GHz BGA Socket - Direct mount, solderless Top View Features Directly mounts to target PCB (needs tooling holes) with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 32.225mm Ball guide prevents over compression of elastomer Easily removable swivel socket lid A A 1 Socket Lid: Black anodized Aluminum. Thickness = 2.5mm. 2 Socket base: Black anodized Aluminum. Thickness = 5mm. 3 Compression Plate: Black anodized Aluminum. Thickness = 2.5mm. 4 Compression screw: Black anodized Aluminum. Thickness = 5mm, Hex socket = 5mm. 5 Elastomer: 40 micron dia gold plated brass filaments arranged symmetrically in a silicone rubber (63.5 degree angle). Thickness = 0.75mm. 6 Elastomer Guide: Non-clad FR4. Thickness = 0.725mm. 7 Ball Guide: Kapton polyimide. 8 Socket base screw: Fillister head, Alloy steel with black oxide finish, 0-80 fine thread , 12.7mm long. 9 Socket lid screw: Shoulder screw, 18-8 SS, 0-80 fine thread. 10 Insulation Plate: FR4/G10, 1.59mm thick. 11 Backing Plate: Anodized Aluminum 6.35mm thick. 32.225mm Side View (Section AA) Recommended torque = 3 in lbs. 4 1 9 3 Assembled 8.25mm + IC thickness 2 8 7 10 6 5 Customer's BGA IC SG-BGA-6010 Drawing © 2001 IRONWOOD ELECTRONICS, INC. PO BOX 21151 ST. PAUL, MN 55121 Tele: (651) 452-8100 www.ironwoodelectronics.com 11 Customer's Target PCB Status: Released Scale: - Rev: G Drawing: Meghann Fedde Date: 8/17/01 File: SG-BGA-6010 Dwg Modified: 5/19/09 All tolerances: ±0.125mm (unless stated otherwise). Materials and specifications are subject to change without notice. PAGE 1 of 4 Recommended PCB Layout Top View *Note: BGA pattern is not symmetrical with respect to the mounting holes. Orientation Mark 1.25mm±0.13mm (x4) 1.25mm±0.13mm(x4) Socket Body Size 3.173mm* 1.27mm typ. 2.798mm 2.54mm Ø 0.85mm±0.025mm (x2) Nonplated Alignment hole Ø 0.635mmPad 32.225mm (x4) 5.08mm Ø 1.61mm±0.05mm(x4) Nonplated Mounting Hole 29.725mm(x4) 34.725mm (x4) Backing Plate Target PCB Recommendations Total thickness: 1.6mm min. Plating: Gold or Solder finish PCB Pad height: Same or higher than solder mask NOTE: Steel backing plate may be required based on end user's application SG-BGA-6010 Drawing © 2001 IRONWOOD ELECTRONICS, INC. PO BOX 21151 ST. PAUL, MN 55121 Tele: (651) 452-8100 www.ironwoodelectronics.com Recommended PCB Layout Tolerances: ±0.025mm [±0.001”] unless stated otherwise. Status: Released Scale: 3:1 Rev: G Drawing: Meghann Fedde Date: 8/17/01 File: SG-BGA-6010 Dwg Modified: 5/19/09 PAGE 2 of 4 Compatible BGA Spec D X DETAIL Y e E 3 Øb Ø0.25 Z X Y Ø0.10 0.20 SIDE VIEW TOP VIEW BOTTOM VIEW DIM DETAIL 5 1 Dimensions are in millimeters. A 0.20 Z 2 Interpret dimensions and tolerances per ASME Y14.5M-1994. A1 3 Dimension b is measured at the maximum solder ball diameter, parallel to datum plane Z. 4 Datum Z (seating plane) is defined by the spherical crowns of the solder balls. 5 Parallelism measurement shall exclude any effect of mark on top surface of package. A A1 Z 4 SG-BGA-6010 Drawing © 2001 IRONWOOD ELECTRONICS, INC. PO BOX 21151 ST. PAUL, MN 55121 Tele: (651) 452-8100 www.ironwoodelectronics.com 0.2 Z Status: Released Scale: - MIN MAX 2.5 0.7 0.5 b 0.90 D 27.00 BSC E 27.00 BSC e 1.27 BSC Array 20x20 Rev: G Drawing: Meghann Fedde Date: 8/17/01 File: SG-BGA-6010 Dwg Modified: 5/19/09 PAGE 3 of 4 2.5mm 1.27mm (x4) 2.5mm 34.725mm 29.725mm±0.025mm (x4) 5mm 5.03mm Top View Ø 1.61mm±0.05mm (x4) 10mm Sqr. Note: Backing plate holes are tapped to accept 0-80 screws. 16mm (x4) 34.725mm 1.59mm Insulation Plate Side View 6.35mm Backing Plate Description: Backing Plate with Insulation Plate SG-BGA-6010 Drawing © 2001 IRONWOOD ELECTRONICS, INC. PO BOX 21151 ST. PAUL, MN 55121 Tele: (651) 452-8100 www.ironwoodelectronics.com Status: Released Scale: - Rev: G Drawing: Meghann Fedde Date: 8/17/01 File: SG-BGA-6010 Dwg Modified: 5/19/09 All dimensions are in mm. All tolerences are +/- 0.125mm. (Unless stated otherwise) PAGE 4 of 4