.525mm long. 9 Socket lid screw: Shoulder screw, 18-8 SS, 0-80 fine thread. 10 Socket base nut: 18-8 Stainless steel, 0-80 fine thread. 11 Nylon washer: 1.73mm ID; 4.78mm OD 0.64mm thickness. 2 8 7 6 10 SG-MLF-7000 Drawing © 2007 IRONWOOD ELECTRONICS, INC. 11351 Rupp Dr. Ste 400 Burnsville, MN 55337 Tele: (952) 229-8200 www.ironwoodelectronics.com 5 Customer's MLF 11 Customer's Target PCB Status: Released Scale: 3:1 Rev: J Drawing: H. Hansen Date: 9/11/02 File: SG-MLF-7000 Dwg.mcd Modified: 05/06/14, DH All tolerances: ±0.125mm (unless stated otherwise). Materials and specifications are subject to change without notice. PAGE 1 of 3 *Note: MLF pattern is not symmetrical with respect to the mounting holes. It is offset 0.25mm to the right of center. Recommended PCB Layout Top View Orientation Mark 1.25mm±0.125mm (x4) C* e typ. 1.25mm±0.13mm (x4) B 15.225mm±0.125mm sqr. Socket size Z2 max 2.54mm Ø 0.85mm±0.025mm (x2) A2 max Non plated alignment hole Y x X mm 5.08mm pad (x N) Ø 1.61mm±0.05mm (x4) Non plated mounting hole A1 max Z1 max 12.725mm±0.125mm (x4) Target PCB Recommendations Total thickness: 1.6mm min. Plating: Gold or Solder finish PCB Pad height: Same or higher than solder mask **** To effectively conduct heat away from the package a thermal pad is recommended with vias spaced 1.0 to 1.2 mm pitch and a diameter of 0.3 to 0.33 mm. Ideally 1 via for every 3 leads has been shown to work well. NOTE: Steel backing plate may be required based on end user's application SG-MLF-7000 Drawing © 2007 IRONWOOD ELECTRONICS, INC. 11351 Rupp Dr. Ste 400 Burnsville, MN 55337 Tele: (952) 229-8200 www.ironwoodelectronics.com Status: Released Scale: 3:1 Rev: J Drawing: H. Hansen Date: 9/11/02 File: SG-MLF-7000 Dwg.mcd Modified: 05/06/14, DH PAGE 2 of 3 Package Code C B Z1max A1max Z2max A2 max e Xmax Yref N Thermal Pad Recommendations MLF44A 2.4 1.18 10.36 8.42 10.36 8.42 0.8 0.44 1.06 44 7.84 x 7.84 MLF52A 2.53 1.18 10.36 8.17 10.36 8.17 0.65 0.37 1 52 6.84 x 6.84 MLF64B 2.72 1.18 10.36 7.78 10.36 7.78 0.5 0.28 0.94 64 8.08 x 8.08 MLF68A 2.47 1.18 10.36 8.28 10.36 8.28 0.5 0.28 0.94 68 8.08 x 8.08 MLF72A 2.22 1.18 10.36 8.78 10.36 8.78 0.5 0.28 0.69 72 8.58 x 8.58 MLF84A 2.49 1.18 10.36 8.25 10.36 8.25 0.4 0.25 0.81 84 8.34 x 8.34 MLF88A 2.29 1.18 10.36 8.65 10.36 8.65 0.4 0.25 0.76 88 8.2 x 8.2 Recommended PCB Layout Tolerances: ±0.025mm unless stated otherwise. All dimensions are in mm. Package Code D D2 L e D min D max E min E max b min b max L min L max D2 N MLF44A 0.8 9.85 10.15 9.85 10.15 0.28 0.4 0.5 0.75 7.94 44 MLF52A 0.65 9.85 10.15 9.85 10.15 0.23 0.35 0.5 0.75 8.07 52 MLF64B 0.5 9.85 10.15 9.85 10.15 0.21 0.25 0.45 0.55 7.05 64 MLF68A 0.5 9.85 10.15 9.85 10.15 0.18 0.3 0.5 0.75 8.18 68 MLF72A 0.5 9.85 10.15 9.85 10.15 0.18 0.3 0.3 0.5 8.68 72 MLF84A 0.4 9.85 10.15 9.85 10.15 0.16 0.27 0.3 0.5 8.44 84 MLF88A 0.4 9.85 10.15 9.85 10.15 0.15 0.25 0.35 0.45 8.2 88 D2 b E e L D SG-MLF-7000 Drawing © 2007 IRONWOOD ELECTRONICS, INC. 11351 Rupp Dr. Ste 400 Burnsville, MN 55337 Tele: (952) 229-8200 www.ironwoodelectronics.com Status: Released Scale: 3:1 Rev: J Drawing: H. Hansen Date: 9/11/02 File: SG-MLF-7000 Dwg.mcd Modified: 05/06/14, DH PAGE 3 of 3