Top View GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB (needs tooling holes) with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 21.225mm Ball guide prevents over compression of elastomer Easily removable swivel socket lid A A 1 Socket Lid: Black anodized Aluminum. Thickness = 2.5mm. 2 Socket base: Black anodized Aluminum. Thickness = 5mm. 3 Compression Plate: Black anodized Aluminum. Thickness = 2.5mm. 21.225mm 4 Side View (Section AA) Compression screw: Clear anodized Aluminum. Thickness = 5mm, Hex socket = 5mm. Recommended Torque = 3 in lb 5 Elastomer: Embedded Silver Ball Matrix Thickness = 0.5969mm - 0.6604mm 6 Ball Guide: Kapton polyimide. 7 Socket base screw: Socket head cap, alloy steel with black oxide finish, 0-80 fine thread , 9.525mm long. 8 Socket lid screw: Shoulder screw, 18-8 SS, 0-80 fine thread. 9 Nylon washer: 1.73mm ID; 4.78mm OD, 0.64mm thick 4 1 3 Assembled 8.25mm + IC thickness 8 2 6 7 5 9 Customer's BGA IC SM-BGA-9006 Drawing © 2011 IRONWOOD ELECTRONICS, INC. Tele: (800) 404-0204 www.ironwoodelectronics.com Customer's Target PCB Status: Released Scale: NA Rev: A Drawing: E. Smolentseva Date: 10/10/11 File: SM-BGA-9006 Dwg.mcd Modified: All tolerances: ±0.125mm (unless stated otherwise). Materials and specifications are subject to change without notice. PAGE 1 of 3 Recommended PCB Layout Top View Note: BGA pattern is not symmetrical with respect to the mounting holes. 1.25mm±0.13mm (x4) Orientation Mark 2.54mm 1.25mm±0.13mm (x4) 14.40mm 0.80mm typ. 2.54mm 2.16mm(x4) Ø 0.85mm±0.03mm (x2) non plated Alignment Hole 21.225mm±0.125mm(x4) Socket size 14.40mm Ø 0.360mmxPAD 5.08mm Ø 1.61mm±0.05mm (x4) non plated Mounting Hole 18.725mm (x4) Target PCB Recommendations Total thickness: 1.6mm min. Plating: Gold or Solder finish PCB Pad height: Same or higher than solder mask Recommended PCB Layout Tolerances: ±0.025mm [±0.001”] unless stated otherwise. SM-BGA-9006 Drawing © 2011 IRONWOOD ELECTRONICS, INC. Tele: (800) 404-0204 www.ironwoodelectronics.com Status: Released Scale: NA Rev: A Drawing: E. Smolentseva Date: 10/10/11 File: SM-BGA-9006 Dwg.mcd Modified: BGA IC Size Pitch Array 16x16mm 0.8mm 19x19 PAGE 2 of 3 Compatible BGA Spec SIDE VIEW TOP VIEW DETAIL D X Y 5 DETAIL 0.20 Z A E A1 Z 0.12 Z 4 0.20 e 3 Dimensions are in millimeters. 2. Interpret dimensions and tolerances per ASME Y14.5M-1994. 3 Dimension b is measured at the maximum solder ball diameter, parallel to datum plane Z. 4 Datum Z (seating plane) is defined by the spherical crowns of the solder balls. 5 Parallelism measurement shall exclude any effect of mark on top surface of package. Øb Ø0.15 Z X Y Ø0.08 DIM 1. MIN MAX 1.70 A A1 0.25 0.35 b 0.38 0.48 D 15.85 16.15 E 15.85 16.15 e 0.8 BSC Array: 19x19 BOTTOM VIEW SM-BGA-9006 Drawing © 2011 IRONWOOD ELECTRONICS, INC. Tele: (800) 404-0204 www.ironwoodelectronics.com Status: Released Scale: NA Rev: A Drawing: E. Smolentseva Date: 10/10/11 File: SM-BGA-9006 Dwg.mcd Modified: PAGE 3 of 3