SG-BGA-6002 - Ironwood Electronics

GHz BGA Socket - Direct mount, solderless
Top View
Features
Directly mounts to target PCB (needs tooling holes) with hardware.
High speed, reliable Elastomer connection
Minimum real estate required
Compression plate distributes forces evenly
Ball guide prevents over compression of elastomer
18.225mm
Easily removable swivel socket lid
A
A
18.225mm
Side View
(Section AA)
Recommended torque = 1 in lbs.
4
1
1
Socket Lid: Black anodized Aluminum.
Thickness = 2.5mm.
2
Socket base: Black anodized Aluminum.
Thickness = 5mm.
3
Compression Plate: Black anodized Aluminum.
Thickness = 2.5mm.
4
Compression screw: Clear anodized Aluminum.
Thickness = 5mm, Hex socket = 5mm.
5
Elastomer: 40 micron dia gold plated brass
filaments arranged symmetrically in a silicone
rubber (63.5 degree angle).
Thickness = 0.75mm.
6
Elastomer Guide: Non-clad FR4.
Thickness = 0.725mm.
7
Ball Guide: Kapton polyimide.
8
Socket base screw: Socket head cap, Alloy steel with
black oxide finish, 0-80 fine thread , 9.525mm long.
9
Socket lid screw: Shoulder screw, 18-8 SS, 0-80 fine
thread.
9
3
Assembled
8.25mm +
IC thickness
2
8
7
Socket base nut: 18-8 Stainless steel, 0-80 fine thread.
10
6
10
5
Customer's
BGA IC
SG-BGA-6002 Drawing
© 2009 IRONWOOD ELECTRONICS, INC.
11351 Rupp Drive, Suite 400, Burnsville, MN 55337
Tele: (952) 229-8200
www.ironwoodelectronics.com
11
11
Nylon washer: 1.73mm ID; 4.78mm OD
0.64mm thickness.
Customer's Target PCB
Status: Released
Scale: -
Rev: H
Drawing: Meghann Fedde
Date: 8/15/01
File: SG-BGA-6002 Dwg.mcd
Modified: 6/12/09, AE
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
PAGE 1 of 3
*Note: BGA pattern is not symmetrical
with respect to the mounting holes.
Recommended PCB Layout
Top View
Orientation Mark
1.25mm±0.125mm(x4)
2.638mm*
1.25mm±0.125mm(x4)
Socket
Body Size
0.8mm typ.
2.263mm
2.54mm
Ø 0.85mm±0.025mm (x2)
Alignment Hole
Ø 0.36mmPAD
5.08mm
Ø 1.61mm±0.05mm(x4)
Mounting Hole
10.95mm
15.725mm(x4)
18.225mm±0.125mm (x4)
Target PCB Recommendations
Total thickness: 1.6mm min.
Plating: Gold or Solder finish
PCB Pad height: Same or higher than solder mask
NOTE: Steel backing plate may be required based on end user's application
SG-BGA-6002 Drawing
© 2009 IRONWOOD ELECTRONICS, INC.
11351 Rupp Drive, Suite 400, Burnsville, MN 55337
Tele: (952) 229-8200
www.ironwoodelectronics.com
Recommended PCB Layout Tolerances: ±0.025mm [±0.001”] unless stated otherwise.
Status: Released
Scale: 3:1
Rev: H
Drawing: Meghann Fedde
Date: 8/15/01
File: SG-BGA-6002 Dwg.mcd
Modified: 6/12/09, AE
PAGE 2 of 3
Compatible BGA Spec
X
DETAIL
DETAIL
D
5
0.20 Z
Y
A
4
Z
A1
0.12 Z
E
TOP VIEW
0.20
SIDE VIEW
DIM
MIN
MAX
2.5
A
e
3
Øb
Ø0.25 Z X Y
Ø0.10
BOTTOM VIEW
SG-BGA-6002 Drawing
© 2009 IRONWOOD ELECTRONICS, INC.
11351 Rupp Drive, Suite 400, Burnsville, MN 55337
Tele: (952) 229-8200
www.ironwoodelectronics.com
A1
1
Dimensions are in millimeters.
2
Interpret dimensions and tolerances per ASME
Y14.5M-1994.
3
Dimension b is measured at the maximum
solder ball diameter, parallel to datum plane Z.
4
Datum Z (seating plane) is defined by the
spherical crowns of the solder balls.
5
Parallelism measurement shall exclude any
effect of mark on top surface of package.
Status: Released
Scale: -
0.4
0.25
b
0.55
D
13.00 BSC
E
13.00 BSC
e
0.80 BSC
Array 15x15
Rev: H
Drawing: Meghann Fedde
Date: 8/15/01
File: SG-BGA-6002 Dwg.mcd
Modified: 6/12/09, AE
PAGE 3 of 3