GHz BGA Socket - Direct mount, solderless Features Top View Directly mounts to target PCB (needs tooling holes) with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 24.225mm Ball guide prevents over compression of elastomer Easily removable swivel socket lid A A 1 Socket Lid: Black anodized Aluminum. Thickness = 2.5mm. 2 Socket base: Black anodized Aluminum. Thickness = 6.5mm. 3 Compression Plate: Black anodized Aluminum. Thickness = 2.5mm. 4 Compression screw: Clear anodized Aluminum. Thickness = 5mm, Hex socket = 5mm. 5 Elastomer: 40 micron dia gold plated brass filaments arranged symmetrically in a silicone rubber (63.5 degree angle). Thickness = 0.75mm. 6 Elastomer Guide: Non-clad FR4. Thickness = 0.725mm. 7 Ball Guide: Kapton polyimide. 8 Socket base screw: Socket head cap, alloy steel with black oxide finish, 0-80 fine thread , 12.7mm long. 9 Socket lid screw: Shoulder screw, 18-8 SS, 0-80 fine thread. 10 Insulation Plate: FR4/G10, 1.59mm thick. 24.225mm Side View (Section AA) Recommended torque = 3 in lbs. 4 1 9 3 Assembled 9.75mm + IC thickness 2 8 7 11 Customer's BGA IC 6 11 5 Backing Plate: Anodized Aluminum 6.35mm thick. Customer's Target PCB 10 SG-BGA-6025 Drawing © 2009 IRONWOOD ELECTRONICS, INC. 11351 Rupp Dr. Suite 400, Burnsville MN 55337 Tele: (952) 229-8200 www.ironwoodelectronics.com Status: Released Scale: - Rev: G Drawing: H. Hansen Date: 11/27/01 File: SG-BGA-6025 Dwg.mcd Modified: 7/16/09, AE All tolerances: ±0.125mm (unless stated otherwise). Materials and specifications are subject to change without notice. PAGE 1 of 4 Note: Full BGA pattern shown. Please adjust pattern according to individual requirements. Recommended PCB Layout Top View Orientation Mark 1mm typ. 1.25mm±0.125mm(x4) 2.74mm* 1.25mm±0.125mm(x4) 2.36mm 24.225mm Note: BGA pattern is not symmetrical with respect to the mounting holes. 2.54mm Ø 0.85mm±0.025mm (x2) Alignment Hole Socket Body Size Ø 0.51mmPAD 5.08mm Ø 1.61mm±0.05mm (x4) Mounting Hole 16.95mm 21.725mm(x4) 24.225mm 26.73mm sqr. backing plate Target PCB Recommendations Total thickness: 1.6mm min. Plating: Gold or Solder finish PCB Pad height: Same or higher than solder mask NOTE: Steel backing plate may be required based on end user's application Recommended PCB Layout Tolerances: ±0.025mm [±0.001”] unless stated otherwise. Scale: - SG-BGA-6025 Drawing Status: Released © 2009 IRONWOOD ELECTRONICS, INC. 11351 Rupp Dr. Suite 400, Burnsville MN 55337 Tele: (952) 229-8200 www.ironwoodelectronics.com Drawing: H. Hansen Date: 11/27/01 File: SG-BGA-6025 Dwg.mcd Modified: 7/16/09, AE Rev: G PAGE 2 of 4 Compatible BGA Spec TOP VIEW SIDE VIEW DETAIL Y 5 DETAIL D X 0.20 Z A Z A1 0.2 Z 4 E 0.20 Dimensions are in millimeters. 2. Interpret dimensions and tolerances per ASME Y14.5M-1994. 3 Dimension b is measured at the maximum solder ball diameter, parallel to datum plane Z. 4 Datum Z (seating plane) is defined by the spherical crowns of the solder balls. 5 Parallelism measurement shall exclude any effect of mark on top surface of package. e 3 DIM 1. Ø0.25 Z X Y Ø0.10 MAX 3.5 A A1 Øb MIN 0.5 0.3 b 0.70 D 19.00 BSC E 19.00 BSC e 1.0 BSC Array: 18x18 BOTTOM VIEW Scale: - SG-BGA-6025 Drawing Status: Released © 2009 IRONWOOD ELECTRONICS, INC. 11351 Rupp Dr. Suite 400, Burnsville MN 55337 Tele: (952) 229-8200 www.ironwoodelectronics.com Drawing: H. Hansen Date: 11/27/01 File: SG-BGA-6025 Dwg.mcd Modified: 7/16/09, AE Rev: G PAGE 3 of 4 26.73mm 2.5mm Top View 26.73mm 21.725mm±0.025mm 3mm 7mm Note: Backing plate holes are tapped to accept 0-80 screws. 6mm sqr. 15.94mm 21.725mm±0.025mm 1.59mm Side View Insulation Plate 6.35mm Backing Plate Description: Backing Plate with Insulation Plate Scale: - SG-BGA-6025 Drawing Status: Released © 2009 IRONWOOD ELECTRONICS, INC. 11351 Rupp Dr. Suite 400, Burnsville MN 55337 Tele: (952) 229-8200 www.ironwoodelectronics.com Drawing: H. Hansen Date: 11/27/01 File: SG-BGA-6025 Dwg.mcd Modified: 7/16/09, AE Rev: G All dimensions are in mm. All tolerences are +/- 0.125mm. (Unless stated otherwise) PAGE 4 of 4