SBT-BGA DIRECT MOUNT, SOLDERLESS SOCKET FOR BURN-IN AND TEST APPLICATIONS 42.7250 40.60 Features • Wide temperature range (-55C to +180C) • High current capability (up to 8A) • Excellent signal integrity at high frequencies • Low and stable contact resistance for reliable production yield • Highly compliant to accommodate wide co-planarity variations • Automated probe manufacturing enables low cost and short lead time 42.7250 40.225 Recommended Torque: 23 in-lbs R DETAIL R SCALE 6 : 1 18.61 1.59 6.35 9.46 Description: SBT-BGA1156 Socket, 35x35, 1.00mm, 34 x 34 Array Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams. Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. SBT-BGA-6000 Drawing ©2015 Ironwood Electronics, Inc. Tele: (800) 404-0204 www.ironwoodelectronics.com Material: Material <not specified> Finish: Weight: 80.87 STATUS: Released SHEET: 1 OF 4 REV. E ENG: V. Panavala DRAWN BY: V. Panavala SCALE: 2:1 FILE: SBT-BGA-6000 DATE: 4/26/2010 *Note: BGA pattern is not symmetrical with respect to the mounting holes. 42.30 40.60 * 2.7375±0.0250 2.3625±0.0250 2.5400±0.0250 0.8500 THRU NON-PLATED HOLE (2) 41.925 40.2250 SOCKET BASE 42.725 BACKING PLATE 1.00 Typ. 0.5100 (x1156 PAD) 5.080±0.025 1.6100±0.0500 THRU NON-PLATED HOLE (8) 18.8625±0.0500 (8) 33.00 Target PCB Recommendations Total thickness: 1.6mm min. Plating: Gold or Solder finish PCB Pad height: Same or higher than solder mask Description: Recommended PCB Layout Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams. Tolerances: Hole diameters ±0.0254mm [±0.001"], Pitches (from true position) ±0.0762mm [±0.003"], substrate thickness tolerance ±10%, all other tolerances ±0.127mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. SBT-BGA-6000 Drawing ©2015 Ironwood Electronics, Inc. Tele: (800) 404-0204 www.ironwoodelectronics.com Material: Material <not specified> Finish: Weight: 80.87 STATUS: Released SHEET: 2 OF 4 REV. E ENG: V. Panavala DRAWN BY: V. Panavala SCALE: 3:1 FILE: SBT-BGA-6000 DATE: 4/26/2010 B D 0.91 min. A 0.20 C E 13.97 2.54 A1 0.20 C DETAIL A SCALE 6 : 1 A A 1. 2. 3. 4. 5. e b SEE NOTE #3 0.25 C A B 0.10 Dimensions are in millimeters. Interpret dimensions and tolerances per ASME Y14.5M-1994. Dimension b is measured at the maximum solder ball diameter, parallel to datum plane C. Datum C (seating plane) is defined by the spherical crowns of the solder balls. Parallelism measurement shall exclude any effect of mark on top surface of package. Description: Compatible BGA Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams. Tolerances: Hole diameters ±0.0254mm [±0.001"], Pitches (from true position) ±0.0762mm [±0.003"], substrate thickness tolerance ±10%, all other tolerances ±0.127mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. SBT-BGA-6000 Drawing ©2015 Ironwood Electronics, Inc. Tele: (800) 404-0204 www.ironwoodelectronics.com Material: Material <not specified> Finish: Weight: 80.87 STATUS: Released DIM A A1 b D E e ARRAY SIZE PIN COUNT Minimum Maximum 4.7 0.4 0.6 0.7 35.0 BSC 35.0 BSC 1.00 BSC 34 X 34 1156 SHEET: 3 OF 4 REV. E ENG: V. Panavala DRAWN BY: V. Panavala SCALE: 2:1 FILE: SBT-BGA-6000 DATE: 4/26/2010 ITEM NO. Description Material 7075-T6, Plate (SS) 2 3 4 SBT socket base, Ni Plated, 35x35mm, 0.375 shift Screw, #0-80 X .313", Flat, SS Pogo Pin, 1mm Pitch SBT BGA pin Socket Lid 35mm GHz swivel 7075-T6 Aluminum Alloy 5 CBT/SBT Ni plt Backing Plate 35x35mm IC 7075-T6, Plate (SS) 1 6 7 8 Insulation Plate 35x35mm IC Compression plate 35mm with cutout Floating Guide Spring FR4 Standard 7075-T6 Aluminum Alloy Alloy Steel (SS) 7 9 Stainless Steel (18-8) 10 #0-80 X .75 LG, SOC HD CAP SCREW, 18-8 SS SBT Ni plt Compression Plate, 35x35mm IC 11 12 Floating Guide 35mm SBT-BGA1156 Bottom Guide SBT-BGA1156 PEEK Ceramic filled PEEK Ceramic filled 13 Middle Guide SBT-BGA1156 PEEK Ceramic filled 14 Test PCB 34x34 array 1mm pitch High Temp FR4 15 Test Chip 35mm 34x34 array High Temp FR4 16 Compression Screw, M30 #0-80 Shoulder Screw, 0.090" thread length 7075-T6 Aluminum Alloy 4 1 16 17 10 2 11 8 15 14 3 6 12 5 9 13 17 Material <not specified> 7075-T6 Aluminum Alloy Stainless Steel (303) 1.70 10.00 18.8625 24.06 1.27 SBT PIN 10:1 scale Description: Assembly, Insulation Plate 42.725 1.5875 INSULATION PLATE DETAIL Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams. Tolerances: Hole diameters ±0.0254mm [±0.001"], Pitches (from true position) ±0.0762mm [±0.003"], substrate thickness tolerance ±10%, all other tolerances ±0.127mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. SBT-BGA-6000 Drawing ©2015 Ironwood Electronics, Inc. Tele: (800) 404-0204 www.ironwoodelectronics.com Material: Material <not specified> Finish: Weight: 80.87 STATUS: Released Rev Date Initials Description A 04/26/10 VP Original layout B 03/11/15 DH Updated page SHEET: 4 OF 4 REV. E ENG: V. Panavala DRAWN BY: V. Panavala SCALE: 3:2 FILE: SBT-BGA-6000 DATE: 4/26/2010